CN103700651A - High-color rendering LED lamp filament - Google Patents
High-color rendering LED lamp filament Download PDFInfo
- Publication number
- CN103700651A CN103700651A CN201310565640.2A CN201310565640A CN103700651A CN 103700651 A CN103700651 A CN 103700651A CN 201310565640 A CN201310565640 A CN 201310565640A CN 103700651 A CN103700651 A CN 103700651A
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- led
- transparency carrier
- color development
- negative electrode
- illuminating module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The invention discloses a high-color rendering LED lamp filament, which comprises a transparent substrate, a yellow fluorescent sealing compound layer and an LED light emitting module, wherein the LED light emitting module is arranged on the transparent substrate; the yellow fluorescent sealing compound layer is packaged on the periphery of the LED light emitting module; one end of the transparent substrate extends out of the yellow fluorescent sealing compound layer to form a positive electrode, and the other end of the transparent substrate also extends out of the yellow fluorescent sealing compound layer, to form a negative electrode; the LED light emitting module comprises an LED chipset or at least two LED chipsets which are connected in parallel; the two ends of each LED chipset are respectively electrically connected with the positive and negative electrodes; each LED chipset comprises a plurality of blue-light chips and red-light chips, which are connected in series. According to the high-color rendering LED chip filament, light can be emitted at 360 degrees, and high color rendering properties are achieved.
Description
Technical field
The present invention relates to a kind of high-color development LED filament, belong to LED lighting technical field.
Background technology
At present, the filament of traditional lighting light fixture generally can be directly luminous by tungsten filament etc. wire form, it is short that this class filament ubiquity the life-span, the defects such as power consumption is large, and generally only can send sodium yellow, color rendering is poor, these light sources are all flat luminous forms, light source luminescent angle is all between 120-140 °, on lighting angle, cannot realize the luminous of wide-angle, in addition, the main method that realizes at present high-power planar white light source is that blue light or near ultraviolet chip excite yellow fluorescent powder to realize, especially the encapsulation of multi-chip basis light source substrate, still there are several deficiencies in the light source of this encapsulation, the one, the color rendering of light source is not fine, especially illuminating product is used in the more concentrated place of crowd, can bring the familiar lacunas of light source, although having many enterprises attempts to obtain high-color rendering by mixing the method for red fluorescence powder, but be that to sacrifice certain light efficiency be cost, the 2nd, the light efficiency of integrated chip light source is not high enough, light decay phenomenon is more serious, can bring familiar lacunas to illuminating product, is unfavorable for extensive use.
Summary of the invention
Technical problem to be solved by this invention is the defect that overcomes prior art, and a kind of high-color development LED filament is provided, and it is luminous that it not only can realize 360 ° of full angles, and has very high color rendering and illumination brightness.
The present invention solves the problems of the technologies described above the technical scheme of taking: a kind of high-color development LED filament, it comprises transparency carrier, yellow fluorescence adhesive layer and LED illuminating module, LED illuminating module is arranged on transparency carrier, yellow fluorescence adhesive layer is encapsulated in the periphery of LED illuminating module, and one end of transparency carrier is stretched out yellow fluorescence adhesive layer and is formed positive electrode, the other end of transparency carrier also stretches out yellow fluorescence adhesive layer and forms negative electrode, described LED illuminating module comprises LED chip group or at least two LED chip groups that are connected in parallel, the two ends of LED chip group are electrically connected with positive electrode and negative electrode respectively, LED chip group comprises a plurality of blue chips and the red light chips being cascaded.
Further in order to simplify the manufacture craft of filament, and make filament outward appearance more succinct, adopted a kind of by positive and negative electrode directly and the structure that is made into integration of transparency carrier, the both ends of described transparency carrier are coated with respectively conductive metal layer, and form respectively positive and negative electrode.
Further provide a kind of material of conductive metal layer of the best can bear high pressure mode and driven, described conductive metal layer is silver material layer.
Further, in order to improve better lighting area and the irradiating angle of LED filament, the one or both sides of described transparency carrier are placed with LED illuminating module.
Further provide the material of the transparency carrier of several the bests to make this LED filament, can have good thermal endurance and weatherability, described transparency carrier is ceramic substrate or sapphire substrate or glass substrate.
A kind of blue chip of LED chip group and the series system of red light chips are further provided, and a plurality of blue chips and a plurality of red light chips in each described LED chip group are cascaded by wire.
The mode of the electric connection of a kind of LED chip group and positive and negative electrode is further provided, and the two ends of described LED chip group are electrically connected by wire and positive electrode and negative electrode respectively.
Further, described wire is LED gold thread.
Adopted after technique scheme, this LED filament adopts high pressure mode to drive, by this LED filament just, negative electrode is connected on power supply, the blue chip of LED illuminating module is sent blue light, yellow fluorescence adhesive layer is stimulated and sends gold-tinted, thereby blue light and gold-tinted coordinate formation white light, by red light chips, directly seal compensation again, can effectively widen the spectral region of ruddiness, the wavelength valley regions that red light wavelength crest region and the blue chip that red light chips excites excites yellow fluorescence adhesive layer to produce look ripple overlaps complementary, reach preferably compensation effect, thereby improve the color rendering index of white light source, make like this white-light spectrum comparison of ingredients abundant, more approach natural daylight, it is almost continuous spectrum, make this LED filament can be applicable to coffee shop, party illumination, to light source, colour developing requires high place in hotel illuminations etc., the present invention has simultaneously adopted transparency carrier, 360 ° of light are unobstructed, the white light sending can be realized 360 ° of irradiations, 360 ° of full angles have been realized luminous, in addition, adopt LED chip group in parallel, improved its intensity of illumination.
Accompanying drawing explanation
Fig. 1 is the structural representation of high-color development LED filament of the present invention;
Fig. 2 is the vertical view of Fig. 1.
Embodiment
For content of the present invention is more easily expressly understood, according to specific embodiment also by reference to the accompanying drawings, the present invention is further detailed explanation below.
As Fig. 1, shown in 2, a kind of high-color development LED filament, it comprises transparency carrier 1, yellow fluorescence adhesive layer 2 and LED illuminating module, LED illuminating module is arranged on transparency carrier 1, yellow fluorescence adhesive layer 2 is encapsulated in the periphery of LED illuminating module, and one end of transparency carrier 1 is stretched out yellow fluorescence adhesive layer 2 and is formed positive electrode 1-1, the other end of transparency carrier 1 also stretches out yellow fluorescence adhesive layer 2 and forms negative electrode 1-2, LED illuminating module comprises LED chip group or at least two LED chip groups that are connected in parallel, the two ends of LED chip group are electrically connected with positive electrode 1-1 and negative electrode 1-2 respectively, LED chip group comprises a plurality of blue chips 3 and the red light chips 4 being cascaded.
As shown in Figure 1, the both ends of transparency carrier 1 are coated with respectively conductive metal layer, and form respectively positive electrode 1-1 and negative electrode 1-2.This structure by positive and negative electrode directly and transparency carrier 1 be made into integration, simplified the manufacture craft of filament, and made filament outward appearance more succinct.
Conductive metal layer is silver material layer, but is not limited to this.
In order to improve better lighting area and the irradiating angle of LED filament, the one or both sides of transparency carrier 1 are placed with LED illuminating module.
In order to make this filament have good thermal endurance and weatherability, transparency carrier 1 is ceramic substrate or sapphire substrate or glass substrate, but is not limited to this.
As shown in Figure 1, 2, a plurality of blue chips 3 and a plurality of red light chips 4 in each LED chip group is cascaded by wire 5.
The two ends of LED chip group are electrically connected with positive electrode 1-1 and negative electrode 1-2 by wire 5 respectively.
Wire 5 is LED gold thread.LED gold thread has the advantages such as conductivity is large, corrosion-resistant, good toughness, non-oxidizability.
The yellow fluorescence adhesive layer 2 of this filament adopts die press technology for forming (molding packaging technology), and the employing of this technique makes the manufacturing cost of this LED filament lower, and has improved production efficiency.
Operation principle of the present invention is as follows:
This LED filament adopts high pressure mode to drive, the positive electrode 1-1 of this LED filament and negative electrode 1-2 are connected on power supply, the blue chip 3 of LED illuminating module is sent blue light, yellow fluorescence adhesive layer 2 is stimulated and sends gold-tinted, thereby blue light and gold-tinted coordinate formation white light, again by the straight envelope compensation of red light chips 4, can effectively widen the spectral region of ruddiness, the wavelength valley regions that red light wavelength crest region and the blue chip 3 that red light chips 4 excites excites yellow fluorescence adhesive layer 2 to produce look ripple overlaps complementary, reach preferably compensation effect, thereby improve the color rendering index of white light source, make like this white-light spectrum comparison of ingredients abundant, more approach natural daylight, it is almost continuous spectrum, make this LED filament can be applicable to coffee shop, party illumination, to light source, colour developing requires high place in hotel illuminations etc., the present invention has simultaneously adopted transparency carrier 1, the white light sending can be realized 360 ° of irradiations, 360 ° of full angles have been realized luminous.
Above-described specific embodiment; technical problem, technical scheme and beneficial effect that the present invention is solved further describe; institute is understood that; the foregoing is only specific embodiments of the invention and oneself; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. a high-color development LED filament, it is characterized in that: it comprises transparency carrier (1), yellow fluorescence adhesive layer (2) and LED illuminating module, LED illuminating module is arranged on transparency carrier (1), yellow fluorescence adhesive layer (2) is encapsulated in the periphery of LED illuminating module, and one end of transparency carrier (1) is stretched out yellow fluorescence adhesive layer (2) and is formed positive electrode (1-1), the other end of transparency carrier (1) also stretches out yellow fluorescence adhesive layer (2) and forms negative electrode (1-2), described LED illuminating module comprises LED chip group or at least two LED chip groups that are connected in parallel, the two ends of LED chip group are electrically connected with positive electrode (1-1) and negative electrode (1-2) respectively, LED chip group comprises a plurality of blue chips (3) and the red light chips (4) being cascaded.
2. high-color development LED filament according to claim 1, is characterized in that: the both ends of described transparency carrier (1) are coated with respectively conductive metal layer, and forms respectively positive electrode (1-1) and negative electrode (1-2).
3. high-color development LED filament according to claim 2, is characterized in that: described conductive metal layer is silver material layer.
4. high-color development LED filament according to claim 1, is characterized in that: the one or both sides of described transparency carrier (1) are placed with LED illuminating module.
5. high-color development LED filament according to claim 1, is characterized in that: described transparency carrier (1) is ceramic substrate or sapphire substrate or glass substrate.
6. high-color development LED filament according to claim 1, is characterized in that: a plurality of blue chips (3) and a plurality of red light chips (4) in each described LED chip group are cascaded by wire (5).
7. high-color development LED filament according to claim 1, is characterized in that: the two ends of described LED chip group are electrically connected by wire (5) and positive electrode (1-1) and negative electrode (1-2) respectively.
8. according to the high-color development LED filament described in claim 6 or 7, it is characterized in that: described wire (5) is LED gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310565640.2A CN103700651A (en) | 2013-11-15 | 2013-11-15 | High-color rendering LED lamp filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310565640.2A CN103700651A (en) | 2013-11-15 | 2013-11-15 | High-color rendering LED lamp filament |
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| Publication Number | Publication Date |
|---|---|
| CN103700651A true CN103700651A (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310565640.2A Pending CN103700651A (en) | 2013-11-15 | 2013-11-15 | High-color rendering LED lamp filament |
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| Country | Link |
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| CN (1) | CN103700651A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956357A (en) * | 2014-05-06 | 2014-07-30 | 佛山市国星光电股份有限公司 | Manufacturing method of LED lamp filament |
| CN105674108A (en) * | 2016-03-24 | 2016-06-15 | 海宁博华照明电器有限公司 | Novel LED lamp |
| CN105805596A (en) * | 2014-12-29 | 2016-07-27 | 镇江胡氏光电科技有限公司 | A novel LED energy-saving bulb |
| CN105805595A (en) * | 2014-12-29 | 2016-07-27 | 镇江胡氏光电科技有限公司 | An all-direction light emitting LED bulb |
| CN105805597A (en) * | 2014-12-29 | 2016-07-27 | 镇江胡氏光电科技有限公司 | An LED energy-saving lamp easy to screw and unscrew |
| CN109686830A (en) * | 2017-10-18 | 2019-04-26 | 李宜臻 | Flexible light emitting diode filament and combinations thereof |
| CN114585853A (en) * | 2019-10-16 | 2022-06-03 | 昕诺飞控股有限公司 | LED filament lamp with candlelight appearance |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201039523Y (en) * | 2007-04-27 | 2008-03-19 | 宁波升谱光电半导体有限公司 | A high color index high-power white light LED part |
| CN202839730U (en) * | 2010-12-28 | 2013-03-27 | 松下电器产业株式会社 | Light emitting device, light emitting module and lamp |
| US20130114250A1 (en) * | 2010-07-20 | 2013-05-09 | Shanghai Yaming Lighting Co.,Ltd | Led integrated packaging light source module |
| CN203553164U (en) * | 2013-11-15 | 2014-04-16 | 江苏银晶光电科技发展有限公司 | High color rendering led filament |
-
2013
- 2013-11-15 CN CN201310565640.2A patent/CN103700651A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039523Y (en) * | 2007-04-27 | 2008-03-19 | 宁波升谱光电半导体有限公司 | A high color index high-power white light LED part |
| US20130114250A1 (en) * | 2010-07-20 | 2013-05-09 | Shanghai Yaming Lighting Co.,Ltd | Led integrated packaging light source module |
| CN202839730U (en) * | 2010-12-28 | 2013-03-27 | 松下电器产业株式会社 | Light emitting device, light emitting module and lamp |
| CN203553164U (en) * | 2013-11-15 | 2014-04-16 | 江苏银晶光电科技发展有限公司 | High color rendering led filament |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956357A (en) * | 2014-05-06 | 2014-07-30 | 佛山市国星光电股份有限公司 | Manufacturing method of LED lamp filament |
| CN103956357B (en) * | 2014-05-06 | 2016-09-28 | 佛山市国星光电股份有限公司 | A kind of manufacture method of LED filament |
| CN105805596A (en) * | 2014-12-29 | 2016-07-27 | 镇江胡氏光电科技有限公司 | A novel LED energy-saving bulb |
| CN105805595A (en) * | 2014-12-29 | 2016-07-27 | 镇江胡氏光电科技有限公司 | An all-direction light emitting LED bulb |
| CN105805597A (en) * | 2014-12-29 | 2016-07-27 | 镇江胡氏光电科技有限公司 | An LED energy-saving lamp easy to screw and unscrew |
| CN105674108A (en) * | 2016-03-24 | 2016-06-15 | 海宁博华照明电器有限公司 | Novel LED lamp |
| CN109686830A (en) * | 2017-10-18 | 2019-04-26 | 李宜臻 | Flexible light emitting diode filament and combinations thereof |
| CN114585853A (en) * | 2019-10-16 | 2022-06-03 | 昕诺飞控股有限公司 | LED filament lamp with candlelight appearance |
| CN114585853B (en) * | 2019-10-16 | 2024-06-21 | 昕诺飞控股有限公司 | LED filament lamp with candle light appearance |
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Application publication date: 20140402 |
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