CN206432289U - The emitting led encapsulating structure of one side - Google Patents
The emitting led encapsulating structure of one side Download PDFInfo
- Publication number
- CN206432289U CN206432289U CN201621493548.5U CN201621493548U CN206432289U CN 206432289 U CN206432289 U CN 206432289U CN 201621493548 U CN201621493548 U CN 201621493548U CN 206432289 U CN206432289 U CN 206432289U
- Authority
- CN
- China
- Prior art keywords
- fluorescence diaphragm
- flip chip
- white glue
- encapsulating structure
- emitting led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 31
- 230000010485 coping Effects 0.000 claims abstract description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of emitting led encapsulating structure of one side, including flip chip, be covered at the top of flip chip fluorescence diaphragm, enclose the white glue wall being located at around flip chip；The white glue wall is located at the lower section of fluorescence diaphragm, and flip chip and fluorescence diaphragm are linked together；The flip chip is rectangular to be set, and the white glue wall is set in a ring, and the fluorescence diaphragm is rectangular to be set and be covered in the flip chip and white glue coping.The emitting led encapsulating structure of one side of the present utility model is by way of white glue wall is by flip chip combination fluorescence diaphragm, simple and stable structure, while fluorescence diaphragm is set fluorescence coating, light transmission is stable unified.
Description
Technical field
The utility model is related to a kind of semiconductor package, more particularly to a kind of emitting led encapsulating structure of one side.
Background technology
Compared to traditional light emitting source, light emitting diode (Light Emitting Diode, LED) has lightweight, body
The advantages of small, energy-conserving and environment-protective of product, high luminous efficiency, it extensively should more and more as a kind of new light emitting source
For indicating, showing, decorate, the field such as backlight, general lighting and urban landscape.
Existing emitting led encapsulating structure generally includes electrode, wire, is then packaged.Due to needing first to weld
Colloid encapsulation is carried out after wire and electrode again, the bad situation of wire failure welding, encapsulated layer printing opacity easily occurs.
Utility model content
Based on this, the utility model provides a kind of simple and stable structure, printing opacity the good emitting led encapsulating structure of one side.
In order to realize the purpose of this utility model, the utility model uses following technical scheme：
A kind of emitting led encapsulating structure of one side, including flip chip, the fluorescent film that is covered at the top of flip chip
Piece, enclose the white glue wall being located at around flip chip；The white glue wall is located at the lower section of fluorescence diaphragm, and by flip chip and
Fluorescence diaphragm links together；The flip chip is rectangular to be set, and the white glue wall is set in a ring, the fluorescence diaphragm
It is rectangular to set and be covered in the flip chip and white glue coping.
The emitting led encapsulating structure of one side of the present utility model is by white glue wall by the side of flip chip combination fluorescence diaphragm
Formula, simple and stable structure, while fluorescence diaphragm is set fluorescence coating, light transmission is stable unified.
In one of the embodiments, the surrounding side of the white glue wall and the surrounding side of the fluorescence diaphragm are corresponding flat
Together.
In one of the embodiments, the lateral surface of the medial surface of the white glue wall and flip chip is bonded, described white
The bottom surface of Jiao Qiang top surface and the fluorescence diaphragm is bonded, so that flip chip be adhesively fixed with fluorescence diaphragm.
In one of the embodiments, the fluorescence diaphragm is prefabricated fluorescence diaphragm.
In one of the embodiments, the thickness of the fluorescence diaphragm is 0.09~0.45mm.
In one of the embodiments, the fluorescence diaphragm is mixed by fluorescent material and binding agent.
Brief description of the drawings
Fig. 1 shows for the sectional structure before the emitting led encapsulating structure encapsulation of one side of a preferred embodiment of the present utility model
It is intended to.
Fig. 2 is the upward view of Fig. 1 emitting led encapsulating structure of one side.
Fig. 3 is Fig. 1 emitting led encapsulating structure top view of one side.
Embodiment
For the ease of understanding the utility model, the utility model will be described more fully below.But, this practicality
It is new to realize in many different forms, however it is not limited to embodiment described herein.On the contrary, providing these implementations
The purpose of example is to make the understanding to disclosure of the present utility model more thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is herein to be in term used in the description of the present utility model
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
Fig. 1 to Fig. 3 is referred to, is the emitting led encapsulating structure of one side of the better embodiment of the utility model one, including is fallen
Dress formula chip 10, the fluorescence diaphragm 20 for being covered in the top of flip chip 10, enclose the white glue wall being located at around flip chip 10
30；The white glue wall 30 is located at the lower section of fluorescence diaphragm 20, and flip chip 10 and fluorescence diaphragm 20 are linked together；Institute
State the top that fluorescence diaphragm 20 is covered in the flip chip 10 and white glue wall 30.
The rectangular body of the flip chip 10 is set, and the electrode of the flip chip 10 is in bottom.The fluorescence diaphragm
20 be prefabricated fluorescence diaphragm, and fluorescent material and binding agent are sufficiently mixed uniformly, film is painted inside mould, then in temperature
It is heating and curing under 170 ° -220 °；The thickness for drawing fluorescence diaphragm 20 is 0.09~0.45mm.
The white glue wall 30 is set in a ring, is formed, is made up of the composition of following parts by weight by white glue solidification：Polyvinyl alcohol
23rd, silica gel 11, boron oxide 12, titanium dioxide 5, sodium hydroxide 5, calcium carbonate 8, hardening agent 7 and water 10 are constituted.
The emitting led encapsulating structure of one side of the present utility model first spreads the prefabricated fluorescence diaphragm of above-mentioned completion when making
On tool, wherein the fluorescence diaphragm is the fluorescence diaphragm of large area；Then by some flip chips 10 turn around it is uniform between
It is placed on every ground on the fluorescence diaphragm；Then, liquid white glue is poured into tool, until the surface with the flip chip 10
Concordantly；Followed by progress drying insulation, soaking time is 21 minutes, and holding temperature is 89 DEG C；Finally, entered by cutting tool
Row is cut, and cuts out the emitting led encapsulating structure of one side of one one, and the one side placed after turning in as Fig. 1 is emitting led
Encapsulating structure.
Because the emitting led encapsulating structure of the one side is formed by cutting, therefore the surrounding side of the white glue wall 30
Surrounding side with the fluorescence diaphragm 20 is corresponding concordant.And the lateral surface of the medial surface of white glue wall 30 and flip chip 10 glues
Knot, the bottom surface of the top surface of white glue wall 30 and the fluorescence diaphragm 20 is bonded, so that flip chip 10 be glued with fluorescence diaphragm 20
Close and fix.
Flip chip 10 is combined fluorescence diaphragm by the emitting led encapsulating structure of one side of the present utility model by white glue wall 30
20 mode, simple and stable structure, while fluorescence diaphragm 20 is set fluorescence coating, light transmission is stable unified, reduces
Aberration problem；Finally, the covering and reflect to the light of the surrounding of flip chip 10 of white glue wall 30 is passed through so that flip-over type core
Piece 10 light formation towards fluorescence diaphragm 20 120 degree of beam angle, realize the demand of one side light extraction, thus meet it is automobile-used,
Illumination, the demand of flash lamp.
Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed,
But therefore it can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (6)
1. a kind of emitting led encapsulating structure of one side, it is characterised in that including flip chip, be covered in the top of flip chip
The fluorescence diaphragm in portion, enclose the white glue wall being located at around flip chip；The white glue wall is located at the lower section of fluorescence diaphragm, and will fall
Dress formula chip and fluorescence diaphragm link together；The flip chip is rectangular to be set, and the white glue wall is set in a ring, institute
State the rectangular setting of fluorescence diaphragm and be covered in the flip chip and white glue coping.
2. the emitting led encapsulating structure of one side according to claim 1, it is characterised in that：The surrounding side of the white glue wall
Surrounding side with the fluorescence diaphragm is corresponding concordant.
3. the emitting led encapsulating structure of one side according to claim 2, it is characterised in that：The medial surface of the white glue wall with
The lateral surface of flip chip is bonded, and the bottom surface of the top surface of the white glue wall and the fluorescence diaphragm is bonded, so that by flip-over type
Chip is adhesively fixed with fluorescence diaphragm.
4. the emitting led encapsulating structure of one side as claimed in any of claims 1 to 3, it is characterised in that：The fluorescence
Diaphragm is prefabricated fluorescence diaphragm.
5. the emitting led encapsulating structure of one side according to claim 4, it is characterised in that：The thickness of the fluorescence diaphragm is
0.09~0.45mm.
6. the emitting led encapsulating structure of one side according to claim 4, it is characterised in that：The fluorescence diaphragm is by fluorescent material
Mixed with binding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621493548.5U CN206432289U (en) | 2016-12-30 | 2016-12-30 | The emitting led encapsulating structure of one side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621493548.5U CN206432289U (en) | 2016-12-30 | 2016-12-30 | The emitting led encapsulating structure of one side |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206432289U true CN206432289U (en) | 2017-08-22 |
Family
ID=59585762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621493548.5U Expired - Fee Related CN206432289U (en) | 2016-12-30 | 2016-12-30 | The emitting led encapsulating structure of one side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206432289U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109638003A (en) * | 2017-10-09 | 2019-04-16 | 晶能光电（江西）有限公司 | The preparation method of LED headlamp based on CSP white chip |
| CN111341897A (en) * | 2018-12-19 | 2020-06-26 | 深圳市聚飞光电股份有限公司 | LED packaging structure, manufacturing method thereof and LED flash lamp |
-
2016
- 2016-12-30 CN CN201621493548.5U patent/CN206432289U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109638003A (en) * | 2017-10-09 | 2019-04-16 | 晶能光电（江西）有限公司 | The preparation method of LED headlamp based on CSP white chip |
| CN111341897A (en) * | 2018-12-19 | 2020-06-26 | 深圳市聚飞光电股份有限公司 | LED packaging structure, manufacturing method thereof and LED flash lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523808, 3, Xincheng Road, Songshan Lake, Guangdong, Dongguan Patentee after: Dongguan Zhongzhi Technology Co.,Ltd. Address before: 523808, 3, Xincheng Road, Songshan Lake, Guangdong, Dongguan Patentee before: DONGGUAN SINOWIN OPTO-ELECTRONIC Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170822 |