CN203205454U

CN203205454U - Package structure of LED light source

Info

Publication number: CN203205454U
Application number: CN 201320069140
Authority: CN
Inventors: 江淳民; 马洪毅
Original assignee: SHENZHEN LANKE ELECTRONICS CO Ltd
Current assignee: SHENZHEN LANKE ELECTRONICS CO Ltd
Priority date: 2013-02-06
Filing date: 2013-02-06
Publication date: 2013-09-18
Anticipated expiration: 2023-02-06

Abstract

The utility model discloses a package structure of an LED light source. LED wafers are fixed on a front face of a transparent sheet-shaped die bond substrate through a transparent adhesive. The positive electrode and the negative electrode of each LED wafer are respectively directly or indirectly electrically connected with the positive electrode circuit or the negative electrode circuit of the die bond substrate in correspondence through bonding leads. The positive electrode circuit and the negative electrode circuit are respectively in corresponding electrical connection with the positive electrode outer pin and the negative electrode outer pin which are disposed on the die bond substrate. Phosphor powder is filled onto the front face and the back face of the die bond substrate through a transparent AB adhesive, so that the phosphor powder filled on the front face wraps the LED chips. The package structure changes a conventional method of die bonding: through the method of fixing the wafers on the transparent die bond substrate and then coating the phosphor power on both the front face and the back face of the die bond substrate, the light extraction efficiency of the LED light source is substantially improved, which is especially obvious for a white light LED light source.

Description

A kind of encapsulating structure of led light source

Technical field

The utility model belongs to lighting field, relates in particular to the encapsulating structure of the led light source part of LED photo engine.

Background technology

Along with the appearance of national energy-saving and emission-reduction policy and the drop year by year of LED price, the LED illumination has progressively entered the visual field of ordinary populace.Correspondingly, along with the large-scale application of LED in every field, the particularly progressively popularization of LED illumination application, the LED wafer technologies also is being pushed constantly development, this brightness that is mainly reflected in the LED wafer constantly promotes, but the encapsulation technology of LED wafer never has big progress, it is solid brilliant at metallic support to remain employing, in solid brilliant cup, fill the packaged type of the fluorescent material of coupling again, this makes the LED illumination still exist light efficiency to be not enough to the problem that is equal to power saving fluorescent lamp, therefore, the LED encapsulating structure of high light efficiency and mode more and more cause the attention of industry.

The utility model content

The purpose of this utility model is to provide a kind of encapsulating structure that can improve the led light source of light efficiency.

The technical solution adopted in the utility model is: a kind of encapsulating structure of led light source, the LED wafer is fixed on the front of the solid brilliant substrate of transparent sheet by transparent bonded adhesives, the positive pole of LED wafer and negative pole respectively by bonding lead directly or indirectly with solid brilliant substrate on positive pole and corresponding electricals connection of negative pole circuit, described positive pole and negative pole circuit respectively with consolidate brilliant substrate on the corresponding electrical connection of pin outside the positive pole that arranges and the negative pole; Fluorescent material is filled on the front and back of solid brilliant substrate by transparent AB glue, makes that being filled in positive fluorescent material is coated on the LED wafer wherein.

Wherein, described LED wafer is the blue light wafer, and described fluorescent material is yellow fluorescent powder, so that described led light source is white LED light source.

Wherein, described LED wafer is the purple light wafer, and described fluorescent material is the RGB three-color phosphor, so that described led light source is white LED light source.

The beneficial effects of the utility model are: encapsulating structure of the present utility model and method for packing have changed traditional mode at the solid crystalline substance of metallic support, by solid brilliant at transparent solid brilliant substrate and then (positively be crystal face admittedly at the front of solid brilliant substrate and the back side, the back side is relative with the front non-solid crystal face) mode that is coated with fluorescent material simultaneously increased substantially the light extraction efficiency of led light source, this point for white LED light source embody more outstanding.

Description of drawings

Fig. 1 shows the half-finished vertical view behind the completing steps 2;

Fig. 2 shows the half-finished vertical view behind the completing steps 4;

Fig. 3 shows the vertical view of the led light source described in the utility model behind the completing steps 6;

Fig. 4 is that A-A among Fig. 3 is to cutaway view.

Embodiment

Shown in Fig. 1 to 4, the encapsulating structure of led light source of the present utility model is: LED wafer 6 is fixed on the front of the solid brilliant substrate 1 of transparent sheet (or being referred to as tabular) by transparent bonded adhesives 9, at this, bonded adhesives 9 can be adhesively fixed by the mode that applies bonded adhesives 9 around LED wafer 6, also can be adhesively fixed by the mode that applies bonded adhesives 9 in LED wafer 6 bottom surfaces, also can be adhesively fixed in conjunction with above dual mode; The positive pole of LED wafer 6 and negative pole respectively by bonding lead 10 directly or indirectly with solid brilliant substrate 1 on anodal circuit 3 and 2 corresponding electrical connection of negative pole circuit, this positive pole circuit 3 and negative pole circuit 2 respectively with solid brilliant substrate 1 on pin 4 corresponding electrical connections outside the outer pin 5 of positive pole that arranges and the negative pole; Fluorescent material 11 is filled on the front and back of solid brilliant substrate 1 by transparent AB glue (this glue of the AB glue that this is transparent (i.e. A glue wherein) for example is epoxy glue or silicon class glue), makes that being filled in positive fluorescent material 11 can be coated on LED wafer 6 wherein.The led light source that encapsulation forms is partly pegged graft and can be lighted with constant-current driving power supply by the outer pin 5 of positive pole and the outer pin 4 of negative pole.

At this, adopt in parallel between the quantity of the LED wafer 6 that led light source adopts and each the LED wafer, series connection still is that the connected mode of series combination parallel connection can be selected as required, therefore, the positive pole of above LED wafer 6 and negative pole respectively by bonding lead 10 indirectly with solid brilliant substrate 1 on anodal circuit 3 and the implication of negative pole circuit 2 corresponding electrical connections be: adjacent LED wafer 6 (being specially the negative pole of a LED wafer and the positive pole of another LED wafer) also is electrically connected by bonding lead 10, effect after the connection is to make positive pole all directly (situation about directly being electrically connected with anodal circuit 3) or the negative pole that is electrically connected (situation about being electrically connected with anodal circuit 3 indirectly by other LED wafers), and makes each LED wafer 6 indirectly with anodal circuit 3 all direct (situation about directly being electrically connected with negative pole circuit 2) or indirect (situation about being electrically connected with negative pole circuit 2 indirectly by other LED wafers) of each LED wafer 6.

If will make white LED light source, according to compound mode well-known to those skilled in the art, if LED wafer 6 adopts the blue light wafer, fluorescent material 11 then is yellow fluorescent powder; If LED wafer 6 is the purple light wafer, then 11 in fluorescent material is the RGB three-color phosphor.

Principle of luminosity (be example with the white light LEDs) with led light source of encapsulating structure described in the utility model is: LED wafer 6 is the transparent body, this coloured light that 6 energisings of LED wafer are sent is six outgoing, after directly passing transparent solid brilliant substrate 1, a part shines on the fluorescent material 11 of solid brilliant substrate back, another part directly excites the fluorescent material of LED wafer surface, the white light output that this coloured light that the LED wafer is sent is converted to.

The method for packing that forms the encapsulating structure of above led light source is:

Step 1: as shown in Figure 1, be fixed in LED wafer 6 on the front of the solid brilliant substrate 1 of transparent sheet by transparent bonded adhesives 9, at this, choose the fixed position of each LED wafer 6 according to the arrangement mode of design in advance, adopt 9 LED wafers 6 in the embodiment shown in fig. 1, and adopt 3 * 3 matrixes to arrange;

Step 2: as shown in Figure 1, with the positive pole of LED wafer 6 and negative pole respectively by bonding lead 10 directly or indirectly with solid brilliant substrate 1 on anodal circuit 3 and the 2 corresponding electrical connections of negative pole circuit, in the embodiment shown in fig. 1, nine LED wafers are divided into three groups, be connected in parallel between three groups, be connected in series between three LED wafers of every group, anodal circuit 3 wherein and negative pole circuit 2 respectively with solid brilliant substrate 1 on the anodal outer pin 5 and the negative pole pin 4 corresponding electrical connections outward that arrange;

Step 3: as shown in Figure 2, with fluorescent material 11 and the front that entirely is filled in solid brilliant substrate 1 after transparent AB glue mixes, make that being filled in positive fluorescent material is coated on LED wafer 6 wherein;

Step 4: the semi-finished product of completing steps 3 are placed on drying and shaping in 80 ℃～160 ℃ the ambient temperature;

Step 5: as shown in Figure 3, again with described fluorescent material 11 and the back side that entirely is filled in solid brilliant substrate 1 after transparent AB glue mixes;

Step 6: the semi-finished product of completing steps 5 are placed on drying and shaping in 80 ℃～160 ℃ the ambient temperature.

When filling fluorescent material, can be earlier fluorescent material 11 be evenly mixed with transparent AB glue, mixed proportion is 6～10:1(volume ratio) can obtain preferable typing and illumination effect, and mixture is filled in the front and back of solid brilliant substrate auxiliary time of tool.

Step 4 is relevant with ambient temperature with 6 drying time, and ambient temperature is more low, and drying time is more long, and ambient temperature is more high, and drying time is more short, and operating personnel can according to circumstances control, and is as the criterion with the typing of AB glue, and drying time is controlled usually at 8 hours～10 hours.

In the present embodiment, the filling step of step 4 and step 6 is finished by the indent model, and at this, the base of the inner chamber of indent model is along exceeding the crystal bonding area territory, to guarantee that being filled in positive fluorescent material can be coated on LED wafer 6 wherein fully.Concrete filling process is: with fluorescent material 11 with after AB glue fully mixes, mixed fluorescent material and AB glue are injected the inner chamber of indent model by the injecting glue perforate that arranges on the indent model, and related indent model puts into 80 ℃～160 ℃ ambient temperature together and dries, after the oven dry again with the indent model separation.

At this, if be that relative crystal bonding area territory outwards is offset in the scope of 2mm～5mm) with the edge control of the inner chamber of indent model exceeding crystal bonding area territory 2mm～5mm(, can save the consumption of fluorescent material and AB glue, can obtain preferable light efficiency again.

The above is the utility model preferred implementation only, is not to limit practical range of the present utility model, and the equivalence of doing in protection range of the present utility model changes and modifies in every case, all should think to have fallen in the protection range of the present utility model.

Claims

1. the encapsulating structure of a led light source, it is characterized in that: the LED wafer is fixed on the front of the solid brilliant substrate of transparent sheet by transparent bonded adhesives, the positive pole of LED wafer and negative pole respectively by bonding lead directly or indirectly with solid brilliant substrate on positive pole and corresponding electricals connection of negative pole circuit, described positive pole and negative pole circuit respectively with consolidate brilliant substrate on the corresponding electrical connection of pin outside the positive pole that arranges and the negative pole; Fluorescent material is filled on the front and back of solid brilliant substrate by transparent AB glue, makes that being filled in positive fluorescent material is coated on the LED wafer wherein.

2. encapsulating structure according to claim 1, it is characterized in that: described LED wafer is the blue light wafer, described fluorescent material is yellow fluorescent powder, so that described led light source is white LED light source.

3. encapsulating structure according to claim 1, it is characterized in that: described LED wafer is the purple light wafer, described fluorescent material is the RGB three-color phosphor, so that described led light source is white LED light source.