CN108281537A - Packaging structure of L ED lamp pearl - Google Patents
Packaging structure of L ED lamp pearl Download PDFInfo
- Publication number
- CN108281537A CN108281537A CN201810229676.6A CN201810229676A CN108281537A CN 108281537 A CN108281537 A CN 108281537A CN 201810229676 A CN201810229676 A CN 201810229676A CN 108281537 A CN108281537 A CN 108281537A
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- China
- Prior art keywords
- recess
- lens
- lamp bead
- led lamp
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 239000011324 bead Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 238000000605 extraction Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 10
- 230000037237 body shape Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 abstract description 3
- 239000012945 sealing adhesive Substances 0.000 abstract 2
- 240000003380 Passiflora rubra Species 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a packaging structure of a L ED lamp bead, which comprises a substrate, L ED chips, metal wires and a lens, wherein the L ED chip is connected with the substrate through the metal wires, a sealing adhesive layer is arranged between the lens and the L ED chip, the lens comprises a light inlet surface and a light outlet surface, the light inlet surface is covered on the sealing adhesive layer, a recess for changing the light distribution direction is arranged on the light outlet surface of the lens, the side wall of the recess is obliquely arranged, and a horn-shaped opening is formed at the top of the recess.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation more particularly to a kind of encapsulating structures of LED lamp bead.
Background technology
In recent years, the development that LED lighting technology is advanced by leaps and bounds, with the development of power-type LED device technology,
LED obtains huge application in lighting area.LED is with its luminous efficiency height, long lifespan, colour gamut are wide, can working frequency is high, nothing
The advantages that mercury, will gradually replace traditional incandescent lamp, and halogen lamp even high-pressure sodium lamp will become the first choice of illumination.
The luminous light type of LED light source generally all approximate Lambertian body, this strong and both sides of also causing to shine among it shine weak.Therefore
In actual illumination application, often also needs to carry out secondary light-distribution design to light source and add secondary lens, to ensure light extraction
The uniformity.This method not only cost of idle time, design cost also waste material cost, increase the production cycle, reduce LED light
Synthesized competitiveness.
Invention content
In order to overcome the shortcomings of the prior art, a kind of making of present invention offer is simple, of low cost, light emitting angle is big
And light source has the LED lamp bead encapsulating structure of Batwing type light distribution curve.
In order to solve the above technical problem, the present invention provides a kind of LED lamp bead encapsulating structure, including substrate, LED chip,
Plain conductor and lens, the LED chip are connected by the plain conductor with the substrate, the lens with it is described
Adhesive layer is equipped between LED chip；
The lens include incidence surface and light-emitting surface, and the incidence surface is covered on the adhesive layer, the lens
Light-emitting surface is equipped with for changing the recess with light direction, and the side wall of the recess is inclined to set and makes the top of the recess
Portion forms flare openings.
Preferably, the recess is in inverted centrum shape, and the recess includes the addendum cone mouth being arranged outwardly and court
The base cone point being arranged to the LED chip.
Preferably, the addendum cone mouth is mutually connected by cambered surface or folding surface with the lens.
Preferably, the recess is in inverted stage body shape, the recess include the open top that is arranged outwardly and
The light extraction bottom surface being arranged towards the LED chip, the light extraction bottom surface is parallel to the incidence surface.
Preferably, the open top of the recess is mutually connected by cambered surface or folding surface with the lens.
Preferably, further include the holder being set between the substrate and the lens, the incidence surface of the lens
It is covered on the holder, the holder is made of the material with reflection light property, and being internally provided with for the holder is used for
House the groove of the LED chip.
Preferably, the side wall of the groove is inclined to set and the top of the groove is made to form horn-like open
Mouthful.
Preferably, described to be recessed with the center line of the groove on the same line.
Preferably, the adhesive layer is set in the groove.
Preferably, the groove is inverted stage body connected in star, and the LED chip is in the bottom of the groove
Center, the open top of the groove connect with the incidence surface.
The encapsulating structure of LED lamp bead provided by the present invention, compared with prior art, advantage is：Institute of the present invention
The LED chip electrified light emitting stated, light eventually pass through lens injection, are realized by the lens and change going out for the LED chip
Light direction forms the light distribution of Batwing type, and the concave design is at horn-like groove so that the LED chip
The light sent out achievees the purpose that expansion light emitting angle by the lens, and make all sections of light extraction light type
Distribution curve flux is in Batwing type makes LED lamp send out evenly to improve the utilization rate of the face to be illuminated uniformity and light energy
Light, avoid application end increase secondary lens, save the time of fabrication processing, reduce secondary optical design
Cost, overall structure is compacter, convenient for making and reducing production cost.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the internal structure schematic diagram of the encapsulating structure of the LED lamp bead of the first embodiment of the invention.
Fig. 2 is the internal structure chart at another visual angle of Fig. 1.
Fig. 3 is the overlooking structure diagram of the encapsulating structure of the LED lamp bead of the first embodiment of the invention.
Fig. 4 is the light path of light schematic diagram of the encapsulating structure of the LED lamp bead of the first embodiment of the invention.
Fig. 5 is the internal structure schematic diagram of the encapsulating structure of the LED lamp bead of second of embodiment of the invention.
Fig. 6 is the internal structure schematic diagram of the encapsulating structure of the LED lamp bead of the third embodiment of the invention.
Fig. 7 is the internal structure schematic diagram of the encapsulating structure of the LED lamp bead of the 4th kind of embodiment of the invention.
Fig. 8 is the distribution curve flux schematic diagram of the encapsulating structure of the LED lamp bead of all embodiments of the invention.
In figure：1. substrate；2. lens；3.LED chips；4. plain conductor；5. recess；6. holder；7. groove；8. insulation
Item；9. light.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
In addition, in the description of the present invention, it should be noted that term " first ", " second " etc. are used for description purposes only,
It is not understood to indicate or imply relative importance.
As shown in Figures 1 to 4, the first currently preferred embodiment provides a kind of encapsulating structure of LED lamp bead, packet
Substrate 1, LED chip 3, plain conductor 4 and lens 2 are included, the LED chip 3 passes through the plain conductor 4 and the substrate 1
It is connected, adhesive layer is equipped between the lens 2 and the LED chip 3；The lens 2 include incidence surface and light-emitting surface, institute
It states incidence surface to be covered on the adhesive layer, the light-emitting surface of the lens 2 is equipped with for changing the recess 5 with light direction, institute
The side wall for stating recess 5 is inclined to set and the top of the recess 5 is made to form flare openings.
The encapsulating structure of LED lamp bead based on above-mentioned technical characteristic, it is real by the way that recess 5 is arranged directly on the lens 2
The light direction for now changing the LED chip 3, forms the light distribution of Batwing type, and the recess 5 be designed to it is horn-like
Groove so that the light 9 that the LED chip 3 is sent out achievees the purpose that expansion light emitting angle by the refraction of the recess 5,
And distribution curve flux is made so that LED lamp is sent out to improve the utilization rate of the face to be illuminated uniformity and light energy in Batwing type
Light evenly avoids and increases secondary lens in application end, saves the time of fabrication processing, reduce secondary optics
The cost of design so that overall structure is compacter, convenient for making and reducing production cost.
As shown in Figures 4 and 8, the encapsulating structure of the LED lamp bead based on above-mentioned technical characteristic, the light type of the Batwing type
Distribution, useful larger light emitting angle, in general, the light emitting angle is between 150 °~180 °, it is preferred that light emitting angle
At 170 °~180 °, the lens 2 use silica gel, silicones, epoxy resin, acrylic, PC material, the COC for being easy compression molding
Material, ABS material etc. are made, and preferred material is silica gel, it is to be understood that the curvature of the indent of the recess 5, linear etc. not by
Limitation, it is described recess 5 side wall either it is described recess 5 bottom surface can be plane or curved surface.
As shown in Figure 1 and Figure 2 above, the both sides line style of the section of the recess 5 is preferably curved shape or is linear, is convenient for
It makes, and can make light path even transition, avoid light path excessively disorderly and unsystematic.
Further, in the present embodiment, the recess 5 is in inverted centrum shape, and the recess 5 includes being arranged outwardly
Addendum cone mouth and the base cone point being arranged towards the LED chip 3 so that the central core light 9 of the LED chip 3 can pass through
The inner wall of the recess 5 is projected toward periphery, and largely the light 9 of ratio can pass through the realization batswing tab of the recess 5
Formula distribution curve flux.
Further, in the present embodiment, the addendum cone mouth is connected by arc surface with 2 phase of the lens so that other
It can be projected toward periphery by the arc surface without the light 9 of the recess 5,9 even transition of light so that plane of illumination has
The more preferably uniformity.
Further, in the present embodiment, the encapsulating structure of the LED lamp bead further include be set to the substrate 1 with it is described
The incidence surface of holder 6 between lens 2, the lens 2 is covered on the holder 6；The holder 6 is by with reflection light 9
The insulating materials of property is made, the groove 7 of the holder 6 being internally provided with for housing the LED chip 3, the adhesive layer
In the groove 7, adhesive layer is filled convenient for the groove 7.
Further, in the present embodiment, the side wall of the groove 7 is inclined to set and makes the top of the groove 7
Form flare openings so that the sidelight of holder 6 described in 3 directive of the LED chip can pass through the reflection of the holder 6, directive
On the lens 2, the energy of light is made full use of, greatly improves the whole light efficiency of the LED lamp bead, is had stable, efficient, energy saving
The features such as, the light 9 sent out in order to avoid the LED lamp bead is asymmetric, and the center line of the recess 5 and the groove 7 is same
On one straight line.
Further, in the present embodiment, the groove 7 is inverted stage body connected in star, and the LED chip 3 is located at institute
The bottom centre of groove 7 is stated, the open top of the groove 7 connects with the incidence surface, is sealed convenient for the filling of the LED lamp bead
The technological processes such as glue-line, assembly, meanwhile, the holder 6 or substrate 1 are made of the material with reflection light 9, including five
Golden material and insulating materials, the hardware material can be copper, iron, aluminium or alloy material.Preferably, the table of the hardware material
Face is at least provided with one layer of the coat of metal, in general, the coat of metal is gold, silver, copper-nickel alloy, nickel etc..The insulation material
Material can be PPA, PCT, EMC, silica gel, silicones, optical glass etc. so that the holder 6 can realize the reflection LED core
The sidelight of piece 3 achievees the effect that improve the LED lamp bead entirety light efficiency.
In the present embodiment, the adhesive layer is set in the groove, described convenient for being filled to the adhesive layer
The material of main part of adhesive layer is the optics high-temperature nylons such as silica gel, silicones, epoxy resin.In addition, being additionally provided in the adhesive layer
At least one fluorescent powder.The fluorescent powder material can be aluminate, silicate, nitride, fluoride, sulfide etc..
In addition, the substrate 1 is additionally provided with for the substrate 1 to be isolated into positive pole zone and the insulation strip 8 of negative regions,
Two plain conductors 4 of the LED chip 3 are connected with the substrate 1, and one is connected with positive pole zone, another
It is connected with negative regions, is easy to implement by welding the substrate 1, you can is logical for the LED chip 3 by the substrate 1
Electricity；The material of the plain conductor 4 can be gold, silver, copper, aluminium or alloy material.
Second of embodiment, for the present embodiment in addition to following characteristics, remaining feature is identical as the first embodiment：
As shown in figure 5, the addendum cone mouth is connected by folding surface with 2 phase of the lens so that other are without described recessed
The light 9 for falling into 5 can be projected by the folding surface toward periphery, and the light 9 of 3 light extraction of the LED chip may make to be irradiated in periphery spy
Determine region, can be used for carrying out significantly irradiation to a certain specific region so that the face to be illuminated of the specific region has preferably
Evenness.
The third embodiment, for the present embodiment in addition to following characteristics, remaining feature is identical as the first embodiment：
As shown in fig. 6, the recess 5 is inverted stage body shape, the recess 5 includes the open top being arranged outwardly and court
The light extraction bottom surface being arranged to the LED chip 3, the light extraction bottom surface are parallel to the incidence surface so that the LED chip 3
Central core light 9 can divide into two parts, and a part is projected by the light extraction bottom surface and is irradiated in center, and another part passes through
For the side inner walls refractive illumination of the recess 5 in the periphery at center, which can increase the illuminance at irradiation center, it is possible to understand that
, the light extraction bottom surface can be plane, can also be curved surface etc., these structural design schemes are in the protection of the present invention
Within, details are not described herein.
Further, in the present embodiment, the open top is connected by arc surface with 2 phase of the lens so that its
He can be projected by the arc surface toward periphery without the light 9 of the recess 5 so that 9 even transition of light on periphery so that
The periphery of plane of illumination has the more preferably uniformity.
4th kind of embodiment, for the present embodiment in addition to following characteristics, remaining feature is identical as the third embodiment：
As shown in fig. 7, the open top is connected by folding surface with 2 phase of the lens so that other are without described
The light 9 of recess 5 can be projected by the folding surface toward periphery, and the light 9 of 3 light extraction of the LED chip may make to be irradiated in periphery
Specific region can be used for significantly irradiating a certain specific region so that the face to be illuminated of the specific region has preferable
The uniformity.
The encapsulation flow of the encapsulating structure of LED lamp bead described in the embodiment of the present invention is：(1) die bond, by the LED core
Piece 3 is fixed in the substrate 1；(2) LED chip 3 is led to the plain conductor 4 and is welded on the substrate 1 by bonding wire；
(3) adhesive layer is filled in dispensing in the groove 7；(4) it is molded, will be filled to specific shape for making the material of the lens 2
In the mold of shape, then suppressed on the holder 6；(5) it cuts, the substrate 1 is cut；(6) test and packaging,
The LED lamp bead that cutting is completed is subjected to energization test, the product of test passes is packed.
The encapsulating structure of LED lamp bead described in the embodiment of the present invention, mainly by substrate 1, lens 2, LED chip 3, metal
Conducting wire 4 and holder 6 are made, and the lens 2 are equipped with for changing the recess 5 with light direction, therefore in practical applications, can make
It is more big and luminous more uniform to obtain light emitting angle, the lens 2 can be direct when being packaged assembly to the LED lamp bead
It is produced, as the time needed for the production technology of conventional SMD LED lamp beads, and makes matching for the LED lamp bead
Light curve is in Batwing type, and to improve the utilization rate of the face to be illuminated uniformity and light energy, and the groove 7 can be to described in directive
The sidelight of holder 6 is reflected, and the utilization rate of light energy is further improved, and is had specular removal, is irradiated the spies such as stable, energy saving
Point can carry out a step popularization in practical applications.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
1. a kind of encapsulating structure of LED lamp bead, which is characterized in that described including substrate, LED chip, plain conductor and lens
LED chip is connected by the plain conductor with the substrate, and adhesive layer is equipped between the lens and the LED chip；
The lens include incidence surface and light-emitting surface, and the incidence surface is covered on the adhesive layer, the light extraction of the lens
Face is equipped with for changing the recess with light direction, and the side wall of the recess is inclined to set and makes the top shape of the recess
At flare openings.
2. the encapsulating structure of LED lamp bead according to claim 1, which is characterized in that the recess is in inverted centrum shape,
The recess includes the addendum cone mouth being arranged outwardly and the base cone point being arranged towards the LED chip.
3. the encapsulating structure of LED lamp bead according to claim 2, which is characterized in that the addendum cone mouth by cambered surface or
Folding surface is mutually connected with the lens.
4. the encapsulating structure of LED lamp bead according to claim 1, which is characterized in that the recess is in inverted stage body shape,
The recess includes the open top being arranged outwardly and the light extraction bottom surface being arranged towards the LED chip, and the light extraction bottom surface is flat
Row is in the incidence surface.
5. the encapsulating structure of LED lamp bead according to claim 4, which is characterized in that the open top of the recess passes through
Cambered surface or folding surface are mutually connected with the lens.
6. the encapsulating structure of LED lamp bead according to any one of claims 1-5, which is characterized in that further include being set to institute
The holder between substrate and the lens is stated, the incidence surface of the lens is covered on the holder, and the holder is anti-by having
The material for penetrating nature of light is made, the groove of the holder being internally provided with for housing the LED chip.
7. the encapsulating structure of LED lamp bead according to claim 6, which is characterized in that the side wall of the groove is inclined to be set
It sets and the top of the groove is made to form flare openings.
8. the encapsulating structure of LED lamp bead according to claim 7, which is characterized in that in the recess and the groove
Heart line is on the same line.
9. the encapsulating structure of LED lamp bead according to claim 6, which is characterized in that the adhesive layer is set to the groove
It is interior.
10. the encapsulating structure of LED lamp bead according to claim 6, which is characterized in that the groove is inverted stage body shape
Groove, the LED chip connect in the bottom centre of the groove, the open top of the groove with the incidence surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810229676.6A CN108281537A (en) | 2018-03-20 | 2018-03-20 | Packaging structure of L ED lamp pearl |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810229676.6A CN108281537A (en) | 2018-03-20 | 2018-03-20 | Packaging structure of L ED lamp pearl |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108281537A true CN108281537A (en) | 2018-07-13 |
Family
ID=62810047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810229676.6A Pending CN108281537A (en) | 2018-03-20 | 2018-03-20 | Packaging structure of L ED lamp pearl |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108281537A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108761586A (en) * | 2018-08-16 | 2018-11-06 | 浙江彩丞照明科技有限公司 | A kind of optical lens of achievable large spot |
| CN109346592A (en) * | 2018-11-19 | 2019-02-15 | 宁波升谱光电股份有限公司 | A kind of LED packaging and preparation method thereof, a kind of SMD light source |
| CN109578843A (en) * | 2018-11-21 | 2019-04-05 | 中山市木林森电子有限公司 | A kind of Novel LED light bar manufacture craft |
| CN109686832A (en) * | 2018-11-21 | 2019-04-26 | 中山市木林森电子有限公司 | A kind of Novel LED chip encapsulating structure and manufacture craft |
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Application publication date: 20180713 |