CN101338879A - Method for preparing white light LED utilizing YAG transparent ceramic - Google Patents
Method for preparing white light LED utilizing YAG transparent ceramic Download PDFInfo
- Publication number
- CN101338879A CN101338879A CNA2008101387919A CN200810138791A CN101338879A CN 101338879 A CN101338879 A CN 101338879A CN A2008101387919 A CNA2008101387919 A CN A2008101387919A CN 200810138791 A CN200810138791 A CN 200810138791A CN 101338879 A CN101338879 A CN 101338879A
- Authority
- CN
- China
- Prior art keywords
- yag
- light
- crystalline ceramics
- epoxy resin
- ceramic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2008101387919A CN100565000C (en) | 2008-08-11 | 2008-08-11 | Utilize the YAG crystalline ceramics to prepare the method for white light LEDs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2008101387919A CN100565000C (en) | 2008-08-11 | 2008-08-11 | Utilize the YAG crystalline ceramics to prepare the method for white light LEDs |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101338879A true CN101338879A (en) | 2009-01-07 |
CN100565000C CN100565000C (en) | 2009-12-02 |
Family
ID=40213011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2008101387919A Expired - Fee Related CN100565000C (en) | 2008-08-11 | 2008-08-11 | Utilize the YAG crystalline ceramics to prepare the method for white light LEDs |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100565000C (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101931040A (en) * | 2010-07-20 | 2010-12-29 | 嘉兴嘉尼光电科技有限公司 | Packaging of LED area light source |
CN101988636A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White light LED (light-emitting diode) and preparation method thereof |
CN102130108A (en) * | 2010-12-14 | 2011-07-20 | 黄金鹿 | Transparent ceramic packaged light emitting diode (LED) light source |
CN102249660A (en) * | 2011-04-22 | 2011-11-23 | 中国科学院上海光学精密机械研究所 | Composite structure fluorescent ceramic for GaInN white light LED (Light Emitting Diode) and preparation method thereof |
CN103443941A (en) * | 2011-03-31 | 2013-12-11 | 松下电器产业株式会社 | Semiconductor light-mitting device |
CN104755966A (en) * | 2012-10-19 | 2015-07-01 | 奥斯兰姆施尔凡尼亚公司 | Index matched composite materials and light sources incorporating the same |
CN108180403A (en) * | 2018-02-12 | 2018-06-19 | 中国人民大学 | A kind of liquid cold laser light-emitting device and preparation method thereof |
CN109336582A (en) * | 2018-09-30 | 2019-02-15 | 汪阳 | A kind of composite construction fluorescence ceramics and preparation method thereof for white light LEDs |
CN114361315A (en) * | 2020-10-13 | 2022-04-15 | 福建中科芯源光电科技有限公司 | White light LED chip and device packaged by inorganic material, and preparation method and application thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (en) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
KR20050053798A (en) * | 1996-06-26 | 2005-06-08 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | Light-emitting semiconductor component with luminescence conversion element |
US6630691B1 (en) * | 1999-09-27 | 2003-10-07 | Lumileds Lighting U.S., Llc | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
CN1204083C (en) * | 2002-08-28 | 2005-06-01 | 中国科学院上海硅酸盐研究所 | Prepn of ion doped yttrium aluminium garnet nano-powder |
CN100389504C (en) * | 2005-12-19 | 2008-05-21 | 中山大学 | YAG chip-type white-light light-emitting-diode and its packing method |
-
2008
- 2008-08-11 CN CNB2008101387919A patent/CN100565000C/en not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101988636A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White light LED (light-emitting diode) and preparation method thereof |
CN101931040A (en) * | 2010-07-20 | 2010-12-29 | 嘉兴嘉尼光电科技有限公司 | Packaging of LED area light source |
CN102130108A (en) * | 2010-12-14 | 2011-07-20 | 黄金鹿 | Transparent ceramic packaged light emitting diode (LED) light source |
CN103443941A (en) * | 2011-03-31 | 2013-12-11 | 松下电器产业株式会社 | Semiconductor light-mitting device |
CN102249660A (en) * | 2011-04-22 | 2011-11-23 | 中国科学院上海光学精密机械研究所 | Composite structure fluorescent ceramic for GaInN white light LED (Light Emitting Diode) and preparation method thereof |
CN102249660B (en) * | 2011-04-22 | 2013-05-08 | 中国科学院上海光学精密机械研究所 | Composite structure fluorescent ceramic for GaInN white light LED (Light Emitting Diode) and preparation method thereof |
CN104755966A (en) * | 2012-10-19 | 2015-07-01 | 奥斯兰姆施尔凡尼亚公司 | Index matched composite materials and light sources incorporating the same |
CN104755966B (en) * | 2012-10-19 | 2019-09-24 | 奥斯兰姆施尔凡尼亚公司 | The composite material of index matching and light source comprising it |
CN108180403A (en) * | 2018-02-12 | 2018-06-19 | 中国人民大学 | A kind of liquid cold laser light-emitting device and preparation method thereof |
CN109336582A (en) * | 2018-09-30 | 2019-02-15 | 汪阳 | A kind of composite construction fluorescence ceramics and preparation method thereof for white light LEDs |
CN114361315A (en) * | 2020-10-13 | 2022-04-15 | 福建中科芯源光电科技有限公司 | White light LED chip and device packaged by inorganic material, and preparation method and application thereof |
Also Published As
Publication number | Publication date |
---|---|
CN100565000C (en) | 2009-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100565000C (en) | Utilize the YAG crystalline ceramics to prepare the method for white light LEDs | |
CN101123286A (en) | LED encapsulation structure and method | |
CN102723424B (en) | Method for preparing fluorescent wafer for LED (light-emitting diode) | |
CN202948972U (en) | White light light emitting diode (LED) module packaging structure | |
US20220064053A1 (en) | Preparation method and use of yellow fluorescent glass ceramic | |
KR20090093202A (en) | White light emitting diode and its manufacture method | |
CN102501478A (en) | Composite transparent ceramic used for white-light LED fluorescence conversion and preparation method thereof | |
CN104609848A (en) | Composite-phase transparent ceramic for white light LED (light-emitting diode) fluorescence conversion and preparation method thereof | |
CN102249660B (en) | Composite structure fluorescent ceramic for GaInN white light LED (Light Emitting Diode) and preparation method thereof | |
CN201237164Y (en) | White light LED | |
JP4425977B1 (en) | Nitride red phosphor and white light emitting diode using the same | |
CN105431953B (en) | Embedded White-light LED package structure based on solid state fluorescent material and preparation method thereof | |
CN203784667U (en) | LED (light emitting diode) lamp | |
CN106450011B (en) | Preparation method of high-apparent-index white light quantum dot LED based on visible light secondary excitation | |
EP2246909B1 (en) | White light emitting device and lighting fitting for vehicles using the white light emitting device | |
KR101496718B1 (en) | Phosphor and light emitting device | |
CN105431503B (en) | High power high-temperature white-light LED encapsulation and preparation method thereof | |
CN109841720A (en) | A kind of white light LEDs preparation method and white light LED part | |
KR20120089927A (en) | Encapsulant for led and manufacturing method thereof, led using the encapsulant and manufacturing method thereof | |
KR101093575B1 (en) | Nitride red phosphors and white light emitting diode using rare-earth-co-doped nitride red phosphors | |
CN204289523U (en) | High power high-temperature white-light LED encapsulation | |
JPH10233533A (en) | Method and device for forming light emitting device | |
CN100477306C (en) | White Light-emitting diode | |
CN102569597A (en) | LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base | |
CN202474015U (en) | LED package structure using transparent ceramic doped with rare-earth element as base |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANDONG INSPUR HUAGUANG OPTOELECTRONICS CO., LTD. Free format text: FORMER OWNER: SHANDONG HUAGUANG PHOTOELECTRONIC CO., LTD. Effective date: 20111212 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 250101 JINAN, SHANDONG PROVINCE TO: 261061 WEIFANG, SHANDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20111212 Address after: 261061 Weifang high tech Zone, Jin Road, No. 9, No. Patentee after: Shandong Inspur Huaguang Optoelectronics Co., Ltd. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee before: Shandong Huaguang Photoelectronic Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091202 Termination date: 20150811 |
|
EXPY | Termination of patent right or utility model |