CN202549918U

CN202549918U - Fluorescent powder coating and packaging structure

Info

Publication number: CN202549918U
Application number: CN2012200244712U
Authority: CN
Inventors: 王国福; 黄淋毅
Original assignee: FUZHOU RUISHENG ELECTRONICS CO LTD
Current assignee: FUZHOU RUISHENG ELECTRONICS CO LTD
Priority date: 2012-01-19
Filing date: 2012-01-19
Publication date: 2012-11-21
Anticipated expiration: 2022-01-19

Abstract

The utility model relates to an LED (Light-Emitting Diode) packaging field and particularly relates to a fluorescent powder coating and packaging structure. The fluorescent powder coating and packaging structure comprises a bracket, solid crystal glue, a blue light chip, a metal wire, a lens, a fluorescent powder glue layer and a sealing glue layer, wherein the lens is fixed at the upper end of the bracket; the solid crystal glue is dispensed at the center of a cup bowl of the bracket; the blue light chip is fixed on the solid crystal glue; and an electrode of the blue light chip is connected with the metal wire, and the sealing glue layer is coated on the outer layer of the blue light chip. The fluorescent powder coating and packaging structure is characterized in that the fluorescent powder glue layer is a fluorescent powder coating layer formed by fluorescent powder, silicon dioxide and silica gel which are mixed together and is coated on the inner surface of the lens. According to the fluorescent powder coating and packaging structure disclosed by the utility model, the fluorescent powder coating layer can be coated on the inner surface of the lens so as to completely separate the fluorescent powder layer from the blue light chip, and achieve the aim of prolong the service life of an LED light source by separating the fluorescent powder from a heat source of the blue light chip; and meanwhile, the light spot problem also can be effectively relieved.

Description

A kind of fluorescent powder coated encapsulating structure

Technical field

The utility model belongs to the LED encapsulation field, relates in particular to a kind of fluorescent powder coated encapsulating structure.

Background technology

Mostly traditional white light LEDs point powder mode is to be covered with on the blue chip layer of fluorescent powder colloid; Light meeting when blue chip and produce a large amount of heats; And owing to the fluorescent material glue-line directly contacts with blue chip; Very easily occur causing the drift of led light source colour temperature, shorten the led light source result in useful life because the phosphor powder layer heatproof is not enough.

The utility model content

The technical problem that the utility model will solve is to provide a kind of raising led light source life-span, improves the fluorescent powder coated encapsulating structure of hot spot simultaneously.

The utility model is achieved in that a kind of fluorescent powder coated encapsulating structure; Comprise support, crystal-bonding adhesive, blue chip, metal wire, lens, fluorescent material glue-line and sealant layer; Said lens are fixed on the upper end of support, and crystal-bonding adhesive point is in the cup bowl central authorities of support, and blue chip is fixed on the crystal-bonding adhesive; The electrode of blue chip connects metal wire; The skin of blue chip is coated sealant layer, it is characterized in that: said fluorescent material glue-line is the composite by a certain percentage fluorescent powder coated layer of fluorescent material and silicon dioxide, silica gel, is coated on the inner surface of lens.

Said sealant layer is silica gel layer or epoxy resin layer.

The application pattern of said fluorescent powder coated layer is directed spin coated.

A kind of fluorescent powder coated encapsulating structure of the utility model has following advantage: adopt the inner surface that fluorescent powder coated layer is coated on lens; Phosphor powder layer and blue chip are thoroughly separated; The thermal source that fluorescent material and blue chip are sent separates the effect that reaches the raising led light source life-span, can also effectively improve the hot spot problem simultaneously.

Description of drawings

Combine embodiment that the utility model is further described with reference to the accompanying drawings.

Fig. 1 is the overall structure sketch map of a kind of fluorescent powder coated encapsulating structure of the utility model.

Embodiment

Come the utility model is carried out detailed explanation below in conjunction with specific embodiment.

See also shown in Figure 1; Be the described a kind of fluorescent powder coated encapsulating structure of the utility model, comprise high-power support 1, crystal-bonding adhesive (not shown), blue chip 2, metal wire 3, sealant layer 4, fluorescent powder coated glue-line 5 and PC lens 6, crystal-bonding adhesive point is in the cup bowl central authorities of high-power support 1; Blue chip 2 is fixed on the crystal-bonding adhesive; The electrode of blue chip 2 connects metal wire 3 and communicates with the external world, and the skin of blue chip 2 is coated sealant layer 4, and sealant layer 4 is used for the protection of chip and gold thread for silica gel or epoxy resin; Fluorescent powder coated glue-line 5 is fluorescent material and silicon dioxide and the composite in proportion fluorescence glue of silica gel; It is coated on the inner surface of PC lens 6, and sealant layer 4 upper ends are the PC lens 6 that inner surface applies good fluorescent powder coated glue-line 5, and PC lens 6 are fixed on the upper end of high-power support 1.

The fluorescent powder coated encapsulating structure of the utility model at first is fixed on cup bowl central authorities with blue chip through crystal-bonding adhesive; Secondly fluorescent material and silicon dioxide, silica gel are mixed into the fluorescence glue by proportioning; It is coated in the inner surface of PC lens, quartz lens or glass lens through directed rotation mode, and oven dry then will have the lens of fluorescent colloid to be positioned over the support upper end again; The encapsulation of light source is accomplished to an amount of sealed colloid of the inner injection of lens in the back.

Claims

1. fluorescent powder coated encapsulating structure; Comprise support, crystal-bonding adhesive, blue chip, metal wire, lens, fluorescent material glue-line and sealant layer, said lens are fixed on the upper end of support, and crystal-bonding adhesive point is in the cup bowl central authorities of support; Blue chip is fixed on the crystal-bonding adhesive; The electrode of blue chip connects metal wire, and the skin of blue chip is coated sealant layer, it is characterized in that: said fluorescent material glue-line is coated on the inner surface of lens.

2. fluorescent powder coated encapsulating structure according to claim 1 is characterized in that: said sealant layer is silica gel layer or epoxy resin layer.