CN201228951Y - Low absorption and high light effect LED illuminating apparatus - Google Patents
Low absorption and high light effect LED illuminating apparatus Download PDFInfo
- Publication number
- CN201228951Y CN201228951Y CNU200820094165XU CN200820094165U CN201228951Y CN 201228951 Y CN201228951 Y CN 201228951Y CN U200820094165X U CNU200820094165X U CN U200820094165XU CN 200820094165 U CN200820094165 U CN 200820094165U CN 201228951 Y CN201228951 Y CN 201228951Y
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- China
- Prior art keywords
- high light
- illuminating apparatus
- base plate
- led illuminating
- fluorescent substance
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to an LED lighting device with low attenuation and high light efficiency, belonging to the semiconductor components, in particular to an LED lighting device, which comprises that an aluminum base plate is arranged on a cooling plate, a blue LED chip is fixed on the aluminum base plate, and an outer cover is transparent, fluorescent substance is filled in the transparent cover, the LED chip is directly bound on the aluminum base plate, and a circuit is coated on the aluminum base plate. The fluorescent substance is Y A G or T A G, the fluorescent substance in the transparent cover is shaped with the material of the transparent cover through the one-time injection, filler substance is filled between the aluminum base plate and the transparent cover, and the filler substance can be silica gel. The utility model facilitates fluorescent powder and luminescent material to separate owing to directly solidifying the fluorescent substance in the transparent cover, and heat energy emitted by the luminescent material can not cause the attenuation of the fluorescent substance, thereby increasing the service life and the photochromic consistency of the LED lighting device. Simultaneously, the side of the luminescent material is not provided with the fluorescent substance, thereby reducing down rays caused by the scattering of the fluorescent material, and increasing the extraction efficiency.
Description
Technical field:
The utility model relates to semiconductor devices, especially the LED lighting device.
Background technology:
Existing LED lighting device, normally adopt the White LED of encapsulated moulding to make, White LED is used blue light usually, purple light or ultraviolet excitation RGB fluorescent material obtain white light, for example blue light emitting material adds the mode of YAG fluorescent material, such as in Chinese patent application 200310120736 disclosed a kind of " surface installing type white light-emitting diode ", Chinese patent ZL 02100345 disclosed " a kind of high-brightness nitride light emitting diode and preparation method thereof ", and Chinese patent application 01141509 disclosed " a kind of manufacture method of white light-emitting diode ".
In the actual production process of above-mentioned known branch art, usually adopt fluorescent material is mixed with liquid state, on luminescent material, add the mode that fluorescent material covers luminescent material, its shortcoming is: 1. the precipitation of fluorescent material is difficult to control evenly, its easy mobility causes the hot spot effect of finished product LED bad, and uniformity is bad during batch process, and 2. wherein most of fluorescent material is deposited to the side-lower of luminescent material, to luminous not contribution, cause serious waste; 3. fluorescent material directly contacts with luminescent material, and the heat that luminescent material sends causes the decay of fluorescent material very big, thereby has shortened service life.How around luminescent crystal, to form uniform fluorescent material coating, with produce luminous evenly and the white light-emitting diodes of high conformity, and reduce the consumption of fluorescent material as far as possible and simplify the curing process of fluorescent material glued membrane, to reduce production costs, do not provide good solution in the prior art.
Summary of the invention:
The purpose of this utility model is: provide a kind of luminous fluorescent substance is separated with luminescent material, the heat that makes luminescent material send can not cause the decay to fluorescent material, thereby improve the life-span, and direct nation fixes on the aluminum substrate with the LED luminescent material, can reduce the low attenuation high light efficiency LED illuminating apparatus of the production cost of LED lighting device.
It is included in aluminium base is set on the heat sink, fixing blue led chip on the aluminium base, and its outer cover is a translucent cover.
Be filled with fluorescent material in the translucent cover.
Led chip directly is bundled on the aluminium base.
Be covered with circuit on the aluminium base.
Fluorescent material is: YAG or TAG.
Fluorescent material and translucent cover material single injection-molded in the translucent cover.
Between aluminium base and translucent cover, inject filler.
Filler can be a silica gel.
The utility model is owing to separate fluorescent material with luminescent material, the heat that makes luminescent material send can not cause the decay to fluorescent material, prolongs the LED lighting device life-span; Simultaneously, the luminescent material side does not have fluorescent material, has reduced the fluorescent material scattering and has caused light to the bottom, thereby improved light extraction efficiency; In addition, because translucent cover is made with special mould, shape is to determine that according to the luminous intensity distribution of led chip size identical property is fine, thereby makes that the uniformity of producing each the LED lighting device that comes out in batches is fine.The profile of translucent cover utilizes optical design accurately to calculate, and can better improve light extraction efficiency.
Description of drawings:
Accompanying drawing 1 is a main pseudosection of the present utility model.
The specific embodiment:
Be described in further detail below in conjunction with shown in the accompanying drawing:
Aluminium base (4) is set on heat sink (5), goes up binding led chip (1) at aluminium base (4); With spun gold (2) both positive and negative polarity of led chip (1) is connected with circuit on the aluminium base (4); Be about to fluorescent material (6) during moulding translucent cover (3) and add one-shot forming; The translucent cover (3) that will contain fluorescent material (6) is fixed on the top of led chip.Inject filler (7) between aluminium base (4) and translucent cover (3), filler (7) can be a silica gel, also can be other similar filler (7).
The structure in the white light emitting diode production process at the liquid fluorescent material of luminescent material (4) surface coverage (6), change into fluorescent material (6) is placed in the translucent cover (3), fluorescent material (6) is separated with led chip (1), and led chip (1) directly is bundled on the aluminium base (4), to reduce its decay, to improve light extraction efficiency and luminous uniformity.
The utility model can be used for multiple lighting devices such as LED fluorescent lamp, LED street lamp, LED shot-light, LED desk lamp, LED bulb.
The enforcement of the utility model is not limited to the disclosed mode of above most preferred embodiment.
Claims (8)
1, a kind of low attenuation high light efficiency LED illuminating apparatus is characterized in that: it is included in aluminium base is set on the heat sink, fixing blue led chip on the aluminium base, and its outer cover is a translucent cover.
2, low attenuation high light efficiency LED illuminating apparatus as claimed in claim 1 is characterized in that: be filled with fluorescent material in the translucent cover.
3, low attenuation high light efficiency LED illuminating apparatus as claimed in claim 1, it is characterized in that: led chip directly is bundled on the aluminium base.
4. low attenuation high light efficiency LED illuminating apparatus as claimed in claim 1 is characterized in that: be covered with circuit on the aluminium base.
5. low attenuation high light efficiency LED illuminating apparatus as claimed in claim 1 or 2, it is characterized in that: fluorescent material is: YAG or TAG.
6. low attenuation high light efficiency LED illuminating apparatus as claimed in claim 1 or 2 is characterized in that: fluorescent material and translucent cover material single injection-molded in the translucent cover.
7. low attenuation high light efficiency LED illuminating apparatus as claimed in claim 1 is characterized in that: inject filler between aluminium base and translucent cover.
8. as claim 1 or 7 described low attenuation high light efficiency LED illuminating apparatus, it is characterized in that: filler can be a silica gel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820094165XU CN201228951Y (en) | 2008-05-23 | 2008-05-23 | Low absorption and high light effect LED illuminating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820094165XU CN201228951Y (en) | 2008-05-23 | 2008-05-23 | Low absorption and high light effect LED illuminating apparatus |
Publications (1)
Publication Number | Publication Date |
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CN201228951Y true CN201228951Y (en) | 2009-04-29 |
Family
ID=40633896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNU200820094165XU Expired - Fee Related CN201228951Y (en) | 2008-05-23 | 2008-05-23 | Low absorption and high light effect LED illuminating apparatus |
Country Status (1)
Country | Link |
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CN (1) | CN201228951Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102080775A (en) * | 2010-11-23 | 2011-06-01 | 山西乐百利特科技有限责任公司 | High-power LED green light lamp |
CN102221132A (en) * | 2011-06-13 | 2011-10-19 | 郑胜 | LED (light-emitted diode) light source structure applied on lamps |
CN102339932A (en) * | 2011-08-22 | 2012-02-01 | 浙江英特来光电科技有限公司 | Outdoor ceramic high-power LED (light-emitting diode) light source |
-
2008
- 2008-05-23 CN CNU200820094165XU patent/CN201228951Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102080775A (en) * | 2010-11-23 | 2011-06-01 | 山西乐百利特科技有限责任公司 | High-power LED green light lamp |
CN102221132A (en) * | 2011-06-13 | 2011-10-19 | 郑胜 | LED (light-emitted diode) light source structure applied on lamps |
CN102339932A (en) * | 2011-08-22 | 2012-02-01 | 浙江英特来光电科技有限公司 | Outdoor ceramic high-power LED (light-emitting diode) light source |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 Termination date: 20160523 |