CN103489857B - A kind of White LED light-emitting device - Google Patents
A kind of White LED light-emitting device Download PDFInfo
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- CN103489857B CN103489857B CN201310405340.8A CN201310405340A CN103489857B CN 103489857 B CN103489857 B CN 103489857B CN 201310405340 A CN201310405340 A CN 201310405340A CN 103489857 B CN103489857 B CN 103489857B
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Abstract
A kind of White LED light-emitting device, comprising base, COB light source module, wavelength conversion component and reflection shield；The bottom connect base of reflection shield, COB light source module is fixed on base, a face in face of wavelength conversion component, and the contact conductor of the blue-light LED chip in COB light source module passes base；Wavelength conversion component is not directly contacted with the blue-light LED chip in COB light source module, has fixed mechanism to connect and utilize high transmittance silica gel between the two, the organic or inorganic transparent material filling of epoxy or other high transmittances and high chemical stability；The gap between blue-light LED chip in wavelength conversion component and COB light source module is 0.5 millimeter to 1 centimetre.The present invention both can effectively solve the problems, such as traditional COB light source device light efficiency decline, light-emitting phosphor deterioration in characteristics, and it is possible to prevente effectively from using in the light-emitting device manufactured by long-range packaging technology occur uneven illumination it is even, light irradiation area is narrow and needs the defect of secondary optical design.
Description
Technical field
The present invention relates to light-emitting device, and more particularly to warm white LED light-emitting device.
Background technology
Used as novel illumination light source, with energy-saving and environmental protection and many advantages, such as the long-life, its operation principle is white light LEDs
White light is obtained using the phosphor combination (or other combinations) of blue chip and yellow.Presently mainly by silica gel or tree
Fat is applied directly to blue chip surface and is packaged after mixing with fluorescent material, these packaging technologies include two kinds of important encapsulation
Mode, paster type encapsulation and integration packaging (COB).Multiple chips can be directly encapsulated into Metal Substrate or pottery by wherein COB encapsulation
On porcelain base circuit board, directly radiated by substrate, it is possible to reduce packaging cost.In COB encapsulation, silica gel or resin and fluorescent material
Blue chip surface is applied directly to after mixing, this encapsulation technology has its inherent defect.Due to silica gel (or resin) and fluorescence
Powder is directly contacted with blue chip, and chip operating temperature higher causes that the luminous intensity of fluorescent material declines.In warm white encapsulation
The middle different fluorescent material (bloom adds rouge and powder) for using, because their attenuation characteristics are different, the luminous intensity decay of COB light source
While, colour rendering index also changes, and causes COB light source quality deterioration.On the other hand, fluorescent powder grain can also reflect a part of light
Line enters blue chip, have impact on the light efficiency of luminescent device.
CN102646674A discloses a kind of White LED light-emitting device.White LED light-emitting device includes：Base, blue light
LED chip, reflection shield and glass substrate.Two ends difference connect base and the glass substrate of reflection shield, blue-light LED chip are arranged on
Seating plane is to the one side of glass substrate, and the contact conductor of blue-light LED chip passes base, is applied on a surface of glass substrate
The glass coating containing fluorophor is covered, when the refractive index of glass coating is less than the refractive index of glass substrate, glass substrate scribbles glass
Facing to base, when the refractive index of glass coating is more than the refractive index of glass substrate, glass substrate is not applied the one of glass coating
Have the one of glass coating facing to base.The glass that the present invention contains fluorophor using the blue light illumination that blue-light LED chip sends
The glass substrate of coating obtains white light, alleviates heat dissipation problem, and fluorophor is also not in because caused by device heat dissipation problem
Emission wavelength drift phenomenon.
CN102810537A discloses a kind of White LED light-emitting device, including base, blue-light LED chip, reflection shield and contains
There is the transparency carrier of fluorescent coating, two ends difference connect base and the substrate of reflection shield, reflection shield internal reflection surface are provided with
Reflector layer, blue-light LED chip is arranged on seating plane the one side of fluorescent coating to transparency carrier, and blue-light LED chip electricity
Pole lead passes base；Wherein blue-light LED chip is the chip of single chip, one group of series, parallel or series-parallel connection.Transparency carrier can
Being plane or convex-surface type or cylindrical.The present invention contains fluorophor painting using the blue light illumination that blue-light LED chip sends
The transparency carrier of layer obtains white light, and reduce causes because the light portion that fluorophor is excited to send reenters chip and absorbed
Luminous loss, also alleviate heat dissipation problem, fluorophor is also not in because of emission wavelength drift caused by device heat dissipation problem
And luminous efficiency decline etc. phenomenon.
CN102945918A discloses a kind of warm white LED light-emitting device, including：Base, while being provided with blue-light LED chip
Group and red LED chip group, reflection shield and wavelength conversion component；Two ends (top and bottom or front end and the rear end two of reflection shield
End) connect base and wavelength conversion component respectively, blue-light LED chip group and red LED chip group be arranged on base, in face of wavelength
One face of transition components, and the contact conductor of blue-light LED chip group and red LED chip group passes base.The painting of fluorophor
Layer is located in wavelength conversion component in face of the one side of LED blue chips and red light chips emergent rays or in another side.Wavelength
Transition components are one piece of acrylic board or glass plate of the transparent organic coating scribbled containing fluorophor；The present invention utilizes blue-ray LED
The transparent organic coating or glass coating that the red light irradiation that the blue light and red LED chip that chip sends send contains fluorophor come
The warm white of high color rendering index (CRI) is obtained, heat dissipation problem is alleviated.
The problems such as prior art solves light efficiency decline and quality deterioration using long-range encapsulation (also referred to as remote excitation), remotely
In encapsulation technology wavelength is carried out at the light extraction of light-emitting device using organic board or glass board material containing fluorescent coating
Change and obtain white light through mixed light.The area in the resettlement area of blue chip and light conversion coating region in long-range encapsulation technology
It is general to there is the blue light luminous flux received in larger difference, therefore light conversion coating area unit area to have larger difference, it is difficult to
Accomplish white light that whole light conversion coating region completes to be obtained after wavelength convert and mixed light all have identical quality (such as colour temperature and
Colour rendering index etc.).Additionally, in order to accomplish that light irradiation area expands, and uniform lighting effect is obtained, it is necessary to light-emitting device
Secondary optical design (such as street lamp), complex process are carried out luxuriously.
Goal of the invention
The purpose of the present invention is：Propose a kind of White LED light-emitting device, wavelength conversion component and COB light source module it
Between increase the packing material of high transmittance, both intercepted blue-light LED chip in COB light source module operating temperature higher to ripple
The influence of transition components long, shortens the distance between wavelength conversion component and COB light source module again.The device both can be effective
Solve the problems, such as the decline of device light efficiency, the light-emitting phosphor deterioration in characteristics of above-mentioned traditional COB light source, and it is possible to prevente effectively from profit
With in the light-emitting device manufactured by long-range packaging technology occur uneven illumination it is even, light irradiation area is narrow and needs secondary light
Learn the defect of design.
The technical scheme is that：A kind of White LED light-emitting device, comprising base, COB light source module, wavelength convert
Component and reflection shield；The bottom connect base of reflection shield, COB light source module is fixed on base, in face of wavelength conversion component one
The contact conductor of the blue-light LED chip in individual face, and COB light source module passes base；Wavelength conversion component and COB light source module
In blue-light LED chip be not directly contacted with, there is fixed mechanism to connect between the two；Profit between wavelength conversion component and COB light source module
Filled with the organic or inorganic transparent material of high transmittance silica gel, epoxy or other high transmittances and high chemical stability；Wavelength
The gap between blue-light LED chip in transition components and COB light source module is 0.5 millimeter to 1 centimetre.
Further, the baseplate material of the COB light source module is metal, alloy or ceramics.
Further, it is integrated with blue-light LED chip group in the COB light source module；Blue-light LED chip can be jewel
(Al2O3) Grown blue chip, or in SiC substrate grow blue chip, or Si Growns indigo plant
It is transferred on other substrates after being grown on optical chip, or any one in above-mentioned three kinds of substrates.
Further, the blue-light LED chip group is the chip of one group of series, parallel or series-parallel connection, blue in COB light source module
Optical chip can be evenly arranged into square, rectangle or circular pattern.
Further, the wavelength conversion component is the transparent resin plate containing fluorescence resin coating or coating containing fluorescent glass
Transparency glass plate；Transparent resin plate material be acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resins,
Epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or the enhanced PMMA or MS resins of PC；Glass
Glass plate is that have alkali glass, alkali-free glass, quartz glass, or using the mill for thering is alkali glass, alkali-free glass or quartz glass to be prepared into
Sand glass.
Further, the fluorescence resin coating is the mixture of fluorophor and resin, and the fluorescent glass coating is glimmering
The mixture of body of light and low-melting glass；The fluorophor is LED yellow fluorescent powders；It is glimmering in order to improve the colour rendering index of white light
Body of light can also be the LED green emitting phosphors of arbitrary proportion yellow with the LED of the mixture of LED red fluorescence powders or arbitrary proportion
The mixture of color fluorescent material and LED red fluorescence powders.
Further, some red LED chips are uniformly laid in the blue-light LED chip group, regulation light-emitting device is sent out
Go out the colour temperature of light, now fluorescent coating can only include yellow fluorescent powder；Luminous flux that red LED chip is glowed with
The ratio between luminous flux that red LED chip is glowed and summation of luminous flux of blue-light LED chip institute blue light-emitting for 0.3%~
27%；Red LED chip is III/V compound semiconductors red light chips (such as InGaAlP) or its derived varieties.
Further, the reflection shield is placed on the mixture that COB light source module is constituted with light transition components, reflection shield
Metallic film is coated with internal reflection surface；Reflection shield can be in cylinder, reverse frustoconic, bowl-type, cuboid and prismatic table shape.
The beneficial effects of the invention are as follows：
(1) increase the packing material of high transmittance between wavelength conversion component and COB light source module, intercept COB light
Influence of blue-light LED chip in the module of the source operating temperature higher to wavelength conversion component, effectively solves traditional COB light source
Device light efficiency decline, the problem of light-emitting phosphor deterioration in characteristics.
(2) gap between the blue-light LED chip in wavelength conversion component and COB light source module is 0.5 millimeter to 1 li
Rice, shortens the distance between wavelength conversion component and COB light source module, is prevented effectively from using manufactured by long-range packaging technology
The uneven illumination of appearance is even in light-emitting device, light irradiation area is narrow and needs the defect of secondary optical design.
(3) purpose of base be radiate, realize light-emitting device electrical connection and play fixed COB light source module.
(4) baseplate material of COB light source module is metal, alloy or ceramics, is heated and is unlikely to deform, steady with good heat
It is qualitative.
(5) in light-emitting device made according to the present invention, directly silica gel or resin are not coated with the mixture of fluorophor
It is packaged in the LED blue chip groups of COB light source module, the operating temperature of fluorescent material is greatly lowered, and effectively alleviates glimmering
The light decay of light powder, alleviates device colour rendering index variation issue caused by the attenuation characteristic difference because of different fluorescent material, significantly prolongs
The service life of luminescent device long.
Brief description of the drawings
Fig. 1 is the structural representation of White LED light-emitting device of the invention；
Fig. 2 is the square COB blue light sources planar structure schematic diagram in embodiment；
Fig. 3 is the circular COB blue light sources planar structure schematic diagram in embodiment.
Specific embodiment
Specific embodiment of the present utility model is further described below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of White LED light-emitting device of the invention.Contact conductor 1 including blue-light LED chip,
Base 2, COB light source module 3, wavelength conversion component, the bindiny mechanism 4 between wavelength conversion component and COB blue light sources, wavelength turns
Change the filler 6 and reflection shield 9 between component and COB light source module 3.The wavelength conversion component is comprising YAG yellow fluorescent powders
Fluorescent glass coating 7 and glass substrate 8.The fluorescent glass coating 7 is the mixture of fluorophor and low-melting glass, described
Glass substrate 8 is that have alkali glass, alkali-free glass, quartz glass, or utilizing has alkali glass, alkali-free glass or quartz glass to be prepared into
Ground glass.The general fluorophor is LED yellow fluorescent powders, and in order to improve the colour rendering index of white light, fluorophor can also
The LED green emitting phosphors of arbitrary proportion with the LED yellow fluorescent powders of the mixture of LED red fluorescence powders or arbitrary proportion with
The mixture of LED red fluorescence powders.
In White LED light-emitting device, base 2 has thermolysis, the bottom connect base 2 of reflection shield 9, COB light source mould
Group 3 is fixed on base 2, a face in face of wavelength conversion component, and the electrode of the blue-light LED chip in COB light source module 3 and draws
Line 1 passes base 2；Wavelength conversion component is not directly contacted with the blue-light LED chip in COB light source module 3, there is fixation between the two
Mechanism connects；Filler 6 between wavelength conversion component and COB light source module 3 is high transmittance silica gel, epoxy or other height are saturating
Cross the organic or inorganic transparent material of rate and high chemical stability；Blue-ray LED in wavelength conversion component and COB light source module 3
Gap between chip is 0.5 millimeter to 1 centimetre；The reflection shield 9 is placed in COB light source module 3 with light transition components composition
On mixture, metallic film is coated with the internal reflection surface of reflection shield 9, improves reflective function.After switching on power, COB light source mould
Group sends blue light, the part for exciting the gold-tinted that the fluorescent glass coating 7 comprising YAG yellow fluorescent powders sends to be sent with blue chip
Blue light, the ejecting white light after reflection shield collection, guiding.
Preferably, the wavelength conversion component is fluorescence resin coating and resin substrate comprising YAG yellow fluorescent powders.Thoroughly
Ming tree fat substrate material is acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resins, epoxy, butylbenzene, benzene
Sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or the enhanced PMMA or MS resins of PC, fluorescence resin coating is
The mixture of fluorophor and resin.
Preferably, reflection shield can be in cylinder, reverse frustoconic, bowl-type, cuboid and prismatic table shape.
In the present invention, blue chip can be evenly arranged into square, rectangle or circular pattern in COB light source module.
The square COB blue light sources planar structure schematic diagram in embodiment is illustrated in figure 2, the circle in embodiment is illustrated in figure 3
COB blue light source planar structure schematic diagrams, including COB light source module substrate 5 and blue-light LED chip 10, the COB light source mould
The material of substrate 5 of group is metal, alloy or ceramics, is heated and is unlikely to deform, with good heat endurance.The COB light source mould
Blue-light LED chip group is integrated with group, blue-light LED chip group is the chip of one group of series, parallel or series-parallel connection, blue-light LED chip 5
Can be jewel (Al2O3) Grown blue chip, or the blue chip grown in SiC substrate, or Si substrates
It is transferred on other substrates after being grown on the blue chip of upper growth, or any one in above-mentioned three kinds of substrates.
Preferably, some red LED chips, regulation light-emitting device institute can be uniformly laid in the blue-light LED chip group
The colour temperature for emitting beam, now fluorescent coating can only comprising yellow fluorescent powder；The luminous flux that red LED chip is glowed
The ratio between luminous flux for being glowed with red LED chip and summation of luminous flux of blue-light LED chip institute blue light-emitting for 0.3%~
27%；Red LED chip is III/V compound semiconductors red light chips (such as InGaAlP) or its derived varieties.
Although prior art scheme of the present invention and preferred embodiment statement are as above, so it is not limited to the present invention.This
Has usually intellectual in technical field that the present invention belongs to, without departing from the spirit and scope of the present invention, when various changes can be made
Change, substitute and retouching.Therefore, protection scope of the present invention is worked as and is defined depending on those as defined in claim.
Claims (1)
1. a kind of White LED light-emitting device, it is characterised in that：Comprising base, COB light source module, wavelength conversion component and reflective
Cover；The bottom connect base of reflection shield, COB light source module is fixed on base, a face in face of wavelength conversion component, and COB
The contact conductor of the blue-light LED chip in light source module passes base；Blue light in wavelength conversion component and COB light source module
LED chip is not directly contacted with, and has fixed mechanism to connect between the two；High transmission is utilized between wavelength conversion component and COB light source module
Rate silicone filler；The gap between blue-light LED chip in wavelength conversion component and COB light source module is 0.5 millimeter to 1 li
Rice；The baseplate material of the COB light source module is metal, alloy or ceramics；The blue-light LED chip group be one group of series connection and
Connection or the chip of series-parallel connection, blue chip can be evenly arranged into square, rectangle or circular pattern in COB light source module；Institute
State reflection shield to be placed on the mixture that COB light source module is constituted with light transition components, gold is coated with reflection shield internal reflection surface
Category film；Reflection shield is in reverse frustoconic or prismatic table shape；
Blue-light LED chip group is integrated with the COB light source module；Blue-light LED chip is the blue light core of jewel Grown
The blue chip grown on piece, or SiC substrate, or Si Growns blue chip, or in above-mentioned three kinds of bases
It is transferred on other substrates after being grown in any one in plate；
The wavelength conversion component is the transparent resin plate containing fluorescence resin coating or the transparency glass plate containing fluorescent glass coating；
Transparent resin plate material is acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resins, epoxy, butylbenzene, benzene
Sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or the enhanced PMMA or MS resins of PC；Glass plate is that have alkali glass
Glass, alkali-free glass, quartz glass, or using the ground glass for thering is alkali glass, alkali-free glass or quartz glass to be prepared into；
The fluorescence resin coating is the mixture of fluorophor and resin, and the fluorescent glass coating is fluorophor and low melting point glass
The mixture of glass；The fluorophor is LED yellow fluorescent powders, or the LED green emitting phosphors of arbitrary proportion are glimmering with LED red
The mixture of the mixture of light powder or the LED yellow fluorescent powders of arbitrary proportion and LED red fluorescence powders；
Some red LED chips are uniformly laid in the blue-light LED chip group, the colour temperature of light-emitting device emitted light is adjusted,
Now fluorescent coating only includes yellow fluorescent powder；The luminous flux that red LED chip is glowed is rubescent with red LED chip institute
The ratio between the luminous flux of light and the summation of luminous flux of blue-light LED chip institute blue light-emitting are 0.3%~27%；Red LED chip is
III/V compound semiconductors red light chips or its derived varieties；
The red LED chip is III/V compound semiconductor red light chips AlGaInP.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310405340.8A CN103489857B (en) | 2013-09-06 | 2013-09-06 | A kind of White LED light-emitting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310405340.8A CN103489857B (en) | 2013-09-06 | 2013-09-06 | A kind of White LED light-emitting device |
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| CN103489857A CN103489857A (en) | 2014-01-01 |
| CN103489857B true CN103489857B (en) | 2017-06-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108087737A (en) * | 2018-02-09 | 2018-05-29 | 超视界激光科技（苏州）有限公司 | LED illumination module and LED illumination lamp |
| CN108105597A (en) * | 2018-02-09 | 2018-06-01 | 超视界激光科技（苏州）有限公司 | High-brightness LED illuminating module and headlamp |
| CN110054806B (en) * | 2019-04-26 | 2020-10-16 | 金旸（厦门）新材料科技有限公司 | Anti-oxidation system, high-temperature-resistant nylon material, application and LED support |
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| CN103155187A (en) * | 2010-10-08 | 2013-06-12 | 欧司朗股份有限公司 | Optoelectronic semiconductor component and method for producing same |
| CN102633440A (en) * | 2012-04-26 | 2012-08-15 | 南通脉锐光电科技有限公司 | Glass coating containing fluorophor and method for producing glass coating, and light-emitting device and method for manufacturing light-emitting device |
| CN102646674A (en) * | 2012-04-26 | 2012-08-22 | 南通脉锐光电科技有限公司 | Light-emitting device of white-light LED (light-emitting diode) |
| CN102810537A (en) * | 2012-08-17 | 2012-12-05 | 南通脉锐光电科技有限公司 | White-light LED lighting device |
| CN102891242A (en) * | 2012-10-30 | 2013-01-23 | 四川新力光源股份有限公司 | LED (Light-Emitting Diode) package device |
| CN102945918A (en) * | 2012-12-05 | 2013-02-27 | 南通脉锐光电科技有限公司 | Warm white LED (light-emitting diode) light-emitting device |
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