CN201448655U - Light-emitting diode structure - Google Patents
Light-emitting diode structure Download PDFInfo
- Publication number
- CN201448655U CN201448655U CN2009200610331U CN200920061033U CN201448655U CN 201448655 U CN201448655 U CN 201448655U CN 2009200610331 U CN2009200610331 U CN 2009200610331U CN 200920061033 U CN200920061033 U CN 200920061033U CN 201448655 U CN201448655 U CN 201448655U
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- CN
- China
- Prior art keywords
- emitting diode
- led chip
- blue led
- chip
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 23
- 238000010276 construction Methods 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 4
- 239000004568 cement Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 101150038956 cup-4 gene Proteins 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model discloses a light-emitting diode structure, comprising a shell, a blue light-emitting diode chip, a yellow phosphor powder layer and a lead wire which is electrically connected with the blue light-emitting diode chip, wherein the yellow phosphor powder layer and the blue light-emitting diode chip are arranged in the shell from top to bottom. The utility model is characterized in that a transparent epoxy resin layer is arranged between the yellow phosphor powder layer and the blue light-emitting diode chip. Yellow phosphor powder in the yellow phosphor powder layer is far from the blue light-emitting diode chip, and the absorption of the blue light-emitting diode chip for scattering of the yellow phosphor powder is reduced, therefore the luminous efficiency of a white LED can be obviously increased. In addition, after a layer of epoxy resin is added on the blue light-emitting diode chip, the smooth area of the coated yellow phosphor powder layer is increased, the radian of the yellow phosphor powder on the chip can be reduced, and the yellow phosphor powder layer is more uniform, so the generated light is also more uniform.
Description
Technical field
The utility model relates to a kind of light emitting diode construction.
Background technology
In recent years, be used to for a long time show that the semiconductor light sources in field is LED (LightEmitting Diode), LED is the abbreviation of light emitting diode English, and just the role with the novel solid light source progressively enters lighting field.Compare energy-conservation, efficient, advantages such as volume is little, the life-span is long, response speed is fast, driving voltage is low, anti-vibration that semiconductor light sources has with conventional light source.Along with the continuous reduction of its price, the improving constantly of luminosity, semiconductor light sources has represented wide prospect in lighting field.
The core of semiconductor lighting is to utilize the semiconductor light emitting technology to realize white light.The technological approaches of realizing white light mainly contains two: the one, and red, green, blue three-primary color LED chip portfolio generates white light, and the 2nd, convert white light to by fluorescent material.Present blue-light LED chip+yellow fluorescent powder converts the white light LEDs technology to and occupies leading position.Method for this realization white light, great majority are fluorescent material and epoxy resin to be mixed directly be coated on the chip, promptly the structure that adopts usually is to comprise shell, blue LED chip, the yellow fluorescence bisque, the lead-in wire that is electrically connected with blue LED chip, the yellow fluorescence bisque is mixed by yellow fluorescent powder and epoxy resin and directly is coated in the chip curing molding and forms, owing to realize the light conversion at fluorescent coating, make the energy loss of blue light in the gold-tinted transfer process be converted into heat, therefore, the temperature of fluorescent coating is higher relatively, the temperature of led chip also increases, thereby influences the luminous efficiency of led chip.Simultaneously, the rising of temperature makes the emission wavelength drift, has influenced photochromic, in addition, because fluorescent powder and chip are close to, make the light of led chip emission and light that the led chip excitated fluorescent powder sends turn back to led chip and absorbed by led chip and lose through scattering, cause the taking-up efficient of light to reduce.
Summary of the invention
The purpose of this utility model provides a kind of light emitting diode construction, can effectively improve the luminous efficiency of white light LEDs, and the light that sends is also more even.
The purpose of this utility model is achieved through the following technical solutions.
A kind of light emitting diode construction, comprise shell, blue LED chip, yellow fluorescence bisque, the lead-in wire that is electrically connected with blue LED chip, yellow fluorescence bisque, blue LED chip are provided with from top to bottom successively and place in the shell, it is characterized in that: be provided with transparent epoxy resin layer between described yellow fluorescence bisque and the blue LED chip.
Described transparent epoxy resin layer is coated in and solidify to form a resin chip firming body on the blue LED chip, and the yellow fluorescence bisque is coated in by yellow fluorescent powder that mixes and epoxy resin and carries out curing molding on the resin chip firming body and form.
Described blue LED chip is a blue light bipolar electrode chip.
Described blue LED chip is connected with a heat carrier by substrate, and heat carrier places in the shell.
Described shell is made of plastic cement drain pan and silicon rubber cup.
The utility model compared with prior art has the following advantages:
The utility model is owing to be provided with transparent epoxy resin layer between yellow fluorescence bisque and blue LED chip, fluorescent material is away from chip like this, reduced the absorption of led chip to the fluorescent material scattering, thereby can obviously improve the luminous efficiency of white light LEDs, adding the yellow fluorescence bisque that applies after one deck resin in addition on chip increases the level and smooth area of yellow fluorescence bisque, the radian of fluorescent material on chip will reduce, the yellow fluorescence bisque can be more even, the light that comes out like this is also more even, and the fluorescent material of traditional light emitting diode construction is curved on chip, makes bright dipping inhomogeneous with regard to the thick middle both sides are thin like this.
Description of drawings
Fig. 1 is the utility model light emitting diode construction example structure schematic diagram.
The specific embodiment
Below in conjunction with accompanying drawing the utility model light emitting diode construction is described in further detail.
As shown in Figure 1, the utility model light emitting diode construction, comprise shell, blue LED chip 1, yellow fluorescence bisque 2, the lead-in wire that is electrically connected with blue LED chip 1, shell is made of plastic cement drain pan 3 and silicon rubber cup 4, yellow fluorescence bisque 2, blue LED chip 1 are provided with from top to bottom successively and place in the shell, are provided with transparent epoxy resin layer 5 between yellow fluorescence bisque 2 and blue LED chip 1.Wherein transparent epoxy resin layer 5 is coated in and solidify to form a resin chip firming body on the blue LED chip 1, and yellow fluorescence bisque 2 is coated in by yellow fluorescent powder that mixes and epoxy resin and carries out curing molding on the resin chip firming body and form.Blue LED chip 1 is a blue light bipolar electrode chip, blue LED chip 1 is connected with a heat carrier 7 by substrate 6, yellow fluorescent powder is away from blue LED chip 1 like this, reduced the absorption of 1 pair of yellow fluorescent powder scattering of blue LED chip, thereby can obviously improve the luminous efficiency of white light LEDs, yellow fluorescence bisque 2 by coating after this one deck resin that adds on blue LED chip 1 increases the level and smooth area of yellow fluorescence bisque in addition, the radian of yellow fluorescence bisque on blue LED chip 1 will reduce, yellow fluorescence bisque 2 can be more even, the light that comes out like this is also more even, and the yellow fluorescence bisque of traditional light emitting diode construction is curved on chip, makes bright dipping inhomogeneous with regard to the thick middle both sides are thin like this.
Claims (5)
1. light emitting diode construction, comprise shell, blue LED chip, yellow fluorescence bisque, the lead-in wire that is electrically connected with blue LED chip, yellow fluorescence bisque, blue LED chip are provided with from top to bottom successively and place in the shell, it is characterized in that: be provided with transparent epoxy resin layer between described yellow fluorescence bisque and the blue LED chip.
2. light emitting diode construction according to claim 1, it is characterized in that: described transparent epoxy resin layer is coated in and solidify to form a resin chip firming body on the blue LED chip, and the yellow fluorescence bisque is coated in by yellow fluorescent powder that mixes and epoxy resin and carries out curing molding on the resin chip firming body and form.
3. light emitting diode construction according to claim 2 is characterized in that: described blue LED chip is a blue light bipolar electrode chip.
4. light emitting diode construction according to claim 1 is characterized in that: described blue LED chip is connected with a heat carrier by substrate, and heat carrier places in the shell.
5. light emitting diode construction according to claim 1 is characterized in that: described shell is made of plastic cement drain pan and silicon rubber cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200610331U CN201448655U (en) | 2009-07-23 | 2009-07-23 | Light-emitting diode structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200610331U CN201448655U (en) | 2009-07-23 | 2009-07-23 | Light-emitting diode structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201448655U true CN201448655U (en) | 2010-05-05 |
Family
ID=42553375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200610331U Expired - Fee Related CN201448655U (en) | 2009-07-23 | 2009-07-23 | Light-emitting diode structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201448655U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103225768A (en) * | 2013-04-19 | 2013-07-31 | 杭州鸿雁电器有限公司 | Blue light prevention desk lamp |
| CN111218078A (en) * | 2020-02-29 | 2020-06-02 | 华南理工大学 | Blue-light-proof fluorescent plate, preparation method thereof and blue-light-proof LED lighting lamp structure |
-
2009
- 2009-07-23 CN CN2009200610331U patent/CN201448655U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103225768A (en) * | 2013-04-19 | 2013-07-31 | 杭州鸿雁电器有限公司 | Blue light prevention desk lamp |
| CN103225768B (en) * | 2013-04-19 | 2016-06-01 | 杭州鸿雁电器有限公司 | A kind of blue light prevention desk lamp |
| CN111218078A (en) * | 2020-02-29 | 2020-06-02 | 华南理工大学 | Blue-light-proof fluorescent plate, preparation method thereof and blue-light-proof LED lighting lamp structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JIANGXI HUAYE ENERGY SAVING LIGHTING CO., LTD. Free format text: FORMER OWNER: YU JIANPING Effective date: 20111121 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518038 SHENZHEN, GUANGDONG PROVINCE TO: 333000 JINGDEZHEN, JIANGXI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20111121 Address after: 333000, Jiangxi, Jingdezhen high tech Zone, north of Indus Avenue (opposite Changhong electronics Park) Patentee after: Jiangxi Huaye Energy-Saving Lighting Co., Ltd. Address before: 518038 Guangdong city of Shenzhen province Futian District Golden Sea View Garden Green Bay seawall 38 31A Patentee before: Yu Jianping |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100505 Termination date: 20140723 |
|
| EXPY | Termination of patent right or utility model |