CN104235641B - Ultra-thin led light engine - Google Patents

Ultra-thin led light engine Download PDF

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Publication number
CN104235641B
CN104235641B CN 201310488314 CN201310488314A CN104235641B CN 104235641 B CN104235641 B CN 104235641B CN 201310488314 CN201310488314 CN 201310488314 CN 201310488314 A CN201310488314 A CN 201310488314A CN 104235641 B CN104235641 B CN 104235641B
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CN
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light engine
led light
circuit board
according
aluminum substrate
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CN 201310488314
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Chinese (zh)
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CN104235641A (en )
Inventor
李刚
龙文涛
赵伟
罗超
唐超
李东明
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四川新力光源股份有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated metal substrate or other insulated electrically conductive substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/04Optical design
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2111/00Light sources of a form not covered by groups F21Y2101/00-F21Y2107/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Abstract

本发明涉及一种超薄式LED光引擎(100),其包括保护盖(106)、驱动电路板(101)、铝基板(103)和至少一个LED模组(104),铝基板的第一表面被双面高粘性导热片(102)覆盖,借此来固定驱动电路板(101),至少一个LED模组(104)固定在第一表面上,并通过位于第一表面上的绝缘层(200)与铝基板保持绝缘,在绝缘层(200)之上布设有导电线路,用以电气连接至少一个LED模组(104)和驱动电路板(101),铝基板的尺寸至少在周向外侧区域的局部大于驱动电路板(101)的尺寸,使得位于第一表面上的双面高粘性导热片(102)至少在局部固定了保护盖(106)。 The present invention relates to a thin-type LED light engine (100), comprising a first protective cover (106), a driving circuit board (101), an aluminum substrate (103) and the at least one LED module (104), the aluminum substrate surface (102) covering the double-sided high tack heat conductive sheet, whereby the drive is fixed to the circuit board (101), the at least one LED module (104) is fixed on the first surface, by an insulating layer (on the first surface 200) holding the aluminum substrate with an insulating, over the insulating layer (200) laid conductive lines for electrically connecting at least one LED module (104) and a drive circuit board (101), the size of the aluminum substrate at least to the outside in the circumferential local area larger than the driving circuit board (101) is dimensioned such that the double-sided high tack thermally conductive sheet positioned on a first surface (102) at least partially fixing the protective cover (106). 本发明实现超薄设计的同时实现了驱动与控制装置的内置集成并利用双面高粘性胶片,在导热的同时固定了PCB与保护盖。 While the invention to achieve a slim design realized with integrated drive and control means and a double-sided high tack film, and the protective cover is fixed at the same PCB thermally conductive.

Description

超薄式LED光引擎 Ultra-thin LED light engine

技术领域 FIELD

[0001] 本发明设及一种L邸照明领域中的集成式L邸照明装置,尤其是设及L邸光引擎(Light Engine)D [0001] The present invention is provided and an integrated illumination device L L Di Di field of lighting, especially in the light engine is provided and the L Di (Light Engine) D

背景技术 Background technique

[0002] LED光引擎(LED li曲t Engine)即包含L邸封装元件或LED阵列(模组)、L邸驱动器W及其他光度、热学、机械和电气元件的集成式光源。 [0002] LED light engine (LED Li song t Engine) i.e. comprising L Di packaging element or an LED array (modules), the integrated light source L Di W drives and other photometric, thermal, mechanical and electrical components. 该集成式光源可W通过与L邸灯具匹配的常规连接器直接连接到分支电路上。 The integrated light source may be connected to the branch circuit W through a conventional connector with the lamp L Di matched directly. 因此,L邸光引擎是介于L邸灯具和L邸光源之间的器件,与L邸光源的区别是它不含有标准灯头不能与分支电路直接连接,与L邸灯具的相同点是可W具有设定的配光及散热功能。 Accordingly, the light engine is L Di device interposed between the lamp L and L Di Di light source, the difference between Di and the light source L is that it does not contain standard bases can not be directly connected to the branch circuit, the same point of the lamp is L Di W having a heat dissipation function and the light distribution settings. 该产品能有效的提高L邸室内灯具的稳定性,提高各性能参数(如显色性,系统光效等),因此是目前各大L邸照明厂家的未来研发及推广的重点。 The product can effectively improve the stability of L Di indoor lighting, and improve various performance parameters (e.g., color, light efficiency, etc.), so is the focus of the future development and promotion of the major manufacturers of lighting L Di.

[0003] 目前在灯具的开发设计中,已开始使用L邸光引擎。 [0003] currently in development and design of the lamp, the light has begun to use L DI engines. 使用光引擎可W简化灯具的研发时间,较少灯具的装配时间,提供系统可靠性。 W may be simplified using the lamp light engine development time, less assembly time of the lamp, a system reliability. 然而现有的光引擎(例如CN200780042271. 1)出于散热和美观需要,通常具有过大的结构高度和重量,不便于安装。 However, the conventional light engine (e.g. CN200780042271. 1) for cooling and aesthetic needs, typically has a large overall height and weight, are not easy to install. 另外,CN201010157844. 9公开了一种分体式设计方案,该方案虽然声称超薄,且一定程度上解决了L邸模组安装更换问题,但是远没有实现超薄的解决方案。 In addition, CN201010157844. 9 discloses a split design scheme that while claiming to thin, and to some extent solves the problem L Di installation of replacement module, but far from realization of ultra-thin solution. 由于光引擎本身带有驱动电路和L邸模组,特别是还带有散热机构,因此重量较大,所W目前所用的光引擎往往都设置了用于固定LED光引擎各个组成部分的机械式固定机构,例如螺钉。 Since the light engine itself, and with a driving circuit module L Di, especially also with cooling means, and therefore the larger the weight, the W light engines currently used are often provided with various mechanical components of the LED light engine for fixing fixing means such as screws. 但是,螺钉本身具有相当长的结构高度,螺纹结构必然也会导致整体机构增大。 However, the screw itself has a relatively long overall height, it will inevitably lead screw structure increases the entire mechanism. 所W,为了达到超薄目的,不得不在侧向设置螺纹螺钉固定机构,如CN201220329399. 4所公开的技术方案。 The W, in order to achieve the purpose of thin, have threaded screw means, such as CN201220329399. 4 The technical solution disclosed in the lateral direction. 侧向增大的结构纯粹出于固定目的,没有实现小型化的目的。 Purely lateral increased fixing structure purpose without miniaturization purposes.

发明内容 SUMMARY

[0004] 本发明公开了一种超薄式L邸光引擎,其包括保护盖106、驱动电路板101、侣基板103和至少一个L邸模组104,其特征在于,所述侣基板的第一表面被双面高粘性导热片102 覆盖,借助于所述双面高粘性导热片102来固定所述驱动电路板101,所述至少一个L邸模组104固定在所述第一表面上,并通过位于所述第一表面上的绝缘层200与所述侣基板保持绝缘,在所述绝缘层200之上布设有导电线路,用W电气连接所述至少一个L邸模组104 和所述驱动电路板101,所述侣基板的尺寸至少在周向外侧区域的局部大于所述驱动电路板101的尺寸,使得位于所述第一表面上的所述双面高粘性导热片102至少在局部固定了所述保护盖106。 [0004] The present invention discloses an ultra-thin light L Di engine, which includes a protective cover 106, the driving circuit board 101, the substrate 103 and at least one companion L Di module 104, wherein the first substrate companion a double-sided surface is covered with a highly viscous heat conductive sheet 102, by means of the double-sided high tack heat conductive sheet 102 is fixed to the driving circuit board 101, the at least one L Di module 104 is fixed on the first surface, and the insulating layer on the first surface 200 is positioned by holding the companion insulating substrate, the insulating layer 200 over the conductive line laid, electrically connected to said at least one of W module 104 and the L Di the driving circuit board 101, the size of the substrate is larger than companion least partially in the circumferential direction of the outer region the size of the driving circuit board 101, such that the double-sided high tack thermally conductive sheet positioned on the first surface 102 at least partially the protective cover 106 is fixed. 阳〇化]根据一个优选实施方式,所述的L邸光引擎100,其特征在于,所述侣基板的覆盖有双面高粘性导热片102的周向外侧区域超出所述驱动电路板101的外周缘,并且所述保护盖106的下边缘固定在所述双面高粘性导热片102的超出所述驱动电路板101外周缘的区域上。 Of male square] According to a preferred embodiment, the light engine 100 L Di, characterized in that the cover has a circumferential double-sided substrate companion high viscosity of the thermally conductive sheet 102 beyond the driving circuit board 101 to the outside region an outer peripheral edge and the lower edge of the protective cover 106 is fixed on an area beyond the outer periphery of the driving circuit board 101 of the double-sided high viscosity of the thermally conductive sheet 102.

[0006] 根据一个优选实施方式,所述的L邸光引擎100,其特征在于,所述驱动电路板101 呈具有中间开口的板状,并且所述至少一个L邸模组104定位于所述驱动电路板的中间开口处,所述至少一个L邸模组104的供电接口位于所述保护盖106之中。 [0006] According to a preferred embodiment, the light engine 100 L Di, wherein said driving circuit board 101 has a plate shape having a central opening, and at least one L Di module 104 positioned in the opening of the intermediate driving circuit board, said at least one power supply interface module 104 L Di is located in the protective cover 106.

[0007] 根据一个优选实施方式,所述的L邸光引擎100,其特征在于,所述保护盖106在俯视图中呈环状、楠圆环状或矩形环状,并且所述保护盖106具有适于容纳所述驱动电路板101的结构高度。 [0007] According to a preferred embodiment, the light engine 100 L Di, characterized in that the annular protective cover 106, Nan annular or rectangular ring in plan view, and the protective cover 106 having a adapted to receive the overall height of the driving circuit board 101.

[0008] 根据一个优选实施方式,所述的L邸光引擎100,其特征在于,所述保护盖106具有内孔、从所述内孔向外周延伸的反光斜面和外壁,其中,所述内孔的尺寸匹配于所述至少一个L邸模组104,所述内孔的下棱边在靠近所述至少一个L邸模组104的位置处固定在所述双面高粘性导热片102上,其中,所述外壁的下棱边固定在所述双面高粘性导热片102的超出所述驱动电路板101外周缘的区域上。 [0008] According to a preferred embodiment, the light engine 100 L Di, characterized in that the protective cap 106 having an internal bore, and an outer reflecting inclined plane extending from the outer periphery of the inner bore, wherein the inner matches the size of the pores of the at least one L Di module 104, the lower edge of the inner edge of the hole at a position adjacent the at least L Di module 104 is fixed to the double-sided high tack heat conductive sheet 102, wherein the side edge of the outer wall is fixed on the double-sided high tack heat conductive sheet 102 beyond the driving circuit board 101 of the outer periphery of the region.

[0009] 根据一个优选实施方式,所述的L邸光引擎100,其特征在于,所述导电线路为印刷电路,所述导电线路具有电源端口用于从外部电源获得供电,并且所述导电线路具有给所述至少一个L邸模组104供电的L邸供电接口。 [0009] According to a preferred embodiment, the light engine 100 L Di, wherein said conductive line is a printed circuit, said conductive line having a supply port for obtaining power from an external power source, and the conductive line having at least one L Di to the power module 104 L Di power interface.

[0010] 根据一个优选实施方式,所述的L邸光引擎100,其特征在于,所述侣基板和所述保护盖106具有彼此匹配的圆形、楠圆形或矩形。 [0010] According to a preferred embodiment, the light engine 100 L Di, characterized in that the companion substrate and the protective cover 106 has a circular shape matching each other, Nan circular or rectangular.

[0011] 根据一个优选实施方式,所述的L邸光引擎100,其特征在于,在所述保护盖106上设有卡合连接部,用W固定光学元件。 [0011] According to a preferred embodiment, the light engine 100 L Di, characterized in that the protective snap connection is provided on the lid portion 106, W is fixed with the optical element.

[0012] 根据一个优选实施方式,所述的L邸光引擎100,其特征在于,在所述侣基板103上的导电线路上设有凸起状焊盘202,在所述驱动电路板101上设有与所述凸起状焊盘202对应的通孔焊盘201,所述凸起状焊盘202与所述通孔焊盘201是通过焊接实现导电连接的。 [0012] According to a preferred embodiment, the light engine 100 L Di, characterized in that the convex shape is provided on the conductive pad 202 on the companion line substrate 103 on the driving circuit board 101 the shaped pad is provided with a protrusion 202 corresponding to the through hole land 201, the convex shape of the pad 202 via pad 201 is electrically conductively connected by welding.

[0013] 根据一个优选实施方式,所述LED光引擎100,其特征在于,在所述LED光引擎100 上设有至少两个安装孔,所述安装孔贯穿所述保护盖106、所述驱动电路板101和侣基板103,从而能够借助于外部固定机构将所述L邸光引擎100固定在照明设备上。 [0013] According to a preferred embodiment, the LED light engine 100, wherein at least two mounting holes on the LED light engine 100, through the mounting hole of the protective cover 106, the drive Lu substrate 101 and the circuit board 103, thereby fixing means to the external light L Di 100 is fixed to the engine by means of the lighting device.

[0014] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述保护盖106的反光斜面105的坡度取决于保护盖106至少能容纳所述驱动电路板101的高度。 [0014] According to a preferred embodiment, the light engine 100 L Di, characterized in that the protective cover 106 of the reflecting inclined plane 105 depends on the slope of the protective cover 106 to accommodate at least the height of the driving circuit board 101.

[0015] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述保护盖106上的卡合连接部属于可拆卸式环形扣,其中,所述保护盖106的卡合连接部表面均匀分布至少两个凹槽,与所述光学元件上与之相对应的至少两个凸缘结合,形成扣位。 [0015] According to a preferred embodiment, the light engine 100 L Di, wherein said snap connection portion on the protective cover 106 belonging removable annular buckle, wherein the protective cover 106 is snap connection uniform distribution of the surface portion at least two grooves, with at least two flanges corresponding to said optical element and binding, buckling is formed.

[0016] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述L邸光引擎100上的至少两个安装孔均匀分布在所述光引擎100的外周缘区域上,其中,所述至少两个安装孔为通孔,贯穿保护盖106、驱动电路板101和侣基板103,其中,所述通孔的内表面分布有螺纹,所述螺纹是B型螺纹,所述B型螺纹的牙型是Ξ角牙。 [0016] According to a preferred embodiment, the light engine 100 L Di, wherein said at least two mounting holes L in the light engine 100 Di uniformly distributed on the outer circumferential edge region 100 of the light engine, wherein , at least two of said mounting hole is a through hole penetrating the protective cover 106, the driving circuit board 101 and the substrate 103 Lu, wherein the inner surface of the through hole with a thread profile, the screw thread type B, said B Tapped tooth type tooth angle is Ξ.

[0017] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述保护盖106下边缘与所述侣基板103侧边重合。 [0017] According to a preferred embodiment, the light engine 100 L Di, characterized in that the lower edge of the protective cap 106 and the substrate 103 side of the companion coincident.

[0018] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述L邸光引擎100其俯视图为矩形,所述保护盖106的第一下棱边、第二下棱边和第Ξ下棱边与所述侣基板103 的第一侧边、第二侧边和第Ξ侧边分别重合。 [0018] According to a preferred embodiment, the light engine 100 L Di, characterized in that, the light engine 100 which L Di rectangular in plan view, the protective cover 106 at a first edge, a second lower edge Ξ lower edge and the first edge of the substrate 103 Lu, a second side edge and the second side respectively coincide Ξ.

[0019] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述保护盖106的第一下棱边、第二下棱边分别与所述侣基板边103的第一侧边、第二侧边重合。 [0019] According to a preferred embodiment, the light engine 100 L Di, characterized in that the lower edge of the protective cover 106 of the first side, a second side of the lower edge, respectively, a first side 103 of the substrate companion edge, a second side edge overlap.

[0020] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述保护盖106的第一下棱边与所述侣基板103第一侧边重合。 [0020] According to a preferred embodiment, the light engine 100 L Di, characterized in that the lower edge of cover 106 to protect the first side of the first side edge 103 coincides with the companion substrate.

[0021] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述侣基板103的尺寸比所述保护盖106所在区域大1%。 [0021] According to a preferred embodiment, the light engine 100 L Di, wherein said companion size of the substrate 103 than the region 106 where the protective cover 1% larger.

[0022] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述驱动电路板101上包括导电材料通孔,机械固定孔和电器连接孔,其中,所述机械固定孔和机械连接孔均匀分布在所述驱动电路板101上。 [0022] According to a preferred embodiment, the light engine 100 L Di, characterized in that the drive comprises a through hole conductive material, the mechanical and electrical connection holes fixing holes on the circuit board 101, wherein the mechanical fixing hole and mechanical connection holes are evenly distributed on the driving circuit board 101.

[0023] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述侣基板103具有与所述驱动电路板相对应的电气连接通孔,其中,所述驱动电路板101的电线穿过所述电气连接通孔与外部电源相连接获取电源。 [0023] According to a preferred embodiment, the light engine 100 L Di, characterized in that the companion substrate 103 having a through hole is electrically connected to the corresponding driving circuit board, wherein the driving circuit board 101 the electrical wires through the connection through-hole is connected to an external power source to receive power.

[0024] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述侣基板103底部覆有所述双面高粘性导热片102,所述L邸光引擎通过所述双面高粘性导热片102直接固定至其他照明设备。 [0024] According to a preferred embodiment, the light engine 100 L Di, characterized in that, the base substrate 103 is coated with the companion sided high tack heat conductive sheet 102, the light L DI engine through the double-sided highly viscous thermally conductive sheet 102 is directly secured to the other lighting devices.

[00巧]根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述反光斜面是呈橘皮效果的斜面。 [Qiao 00] According to a preferred embodiment, the light engine 100 L Di, wherein said light reflecting inclined slope is orange peel effect.

[00%] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述内孔下棱边的横截面呈梯形状,其中,所述下棱边的下表面均匀分布有小凸点,使得所述下表面与所述双面高粘性导热片102紧密结合。 [00%] According to a preferred embodiment, the light engine 100 L Di, characterized in that the cross section of the trapezoidal shape of the lower edge of the bore, wherein the lower surface of the lower edge of the small uniformly distributed bumps, so that the lower surface of the double-sided high tack closely thermally conductive sheet 102.

[0027] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述侣基板103的外周缘包括向上凸起的向下U型状倒钩元件,所述保护盖106外壁下端有与所述向下U型状倒钩元件相匹配的向上U型状倒钩元件,使得所述向下U型状倒钩元件和向上U型状倒钩元件W嵌入的方式相互连接。 [0027] According to a preferred embodiment, the light engine 100 L Di, characterized in that the outer periphery of the substrate 103 includes a companion downwardly U-shaped barb elements projecting upwardly, the lower end of the outer wall of the protective cover 106 upward U shape of the barb element downwardly U-shaped barb elements match, such that the U-shaped barb element downwardly and upwardly U-shaped barb elements connected to each other W embedded.

[0028] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述第一表面包括均匀分布的小凸点,使得所述双面高粘性导热片102紧密地覆盖所述侣基板103。 [0028] According to a preferred embodiment, the light engine 100 L Di, wherein said first surface comprises a uniform distribution of small bumps, such that the double-sided high tack heat conductive sheet 102 tightly covers the companion the substrate 103.

[0029] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,所述双面高粘性导热片102是具有0. 1-0. 5mm厚度的弹性材料。 [0029] According to a preferred embodiment, the light engine 100 L Di, wherein the double-sided high tack heat conductive sheet 102 is an elastic material having a 0. 1-0. 5mm thickness.

[0030] 根据一个优选实施方式,所述L邸光引擎100,其特征在于,侣基板103的外周缘超出保护盖106区域的部分包括预断槽,所述预断槽是V型预断槽。 [0030] According to a preferred embodiment, the L Di light engine 100, wherein the outer peripheral edge of the companion substrate 103 beyond the portion of the protective cover 106 area includes a pre-off slots, the pre-breaking groove is V-shaped prejudge groove.

[0031] 本发明至少达到了下述优点: [0031] The present invention is to achieve at least the following advantages:

[0032] 1、实现超薄设计的同时实现了驱动与控制装置的内置集成。 [0032] 1, by which a thin design while achieving a built-in integrated drive and control device.

[0033] 2、通过使用了双面高粘性胶片,在导热的同时固定了PCB与保护盖。 [0033] 2, by using a double-sided high tack film, while the thermally conductive fixing the PCB with the protective cover.

[0034] 3、PCB与侣基板之间使用了对用焊点焊接,一次性实现了机械固定和电气连接。 [0034] 3, with the use of the solder joints, disposable achieve mechanical fixing and electrical connection between the PCB and companion board.

[0035] 4、LED出光一侧设计为带有斜面的方式。 [0035] 4, LED light side is designed as a beveled manner. 可W根据需要选用适当保护盖来调整出光角度。 W may be suitably selected according to need to adjust the light cover angle.

[0036] 5、本发明便于实现多种轮廓形状。 [0036] 5, the present invention is easy to implement a variety of profile shapes.

[0037] 6、保护盖使用的材料是轻质导热材料,利于散热,并且保护盖的反光斜面在相同高度下比垂直面面积更大,增大了散热面积,进一步提高了散热效率。 [0037] 6, the protective material used is a lightweight cover thermally conductive material for heat dissipation, and the protective cover of the reflecting inclined plane area larger vertical than the heat dissipation efficiency is further improved at the same height, increasing the cooling area.

[0038] 7、卡合连接使用的是可拆卸式环形扣,可反复拆卸安装,使用简单、方便、快捷。 [0038] 7, the engagement is detachable connection ring buckle, can be repeatedly disassembled to install, simple, convenient and fast.

[0039] 根据本发明的L邸光引擎适用于超薄需要,同时还需要内置驱动与控制的方案而设计,可广泛应用在射灯、筒灯等场合。 [0039] The L Di light engine according to the present invention needs applicable to thin, but also need to built-in drive and control scheme is designed, can be widely used in the spotlight, down and so on. 体积更小,厚度更薄。 Smaller and thinner. 属于小型化产品,既轻薄尺寸又小,性价比高,无外置驱动电路。 It is a small product, both thin and small size, high cost, no external drive circuit. 特别是,根据本发明的L邸光引擎可实现整体厚度小于6毫米的技术方案。 In particular, according L Di light engine according to the present invention may be implemented aspect of overall thickness less than 6 mm.

附图说明W40] 图1是本发明的超薄式LED光引擎的剖视图; Brief Description of W40] FIG. 1 is a sectional view of a thin-type LED light engine according to the present invention;

[0041] 图2是本发明的超薄式LED光引擎的细节图; [0041] FIG. 2 is a thin-type LED light engine according to the present invention, a detailed view;

[0042] 图3是根据本发明一个实施方式的超薄式LED光引擎的俯图; [0042] FIG. FIG. 3 is a plan ultra-thin LED light engine according to an embodiment of the present invention;

[0043] 图4是根据本发明一个实施方式的超薄式LED光引擎的俯图; [0043] FIG. 4 is a plan ultra-thin LED light engine according to an embodiment of the present invention;

[0044] 图5是根据本发明一个实施方式的超薄式LED光引擎的俯图; [0044] FIG. FIG. 5 is a plan ultra-thin LED light engine according to an embodiment of the present invention;

[0045] 图6是根据本发明一个实施方式的超薄式LED光引擎的俯图; [0045] FIG. 6 is a plan ultra-thin LED light engine according to an embodiment of the present invention;

[0046] 图7是本发明的超薄式LED光引擎的细节图。 [0046] FIG. 7 is a thin-type LED light engine is a detailed view of the present invention.

[0047] 附图标记列表W4引100:LED光引擎106 :保护盖101 :驱动电路板W例103:侣基板104 :L邸模组102:双面高粘性导热片 [0047] LIST OF REFERENCE NUMERALS W4 primer 100: LED light engine 106: cover 101: driving circuit board 103 Example W: Lu substrate 104: L Di Module 102: double-sided high tack heat conductive sheet

[0050] 105 :反光斜面 [0050] 105: reflecting inclined plane

[0051] 200:绝缘层201 :通孔焊盘202 :凸起状焊盘 [0051] 200: insulating layer 201: through-hole lands 202: pad-like projections

具体实施方式 Detailed ways

[0052] W下结合附图详细说明本发明。 The [0052] W the present invention is described in detail in conjunction with the accompanying drawings.

[0053] 图1示出了一种超薄式LED光引擎100,其包括保护盖106、驱动电路板101、侣基板103和至少一个L邸模组104。 [0053] FIG. 1 shows a thin-type LED light engine 100, which includes a protective cover 106, the driving circuit board 101, the substrate 103 and at least one companion L Di module 104. 如图所示,该超薄式L邸光引擎100朝向上方是出光表面。 As shown, the ultra-thin facing upward Di L 100 is the light exit surface of the light engine. 在下方为侣基板。 Below is a companion board. 保护盖106用于覆盖保护驱动电路板101,防止外界对驱动电路板的损坏,并且使其免受潮气等的影响。 Effect 106 for covering the driving circuit board 101 is protected against external damage to the driving circuit board, and the like so that the protective cover from moisture. 侣基板103和至少一个L邸模组104通过双面高粘性导热片102彼此紧贴。 Lu substrate 103 and at least one L Di module 104 by a double-sided high tack heat conductive sheet 102 against one another.

[0054] 侣基板的第一表面被双面高粘性导热片102覆盖,借助于双面高粘性导热片102 来固定驱动电路板101。 [0054] a first surface of the substrate is thermally conductive companion sheet 102 covers the two-sided high tack, high viscosity by means of a double-sided thermally conductive sheet 102 is fixed to the driving circuit board 101. 双面高粘性导热片是导热硅胶片、阻燃硅胶片或者高性能导热绝缘片。 Thermally conductive sheet is a double-sided high tack sheet thermal silica, silica retardant high performance thermal insulation sheets or sheet. 导热硅胶片是高性能间隙填充导热材料,主要用于电子设备与散热片或产品外壳间的传递界面。 Silicone is a high performance thermal conductive gap filling sheet of thermally conductive material, mainly for transferring interface between the electronic device and the heat sink or the case. 有些导热硅胶还加有玻璃纤维(或碳纤维)W增加其机械强度。 Some further added thermal silica glass fibers (or carbon fibers) W to increase its mechanical strength. 有些导热硅胶还涂覆有耐溫压敏胶。 Some temperature thermal silica also be coated with a pressure sensitive adhesive. 阻燃硅胶片具有导热,绝缘,防震性能,材质柔软表面自带粘性,操作方便,可应用在各种不规则零件表面与散热器,外壳等之间起导热填充作用。 A thermally conductive sheet having a silicone flame retardant, insulation, shock resistance, self-adhesive surface material is soft, easy to operate, the role of the thermally conductive filler may be applied between the various parts of the irregular surface of the heat sink, and the like from the housing. 导热硅胶绝缘片是一种W特殊薄膜为基材的高性能弹性体绝缘材料,具有优良的抗切割能力和极好的导热性能,被广泛应用于电子电器等行业。 Thermal silica insulating film is a W film as the substrate, high-performance special elastomeric insulating material having excellent cut resistance and excellent thermal conductivity are widely used in electrical and electronic industries. 双面高粘性导热片102具有良好的粘性、柔性、 良好的压缩性能W及具有优良的热传导率。 High tack double-sided thermal conductive sheet 102 having a good adhesion, flexibility, good compression performance and W have excellent thermal conductivity. 在使用中,使电子原件和散热片之间的接触充分,可W达到充分的散热效果,并且可W根据发热界面的大小及间隙高度选择不同厚度的双面高粘性导热片进行裁切。 In use, the contact between the electronic components and the heat sink sufficiently, W can achieve a sufficient cooling effect, and may select a different height W the thickness of the thermally conductive sheet for double-sided high tack and cut according to the size of the interface space heating. 而且双面高粘性导热片102不易脱落,便于安装操作,除了能够散热,还可W对光引擎中的其他构件如保护盖的粘接,取代了螺丝钉固定,大大缩小了产品结构。 And a double-sided high tack heat conductive sheet 102 easy to fall off, easy to install and operate, in addition to cooling, other components may be W light engine protective adhesive cover, replace the screws, greatly reducing the product structure. 本发明使用的双面高粘性导热片102的物理特性参数例如见下表: High tack double-sided thermal conductive sheet used in the present invention, parameters such as the physical characteristics of 102 as follows:

[ο化5] 表1 [5 of o] TABLE 1

[0056] [0056]

Figure CN104235641BD00091

[0057] 至少一个L邸模组104固定在第一表面上,并通过位于第一表面上的绝缘层200 与侣基板保持绝缘。 [0057] L Di at least one module is fixed on the first surface 104, and insulated by an insulating layer held on the first surface of the substrate 200 and the companion. 在绝缘层200之上布设有导电线路(图中未示出),用W电气连接至少一个L邸模组104和驱动电路板101。 Laid over the insulating layer 200 has conductive traces (not shown), connecting at least one L Di module 104 and the drive circuit board 101 for electrically W. 导电线路具有给至少一个L邸模组104供电的LED 供电接口。 At least one conductive trace having a 104 L Di powered LED power module interface. 侣基板的尺寸至少在周向外侧区域的局部大于驱动电路板101的尺寸,使得位于第一表面上的双面高粘性导热片102至少在局部固定了保护盖106。 Lu substrate size is larger than at least a partially circumferential outer region of the size of the driving circuit board 101, so that the double-sided high tack positioned on a first surface of the thermally conductive sheet 102 is at least partially fixed in the protective cover 106. 利用双面高粘性导热片固定保护盖省去了用螺丝钉或者螺栓固定,节省了空间。 A double-sided high tack heat conductive sheet eliminating the fixed cover with screws or bolts, to save space.

[0058] 根据一个优选实施方式,侣基板的覆盖有双面高粘性导热片102的周向外侧区域超出驱动电路板101的外周缘,并且保护盖106的下边缘固定在双面高粘性导热片102的超出驱动电路板101外周缘的区域上。 [0058] According to a preferred embodiment, the substrate has a peripheral cover companion sided high tack heat conductive sheet 102 beyond the outer periphery of the driving circuit board 101 to the outside area, a double-sided high tack and protects the lower edge of the thermally conductive sheet 106 is fixed to the cover beyond the driving circuit board 101 of the 102 region of the outer periphery.

[0059] 根据一个优选实施方式,驱动电路板101呈具有中间开口的板状,并且至少一个L邸模组104定位于驱动电路板101的中间开口处,至少一个L邸模组104的供电接口位于保护盖106之中。 [0059] According to a preferred embodiment, the driving circuit board 101 has a plate shape of a central opening, and at least one L Di module 104 is positioned in the middle of the opening of the driving circuit board 101, at least one L Di supply interface module 104 in the protective cover 106.

[0060] 根据一个优选实施方式,保护盖106在俯视图中呈环状、楠圆环状或矩形环状,并且保护盖106具有适于容纳驱动电路板101的结构高度。 [0060] According to a preferred embodiment, the protective cover 106 is annular or rectangular ring Nan annular in plan view, and the protective cover 106 has a structure highly adapted to receive the driving circuit board 101. 由于驱动电路板101具有较小的结构高度,所W整体上实现了较小结构高度。 Since the driving circuit board 101 has a smaller structural height, to achieve a smaller overall height of the structure W. 保护盖本身也是由导热性优异的轻型材料制成。 Cover itself is made of a lightweight material having excellent thermal conductivity. 因此,侣基板通过双面高粘性导热片102与保护盖一起构成了散热结构。 Thus, companion substrates together constitute a double-sided high tack heat dissipating structure thermally conductive sheet 102 and the protective cover. 运种散热结构充分利用了光引擎的各种壳体部分,从而达成了超薄和散热两项目的。 Transport heat dissipation structure makes full use of the various portions of the light engine housing, so as to achieve the slim and two cooling projects.

[0061] 根据一个优选实施方式,保护盖106具有内孔、从内孔向外周延伸的反光斜面和外壁,其中,内孔的尺寸匹配于至少一个LED模组104,内孔的下棱边在靠近至少一个LED模组104的位置处固定在双面高粘性导热片102上,其中,外壁的下棱边固定在双面高粘性导热片102的超出驱动电路板101外周缘的区域上。 [0061] According to a preferred embodiment, the protective cover 106 having an internal bore, and an outer reflecting inclined plane from the inner periphery outwardly extending bore, wherein the bore is matched to the size of the at least one LED module 104, the lower edge of the inner edge of the hole in the at a location near the at least one LED module 104 is fixed to the double-sided high tack heat conductive sheet 102, wherein the lower edge of the outer wall is fixed on both sides of a highly viscous thermally conductive sheet 102 beyond the driving circuit board 101 of the outer periphery of the region. 换而言之,保护盖仅在内孔下边缘和外壁下边缘固定至侣基板。 In other words, only the inner cover lower edge of the lower edge of the hole and an outer wall fixed to companion board. 运种固定是通过双面高粘性导热片102实现的,便于充分利用外壳进行散热。 102 species transport is realized by fixing two-sided high tack heat conductive sheet, to facilitate the full use of the housing for heat dissipation.

[0062] 根据一个图中未出示的优选技术方案,导电线路为印刷电路,导电线路具有电源端口用于从外部电源获得供电,并且导电线路具有给所述至少一个L邸模组104供电的LED 供电接口。 [0062] According to a preferred aspect of the figures are not presented, as a printed circuit conductive traces, the conductive line has a power port for obtaining power from an external power source, and to said conductive trace having at least one LED module 104 L Di powered power connector. 使用印刷电路的好处在于不用在电路板上一次一次地进行焊接,免去了大量复杂的手工接线操作,而且能达到高精度,使电路板的生产效率大大提高。 Advantage is that without using a printed circuit board in the welding time and again, a large number of complex eliminates manual connection operation, and can achieve high precision, the circuit board so that the productivity is greatly improved. 生产时只需把导体图形用印制手段蚀刻或感光在侣基板103的绝缘层200上,使生产变得简单易行,而且电子设备性能一致,质量稳定,结构紧凑。 Simply means printed conductor pattern by etching or the photosensitive layer on the insulating substrate 103 Lu 200, so the production becomes easy production, and that the electronic equipment performance, stable quality, compact structure. 导电线路通过电源端口从外部获得电源,然后通过至少一个L邸模组104的L邸供电接口将电源提供给至少一个L邸模组,从而实现电气连接。 Conductive trace obtained from an external source through a power port, and then through at least one of L 104 L Di Di module power connector to supply power to the at least one L Di module, thereby achieving electrical connection.

[0063] 根据一个优选实施方式,侣基板103和保护盖106具有彼此匹配的圆形(图3)、楠圆形或矩形(图4)。 [0063] According to a preferred embodiment, the companion substrate 103 and the protective cover 106 having a circular (FIG. 3) match each other, Nan circular or rectangular (FIG. 4). 如图5所示,侣基板103和保护盖106也可W呈正方形。 5, Lu substrate 103 and the protective cover 106 may also W square. 侣基板与保护盖的形状彼此配合,便于实现光引擎的整体式造型结构,从而有助于此后将该光引擎100 安装至其他照明机构。 Lu substrate and cover cooperate with each other to form, shape facilitate unitary structure of the light engine, thereby contributing to light after the engine 100 is mounted to the other lighting means.

[0064] 根据一个优选实施方式,在保护盖106上设有卡合连接部,用W固定光学元件。 [0064] According to a preferred embodiment, an engaging portion connecting the upper cover 106, W is fixed with the optical element. 在保护盖106的内孔上方的出光区域可W设置光学元件,用W实现各种光学效果。 In the region above the light hole cover 106 may be an optical element W, with W achieve various optical effects. 而运也不会影响到本发明的结构高度。 The operation will not affect the overall height of the present invention. 阳0化]参见图2,根据一个优选实施方式,在侣基板103上的导电线路上设有凸起状焊盘202,在驱动电路板101上设有与凸起状焊盘202对应的通孔焊盘201,使用焊锡丝可将侣基板103上的凸起状焊盘202与驱动电路板上与之对应的通孔焊盘焊接起来,运样可W将侣基板和驱动电路板101牢固的固定起来,同时形成电气连接。 0 of the male] Referring to Figure 2, according to one preferred embodiment, the companion conductive trace on the substrate 103 provided with a protrusion shaped pad 202, pad 202 is provided with a convex shape corresponding through the driving circuit board 101 in hole pads 201 using solder wire via pad may be shaped projection on the pad 202 and the driving substrate 103 companion circuit board corresponding thereto welded together to transport the sample W can be Lu substrate and the driving circuit board 101 is firmly It fixed together while forming an electrical connection.

[0066] 根据一个优选实施方式,在L邸光引擎100上设有至少两个安装孔,安装孔贯穿保护盖106、驱动电路板101和侣基板103,从而能够借助于外部固定机构将L邸光引擎100 固定在照明设备上。 [0066] According to a preferred embodiment, is provided in the optical engine 100 L Di at least two mounting holes, mounting hole penetrating the protective cover 106, the driving circuit board 101 and the companion substrate 103, thereby fixing means of an external mechanism L Di light engine 100 is fixed to the lighting device.

[0067] 根据一个优选实施方式,保护盖106的反光斜面105的坡度取决于保护盖106至少能容纳驱动电路板101的高度。 [0067] According to a preferred embodiment, the protective cover 106 of the reflecting inclined plane 105 depends on the slope of the driving circuit 106 can accommodate at least the height of the cover plate 101. 由于驱动电路板带有占用一定立体空间的电器元件巧曰电容),因此需要为其提供一定结构空间。 Since the driving circuit board with electrical components take up some space perspective Qiao said capacitance), it is necessary to provide a certain space. 为了形成运种结构空间,需要保护盖具备一定的立体结构。 To form seed transport space, we need to have some protective cover three-dimensional structure. 为此,本发明规定了一种优化的结构设计,使得保护盖106在起到容纳保护效果的同时,还担负起反光作用。 To this end, the present invention provides an optimized design, so that the protective cover 106 while accommodating the protective effect of the play, but also take reflective effect.

[0068] 根据一个优选实施方式,保护盖106的反光斜面上设有反射膜,构成所述反射膜的材料是镜面侣、喷砂氧化侣、塑胶面、白色油漆图层或者高反射率纳米漫反射涂料。 [0068] According to a preferred embodiment, a reflecting film on the protective cover 106 of the reflecting inclined plane, a material constituting the reflective film is mirror Lu, Lu sandblasting, plastic surface, a layer of white paint or a high diffuse reflectance nano reflective coating. 通过此项技术特征进一步增强了出光效果。 Characterized in the art by the light emitting effect is further enhanced. 采用各种反射率或反射效果不同的材料,可W使得该光引擎具备各异的发光效果。 Different reflection effect of reflectance or various material W such that the light engine may have different glow. 此外,L邸灯使用中最大的一个障碍是光源利用率不大并且会产生眩光。 In addition, L Di lamp operation is the biggest obstacle to a light utilization and can not produce glare. 因此,在生产L邸灯具时会增加能避免L邸眩光的反射涂料或者安装反射器, 使光源通过反射面形成二次面光源,解决L邸眩光问题并且提高对光源的利用率。 Accordingly, when the lamps will increase the production of L Di-reflective coating to avoid glare or L Di mount reflector, the secondary light source is formed by a surface light source reflecting surface, and solving the glare problem L Di improve the utilization of the light source. 例如,本发明超薄式L邸光引擎出光面周围的保护盖具有平滑的反光斜面,在该反光斜面上涂覆具有星光效果的反射涂料。 For example, the present invention thin light engine of formula L Di around the protective cap having a smooth surface reflecting inclined plane, coated with a reflective coating starlight effect on the reflecting inclined plane. 运种L邸光引擎可W在低光情况下,产生星光效应,起到装饰效果。 L Di transported species may be W light engine in low light situations, produce star effect, for decorative effect. 另一个例子,保护盖106定位在COB封装和L邸发光部分四周,在其反光斜面上设置安装座,该安装座便于使用者根据具体应用场合而安装各异的光学反射器,从而满足各种个性化要求。 As another example, the protective cover 106 is positioned in the package and the light emitting portion L Di four weeks COB, the mounting seat is provided on its reflecting inclined plane, which facilitates the user mount according to the particular application and different optical reflectors installed to meet individual requirements.

[0069] 根据一个优选实施方式,保护盖106上的卡合连接部属于可拆卸式环形扣,其中, 保护盖106的卡合连接部表面均匀分布至少两个凹槽。 [0069] According to a preferred embodiment, the protective snap connection portions 106 belonging to the removable annular lid fastener, wherein the protective cover 106 of the card connector engagement surface at least two recesses uniformly distributed. 参见图7,凹槽呈钩形状,与光学元件上与之相对应的至少两个凸缘结合,形成扣位。 Referring to Figure 7, the form of hook-shaped groove, the optical element with at least two flanges combined with the corresponding form buckling. 凸缘是由梁和保持元件构成。 Beam flange is made and the holding member. 卡合(卡扣) 是用于一个零件与另一个零件的嵌入连接或整体闭锁的机构,通常用于塑料件的连接,其材料通常是具有一定柔初性的塑料材料构成。 Engaging (locking) is connected to or integral latching mechanism for embedding a part of the other part, typically used to connect a plastic member, which material is typically a plastic material having a certain configuration of flexible early. 保护盖的材料是轻质导热复合材料,具有一定弹性变形的能力,安装拆卸方便,可W做到免工具拆卸。 The cover material is a lightweight thermally conductive composite material having a certain elastic deformation capacity, easy installation and removal can be done tool-W. 此外,保护盖106上的卡合连接部不仅能将L邸光引擎100与其他照明设备相连接,由于本发明采用的是可拆卸式环形扣还便于L邸光引擎或照明设备的更换,在使用时变得非常方便并且不会造成资源的浪费, 不至于因为一个构件的损坏而废弃整个L邸照明设备。 Further, the protective cover on the engaging portion 106 is connected not only can L Di light engine 100 is connected to the other lighting devices, since the present invention uses a detachable ring buckle further facilitate the replacement of L Di light engine or lighting device, in It becomes very convenient and does not cause waste of resources when used, because they can not damage a member L Di discarded entire lighting apparatus.

[0070] 根据图中一个未出示的优选设计方案,L邸光引擎100上的至少两个安装孔均匀分布在L邸光引擎100的外周缘区域上。 [0070] According to a preferred embodiment of the figures are not presented, L at least two mounting holes on the light engine 100 Di uniformly distributed on the outer circumferential edge region of 100 L Di light engine. 例如圆形或楠圆形L邸光引擎,安装孔是等间距分布在L邸光引擎外周缘区域上。 Such as circular or circular Nan L Di light engine, mounting holes are equally spaced on the light L Di outer circumferential region of the engine. 另一个例子,L邸光引擎为矩形时,每一条边上的安装孔也是等间距分布的,其中至少两个安装孔设置在L邸光引擎的对角上,运样会固定得更加牢固。 As another example, when the light L DI engine is rectangular, one edge of each of the mounting holes are equally spaced, wherein the at least two mounting holes provided in the light engine L Di on the diagonal, the sample transport will be fixed more solid. 该至少两个安装孔为通孔,贯穿保护盖106、驱动电路板101和侣基板103,使得起紧固作用的螺丝穿过保护盖106、驱动电路板101和侣基板103。 The at least two mounting holes is a through hole penetrating the protective cover 106, the driving circuit board 101 and the substrate 103 Lu, so that the fastening effect from the screw through the cover 106, the driving circuit board 101 and the substrate 103 Lu. 螺丝柱的长度大于L邸光引擎的厚度,多出的部分刚好和安装部件如灯具上的安装孔匹配。 Column length of the screw is greater than the thickness L Di of the light engine, and the extra section just on the mounting member such as a lamp mounting hole match. 通孔内表面分布有螺纹,所述螺纹是B型螺纹。 The surface distribution of the through-hole thread which is a B-type thread. 所述B型螺纹是单线Ξ角牙螺纹,牙型大,自锁性能好,而且牙根厚,强度高,锁紧速度快,反复使用性好,适用于可塑性塑料,不会引起塑料的烧附、破裂W及锁入口的破损。 The type B is a single screw thread angle Ξ, tooth type, good self-locking capability, and the root thickness, high strength, high locking speed, repeated use resistance, plasticity suitable plastic, without causing sticking of plastic , damage and rupture W lock the entrance.

[0071] 参见图3、图4、图5,保护盖106的下边缘与侣基板103侧边重合。 [0071] Referring to FIG 3, FIG 4, FIG 5, the protective cover 103 and the lower edge of the companion side of the substrate 106 overlap. 此时LED光引擎体积最小。 At this time, the minimum volume of the LED light engine. 除此之外,当L邸光引擎为矩形时,保护盖106与侣基板103的相对位置还有W下Ξ种情况:参见图6 (a),保护盖106的第一下棱边、第二下棱边和第Ξ下棱边与所述侣基板103的第一侧边、第二侧边和第Ξ侧边分别重合;参见图6 (b),保护盖106的第一下棱边、第二下棱边分别与所述侣基板边(103)的第一侧边、第二侧边重合;参见图6 (C), 保护盖106的第一下棱边与所述侣基板103第一侧边重合。 In addition, when L Di rectangular light engine, the relative position of the protective cover 106 and substrate 103 as well as companion case Ξ case W: see FIG. 6 (a), a first lower edge of the protective cover 106 side, the first two Ξ lower edge and the lower edge of the first side of the substrate 103 Lu, a second side edge and the second side edges, respectively, coincide Ξ; see FIG. 6 (b), the protective cover 106 of the first lower edge , the second lower edge, respectively, of the companion substrate edge (103) first side, a second side edge coincident; see FIG. 6 (C), the lower edge of the protective cover 106 of a first side of the substrate 103 and the companion The first side coincide. 具体情况根据L邸光引擎的使用情况不同而定。 The case may be depending on the use of L Di of the light engine. 参见图6 (a)、图6 (b)、图6 (C),侣基板103的尺寸比所述保护盖106 所在区域大1%。 Referring to FIG. 6 (a), FIG. 6 (b), FIG. 6 (C), the size of the substrate 103 than the companion protective cover region 106 where 1% larger.

[0072] 根据一个图中未出示的优选技术方案,L邸模组104)是COB封装式L邸模组,其中,L邸模组中的忍片直接封装在印刷电路上。 [0072] According to a preferred aspect of the figures are not presented, L Di module 104) is encapsulated L Di COB module, wherein, the tolerance L Di module on the printed circuit sheet directly encapsulated. COB封装是将多颗L邸忍片直接封装在金属基如侣基板印刷电路板MCPCB,通过侣基板103直接散热,不仅能减少制造工艺及其成本, 还具有减少热阻的散热优势。 COB packaging is more stars L Di tolerance sheet directly encapsulated metal-based substrate such as a printed circuit board an MCPCB Lu, Lu substrate 103 by direct heat, not only to reduce the manufacturing process and cost, but also has the advantage to reduce heat thermal resistance. COB封装的L邸模块在底板上安装了多枚L邸忍片,使用多枚忍片不仅能够提高亮度,还有助于实现L邸忍片的合理配置,降低单个L邸忍片的输入电流量W确保高效率。 L Di COB module package installed on the base to endure multiple pieces of sheet L Di, using multiple pieces of sheet endure not only possible to improve the brightness, but also contribute to a reasonable configuration endure L Di sheet, reducing the input electrical single L Di tolerance sheet W traffic to ensure high efficiency. 而且运种面光源能在很大程度上扩大封装的散热面积,使热量更容易传导至保护盖106,并通过由轻质导热复合材料做成保护盖106将热量散失。 And a surface light source can be transported in large seed encapsulated enlarged cooling area, the heat is more easily conducted to the protective cover 106, and through the heat conducting composite material made of a lightweight protective cover 106 heat loss. 除此之外,通过合理地设计和模造微透镜,能有效地避免分立光源器件组合存在的点光、眩光等弊端,另外加入适当的红色忍片组合,能在不降低光源效率和寿命的前提下,有效地提高光源的显色性。 In addition, by rational design and mold making microlenses, can effectively avoid the presence of a combination of the discrete light source device of the light, glare and other disadvantages, further addition of an appropriate combination of red tolerance sheet can be made without reducing the efficiency and lifetime of the light source under effectively improve the color rendering properties of light sources. COB光源模块使照明灯具的安装生产更简单和方便。 COB lighting source module enables easier installation and ease of production.

[0073] 根据一个图中未示出的优选技术方案,驱动电路板包括锻金(导电材料)通孔,机械固定孔和电气连接孔。 [0073] The preferred technique is not shown, the driving circuit board includes a forged metal (conductive material) the through hole, fixing holes mechanical and electrical connection in accordance with one hole in FIG. 其中,机械固定孔均匀分布在驱动电路板101的外周缘区域上,用于固定驱动电路板。 Wherein the mechanical fixing holes are evenly distributed over the outer circumferential edge region of the driving circuit board 101, for fixing the driving circuit board. 锻金通孔是用于驱动电路板101上电器元件的安装,为了使元件整齐、 均匀、合理地分布在驱动电路板上,相应的锻金通孔也应合理布局。 Gold forging a through hole for mounting on the driving circuit board 101 of the electrical components, in order to make elements neat, uniform, rationally distributed on the driving circuit board, forging the respective through holes should be rational distribution of gold. 电气连接孔是用于元件与元件之间的电气连接。 Electrical connection hole for electrical connection between the element and the element.

[0074] 根据一个优选实施方式,至少一个L邸模组104的供电接口W凸点形式裸露在外, 供电接口凸点为上锡焊盘,通过导电线路与驱动电路板101电气连接。 [0074] According to a preferred embodiment, at least one supply connection W L form bumps exposed Di module 104, the power supply to the interface on the tin bump pads connected to the driving circuit board 101 through electrically conductive traces. 导电线路上的凸起状焊盘分别与至少一个L邸模组104的供电接口凸点和驱动电路板101的通孔焊盘用焊丝实现电气连接。 A convex shape on the conductive pads are connected to the line at least one via pad 104 of the power module L Di interfaces bumps and the drive circuit board 101 electrically by wire.

[0075] 根据一个优选实施方式,侣基板103具有与所述驱动电路板相对应的电气连接通孔,其中,所述驱动电路板101的电线穿过所述电气连接通孔与外部电源相连接获取电源。 [0075] According to a preferred embodiment, the substrate 103 having a companion electrical connection through-hole corresponding to the drive circuit board, wherein said wire drive circuit board 101 through the electrical connection through-hole is connected to an external power source get power. 阳076] 根据一个优选实施方式,侣基板103底部覆有所述双面高粘性导热片102,所述L邸光引擎通过所述双面高粘性导热片102直接固定至其他照明设备。 Male 076] According to one preferred embodiment, the base substrate 103 is coated with a companion two-sided high tack heat conductive sheet 102, the light engine is fixed by L Di sided high tack heat conductive sheet 102 directly to the other lighting devices.

[0077] 根据一个图中未出示的优选技术方案,保护盖106的反光斜面是呈橘皮效果的斜面。 [0077] According to a preferred aspect of the figure is not presented, the protective cover 106 is in the form of orange peel reflecting inclined plane slope. 橘皮效果的反射斜面,能将光均匀的反射出去,并且形成的光斑柔和不会产生眩晕,可广泛运用于日常生活用的L邸照明装置。 Reflecting bevel orange peel effect, capable of uniformly reflecting light out, and no soft spots formed vertigo, L Di can be widely used in everyday life of the lighting apparatus.

[0078] 根据一个图中未出示的优选技术方案,所述内孔下棱边的横截面呈梯形状,其中, 所述下棱边的下表面均匀分布有小凸点,使得所述下表面与所述双面高粘性导热片102紧密结合。 [0078] According to a preferred aspect of the figure is not presented, the trapezoidal cross-section bore in the lower edge, wherein the lower surface of the lower edge of evenly distributed small bump, so that said lower surface tightly coupled with the heat conductive sheet 102 double-sided high tack. 横截面为梯形状的下棱边增大了所述内孔下棱边与双面高粘性导热片102的接触面积,使得保护盖106能牢固的固定在侣基板103上。 Cross section of the lower edge side trapezoidal increases the contact area of ​​the lower edge of the hole and the double-sided high tack heat conductive sheet 102, so that the protective cover 106 can be firmly fixed on the substrate 103 Lu. 除此之外,所述下棱边的下表面上均匀分布的小凸点进一步增大了所述下棱边与双面高粘性导热片102的接触面积,并且使二者的接触面变得粗糖。 In addition, a small bump on the lower surface of the lower edge of the uniform distribution further increases the contact area of ​​the lower edge of the double-sided high tack heat conductive sheet 102, and both the contact surface becomes raw sugar. 由于小凸点体积小,在外力作用下能够嵌入到双面高粘性导热片中, 使得所述内孔下棱边与侣基板结合得更加牢固。 Small bumps due to the small volume, the external force can be embedded in a highly viscous sided thermally conductive sheet, such that the lower edge of the inner bore companion substrate binding more solid.

[0079] 根据一个图中未出示的优选技术方案,所述侣基板103的外周缘包括向上凸起的向下U型状倒钩元件,所述保护盖106外壁下端有与所述向下U型状倒钩元件相匹配的向上U型状倒钩元件,使得所述向下U型状倒钩元件和向上U型状倒钩元件W嵌入的方式相互连接。 [0079] According to a preferred aspect of the figure is not presented, the companion outer peripheral edge of the substrate 103 comprises a downward U-shaped upwardly projecting barb elements, the protective cover 106 has an outer wall with a lower end of the downwardly U up member U-shaped barb shape that matches the barb elements, such that the U-shaped barb element downwardly and upwardly U-shaped barb elements connected to each other W embedded. 所述向下U型状倒钩元件和向上U型状倒钩元件的自由端可W是平滑的曲面,便于在安装时,将保护盖106顺利的推入侣基板103中。 The free end of the U-shaped barb element downwardly and upwardly U-shaped barb elements may be W is a smooth curved surface, facilitates the installation, the cover 106 is pushed into the smooth substrate 103 Lu. 运样的连接方式使得保护盖106和侣基板103结合得更加牢固,即便双面高粘性导热片102随着时间的推移其粘性降低甚至是失去粘性,保护盖106也不会从侣基板103上脱落。 Sample transport connections so that the protective cover 106 and substrate 103 in conjunction with companion more solid, even if the double-sided thermal conductive sheet 102 highly viscous over time to reduce its viscosity and even lose their stickiness, the protective cover 106 is not on the substrate 103 from companion off.

[0080] 根据一个图中未出示的优选技术方案,所述第一表面包括均匀分布的小凸点,使得所述双面高粘性导热片102紧密地覆盖所述侣基板103。 [0080] According to a preferred aspect of the figure is not presented, the first surface comprises a uniform distribution of small bumps, such that the double-sided high tack heat conductive sheet 102 tightly covers the substrate 103 Lu. 所述侣基板103上的小凸点不仅增大了所述侣基板103与双面高粘性导热片102的接触面积,还使该接触面变得粗糖,摩擦系数增大,双面高粘性导热片102紧密地覆盖侣基板103。 Companion small bump on the substrate 103 not only increases the contact area of ​​the substrate 103 and Lu-sided high tack heat conductive sheet 102, so that the contacts are still raw sugar, the friction coefficient increases, a double-sided thermally highly viscous sheet 102 tightly covers the substrate 103 Lu.

[0081] 根据一个优选实施方式,所述双面高粘性导热片102是具有0. 1-0. 5mm厚度的弹性材料。 [0081] According to a preferred embodiment, the double-sided thermal conductive sheet 102 is a high viscosity elastic material 0. 1-0. 5mm thickness. 该弹性材料不仅具有粘性和导热性,同时还具有弹性,可W随溫度热胀冷缩。 The elastomeric material having not only thermal conductivity and viscosity, and also has elasticity, thermal expansion and contraction with temperature W. 换言之,具有弹性的双面高粘性导热片在外界溫度或者由于L邸发光引起的溫度变化的情况下,随着例如侣基板103或保护盖106的下端等所有用双面高粘性导热片连接的构件的体积的变化而变化,能与所设及到的构件保持同步的热胀冷缩,运样双面高粘性导热片就不会与构件产生间隙,紧紧地将各个构件粘接在一起。 In other words, a highly viscous elastic double-sided thermal conductive sheet due to the ambient temperature or the temperature L Di emission changes caused, for example, with companion lower substrate 103 or the protective cover 106 and the like all of the double-sided high tack of the thermally conductive sheet is connected change in volume of the member varies, and can be provided with the means to synchronize the expansion and contraction of the sample transport sided high tack heat conductive sheet member with no gaps, the tightly bonded together each member . 所述双面高粘性导热片还具有0. 1-0. 5mm的厚度,使得所述侣基板103第一表面上的小凸点在外力作用下嵌入到所述双面高粘性导热片102中但不穿过所述双面高粘性导热片102,所述内孔下棱边下表面的小凸点同样嵌入到所述双面高粘性导热片102并且也不穿过所述双面高粘性导热片102。 The double-sided high tack heat conductive sheet further having a thickness 0. 1-0. 5mm, so that small bumps 103 on the first surface of the substrate companion embedded in the thermally conductive sheet 102 double-sided high tack under loads but not through the double-sided high tack heat conductive sheet 102, the lower edge of the inner bore surface of the lower small bump likewise embedded in the thermally conductive sheet 102 double-sided high viscosity and does not pass through the double-sided high tack the thermally conductive sheet 102. 运样,具有0. 1-0. 5mm厚度的双面高粘性导热片既具有小凸点嵌入的深度,又不会因为太薄而影响粘接效果。 Sample transport, with 0. 1-0. 5mm thickness of the double-sided sheet having both high viscosity thermally conductive bump embedded small depth, but not too thin affect the bonding effect. 运种具有弹性的双面高粘性导热片可W是导热硅胶片。 Species transported elastic heat conductive sheet may be a double-sided high tack W is a thermally conductive silicone sheet.

[0082] 根据一个图中未出示的优选技术方案,所述侣基板103的外周缘超出保护盖106 区域的预留部分包括预断槽,所述预断槽是V型预断槽。 [0082] According to a preferred aspect of the figure is not presented, the companion substrate 103 beyond the outer peripheral edge portion of the reserved area of ​​the protective cover 106 includes a pre-off grooves, said V-shaped groove prognostic prognostic groove. 由于所述L邸光引擎100是超薄结构,安装时不便拿放,因此在所述L邸光引擎上设有所述预留部分使得所述L邸光引擎既便于安装拿放,又可W在安装过后沿所述预断槽折断,去除预留部分,达到美观的效果。 Since the light engine 100 is L Di thin structure, when handling the inconvenience of installation, and therefore the reservation is provided on the light L Di Di engine portion such that the light L is easy to install both engines take place, but also W after mounting groove broken off along the pre removed aside some, for aesthetic effect.

[0083] 本发明解决了下列技术问题: [0083] The present invention solves the following technical problems:

[0084] 1、内置驱动电路板将发出很大的热量,必须通过良好的热传到解决驱动1C的发热问题; [0084] 1, built-in drive circuit board will issue a large amount of heat, the heat must be transmitted to solve the problem by driving good thermal 1C;

[0085] 2、驱动电路板与侣基板之间需要合适的电气连接方式,又导热又稳固而同时又不能使用飞线方式。 [0085] 2, requires a suitable electrical connection between the drive circuit board and the companion substrate, and thermally stable and can not be used while at the same time the fly-line. 根据本发明的L邸光引擎适用于超薄需要,同时还需要内置驱动与控制的方案而设计,可广泛应用在射灯、筒灯等场合。 The L Di light engine according to the present invention needs applicable to thin, but also need to built-in drive and control scheme is designed, can be widely used in the spotlight, down and so on. 体积更小,厚度更薄。 Smaller and thinner. 属于小型化产品,既轻薄、尺寸又小,性价比高,无外置驱动电路。 Belonging to the miniaturization of products, both thin, and small size, high cost, no external drive circuit. 特别是,根据本发明的L邸光引擎可实现整体厚度小于6毫米的技术方案。 In particular, according L Di light engine according to the present invention may be implemented aspect of overall thickness less than 6 mm.

Claims (26)

  1. 1. 一种超薄式LED光引擎(100),其包括保护盖(106)、驱动电路板(101)、铝基板(103)和至少一个LED模组(104), 其特征在于, 所述铝基板的第一表面被双面高粘性导热片(102)覆盖,借助于所述双面高粘性导热片(102)来固定所述驱动电路板(101), 所述至少一个LED模组(104)固定在所述第一表面上,并通过位于所述第一表面上的绝缘层(200)与所述错基板保持绝缘, 在所述绝缘层(200)之上布设有导电线路,用以电气连接所述至少一个LED模组(104) 和所述驱动电路板(101), 所述铝基板的尺寸至少在周向外侧区域的局部大于所述驱动电路板(101)的尺寸, 使得位于所述第一表面上的所述双面高粘性导热片(102)至少在局部固定了所述保护盖(106), 其中,所述保护盖(106)具有内孔、从所述内孔向外周延伸的反光斜面和外壁,其中, 所述内孔的尺寸匹配于所述至 An ultra-thin LED light engine (100), which comprises a protective cap (106), a driving circuit board (101), an aluminum substrate (103) and the at least one LED module (104), characterized in that said the first surface of the aluminum substrate is covered double-sided high tack heat conductive sheet (102), by means of a double-sided high tack heat conductive sheet (102) secured to the drive circuit board (101), said at least one LED module ( 104) fixed to the first surface, and positioned through the insulating layer (200) on a first surface of the insulating substrate holding error, over the insulating layer (200) with conductive lines laid, with at least one electrical connection to the LED module (104) and said drive circuit board (101), the size of the aluminum plate is larger than the outer region is at least partially in the circumferential dimension of the driving circuit board (101), such that the double-sided high tack located on a first surface of the thermally conductive sheet (102) at least partially fixed in the protective cap (106), wherein the protective cap (106) having a bore, said bore from reflecting inclined plane and an outer wall extending toward the outer periphery, wherein the inner bore to a size that matches the 少一个LED模组(104),所述内孔的下棱边在靠近所述至少一个LED模组(104)的位置处固定在所述双面高粘性导热片(102)上,其中,所述外壁的下棱边固定在所述双面高粘性导热片(102)的超出所述驱动电路板(101)外周缘的区域上。 At least one LED module (104), the lower edge of the inner edge of the hole near at least one LED module (104) is fixed in position on both sides of said highly viscous heat-conducting sheet (102), wherein the on a region of the outer periphery of the lower edge of said outer wall fixed to the side of the double-sided high tack heat conductive sheet (102) exceeds the driving circuit board (101).
  2. 2. 如权利要求1所述的LED光引擎(100),其特征在于,所述铝基板的覆盖有双面高粘性导热片(102)的周向外侧区域超出所述驱动电路板(101)的外周缘,并且所述保护盖(106)的下边缘固定在所述双面高粘性导热片(102)的超出所述驱动电路板(101)外周缘的区域上。 2. The LED light engine (100) according to claim 1, wherein the aluminum substrate has a cover peripheral high tack double-sided thermally conductive sheet (102) exceeds the driving circuit board (101) to the outer region an outer peripheral edge, and the protective cover (106) fixed to the lower edge region of the outer periphery of the double-sided high tack heat conductive sheet (102) exceeds the driving circuit board (101).
  3. 3. 如权利要求2所述的LED光引擎(100),其特征在于,所述驱动电路板(101)呈具有中间开口的板状,并且所述至少一个LED模组(104)定位于所述驱动电路板的中间开口处, 所述至少一个LED模组(104)的供电接口位于所述保护盖(106)之中。 3. The LED light engine (100) according to claim 2, wherein said driving circuit board (101) having an intermediate plate-shaped opening, and at least one LED module (104) is positioned to the intermediate opening of said driving circuit board, said at least one LED module (104) power supply interface on the protective cap (106) into.
  4. 4. 如权利要求3所述的LED光引擎(100),其特征在于,所述保护盖(106)在俯视图中呈环状,并且所述保护盖(106)具有适于容纳所述驱动电路板(101)的结构高度。 4. The LED light engine (100) according to claim 3, characterized in that the protective cap (106) annular in plan view, and the protective cap (106) adapted to receive said drive circuit having structural height of the plate (101).
  5. 5. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,所述导电线路为印刷电路,所述导电线路具有电源端口用于从外部电源获得供电,并且所述导电线路具有给所述至少一个LED模组(104)供电的LED供电接口。 5. The LED light engine (100) according to claim 4, wherein said conductive line is a printed circuit, said conductive line having a supply port for obtaining power from an external power source, and the to said conductive trace having at least one LED module (104) power supply LED interface.
  6. 6. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,所述铝基板和所述保护盖(106)具有彼此匹配的圆形、椭圆形或矩形。 LED light engine (100) according to any one of claim 4, wherein said aluminum plate and the protective cover (106) having a mutually matching circular, oval or rectangular.
  7. 7. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,在所述保护盖(106) 上设有卡合连接部,用以固定光学元件。 7. The LED light engine (100) according to claim 4, characterized in that a snap connection portion on the protective cap (106) for fixing the optical element.
  8. 8. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,在所述铝基板(103) 上的导电线路上设有凸起状焊盘(202),在所述驱动电路板(101)上设有与所述凸起状焊盘(202)对应的通孔焊盘(201),所述凸起状焊盘(202)与所述通孔焊盘(201)是通过焊接实现导电连接的。 8. The LED light engine (100) according to claim 4, wherein the aluminum substrate is provided with pad-like projections (202) on the conductive line (103), in the the pad is provided with a convex shape (202) corresponding to a via pad (201) on said drive circuit board (101), said projection-shaped pad (202) with said via pad (201 ) are conductively connected by soldering to achieve.
  9. 9. 如权利要求1至4之一所述LED光引擎(100),其特征在于,在所述LED光引擎(100) 上设有至少两个安装孔,所述安装孔贯穿所述保护盖(106)、所述驱动电路板(101)和铝基板(103),从而能够借助于外部固定机构将所述LED光引擎(100)固定在照明设备上。 1 to 9. 4 one of the LED light engine (100) as claimed in claim, characterized in that at least two mounting holes on the LED light engine (100), the mounting hole penetrating the protective cap (106), the drive circuit board (101) and the aluminum substrate (103), so that the external fixing means to the LED light engine (100) is fixed by means of the lighting device.
  10. 10. 如权利要求1至4之一所述LED光引擎(100),其特征在于,所述保护盖(106)的反光斜面(105)的坡度取决于保护盖(106)至少能容纳所述驱动电路板(101)的高度。 1 to 10. one of the 4 LED light engine (100) as claimed in claim, characterized in that the protective cap (106) of the reflecting inclined plane (105) depending on the slope of the protective cap (106) to accommodate at least the height driving circuit board (101).
  11. 11. 如权利要求7所述LED光引擎(100),其特征在于,所述保护盖(106)上的卡合连接部属于可拆卸式环形扣, 其中,所述保护盖(106)的卡合连接部表面均匀分布至少两个凹槽,与所述光学元件上与之相对应的至少两个凸缘结合,形成扣位。 11. The card 7 LED light engine (100) as claimed in claim, characterized in that the protective cap engages the connector portion (106) belonging to the removable snap ring, wherein the protective cap (106) engagement surface portion connecting at least two grooves evenly distributed, with at least two corresponding flanges combined with the optical element, formed buckling.
  12. 12. 如权利要求9所述LED光引擎(100),其特征在于,所述LED光引擎(100)上的至少两个安装孔均匀分布在所述光引擎(100)的外周缘区域上, 其中,所述至少两个安装孔为通孔,贯穿保护盖(106)、驱动电路板(101)和铝基板(103), 其中,所述通孔的内表面分布有螺纹,所述螺纹是B型螺纹,所述B型螺纹的牙型是三角牙。 9 LED 12. The light engine (100) as claimed in claim, wherein the at least two mounting holes on the LED light engine (100) uniformly distributed over the light engine (100) of the outer circumferential edge region, wherein at least two of said mounting hole is a through hole penetrating the protective cap (106), a driving circuit board (101) and the aluminum substrate (103), wherein the inner surface of the through-holes are distributed thread which is B type thread, the thread tooth type B type triangular teeth.
  13. 13. 如权利要求1所述LED光引擎(100),其特征在于,所述保护盖(106)下边缘与所述铝基板(103)侧边重合。 13. The 1 LED light engine (100) as claimed in claim, characterized in that the protective cap (106) with a lower edge of said aluminum substrate (103) side coincide.
  14. 14. 如权利要求13所述LED光引擎(100),其特征在于,所述LED光引擎(100)其俯视图为矩形, 所述保护盖(106)的第一下棱边、第二下棱边和第三下棱边与所述铝基板(103)的第一侧边、第二侧边和第三侧边分别重合。 14. The LED light engine 13 is (100) as claimed in claim, wherein the LED light engine (100) which is rectangular in plan view, the protective cap (106) at a first edge, a second lower edge and a third lower-side edge of the aluminum substrate with a first side (103), a second side and the third side are overlapped.
  15. 15. 如权利要求13所述LED光引擎(100),其特征在于,所述保护盖(106)的第一下棱边、第二下棱边分别与所述铝基板边(103)的第一侧边、第二侧边重合。 15. The 13 LED light engine (100) at a second edge of the first side of the aluminum substrate (103), respectively, as claimed in claim, characterized in that the protective cap (106) at a first edge, a side edge, a second side coincide.
  16. 16. 如权利要求13所述LED光引擎(100),其特征在于,所述保护盖(106)的第一下棱边与所述铝基板(103)第一侧边重合。 16. The 13 LED light engine (100) as claimed in claim, characterized in that the protective cap (106) and a first lower edge of said aluminum substrate (103) a first side coincident.
  17. 17. 如权利要求14至16之一所述LED光引擎(100),其特征在于,所述铝基板(103) 的尺寸比所述保护盖(106)所在区域大1%。 14 to 17. The one of 16 LED light engine (100) as claimed in claim, wherein the size of said aluminum substrate (103) in the area where (106) than the protective cap 1% larger.
  18. 18. 如权利要求1至4之一所述LED光引擎(100),其特征在于,所述驱动电路板(101) 上包括导电材料通孔,机械固定孔和电器连接孔,其中,所述机械固定孔和所述电器连接孔均匀分布在所述驱动电路板(101)上。 1 to 18. As one of the 4 LED light engine (100) as claimed in claim, wherein said driving circuit board includes a through hole conductive material, the mechanical and electrical connection hole fixing hole (101), wherein the mechanical fastening hole and the electrical connection holes are evenly distributed on the driving circuit board (101).
  19. 19. 如权利要求1至4之一所述LED光引擎(100),其特征在于,所述铝基板(103)具有与所述驱动电路板相对应的电气连接通孔,其中,所述驱动电路板(101)的电线穿过所述电气连接通孔与外部电源相连接获取电源。 1 to 19. As one of the 4 LED light engine (100) as claimed in claim, wherein said aluminum substrate (103) having a through-hole is electrically connected to the corresponding drive circuit board, wherein the drive wire circuit board (101) passes through the through-hole electrical connection to the external power source is connected to receive power.
  20. 20. 如权利要求1至4之一所述LED光引擎(100),其特征在于,所述铝基板(103)底部覆有所述双面高粘性导热片(102),所述LED光引擎通过所述双面高粘性导热片(102)直接固定至其他照明设备。 20. The according to claim 1 to the LED light engine. 4 (100) of the LED light engine, characterized in that said aluminum substrate (103) coated with the base-sided high viscosity of the thermally conductive sheet (102), It is directly secured to the other lighting apparatus via the double-sided high tack heat conductive sheet (102).
  21. 21. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,所述反光斜面是呈橘皮效果的斜面。 21. The LED light engine (100) according to claim 4, wherein said light reflecting inclined slope is orange peel effect.
  22. 22. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,所述内孔的下棱边的横截面呈梯形状, 其中,所述内孔的下棱边的下表面均匀分布有小凸点,使得所述下表面与所述双面高粘性导热片(102)紧密结合。 22. The 1 to 4 LED light engine (100) as claimed in claim, characterized in that the lower edges of said trapezoidal cross-section wherein the internal bore of the lower edge, said inner bore the lower surface of evenly distributed small bump, so closely integrated with the double-sided high tack surface of the thermally conductive sheet (102) of the lower.
  23. 23. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,所述铝基板(103) 的外周缘包括向上凸起的向下U型状倒钩元件,所述保护盖(106)外壁下端有与所述向下U 型状倒钩元件相匹配的向上U型状倒钩元件,使得所述向下U型状倒钩元件和向上U型状倒钩元件以嵌入的方式相互连接。 23. The LED light engine (100) according to claim 4, characterized in that the outer periphery of the aluminum substrate (103) comprises a U-shaped downwardly projecting barb elements upwardly, the cover (106) has an outer wall of the lower end of an upward U-shape of the barb element downward U shape to match the barb elements, such that the U-shaped barb element downwardly and upwardly in a U-shaped barb elements embedded connected to each other.
  24. 24. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,所述第一表面包括均匀分布的小凸点,使得所述双面高粘性导热片(102)紧密地覆盖所述铝基板(103)。 24. The LED light engine (100) according to claim 1 to 4 closely, wherein said first surface comprises a uniform distribution of small bumps, such that the double-sided high tack heat conductive sheet (102) covering the aluminum substrate (103).
  25. 25. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,所述双面高粘性导热片(102)是具有0. 1-0. 5mm厚度的弹性材料。 25. The LED light engine (100) according to claim 4, wherein said double-sided high tack heat conductive sheet (102) is an elastic material having a 0. 1-0. 5mm thickness.
  26. 26. 如权利要求1至4之一所述的LED光引擎(100),其特征在于,铝基板的外周缘超出保护盖(106)区域的部分包括预断槽,所述预断槽是V型预断槽。 26. The LED light engine (100) according to claim 4, wherein an outer periphery of the aluminum substrate exceeds the cover (106) the partial region includes a pre-off slots, the pre-breaking groove is V-shaped prognostic groove.
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CN 201310488314 CN104235641B (en) 2013-06-09 2013-10-17 Ultra-thin led light engine
US14893869 US9982876B2 (en) 2013-06-09 2014-06-06 Ultrathin LED light engine
EP20140810680 EP3009731A4 (en) 2013-06-09 2014-06-06 Ultrathin led light engine
AU2014280699A AU2014280699B2 (en) 2013-06-09 2014-06-06 Ultrathin LED light engine
CA 2914645 CA2914645C (en) 2013-06-09 2014-06-06 Ultrathin led light engine
JP2016517152A JP6158432B2 (en) 2013-06-09 2014-06-06 Ultra-thin led light engine
KR20157034886A KR20160030096A (en) 2013-06-09 2014-06-06 Ultrathin led light engine
PCT/CN2014/079381 WO2014198200A1 (en) 2013-06-09 2014-06-06 Ultrathin led light engine
EA201592282A EA201592282A1 (en) 2013-06-09 2014-06-06 Ultra-slim LED light unit
BR112015029726A BR112015029726A2 (en) 2013-06-09 2014-06-06 light engine led ultrathin

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US9982876B2 (en) 2018-05-29 grant
US20160131350A1 (en) 2016-05-12 application

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