CN103872224A - Novel LED (Light Emitting Diode) illuminating element - Google Patents
Novel LED (Light Emitting Diode) illuminating element Download PDFInfo
- Publication number
- CN103872224A CN103872224A CN201410076503.7A CN201410076503A CN103872224A CN 103872224 A CN103872224 A CN 103872224A CN 201410076503 A CN201410076503 A CN 201410076503A CN 103872224 A CN103872224 A CN 103872224A
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- Prior art keywords
- light
- transparent substrates
- led chip
- emitting component
- led
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- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 27
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 abstract description 15
- 238000005498 polishing Methods 0.000 abstract 1
- 239000000499 gel Substances 0.000 description 13
- 238000007598 dipping method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a novel LED (Light Emitting Diode) illuminating element which comprises a light-transmitting substrate, an LED chip, an illuminating element power source electrode, a bonding glue containing fluorescent powder and a fluorescent powder glue. The novel LED illuminating element is characterized in that the layer of bonding glue containing the fluorescent powder is arranged between one illuminating surface of the LED chip and the light-transmitting substrate; the other illuminating surface and the other surfaces of the LED chip are covered with the fluorescent powder glue; the light-transmitting substrate is made of glass; the surface, for fixing the LED chip, on the light-transmitting substrate is subjected to dull polishing treatment, so that a roughened surface is formed. The novel LED illuminating element provided by the invention can all-directionally illuminate, can save the dosage of the fluorescent powder and has a simple structure.
Description
Technical field
The invention belongs to LED technical field, be specifically related to a kind of New LED light-emitting component.
Background technology
In the use of general lighting, LED blue chip is generally made LED light-emitting component by spectrum conversion, in the prior art, LED light-emitting component generally all adopts high thermal conductive substrate supporting LED chip, as LED lamp pearl, LEDCOB panel, in this structure, light-emitting area of LED chip and substrate contacts are blocked cannot bright dipping, can only unidirectional bright dipping; Prior art useful transparency carrier supporting LED chip realizes the bright dipping of LED chip omnirange; But the technical scheme of the no matter unidirectional or omnirange bright dipping of prior art, is all a light-emitting area of LED chip to be bonded in above substrate upper, then applies phosphor gel or the substrate with fluorescent powder wrap chip at substrate back.
The three-dimensional LED white light parts of disclosed one also in invention as described in Chinese patent CN103035820A, comprise transparency carrier, be arranged at the LED wafer on described substrate, gold thread and fluorescent powder, the two ends of described substrate are bonded with lead terminal, described gold thread two ends are connected with described LED wafer and lead terminal respectively, in described fluorescent powder, be filled with transparent silica gel, described substrate is installed in described fluorescent powder, comprises fluorescent material and light transmission material with yttrium-aluminium-garnet or nitride in described fluorescent powder.This invention can be in luminous form, approaches the filament light-emitting effect of conventional lamp.
Disclosed a kind of fluorescent powder that excites LED white light also in invention as described in Chinese patent CN103035823A, LED chip is fixed on substrate, and substrate is put into fluorescent powder inside.
Above-mentioned two disclosed technology have all proposed the luminous technical scheme of LED chip omnirange, with respect to the technology of unidirectional bright dipping, improve the light extraction efficiency of LED chip, but this technical scheme fluorescent material consumption increase, complex structure.
Summary of the invention
Technical problem to be solved by this invention be to provide a kind of omnirange luminous, save fluorescent material consumption and New LED light-emitting component simple in structure.
A kind of New LED light-emitting component of the present invention, can adopt following two schemes to realize:
The first structure is as follows:
A kind of New LED light-emitting component, comprise transparent substrates, LED chip, light-emitting component power electrode, the adhesive glue that contains fluorescent material and phosphor gel, it is characterized in that, between described LED chip one light-emitting area and transparent substrates, the adhesive glue that one deck contains fluorescent material is set, another light-emitting area of LED chip and other surface coverage phosphor gel.
Described New LED light-emitting component, described transparent substrates is glass, transparent substrates corresponding with LED chip light-emitting area surface frosted process form rough surface.
The described adhesive glue that contains fluorescent material and phosphor gel can be to adopt same adhesive glue.
The second structure is as follows:
On the basis of above-mentioned the first structure, the phosphor gel top in another light-emitting area of described LED chip also arranges another transparent substrates parallel with transparent substrates.Between described transparent substrates and another transparent substrates, spacing distance is 0.5-2 millimeter.
The advantage of a kind of New LED light-emitting component of the present invention is:
1, owing between LED chip one light-emitting area and transparent substrates, the adhesive glue that one deck contains fluorescent material being set, this structure can arrange layer of fluorescent powder glue-line on substrate, then carry out the operations such as die bond, or complete in the die bond operation of LED encapsulation, in die bond adhesive glue, directly add fluorescent material and make the adhesive glue that contains fluorescent material, by die bond machine by the adhesive glue point that contains fluorescent material on substrate, by die bond machine, LED chip is fixed in the adhesive glue that contains fluorescent material above substrate, therefore, light emitting element structure of the present invention is simple, compare existing die bond technique, its production efficiency can improve 5% left and right, and solve in substrate dusting behind, because side blue streak leakage phenomenon appears in thickness of glass reason.
2, because transparent substrates is glass, and process and form rough surface at the surface frosted of fixed L ED chip, like this, in the time that the pit of above-mentioned rough surface can storage phosphor be avoided LED chip with substrate compression, the attenuation of fluorescent material glue-line affects luminous efficiency; Compare existing LED encapsulating structure, its light extraction efficiency can improve more than 2%,
3, because the phosphor gel top in another light-emitting area of described LED chip also arranges another transparent substrates parallel with transparent substrates, between two substrates, distance is 0.5-2 millimeter, like this, by regulating the distance between two substrates, be easy to the even thickness of another light-emitting area surface coverage fluorescent material glue-line of controlling LED chip, can improve the luminous efficiency of LED light-emitting component, and save a large amount of phosphor material powders; Find through great many of experiments, between two substrates, distance is in the time of the scope of 0.5-2 millimeter, and luminous efficiency the best of LED light-emitting component, and relatively traditional die bond technique, can save approximately 60% phosphor material powder, and economic benefit is very obvious.
Brief description of the drawings
Fig. 1 is the first structural representation of prior art.
Wherein, 1.LED chip connecting line; 2. fluorescent material glue-line; 3. the transparent support plate of leading; 4.LED chip; 5. power electrode.
Fig. 2 is the second structural representation of prior art.
Wherein, 11.LED luminescence component; 12. phosphor gel; 13. transparent outer covers; 14. power electrode lead-in wires.
Fig. 3 is the third structural representation of prior art.
Wherein, 21.LED luminescence component; 22. fluorescent material; 23. transparent Heat Conduction Materials; 24. transparent outer covers; 25. power electrode lead-in wires.
Fig. 4 is the 4th kind of structural representation of prior art.
Wherein, 31.LED chip connecting line; 32. fluorescent material glue-lines; The 33. transparent support plates one of leading; 34.LED chip; 35. power electrodes; The 36. transparent support plates two of leading; The 37. transparent support plates three of leading.
Fig. 5 is the structural representation of the first embodiment of New LED light-emitting component of the present invention.
Fig. 6 is the structural representation of the second embodiment of New LED light-emitting component of the present invention.
Fig. 7 is the structural representation of the third embodiment of New LED light-emitting component of the present invention.
Fig. 8 is the A-A profile of the structural representation of the third embodiment of New LED light-emitting component of the present invention.
Fig. 9 is the structural representation of the 4th kind of embodiment of New LED light-emitting component of the present invention.
Figure 10 is the B-B profile of the structural representation of the 4th kind of embodiment of New LED light-emitting component of the present invention.
Embodiment
As Fig. 5, it is the structural representation of the first embodiment of New LED light-emitting component of the present invention, a kind of New LED light-emitting component, comprise transparent substrates (41), LED chip (42), light-emitting component power electrode (43), the adhesive glue (44) that contains fluorescent material and phosphor gel (45), between each LED chip (42), between LED chip (42) and light-emitting component power electrode (43), all interconnect by LED chip connecting line (46), the adhesive glue (44) that one deck contains fluorescent material is set between one light-emitting area of described LED chip (42) and transparent substrates (41), cementing fixing for LED chip (42) on transparent substrates (41), another light-emitting area of LED chip (42) and other surfaces all cover phosphor gel (45).Described New LED light-emitting component, described transparent substrates (41) is glass, the upper surface frosted for fixed L ED chip (42) of transparent substrates (41) is processed and is formed rough surface.
As Fig. 6, it is the structural representation of the second embodiment of New LED light-emitting component of the present invention, the coating method that the difference of itself and the first structure is described phosphor gel (45) is by changing into around LED chip (42) and forming a fluorescent material glue-line with top in coating around each LED chip (42) in the first structure, and all the other structures are all identical.
As Fig. 7 and Fig. 8, it is the structural representation of the third embodiment of New LED light-emitting component of the present invention, it is on the basis of above-mentioned the first structure, phosphor gel top in another light-emitting area of described LED chip (42) also arranges a transparent substrates (47) parallel with transparent substrates (41), and when the spacing distance between described transparent substrates (41) and transparent substrates (47) is 0.5-2 millimeter, effect is best.Between described transparent substrates (41) and transparent substrates (47), be also provided with transparency carrier back-up block (48).
As Fig. 9 and 10, it is the structural representation of the 4th kind of embodiment of New LED light-emitting component of the present invention, it is on the basis of above-mentioned the second structure, phosphor gel (45) in another light-emitting area of described LED chip (42) top also arranges a transparent substrates (47) parallel with transparent substrates (41), and when the spacing distance between the parallel transparent substrates (47) of described transparent substrates (41) is 0.5-2 millimeter, effect is best.Between the parallel transparent substrates (47) of described transparent substrates (41), be also provided with transparency carrier back-up block (48).
In above-described embodiment, the described adhesive glue that contains fluorescent material (44) can be to adopt same adhesive glue with phosphor gel (45).
Claims (5)
1. a New LED light-emitting component, comprise transparent substrates, LED chip, light-emitting component power electrode, the adhesive glue that contains fluorescent material and phosphor gel, it is characterized in that, between one light-emitting area of described LED chip and transparent substrates, the adhesive glue that one deck contains fluorescent material is set, another light-emitting area of LED chip and other surface coverage phosphor gel.
2. New LED light-emitting component according to claim 1, is characterized in that, described transparent substrates is glass, transparent substrates corresponding with LED chip light-emitting area surface frosted process form rough surface.
3. New LED light-emitting component according to claim 1, is characterized in that, the described adhesive glue that contains fluorescent material and phosphor gel are to adopt same adhesive glue.
4. New LED light-emitting component according to claim 1, is characterized in that, the phosphor gel top in another light-emitting area of described LED chip also arranges another transparent substrates parallel with transparent substrates.
5. New LED light-emitting component according to claim 4, is characterized in that, between described transparent substrates and another transparent substrates, spacing distance is 0.5-2 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410076503.7A CN103872224A (en) | 2014-03-04 | 2014-03-04 | Novel LED (Light Emitting Diode) illuminating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410076503.7A CN103872224A (en) | 2014-03-04 | 2014-03-04 | Novel LED (Light Emitting Diode) illuminating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103872224A true CN103872224A (en) | 2014-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410076503.7A Pending CN103872224A (en) | 2014-03-04 | 2014-03-04 | Novel LED (Light Emitting Diode) illuminating element |
Country Status (1)
| Country | Link |
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| CN (1) | CN103872224A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157640A (en) * | 2014-08-29 | 2014-11-19 | 王维昀 | Omni-directional LED light source |
| WO2015192280A1 (en) * | 2014-06-20 | 2015-12-23 | 福建永德吉灯业股份有限公司 | Led lighting element visible to the eye |
| EP3732736A4 (en) * | 2017-12-26 | 2021-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | Led filament and led light bulb |
| US11168843B2 (en) | 2014-09-28 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US11187384B2 (en) | 2014-09-28 | 2021-11-30 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11629825B2 (en) | 2014-09-28 | 2023-04-18 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with curved filament |
| US11686436B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
| US11690148B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US12007077B2 (en) | 2014-09-28 | 2024-06-11 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US12060455B2 (en) | 2018-04-17 | 2024-08-13 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102185048A (en) * | 2011-04-14 | 2011-09-14 | 翁小翠 | Manufacturing method of high-light emitting rate light-emitting diode (LED) lamp strip |
| CN102281659A (en) * | 2002-12-26 | 2011-12-14 | 株式会社半导体能源研究所 | Panel light with light emitting device and method of manufacturing the light emitting device |
| CN202758885U (en) * | 2012-06-21 | 2013-02-27 | 东莞李洲电子科技有限公司 | Light emitting diode module packaging structure |
| CN103123950A (en) * | 2013-02-06 | 2013-05-29 | 深圳市蓝科电子有限公司 | LED light source packaging structure and packaging method |
| CN103343891A (en) * | 2013-06-08 | 2013-10-09 | 杭州杭科光电股份有限公司 | LED light source module capable of emitting light in 4pi mode |
| CN204155961U (en) * | 2014-03-04 | 2015-02-11 | 福建永德吉灯业股份有限公司 | New LED light-emitting component |
-
2014
- 2014-03-04 CN CN201410076503.7A patent/CN103872224A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281659A (en) * | 2002-12-26 | 2011-12-14 | 株式会社半导体能源研究所 | Panel light with light emitting device and method of manufacturing the light emitting device |
| CN102185048A (en) * | 2011-04-14 | 2011-09-14 | 翁小翠 | Manufacturing method of high-light emitting rate light-emitting diode (LED) lamp strip |
| CN202758885U (en) * | 2012-06-21 | 2013-02-27 | 东莞李洲电子科技有限公司 | Light emitting diode module packaging structure |
| CN103123950A (en) * | 2013-02-06 | 2013-05-29 | 深圳市蓝科电子有限公司 | LED light source packaging structure and packaging method |
| CN103343891A (en) * | 2013-06-08 | 2013-10-09 | 杭州杭科光电股份有限公司 | LED light source module capable of emitting light in 4pi mode |
| CN204155961U (en) * | 2014-03-04 | 2015-02-11 | 福建永德吉灯业股份有限公司 | New LED light-emitting component |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192280A1 (en) * | 2014-06-20 | 2015-12-23 | 福建永德吉灯业股份有限公司 | Led lighting element visible to the eye |
| CN105849919A (en) * | 2014-06-20 | 2016-08-10 | 福建永德吉灯业股份有限公司 | LED lighting element visible to the eye |
| CN105849919B (en) * | 2014-06-20 | 2019-05-28 | 福建永德吉灯业股份有限公司 | It can direct view led light-emitting component |
| CN104157640A (en) * | 2014-08-29 | 2014-11-19 | 王维昀 | Omni-directional LED light source |
| US11690148B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11686436B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
| US11187384B2 (en) | 2014-09-28 | 2021-11-30 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US12066155B2 (en) | 2014-09-28 | 2024-08-20 | Zhejiang Super Lighting Electric Ap | LED bulb lamp |
| US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11629825B2 (en) | 2014-09-28 | 2023-04-18 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with curved filament |
| US11168843B2 (en) | 2014-09-28 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US12007077B2 (en) | 2014-09-28 | 2024-06-11 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11892127B2 (en) | 2014-09-28 | 2024-02-06 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED bulb lamp |
| US11997768B2 (en) | 2014-09-28 | 2024-05-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| EP3732736A4 (en) * | 2017-12-26 | 2021-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | Led filament and led light bulb |
| US12060455B2 (en) | 2018-04-17 | 2024-08-13 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
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Application publication date: 20140618 |