CN208998011U - A kind of light refractive type CSP backlight module lens packages structure - Google Patents
A kind of light refractive type CSP backlight module lens packages structure Download PDFInfo
- Publication number
- CN208998011U CN208998011U CN201821640621.6U CN201821640621U CN208998011U CN 208998011 U CN208998011 U CN 208998011U CN 201821640621 U CN201821640621 U CN 201821640621U CN 208998011 U CN208998011 U CN 208998011U
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- China
- Prior art keywords
- lens
- backlight
- csp
- light
- backlight module
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Abstract
The utility model discloses a kind of light refractive type CSP backlight module lens packages structures, including backlight lens, light extraction lens, circuit base plate and CSP light source, the light extraction lens carry out secondary lens filling encapsulation by backlight lens and are formed, it is arranged in backlight lens bottom, the backlight lens base is equipped with the installing ring that is sealing adhesive, it is connected with the sealing concave ring that circuit base plate is equipped with, the CSP light source is welded on circuit base plate, is arranged in light extraction lens interior;Manufacturing method includes: that CSP light source is welded in circuit base plate;Backlight is lens curing to be bonded in circuit base plate;Spininess is inverted injecting glue and solidification simultaneously;A kind of light refractive type CSP backlight module lens packages structure and manufacturing method of the utility model have the light extraction efficiency for promoting device, the irradiation uniformity, reduce the dosage of device, reduce production cost and energy saving advantage.
Description
Technical field
The utility model relates to photoelectric fields, and in particular to a kind of light refractive type CSP backlight module lens packages structure.
Background technique
CSP(Chip Scale Package) encapsulation, i.e. wafer-level package, it is equal by feat of excellent light extraction efficiency and color
One property, exquisite size advantage and good radiator structure are gradually applied to mobile phone flashlight, automobile front, commercial photograph
Bright equal high-end fields.Currently, CSP device arranges in pairs or groups backlight lens gradually by backlight mould with the continuous development of CSP encapsulation technology
The favor of the fields such as group, headlight for vehicles.
It is limited to the optical design and manufacturing method of current backlight lens, the Illumination Distribution of backlight lens in the prior art
And out luminous intensity still have it is to be hoisted.In order to improve the intensity of LED light, the method for increasing the quantity of LED component is generallyd use, thus
Bring the raising and backlight energy consumption of production cost.Therefore, the light means that go out for seeking to be promoted backlight device are particularly important.It is vertical
Backlight source module is seen, there are air layer boundary between light source device and lens, interface is brought there is serious inner total reflection
It absorbs and causes light loss.For the secondary encapsulation toroidal lens of CSP backlight module lens, organic polymer colloid layer is encapsulated
Air layer is replaced to advantageously reduce the light loss that device goes out optical interface, the entirety of lifting system goes out light, research and envelope in this respect
Dress method is not reported still.
Utility model content
In view of this, to solve above-mentioned the problems of the prior art, the utility model provides a kind of light refractive type CSP backlight
Module lens encapsulating structure has the light extraction efficiency for promoting device, the irradiation uniformity, reduces the dosage of device, reduction is produced into
Sheet and energy saving advantage.
To achieve the above object, the technical solution of the utility model is as follows.
A kind of light refractive type CSP backlight module lens packages structure, including backlight lens, light extraction lens, circuit base plate and
CSP light source, the light extraction lens carry out secondary lens filling encapsulation by backlight lens and are formed, are arranged at backlight lens bottom
Portion, the backlight lens base is equipped with the installing ring that is sealing adhesive, is connected with the sealing concave ring that circuit base plate is equipped with, described
CSP light source is welded on circuit base plate, is mounted on light extraction lens interior.
Further, the installing ring that is sealing adhesive is circular configuration, and width is 1.5~5mm;The backlight lens base
It is also machined with filling glue and reserves runner, be connected to the unthreaded hole on backlight lens, the width of flow path that the filling glue reserves runner is
0.3~2mm.
Further, the sealing concave ring is identical as the installing ring size that is sealing adhesive, be circular configuration, width be 1.5~
5mm, depth are 0.2~0.6mm;Also be machined with injecting glue runner and plastic emitting runner on the circuit base plate, the injecting glue runner and
Plastic emitting runner is reserved runner with filling glue respectively and is connected to.
Further, the installing ring that is sealing adhesive is connect with sealing concave ring by bonding adhesive curing, and the adhesive glue is
Uv-curable glue, glue amount overflow sealing 0.1~0.3mm of concave ring depth, and curing mode is ultra-violet curing.
Further, the backlight lens are made of material polymethyl methacrylate or polycarbonate.
A kind of manufacturing method of light refractive type CSP backlight module lens packages structure, comprising the following steps:
Step 1, the CSP light source installed position brushing tin cream on backlight lens, are welded on circuit base plate for CSP light source
On;
Adhesive glue is coated at step 2, the sealing concave ring on circuit base plate, is carried out by the dowel hole on backlight lens
Positioning, connect with the installing ring that is sealing adhesive and solidifies sealing;
Step 3 stands upside down backlight vertical lens downward, by injecting glue runner on circuit base plate and plastic emitting runner to backlight
Unthreaded hole on lens fills packaging silicon rubber, is formed by curing light refractive type CSP backlight module lens packages structure.
Further, the packaging silicon rubber filled in the step 3 is DOW CORNING OE6650 or PDMS high resiliency flexible glue, refraction
Rate is less than backlight lens, and refractive index is 1.41~1.62;The curing mode is heat cure or ultra-violet curing;The CSP light source
For top surface luminescent device or five surface light-emitting devices.
Further, the refractive index of the packaging silicon rubber is adjusted by adding scattering particles, and the scattering particles is
Zinc oxide or titanium dioxide.
Compared with the prior art, the utility model has the following beneficial effects:
(1) colloid that different refractivity is encapsulated in backlight lens, reduces beam projecting air layer inner total reflection bring
Light loss, promote CSP device goes out optical property, compared to traditional backlight module, it is possible to reduce the usage quantity of device, to drop
Low production cost.
(2) by adjust unthreaded hole in encapsulation light extraction free lens refractive index, the illumination of Effective Regulation radiation source and
The homogenization of hot spot.
(3) by reserving lens installation sealing concave ring on circuit base plate, default injecting glue runner, plastic emitting runner are same with spininess
When injecting glue mode be packaged, improve production efficiency.
(4) air layer is replaced with resin-encapsulated, is conducive to the heat dissipation for enhancing device, to extend the working life of device.
Detailed description of the invention
Fig. 1 is the manufacturing method of one of the utility model embodiment light refractive type CSP backlight module lens packages structure
Flow chart.
Fig. 2 is the structural representation of one of the utility model embodiment light refractive type CSP backlight module lens packages structure
Figure.
Fig. 3 is the structural schematic diagram of the backlight lens in the utility model embodiment.
Fig. 4 is that the backlight module spininess in the utility model embodiment is vertically inverted injecting glue encapsulation schematic diagram simultaneously.
Specific embodiment
The specific implementation of the utility model is described further below in conjunction with attached drawing and specific embodiment.It needs to refer to
Out, the described embodiments are only a part of the embodiments of the utility model, instead of all the embodiments, is based on this reality
It is obtained by those of ordinary skill in the art without making creative efforts every other with the embodiment in novel
Embodiment is fallen within the protection scope of the utility model.
As shown in Fig. 2, a kind of structural representation of light refractive type CSP backlight module lens packages structure for the utility model
Figure, including backlight lens 1, light extraction lens 2, circuit base plate 5 and CSP light source 10, the light extraction lens 2 pass through backlight lens
1, which carries out secondary lens filling encapsulation, forms, and setting is equipped with the peace that is sealing adhesive in 1 bottom of backlight lens, 1 bottom surface of backlight lens
Dress circle 3, is connected with the sealing concave ring 6 that circuit base plate 5 is equipped with, and the CSP light source 10 is welded on circuit base plate 5, installation
In 2 inside center of light extraction lens.
Preferably, the installing ring 3 that is sealing adhesive is circular configuration, and width is 1.5~5mm;1 bottom surface of backlight lens
It is also machined with filling glue and reserves runner 4, be connected to the unthreaded hole 13 on backlight lens 1, width of flow path is 0.3~2mm.Such as Fig. 3 institute
Show that backlight lens 1 include that lens go out light concave point 11, lens unthreaded hole goes out arc of lighting face 12 and Fresnel line ring 14.
Preferably, the sealing concave ring 6 is circular configuration, and width is 1.5~5mm, and depth is 0.2~0.6mm;The line
Injecting glue runner 7 and plastic emitting runner 8 are also machined on base board 5, the injecting glue runner 7 and plastic emitting runner 8 are pre- with filling glue respectively
Runner 4 is stayed to be connected to.
Preferably, the installing ring 3 that is sealing adhesive is connect with sealing concave ring 6 by bonding adhesive curing, and the adhesive glue is
Uv-curable glue 9, glue amount overflow sealing 6 0.1~0.3mm of depth of concave ring, and curing mode is ultra-violet curing.
Preferably, the backlight lens 1 are made of material polymethyl methacrylate or polycarbonate.
Embodiment 1
As shown in Figure 1, a kind of manufacturing method process of light refractive type CSP backlight module lens packages structure of the utility model
Figure, comprising the following steps:
Step 1, five surface illuminators have installed position brushing tin cream on backlight lens 1, and five surface illuminators are had and are welded
On circuit base plate 5;
Step 2 coats uv-curable glue 9 at the sealing concave ring 6 on circuit base plate 5, passes through the positioning on backlight lens 1
Pin hole 15 is positioned, and is connect with the installing ring 3 that is sealing adhesive and is sealed by ultra-violet curing mode;
Step 3, as shown in figure 4, by backlight lens 1 vertically stand upside down downward, pass through 7 He of injecting glue runner on circuit base plate 5
To the unthreaded hole 13 on backlight lens 1, spininess fills DOW CORNING OE6650 packaging silicon rubber to plastic emitting runner 8 simultaneously, after end-of-fill, protects
Hold 150 DEG C of ambient cures, 3 hours formation light refractive type CSP backlight module lens packages structures.
Embodiment 2
As shown in Figure 1, a kind of manufacturing method process of light refractive type CSP backlight module lens packages structure of the utility model
Figure, comprising the following steps:
It is substantially the same manner as Example 1, the difference is that the packaging silicon rubber filled in step 3 is healthy and free from worry PDMS and TiO2's
Complex colloid changes the refractive index of packaging silicon rubber while encapsulation, is thus further reduced light caused by the inner total reflection of light
Loss and further Lifting Modules group go out the uniformity of light.
In conclusion a kind of light refractive type CSP backlight module lens packages structure and manufacturing method of the utility model, have
Light extraction efficiency, the irradiation uniformity for promoting device, reduce the dosage of device, reduce production cost and energy saving advantage.
Claims (7)
1. a kind of light refractive type CSP backlight module lens packages structure, it is characterised in that: including backlight lens (1), light extraction lens
(2), circuit base plate (5) and CSP light source (10), the light extraction lens (2) carry out secondary lens filling by backlight lens (1)
Encapsulation is formed, and is arranged in backlight lens (1) bottom;Backlight lens (1) bottom surface is equipped with and is sealing adhesive installing ring (3), with line
The sealing concave ring (6) that base board (5) is equipped with is connected, and the CSP light source (10) is welded on circuit base plate (5), is mounted on
Light extraction lens (2) are internal.
2. a kind of light refractive type CSP backlight module lens packages structure according to claim 1, it is characterised in that: described close
Envelope bonding installing ring (3) is circular configuration, and width is 1.5~5mm;It is pre- that backlight lens (1) bottom surface is also machined with filling glue
Runner (4) are stayed, are connected to the unthreaded hole (13) on backlight lens (1), the width of flow path that the filling glue reserves runner (4) is 0.3
~2mm.
3. a kind of light refractive type CSP backlight module lens packages structure according to claim 1, it is characterised in that: described close
Envelope concave ring (6) is identical as the installing ring that is sealing adhesive (3) size, is circular configuration.
4. a kind of light refractive type CSP backlight module lens packages structure according to claim 1, it is characterised in that: described close
Envelope concave ring (6) width is 1.5~5mm, and depth is 0.2~0.6mm.
5. being also machined with injecting glue runner (7) and plastic emitting runner (8) on the circuit base plate (5), the injecting glue runner (7) and plastic emitting
Runner (8) is reserved runner (4) with filling glue respectively and is connected to.
6. a kind of light refractive type CSP backlight module lens packages structure according to claim 1, it is characterised in that: described close
Envelope bonding installing ring (3) is connect with sealing concave ring (6) by bonding adhesive curing, and the adhesive glue is uv-curable glue (9), glue amount
Sealing concave ring (6) 0.1~0.3mm of depth is overflowed, curing mode is ultra-violet curing.
7. a kind of light refractive type CSP backlight module lens packages structure according to claim 1, it is characterised in that: the back
Optical lens (1) is made of material polymethyl methacrylate or polycarbonate.
Priority Applications (1)
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CN201821640621.6U CN208998011U (en) | 2018-10-10 | 2018-10-10 | A kind of light refractive type CSP backlight module lens packages structure |
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CN201821640621.6U CN208998011U (en) | 2018-10-10 | 2018-10-10 | A kind of light refractive type CSP backlight module lens packages structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109340711A (en) * | 2018-10-10 | 2019-02-15 | 华南理工大学 | A kind of light refractive type CSP backlight module lens packages structure and manufacturing method |
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2018
- 2018-10-10 CN CN201821640621.6U patent/CN208998011U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109340711A (en) * | 2018-10-10 | 2019-02-15 | 华南理工大学 | A kind of light refractive type CSP backlight module lens packages structure and manufacturing method |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190618 Termination date: 20191010 |