CN208637457U

CN208637457U - A kind of high-power patch-type encapsulation LED crystal lamp

Info

Publication number: CN208637457U
Application number: CN201821471865.6U
Authority: CN
Inventors: 魏伟
Original assignee: Zhongshan Aishihua Lighting Co Ltd
Current assignee: Zhongshan Aishihua Lighting Co Ltd
Priority date: 2018-09-07
Filing date: 2018-09-07
Publication date: 2019-03-22
Anticipated expiration: 2028-09-07

Abstract

The utility model relates to Crystal lamp technical fields, LED crystal lamp is encapsulated more particularly to a kind of high-power patch-type, including Crystal lamp ontology, Crystal lamp ontology includes LED chip, packaging cartridge is equipped with outside LED chip, packaging cartridge upper and lower ends have first through hole and the second through-hole, cooling fin is equipped with inside packaging cartridge, the LED bulb other end that the connection of LED chip one end is located in first through hole is attached on the substrate outside the second through-hole, and fluorescent glue encapsulation is all made of between LED chip and first through hole and between substrate and the second through-hole.For installing LED chip, LED bulb is located in first through hole present apparatus packaging cartridge, reduces the package thickness of fluorescent glue, has saved cost while also having improved light emission rate, the heat derives in LED chip can be increased the service life of LED chip by cooling fin.

Description

A kind of high-power patch-type encapsulation LED crystal lamp

Technical field

The utility model relates to Crystal lamp technical fields, and in particular to a kind of high-power patch-type encapsulation LED crystal lamp.

Background technique

What Crystal lamp should be made by K9 crystal material.It is extensive in Chinese influence, there is long history in countries in the world, beauty Good quality, appearance is bright, glittering, and the product liked that are glittering and translucent and becoming people, current most of Crystal lamps are all adopted With LED illumination, LED light source has few luminous efficiency height, power consumption, long service life, security reliability strong, is good for the environment Characteristic is especially advocated energy-saving and environment-friendly today in the whole world, and LED illumination becomes the favorite of global illumination market.

At present in high-brightness white-light LED field, preparing LED integrating packaging module method is that be attached to chip has first On high reflection substrate, then the electrode of chip is connected on bracket or circuit by way of wire bonding, later on chip Face, which applies, has mixed the silica gel of fluorescent powder, after curing molding, then applies one layer of silica gel not mixed outside for protecting gold thread or electricity Pole.Although this traditional packaged type is simple, there are at high cost, existing high-power LED chip integration packagings, single to produce Condition is to the high amount of encapsulation glue of needs, and the good glue of reliability is mostly import to mesh in the market, and price is very high.Light-out effect It is undesirable, existing high-power LED chip integration packaging, since the thickness of fluorescent glue and external sealant is at least all in 0.5mm or more, The translucency of glue is gradually decreased with the increase of thickness, so that some optical attenuation is in colloid, due to glue itself Thermal conductivity it is very poor, the light of decaying is transformed into heat, accelerates the rate of decay of the materials such as glue and chip, and great power LED core The heat dissipation effect of piece integration packaging is bad to be easy to produce failure.

Utility model content

The purpose of the utility model is to overcome problems of the prior art, provide a kind of high-power patch-type encapsulation LED crystal lamp.

A kind of high-power patch-type encapsulation LED crystal lamp, including Crystal lamp ontology, the Crystal lamp ontology includes LED core Piece, the LED chip outside are equipped with packaging cartridge, and the packaging cartridge is the box like structure of inner hollow, the packaging cartridge upper and lower two End has first through hole and the second through-hole, is equipped with cooling fin inside the packaging cartridge, the cooling fin is enclosed around LED chip At a circle, the LED bulb other end that LED chip one end connection is located in first through hole is attached to outside the second through-hole On substrate, fluorescent glue encapsulation is all made of between the LED chip and first through hole and between substrate and the second through-hole.

Further, round table-like reflecting plate is equipped with outside the LED bulb, the reflection plate surface carries out at frosted Reason.

Further, it is provided with heat release hole on the cooling fin and the heat release hole of abutting fins mutually staggers.

Further, heat-dissipating pipe is equipped in the heat release hole, the heat-dissipating pipe is provided with heat eliminating medium.

Further, the substrate is metal ceramic composite substrate.

The utility model has the beneficial effects that packaging cartridge is for installing LED chip, LED bulb is located in first through hole, reduces The package thickness of fluorescent glue, has saved cost while also having improved light emission rate, cooling fin can be by the heat derives in LED chip The service life of LED chip is increased, metal ceramic composite substrate has high-termal conductivity and ultralow thermal resistance, by frosted processing Reflecting plate can make the light of LED bulb generate diffusing reflection, the full and uniform mixing of spectrum of the light after making reflection, light source side The color of edge is not in jaundice or greening, and heat eliminating medium has very big specific heat capacity, can by heat absorption on cooling fin to Achieving the effect that heat dissipation, heat-dissipating pipe is end to end lower in the position temperature far from LED chip, and in the position for being adjacent to LED chip It sets that temperature is higher, flows heat eliminating medium using the principle expanded with heat and contract with cold, LED chip preferably is increased to LED chip cooling Service life.

Detailed description of the invention

In order to illustrate more clearly of the technical solution of the utility model embodiment, make required for being described below to embodiment Attached drawing is briefly described, it should be apparent that, the drawings in the following description are merely some embodiments of the present invention, For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings Other attached drawings.

Fig. 1 is the structural schematic diagram of the utility model；

Fig. 2 is the schematic top plan view of the utility model；

In attached drawing, parts list represented by the reference numerals are as follows:

1- Crystal lamp ontology 2-LED chip 3- packaging cartridge 4- first through hole 5- the second through-hole 6- cooling fin 7-LED Light bulb 8- substrate 9- reflecting plate 10- heat release hole 11- heat-dissipating pipe.

Specific embodiment

In order to be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, under Face will combine the attached drawing in the utility model embodiment, carry out to the technical scheme in the embodiment of the utility model clear, complete Ground description, it is clear that the described embodiments are only a part of the embodiments of the utility model, instead of all the embodiments.Base In the embodiments of the present invention, institute obtained by those of ordinary skill in the art without making creative efforts There are other embodiments, fall within the protection scope of the utility model.

In the description of the utility model, it should be noted that the side of the instructions such as term "vertical", "upper", "lower", "horizontal" Position or positional relationship be orientation based on the figure or positional relationship, be merely for convenience of description this it is practical and simplification retouch State, rather than indicate or imply that signified device or element must have a particular orientation, with specific orientation construction and Operation, therefore should not be understood as limiting the present invention.In addition, " first ", " second ", " third ", " the 4th " are only used for Purpose is described, and should not be understood as indicating or implying relative importance.

In the description of the utility model, it is also necessary to which explanation " is set unless otherwise specific regulation and limitation, term Set ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, Or be integrally connected, it can be mechanical connection, be also possible to be electrically connected, can be and be directly connected to, be also possible to through intermediate matchmaker It is situated between and is connected, can be the connection inside two elements.It for the ordinary skill in the art, can be as the case may be Understand the concrete meaning of above-mentioned term in the present invention.

As shown in attached drawing 1 to 2, a kind of high-power patch-type encapsulation LED crystal lamp, including Crystal lamp ontology 1, Crystal lamp sheet Body 1 includes LED chip 2, is equipped with packaging cartridge 3 outside LED chip 2, and packaging cartridge 3 is the box like structure of inner hollow, in packaging cartridge 3 Lower both ends have first through hole 4 and the second through-hole 5, and cooling fin 6 is equipped with inside packaging cartridge 3, and cooling fin 6 is used for LED core Piece 2 radiates, and cooling fin 6 forms a circle around LED chip 2, keeps the effect of heat dissipation more preferable, and the connection of 2 one end of LED chip is located at first 7 other end of LED bulb in through-hole 4 is attached on the substrate 8 outside the second through-hole 5, between LED chip 2 and first through hole 4 And fluorescent glue encapsulation is all made of between substrate 8 and the second through-hole 5.

Round table-like reflecting plate 9 is equipped with outside LED bulb 7,9 surface of reflecting plate carries out frosted processing, and frosted is handled anti- Plate 9 is penetrated, the light of LED bulb 7 can be made to generate diffusing reflection, the full and uniform mixing of spectrum of the light after making reflection, light source side The color of edge is not in jaundice or greening.

The heat release hole 10 that heat release hole 10 and abutting fins 6 are provided on cooling fin 6 mutually staggers, and makes on each cooling fin 6 Heat eliminating medium temperature is different in heat-dissipating pipe 11, convenient for the circulation of heat eliminating medium.

Heat-dissipating pipe 11 is equipped in heat release hole 10, heat-dissipating pipe is provided with heat eliminating medium, and heat eliminating medium can reinforce heat dissipation effect.

Substrate 8 is metal ceramic composite substrate, and metal ceramic composite substrate has the characteristics that high-termal conductivity and ultralow thermal resistance, Heat dissipation effect can be played.

In use, LED bulb 7 shines, the diffusing reflection by reflecting plate 9 is that Crystal lamp ontology 1 provides illumination, at the same time High-power LED chip 2 generates amount of heat, and cooling fin 6 is adjacent to LED chip 2, radiates to LED chip 2, cooling fin 6 On be installed with heat-dissipating pipe 11, it is higher close to the heat eliminating medium temperature in the heat-dissipating pipe 11 of LED chip 2, and far from LED chip 2 dissipate Heat eliminating medium temperature in heat pipe 11 is lower, is recycled in heat-dissipating pipe according to the principle heat eliminating medium to expand with heat and contract with cold and by cooling fin Heat on 6 guides, and thus cool down to LED chip 2, and the circuit on substrate 8 is connected with LED chip 2, gold Belonging to ceramic composite substrate has the characteristics that high-termal conductivity and ultralow thermal resistance, can also radiate to a certain extent to LED chip 2, whole A apparatus structure is simple, good heat dissipation effect, increases the service life of LED bulb 7, also increases making for Crystal lamp ontology 1 The brightness and the uniformity of illumination can be increased well with the reflecting plate 9 in service life, and frosted processing.Crystal lamp is supplied by external power supply Electricity.

The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously There is no the details that detailed descriptionthe is all, also not limiting the utility model is only the specific embodiment.Obviously, according to this theory The content of bright book can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably The principles of the present invention and practical application are explained, so that skilled artisan be enable to better understand and utilize this Utility model.The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. a kind of high-power patch-type encapsulates LED crystal lamp, including Crystal lamp ontology (1), which is characterized in that the Crystal lamp sheet Body (1) includes LED chip (2), is equipped with packaging cartridge (3) outside the LED chip (2), and the packaging cartridge (3) is inner hollow Box like structure, packaging cartridge (3) upper and lower ends have first through hole (4) and the second through-hole (5), the packaging cartridge (3) Inside is equipped with cooling fin (6), and the cooling fin (6) forms a circle around LED chip (2), LED chip (2) one end connection LED bulb (7) other end in first through hole (4) is attached on the external substrate (8) of the second through-hole (5), the LED Fluorescent glue encapsulation is all made of between chip (2) and first through hole (4) and between substrate (8) and the second through-hole (5).

2. a kind of high-power patch-type according to claim 1 encapsulates LED crystal lamp, which is characterized in that the LED bulb (7) external to be equipped with round table-like reflecting plate (9).

3. a kind of high-power patch-type according to claim 1 encapsulates LED crystal lamp, which is characterized in that the cooling fin (6) heat release hole (10) that heat release hole (10) and abutting fins (6) are provided on mutually staggers.

4. a kind of high-power patch-type according to claim 3 encapsulates LED crystal lamp, which is characterized in that the heat release hole (10) heat-dissipating pipe (11) are equipped in, the heat-dissipating pipe is provided with heat eliminating medium.

5. a kind of high-power patch-type according to claim 1 encapsulates LED crystal lamp, which is characterized in that the substrate (8) For metal ceramic composite substrate.