CN201282151Y - High power light-emitting diode device - Google Patents
High power light-emitting diode device Download PDFInfo
- Publication number
- CN201282151Y CN201282151Y CNU2008200124818U CN200820012481U CN201282151Y CN 201282151 Y CN201282151 Y CN 201282151Y CN U2008200124818 U CNU2008200124818 U CN U2008200124818U CN 200820012481 U CN200820012481 U CN 200820012481U CN 201282151 Y CN201282151 Y CN 201282151Y
- Authority
- CN
- China
- Prior art keywords
- silica gel
- conversion film
- epoxy resin
- fluorescent material
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The utility model aims to provide a high power LED device, which has the advantages of uniform luminescence, excellent heat dissipation performance and long service life. the high power LED device comprises a lens, transparent silica gel or epoxy resin, a phosphor powder optical conversion film, a gold thread, a plastic base with a concave cavity in the middle, an electrode pin, an LED chip, silver gel, heat sink, heat conduction gel or a heat conduction silica gel gasket, and an aluminum baseplate. The transparent silica gel or the epoxy resin fills the gaps between the lens and the phosphor powder optical conversion film as well as the phosphor powder optical conversion film and the LED chip, wherein, the phosphor powder optical conversion film is arranged on the transparent silica gel or the epoxy resin used for coating the LED chip and connecting the chip and the gold thread of the electrode pin, and is lower than the upper part edge of the concave cavity of the plastic base.
Description
Technical field
The utility model relates to luminescent device, particularly a kind of great power LED device that adopts fluorescent material light conversion film structure.
Background technology
In recent years, along with the semiconductor LED technology rapid development, the LED illumination more and more is subjected to people's attention and attention.LED is the development trend of following illumination owing to have advantages such as energy-saving and environmental protection, operating voltage are low, long service life.But traditional low shortcoming of low-power LED brightness is difficult to satisfy the demand of actual illumination.The prior art restriction of defectives such as the development of great power LED is dispelled the heat, luminous efficiency, useful life is difficult to large-scale promotion and use.
Summary of the invention
Purpose of the present invention is exactly at the deficiencies in the prior art, and a kind of great power LED device is provided, and has good heat dissipation effect, long service life, luminous advantage of uniform.
Goal of the invention of the present utility model is achieved through the following technical solutions:
A kind of great power LED device comprises:
Aluminium base;
Be positioned at the plastic feet at aluminium base center;
Be positioned at the heat sink of plastic feet cavity center;
Connect heat sink and heat-conducting glue or heat conductive silica gel pad aluminium base;
Be positioned at the led chip of heat sink central upper portion;
The elargol of fixed L ED chip on heat sink central upper portion;
The electrode pin that connects plastic feet inside and outside electrode district;
The gold thread that connects led chip and plastic feet internal electrode pin;
Wrap the transparent silica gel or the epoxy resin of led chip and the gold thread that is connected chip and electrode pin;
Be positioned at the transparent silica gel that wraps led chip and gold thread or the fluorescent material light conversion film on the epoxy resin;
Be filled in transparent silica gel or epoxy resin in the lens, on the fluorescent material conversion film;
Be positioned at the lens on the plastic feet.
According to a kind of preferred version of the present utility model, in above-mentioned great power LED device, the laminar film that employed fluorescent material light conversion film is made up of fluorescent material and organic resin material.
Compared with prior art, outstanding advantage of the present utility model is, heat can dispel the heat by aluminium base, special in fluorescent material is present among the light conversion film, and by transparent silica gel or epoxy resin and luminescence chip isolation, the heat of avoiding fluorescent material to absorb the chip emission can't be got rid of, thereby has prolonged the useful life of chip and fluorescent material, and then prolongs the useful life of LED.The laminar film that fluorescent material and organic resin material are formed, make fluorescent material can evenly absorb the light that luminescence chip is launched, and then better realize optical conversion luminous, avoided prior art fluorescent material and silica gel or epoxy resin mixed-stacking on luminescence chip, to absorb the chip non-uniform light, the problem that causes non-uniform light has especially guaranteed the illumination effect consistency of encapsulation in batches.
Description of drawings
Fig. 1 is the generalized section of the utility model great power LED device;
Accompanying drawing number:
1-lens;
2-transparent silica gel or epoxy resin;
3-fluorescent material light conversion film;
4-gold thread;
There is the plastic feet of cavity 5-centre;
6-electrode pin;
7-led chip;
8-elargol;
9-heat sink;
10-heat-conducting glue or heat conductive silica gel pad;
11-aluminium base.
Embodiment
Below with embodiment the utility model is described further.Specific embodiment of the utility model is referring to accompanying drawing.
As shown in Figure 1, great power LED device of the present utility model comprises: there are the plastic feet 5, electrode pin 6, led chip 7, elargol 8 of cavity, heat sink 9, heat-conducting glue or heat conductive silica gel pad 10, aluminium base 11 in lens 1, transparent silica gel or epoxy resin 2, fluorescent material light conversion film 3, gold thread 4, centre, and transparent silica gel or epoxy resin 2 are filled between lens 1 and fluorescent material light conversion film 3 and fluorescent material light conversion film 3 and the led chip 7.Fluorescent material light conversion film 3 is positioned on the transparent silica gel or epoxy resin 2 that wraps led chip 7 and the gold thread 4 that is connected chip and electrode pin 6, and is lower than the cavity top edge of plastic feet 5.
Prior art wraps led chip and gold thread after normally fluorescent material transparent silica gel or epoxy resin being mixed, and is luminous by the luminous excitated fluorescent powder of LED again, compoundly goes out needed glow color.Because great power LED in use, can produce a large amount of heats, though can conduct a part of heat by heat sink and aluminium base, still have the fluorescent material that suitable a part of heat is blended in transparent silica gel or the epoxy resin and absorb, the heat eliminating is difficult.Long-term heat can cause the luminosity decay of fluorescent material and led chip, the compound glow color chromaticity coordinates drift that goes out.
Great power LED device of the present utility model, used the laminar film of being made up of fluorescent material and organic resin material---the fluorescent material light conversion film.The fluorescent material light conversion film is positioned on the transparent silica gel or epoxy resin that wraps led chip and gold thread.This structure has following advantage: one, owing to be separated with transparent silica gel or epoxy resin between fluorescent material and the led chip, significantly reduced the heat that fluorescent material directly absorbs led chip and distributed, can effectively prolong the useful life of fluorescent material and chip; Two, the laminar film formed by fluorescent material and organic resin material of fluorescent material light conversion film, fluorescent material in the plane distributes more even, it is also more even to accept the led chip illumination effect, guarantee the luminous even of great power LED, especially in batches the illumination effect consistency of encapsulation improves rate of finished products greatly; Three, the employed fluorescent material of fluorescent material light conversion film compared with prior art use amount still less can save cost of manufacture.
The utility model connects heat sink and material aluminium base can be a heat-conducting glue, also can be the heat conductive silica gel pad.
The material that wraps the material of led chip and gold thread and be filled in the lens, on the fluorescent material conversion film can be a transparent silica gel, also can transparent epoxy resin.The cost of epoxy resin is lower, still long-time the use, owing to be subjected to the irradiation and the heat factor affecting of led chip, flavescence influences the quality and the life-span of device with aging easily.The utility model uses the effect of transparent silica gel to be better than using the effect of epoxy resin, and better quality, life-span are longer.
Claims (1)
1. high power LED device, comprise: lens, transparent silica gel or epoxy resin, gold thread, there is the plastic feet of cavity the centre, electrode pin, led chip, elargol, heat sink, heat-conducting glue or heat conductive silica gel pad, aluminium base, transparent silica gel or epoxy resin are filled between lens and fluorescent material light conversion film and fluorescent material light conversion film and the led chip, it is characterized in that: being positioned on the transparent silica gel that wraps led chip and the gold thread that is connected chip and electrode pin or the epoxy resin has the layer of fluorescent powder light conversion film, and described fluorescent material light conversion film is lower than the cavity top edge of plastic feet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200124818U CN201282151Y (en) | 2008-04-30 | 2008-04-30 | High power light-emitting diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200124818U CN201282151Y (en) | 2008-04-30 | 2008-04-30 | High power light-emitting diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201282151Y true CN201282151Y (en) | 2009-07-29 |
Family
ID=40929019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200124818U Expired - Lifetime CN201282151Y (en) | 2008-04-30 | 2008-04-30 | High power light-emitting diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201282151Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130227A (en) * | 2010-12-22 | 2011-07-20 | 哈尔滨工业大学 | Fluorescent powder coating process for LED optical lens and encapsulation process for white light LED with optical lens |
| CN102255032A (en) * | 2011-07-06 | 2011-11-23 | 深圳市顶点照明设备有限公司 | Light distribution structure of high-power LED (light-emitting diode) |
| CN102339821A (en) * | 2011-10-10 | 2012-02-01 | 河南恒基光电有限公司 | High-power straw-hat-shaped integrated packaging light-emitting diode (LED) light source structure for automobile headlight |
| CN109817783A (en) * | 2017-11-22 | 2019-05-28 | 东莞市广信知识产权服务有限公司 | A kind of anticollision LED encapsulation structure with high-efficient radiating function |
| CN110081381A (en) * | 2019-05-08 | 2019-08-02 | 镇江尚沃电子有限公司 | A kind of novel three-dimensional LED encapsulation vehicle headlight light-source structure and application system |
-
2008
- 2008-04-30 CN CNU2008200124818U patent/CN201282151Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130227A (en) * | 2010-12-22 | 2011-07-20 | 哈尔滨工业大学 | Fluorescent powder coating process for LED optical lens and encapsulation process for white light LED with optical lens |
| CN102255032A (en) * | 2011-07-06 | 2011-11-23 | 深圳市顶点照明设备有限公司 | Light distribution structure of high-power LED (light-emitting diode) |
| CN102339821A (en) * | 2011-10-10 | 2012-02-01 | 河南恒基光电有限公司 | High-power straw-hat-shaped integrated packaging light-emitting diode (LED) light source structure for automobile headlight |
| CN109817783A (en) * | 2017-11-22 | 2019-05-28 | 东莞市广信知识产权服务有限公司 | A kind of anticollision LED encapsulation structure with high-efficient radiating function |
| CN110081381A (en) * | 2019-05-08 | 2019-08-02 | 镇江尚沃电子有限公司 | A kind of novel three-dimensional LED encapsulation vehicle headlight light-source structure and application system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202884614U (en) | Novel light-emitting diode (LED) fluorescent lamp | |
| CN101834263B (en) | Integrated light source structure with wide-angle transmission | |
| CN101769455A (en) | LED bulb adopting whole-body fluorescence conversion technology | |
| CN201282151Y (en) | High power light-emitting diode device | |
| CN202058732U (en) | High-power LED (light-emitting diode) white light panel with separated chip and fluorescent powder | |
| CN101853914A (en) | High-power LED white lighting source structure | |
| CN102364710A (en) | Light emitting diode (LED) white light source device | |
| CN205752232U (en) | A kind of COB light module | |
| CN202100964U (en) | LED (light emitting diode) energy-saving lamp tube with wide spectrum | |
| CN206349386U (en) | A kind of LED lamp bead structure with stability and refractive index | |
| CN202018990U (en) | High-power white-light LED light source encapsulating structure | |
| CN205752229U (en) | A kind of encapsulating structure of high-capacity LED | |
| CN213878149U (en) | Evenly-distributed white light LED packaging structure | |
| CN201561314U (en) | LED energy-saving lamp adopting integral fluorescence conversion technique | |
| CN203367350U (en) | Interlayer diffusant white-light LED of direct-embedded type | |
| CN208637457U (en) | A kind of high-power patch-type encapsulation LED crystal lamp | |
| CN202501250U (en) | High-power LED (light emitting diode) light source capable of directly radiating heat of shell | |
| CN207651516U (en) | Infrared LED integral type encapsulating structure for lossless signal transmission | |
| CN207674244U (en) | Intelligent LED ground light | |
| CN201448655U (en) | Light-emitting diode structure | |
| CN201975418U (en) | High-power diode | |
| CN203631595U (en) | Insulating and radiating type light emitting diode | |
| CN203883001U (en) | White-light LED encapsulation structure | |
| CN202769469U (en) | Light-emitting diode (LED) street lamp integrated light source | |
| CN202871857U (en) | LED package structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 116025 No. 32, high energy street, hi tech Zone, Liaoning, Dalian Patentee after: Dalian Luming Light Emitting Sci-Tech Co., Ltd. Address before: 116025 Liaoning Province, Dalian City High-tech Park Qixianling high-energy Street No. 1 Patentee before: Dalian Luming Light Emitting Sci-Tech Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20090729 |
|
| CX01 | Expiry of patent term |