CN102881803A - Light emitting diode chip package - Google Patents
Light emitting diode chip package Download PDFInfo
- Publication number
- CN102881803A CN102881803A CN2011102731830A CN201110273183A CN102881803A CN 102881803 A CN102881803 A CN 102881803A CN 2011102731830 A CN2011102731830 A CN 2011102731830A CN 201110273183 A CN201110273183 A CN 201110273183A CN 102881803 A CN102881803 A CN 102881803A
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- CN
- China
- Prior art keywords
- light
- emitting diode
- diode chip
- encapsulation body
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims abstract description 59
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000005538 encapsulation Methods 0.000 claims description 48
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 230000035515 penetration Effects 0.000 claims description 5
- 230000012447 hatching Effects 0.000 description 8
- 230000008033 biological extinction Effects 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention provides a light emitting diode chip package, which comprises a support structure, wherein the support structure is provided with a groove and a raised platform arranged in the groove, the raised platform divides the groove into two areas, a light emitting diode chip is arranged on the raised platform, two kinds of fluorescent powder are respectively coated on the bottom surfaces of the two areas, and a packaging adhesive material is filled in the support structure and covers the light emitting diode chip and the fluorescent powder.
Description
Technical field
The present invention relates to a kind of LED chip encapsulation body, relate in particular to a kind of LED chip encapsulation body that height is drilled colour index that has.
Background technology
Light-emitting diode (light-emitting diode is called for short LED) chip is a kind of compound semiconductor subassembly, and its mode by power conversion is light with current conversion, and single light-emitting diode chip for backlight unit can only send specific photochromic light.
Traditionally, in order to reach white light, the light that can use ruddiness, green glow and three kinds of light-emitting diode chip for backlight unit of blue light to send blendes together white light, this kind white light drill colour index (color renderingindex; CRI) height, but circuit design trouble.
The another kind of mode that forms white light is at the red and green fluorescent material that mixes of blue light diode chip coating, the blue light that the blue light diode chip sends, blend together white light with redness and green emitting phosphor ruddiness and the green glow that sends that be stimulated, although the drilling colour index and can reach 80% of this kind white light, but redness and green emitting phosphor have the problem of mutual extinction, can't reach good luminous efficiency.
In addition, can also on ruddiness and blue light diode chip, directly be coated with green emitting phosphor, reach the purpose that emits white light, yet the green emitting phosphor above chip easily be subject to the impact of light and heat, so that the reliability of fluorescent material is not good.
Summary of the invention
Embodiments of the invention provide LED chip encapsulation body, and it can overcome above-mentioned problem, drill colour index so that the white light that sends has height, do not have the problem of the mutual extinction of fluorescent material simultaneously.In addition, can also improve the reliability of fluorescent material, prolong the useful life of fluorescent material.
According to embodiments of the invention, LED chip encapsulation body comprises: supporting structure, and have groove and raised platforms and be arranged in the groove, wherein raised platforms is divided into two zones with groove; Light-emitting diode chip for backlight unit is arranged on the raised platforms; Two kinds of fluorescent material is coated respectively on the lower surface in two zones of groove; And packaging adhesive material is filled in the supporting structure covering luminousing diode chip and these fluorescent material.
For allow above-mentioned purpose of the present invention, feature, and advantage can become apparent, below cooperate accompanying drawing, be described in detail below.
Description of drawings
Figure 1A-1D shows according to various embodiments of the present invention the floor map of LED chip encapsulation body.
Fig. 2 A and 2B show according to various embodiments of the present invention, along the hatching 2-2 ' of Figure 1A, and the generalized section of LED chip encapsulation body, wherein lens arrangement is shaped as two continuous curved surfaces.
Fig. 3 A and 3B show according to various embodiments of the present invention, along the hatching 2-2 ' of Figure 1A, and the generalized section of LED chip encapsulation body, wherein lens arrangement is shaped as a curved surface.
Fig. 4 shows according to one embodiment of the invention, along the hatching 4-4 ' of Fig. 1 D, the generalized section of LED chip encapsulation body.
Reference numeral:
10: supporting structure
12: raised platforms
14: groove
14A, 14B: two zones of groove
16: light-emitting diode chip for backlight unit
18,20: fluorescent material
22: packaging adhesive material
24: lens arrangement
26: the reflector
28: routing engages
30: conducting bracket
32: via
34: electrode
Embodiment
Consult Figure 1A, it shows the floor map of the LED chip encapsulation body of one embodiment of the invention.LED chip encapsulation body comprises supporting structure (lead frame) 10, and supporting structure 10 has groove 14 and raised platforms 12 is arranged in the groove 14, on raised platforms 12 one or more light-emitting diode chip for backlight unit 16 can be set.In Figure 1A, raised platforms 12 is divided into former and later two regional 14A and 14B with groove 14, is coated with respectively two kinds of fluorescent material 18 and 20 on the lower surface of these two regional 14A and 14B.In one embodiment, the sidewall of groove 14 can be the sidewall that tilts, and can reduce by this fluorescent material 18 and 20 and absorb mutually, and then promote the luminous efficiency of fluorescent material 18 and 20.
In one embodiment, light-emitting diode chip for backlight unit 16 can be the blue light diode chip, and fluorescent material 18 and 20 then is respectively redness and green emitting phosphor, forms the LED chip encapsulation body that sends white light.In another embodiment, light-emitting diode chip for backlight unit 16 can be the blue light diode chip, and fluorescent material 18 and 20 then is respectively redness and yellow fluorescent powder, forms the LED chip encapsulation body that sends white light or warm colour light.
According to one embodiment of the invention, these two kinds of fluorescent material 18 and 20 can separate fully by raised platforms 12, contactless each other in fluorescent material 18 and 20, therefore can avoid or reduce the problem of two kinds of fluorescent material 18 and 20 mutual extinctions, promote the luminous efficiency of fluorescent material 18 and 20, and can improve the colour index of drilling of LED chip encapsulation body.
Figure 1B shows the floor map of the LED chip encapsulation body of another embodiment of the present invention, the difference of Figure 1B and Figure 1A is that conducting bracket 30 is arranged on the top of raised platforms 12, and two conductive pad (not shown) of light-emitting diode chip for backlight unit 16 engage 28 mode by routing and are electrically connected with conducting bracket 30 respectively.
Fig. 1 C shows the floor map of the LED chip encapsulation body of another embodiment of the present invention, the difference of Fig. 1 C and Figure 1B is that two conductive pad (not shown) of light-emitting diode chip for backlight unit 16 are arranged on the bottom of chip, and light-emitting diode chip for backlight unit 16 directly is electrically connected with the conducting bracket 30 that is arranged on raised platforms 12 tops.
Fig. 1 D shows the floor map of the LED chip encapsulation body of another embodiment of the present invention, the difference of Fig. 1 D and Figure 1A-1C is to have via (via) 32 in the raised platforms 12, and electrode 34 is set below raised platforms 12, two conductive pad (not shown) of light-emitting diode chip for backlight unit 16 are arranged on the bottom of chip, and light-emitting diode chip for backlight unit 16 is electrically connected via via 32 and electrode 34, so light-emitting diode chip for backlight unit 16 can be electrically connected by electrode 34 and external circuit.
Consult Fig. 2 A, it shows the hatching 2-2 ' along Figure 1A, the generalized section of the LED chip encapsulation body of one embodiment of the invention.Shown in Fig. 2 A, the top of raised platforms 12 is higher than the surface of fluorescent material 18 and 20, so that the light-emitting diode chip for backlight unit 16 that is arranged on the raised platforms 12 separates and contactless fully with fluorescent material 18 and 20, therefore fluorescent material 18 and 20 can not be subject to the impact of the luminous and heating of light-emitting diode chip for backlight unit 16, can promote the reliability of fluorescent material 18 and 20, prolong the useful life of fluorescent material 18 and 20.
Shown in Fig. 2 A, LED chip encapsulation body also comprises in the groove 14 that packaging adhesive material 22 is filled in supporting structure 10, covering luminousing diode chip 16 and fluorescent material 18 and 20, and above packaging adhesive material 22, also have lens arrangement 24.
In this embodiment, lens arrangement 24 be shaped as two continuous curved surfaces, for example lens arrangement 24 can be two continuous convex lens, has the function that makes light reflection and penetrate.The junction alignment leds chip 16 of two continuous curve surfaces of lens arrangement 24, so that the light part that light-emitting diode chip for backlight unit 16 sends penetrates from the junction of two continuous curve surfaces, another part is from these two continuous camber reflections.In one embodiment, light-emitting diode chip for backlight unit 16 for example is the blue light diode chip, and the light penetration rate that its light that sends passes lens arrangement 24 is about 15% to 30%, is preferably 25%, and the light reflectance of lens arrangement 24 is about 70% to 85%, is preferably 75%.
Shown in Fig. 2 A, some can be radiated at the light that light-emitting diode chip for backlight unit 16 sends on fluorescent material 18 and 20, it is luminous so that fluorescent material 18 and 20 is excited, and the light that fluorescent material 18 and 20 sends passes packaging adhesive material 22 and lens arrangement 24, and the light that sends with light-emitting diode chip for backlight unit 16 blendes together white light.
Consult Fig. 2 B, it shows the hatching 2-2 ' along Figure 1A, the generalized section of the LED chip encapsulation body of another embodiment of the present invention.Fig. 2 B is that with the difference of Fig. 2 A the light-emitting diode chip for backlight unit 16 of Fig. 2 A has vertical sidewall, and the light-emitting diode chip for backlight unit 16 of Fig. 2 B has the sidewall of inclination, therefore the side bright dipping of the light-emitting diode chip for backlight unit 16 of Fig. 2 B is better, can utilize side bright dipping deexcitation fluorescent material 18 and 20.
Consult Fig. 3 A, it shows the hatching 2-2 ' along Figure 1A, the generalized section of the LED chip encapsulation body of another embodiment of the present invention.The difference of Fig. 3 A and Fig. 2 A is that the shape of lens arrangement 24 is curved surfaces, for example be convex lens, and the LED chip encapsulation body of Fig. 3 A also comprises reflector 26 and is arranged in the lens arrangement 24, and the material in reflector 26 is for example for having the metal material of mirror effect or other can make the material of light reflection.Reflector 26 is positioned at the interface place of lens arrangement 24 and packaging adhesive material 22, and the position alignment light-emitting diode chip for backlight unit 16 in reflector 26.
In this embodiment, reflector 26 has the function that makes light reflection and penetrate with the combination of lens arrangement 24.In one embodiment, light-emitting diode chip for backlight unit 16 for example is the blue light diode chip, the light penetration rate that its light that sends passes the combination in lens arrangement 24 and reflector 26 is about 15% to 30%, be preferably 25%, and reflector 26 is about 70% to 85% with the light reflectance of the combination of lens arrangement 24, is preferably 75%.
As shown in Figure 3A, the light part that light-emitting diode chip for backlight unit 16 sends is reflected layer 26 reflection and shines on fluorescent material 18 and 20, and the light of another part then passes lens arrangement 24.In addition, some can be radiated at the light that light-emitting diode chip for backlight unit 16 sends on fluorescent material 18 and 20, it is luminous so that fluorescent material 18 and 20 is excited, and the light that fluorescent material 18 and 20 sends passes packaging adhesive material 22 and lens arrangement 24, and the light that sends with light-emitting diode chip for backlight unit 16 blendes together white light.
Consult Fig. 3 B, it shows the hatching 2-2 ' along Figure 1A, the generalized section of the LED chip encapsulation body of another embodiment of the present invention.The difference of Fig. 3 B and Fig. 3 A is that the reflector 26 of the LED chip encapsulation body of Fig. 3 B is arranged in the packaging adhesive material 22.Similarly, the reflector 26 of Fig. 3 B is positioned at the interface place of lens arrangement 24 and packaging adhesive material 22, and the position alignment light-emitting diode chip for backlight unit 16 in reflector 26.Therefore, the reflector 26 of Fig. 3 B has the function that makes light reflection and penetrate equally with the combination of lens arrangement 24.
Consult Fig. 4, it shows the hatching 4-4 ' along Fig. 1 D, the generalized section of the LED chip encapsulation body of another embodiment of the present invention.The difference of Fig. 4 and Fig. 2 A is that the LED chip encapsulation body of Fig. 4 has via (via) 32 and is formed in the raised platforms 12, via 32 is through to lower surface by the top surface of raised platforms 12, electric conducting material is for example metal filled in via 32, the conductive pad (not shown) of light-emitting diode chip for backlight unit 16 produces electrically connect by via 32 and the electrode 34 that is arranged on raised platforms 12 belows, and light-emitting diode chip for backlight unit 16 can be electrically connected via electrode 34 and external circuit (not shown).Therefore, in the LED chip encapsulation body of Fig. 4, mode and external circuit that light-emitting diode chip for backlight unit 16 does not need to engage by routing are electrically connected.
In addition, the via 32 of the embodiment of Fig. 4 also can be applied among the embodiment of Fig. 2 B, 3A and 3B with the design of electrode 34, replaces routing juncture wherein.
In sum, the LED chip encapsulation body of the embodiment of the invention utilizes the groove of supporting structure and the design of raised platforms, so that two kinds of fluorescent material are separated and contactless fully by raised platforms, therefore can avoid or reduce the problem of these two kinds of mutual extinctions of fluorescent material, promote the luminous efficiency of fluorescent material, and improve the colour index of drilling of LED chip encapsulation body.
In addition, LED chip encapsulation body according to the embodiment of the invention, fluorescent material and light-emitting diode chip for backlight unit separate and contactless fully, therefore fluorescent material can not be subject to light and the hot impact that light-emitting diode chip for backlight unit sends, can promote the reliability of fluorescent material, prolong the useful life of fluorescent material.
Although the present invention has disclosed preferred embodiment as above, so it is not to limit the present invention, and any those of ordinary skill in the field when can doing a little change and retouching, and do not break away from the spirit and scope of the present invention.
Claims (18)
1. LED chip encapsulation body comprises:
One supporting structure has a groove and a raised platforms and is arranged in this groove, and wherein this raised platforms is divided into two zones with this groove;
One light-emitting diode chip for backlight unit is arranged on this raised platforms;
Two kinds of fluorescent material are coated respectively on the lower surface in these two zones of this groove; And
One packaging adhesive material is filled in this supporting structure, covers this light-emitting diode chip for backlight unit and those fluorescent material.
2. LED chip encapsulation body according to claim 1 comprises also that wherein a lens arrangement is arranged on this packaging adhesive material.
3. LED chip encapsulation body according to claim 2, wherein the shape of this lens arrangement comprises a curved surface or two continuous curved surfaces, and wherein this light-emitting diode chip for backlight unit is aimed in the junction of these two continuous curve surfaces.
4. LED chip encapsulation body according to claim 2, wherein this lens arrangement is convex lens, and comprises that also a reflector is arranged between these convex lens and this packaging adhesive material.
5. LED chip encapsulation body according to claim 4, wherein the combination in this lens arrangement and this reflector has light penetration and light reflection function, and its light reflectance is 70% to 85%.
6. LED chip encapsulation body according to claim 5, wherein this light-emitting diode chip for backlight unit is the blue light diode chip, and its light penetration rate is 15% to 30%.
7. LED chip encapsulation body according to claim 4, wherein this reflector is arranged in these convex lens or in this packaging adhesive material, and this light-emitting diode chip for backlight unit of the position alignment in this reflector.
8. LED chip encapsulation body according to claim 2, wherein this lens arrangement is two continuous convex lens.
9. LED chip encapsulation body according to claim 8, wherein this light-emitting diode chip for backlight unit is the blue light diode chip, and its light penetration rate is 15% to 30%.
10. LED chip encapsulation body according to claim 1, wherein this light-emitting diode chip for backlight unit and those fluorescent material separate fully, and this light-emitting diode chip for backlight unit comprises one or more light-emitting diode chip for backlight unit.
11. LED chip encapsulation body according to claim 1, wherein these two kinds of fluorescent material are separated fully by this raised platforms.
12. LED chip encapsulation body according to claim 1, wherein this light-emitting diode chip for backlight unit comprises the blue light diode chip, and these two kinds of fluorescent material comprise green emitting phosphor and red fluorescence powder, or yellow fluorescent powder and red fluorescence powder.
13. LED chip encapsulation body according to claim 1, wherein the sidewall of this light-emitting diode chip for backlight unit comprises vertical sidewall or the sidewall of inclination.
14. LED chip encapsulation body according to claim 1 comprise also that wherein a conducting bracket is arranged at this groove below of this supporting structure, and this light-emitting diode chip for backlight unit is electrically connected via mode and this conducting bracket that a routing engages.
15. LED chip encapsulation body according to claim 1 comprise also that wherein a conducting bracket is arranged at this raised platforms top of this supporting structure, and this light-emitting diode chip for backlight unit is electrically connected via mode and this conducting bracket that a routing engages.
16. LED chip encapsulation body according to claim 1 comprise also that wherein a conducting bracket is arranged at this raised platforms top of this supporting structure, and this light-emitting diode chip for backlight unit is direct and this conducting bracket is electrically connected.
17. LED chip encapsulation body according to claim 1, comprise also that wherein a via is arranged in this raised platforms, and one electrode be arranged at this raised platforms below, wherein this light-emitting diode chip for backlight unit is via this via and the electric connection of this electrode.
18. LED chip encapsulation body according to claim 1, wherein the sidewall of this groove of this supporting structure comprises the sidewall of inclination.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100124557A TW201304199A (en) | 2011-07-12 | 2011-07-12 | Light emitting diode chip packages |
| TW100124557 | 2011-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102881803A true CN102881803A (en) | 2013-01-16 |
Family
ID=47483061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102731830A Pending CN102881803A (en) | 2011-07-12 | 2011-09-15 | Light emitting diode chip package |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102881803A (en) |
| TW (1) | TW201304199A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107078195A (en) * | 2014-09-15 | 2017-08-18 | 皇家飞利浦有限公司 | Luminaire on base with reflecting layer |
| CN108281537A (en) * | 2018-03-20 | 2018-07-13 | 木林森股份有限公司 | Packaging structure of L ED lamp pearl |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080041818A (en) * | 2006-11-08 | 2008-05-14 | 엘지전자 주식회사 | Lens and led package having the same |
| US20080210962A1 (en) * | 2005-02-28 | 2008-09-04 | Osram Opto Semiconductors Gmbh | Illumination Device |
| US20100061078A1 (en) * | 2008-09-10 | 2010-03-11 | Samsung Electronics Co., Ltd. | Light emitting device and system providing white light with various color temperatures |
| CN201820755U (en) * | 2010-07-15 | 2011-05-04 | 弘凯光电(深圳)有限公司 | Light emitting diode |
| US20110156092A1 (en) * | 2009-12-30 | 2011-06-30 | Lumenmax Optoelectronics Co., Ltd. | Smt encapsulation body of a light-emitting diode with a wide-angle illumination light shape |
-
2011
- 2011-07-12 TW TW100124557A patent/TW201304199A/en unknown
- 2011-09-15 CN CN2011102731830A patent/CN102881803A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080210962A1 (en) * | 2005-02-28 | 2008-09-04 | Osram Opto Semiconductors Gmbh | Illumination Device |
| KR20080041818A (en) * | 2006-11-08 | 2008-05-14 | 엘지전자 주식회사 | Lens and led package having the same |
| US20100061078A1 (en) * | 2008-09-10 | 2010-03-11 | Samsung Electronics Co., Ltd. | Light emitting device and system providing white light with various color temperatures |
| US20110156092A1 (en) * | 2009-12-30 | 2011-06-30 | Lumenmax Optoelectronics Co., Ltd. | Smt encapsulation body of a light-emitting diode with a wide-angle illumination light shape |
| CN201820755U (en) * | 2010-07-15 | 2011-05-04 | 弘凯光电(深圳)有限公司 | Light emitting diode |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107078195A (en) * | 2014-09-15 | 2017-08-18 | 皇家飞利浦有限公司 | Luminaire on base with reflecting layer |
| CN107078195B (en) * | 2014-09-15 | 2020-03-03 | 亮锐控股有限公司 | Light emitting device on submount with reflective layer |
| CN108281537A (en) * | 2018-03-20 | 2018-07-13 | 木林森股份有限公司 | Packaging structure of L ED lamp pearl |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201304199A (en) | 2013-01-16 |
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Application publication date: 20130116 |