CN102969434B - LED component - Google Patents
LED component Download PDFInfo
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- CN102969434B CN102969434B CN201210484697.5A CN201210484697A CN102969434B CN 102969434 B CN102969434 B CN 102969434B CN 201210484697 A CN201210484697 A CN 201210484697A CN 102969434 B CN102969434 B CN 102969434B
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- Prior art keywords
- led
- led wafer
- led component
- groove
- outgoing sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED component, relate to lighting technical field, LED component, comprise: LED wafer, support, light outgoing sheet and the circuit for LED wafer being connected to external circuit, described support has groove, and described smooth outgoing sheet is connected with described support, and forms package cavity with described groove, described LED wafer is positioned at the surface of described smooth outgoing sheet towards package cavity side, and the surface of described groove is reflecting surface.LED component of the present invention is inverted structure, the light that LED sends in package cavity reflection mixing after outgoing again, make the light of outgoing evenly.
Description
Technical field
The present invention relates to lighting technical field, particularly a kind of LED component.
Background technology
LED(light-emitting diode) appearance of white-light illuminating facilitates changing again of lighting field, white light LEDs assembly have Small Solid, vibration resistance, startup fast, respond fast, energy-conservation and the life-span long and many advantages such as green high-efficient, the application in general lighting, backlight, decorative lighting is increasingly extensive.Especially there is energy-conservation good characteristic, therefore can be widely used in various illumination link future based on LED illumination technology.
The main method of current traditional fabrication white light LEDs assembly the colloid of doping fluorescent powder is coated in blue LED wafers or UV LED wafer on the surface, as shown in Figure 1, for a kind of traditional white light LEDs assembly, comprise: LED wafer 101, gold thread 102, lead-in wire 103(connect external circuit), the reeded support 104 of tool and light outgoing sheet 105, the reeded support 104 of tool and light outgoing sheet 105 form the package cavity of packaged LED wafer 101 by the sealing of the packing colloid such as epoxy resin or silicones.
The blue-light excited fluorescent material that blue or UV LED wafer sends short wavelength produces longwave optical (as gold-tinted), and blue light and gold-tinted are jointly mixed into white light and penetrate.The nontransparent fluorescent material of molecule realizes white light by wavelength convert.Blue-ray LED continues to light chip temperature can be caused to raise, fluorescent material, and the packaging plastic such as epoxy resin or silicones cognition is degenerated, moreover fluorescent material is coated in LED wafer surface, due to the problem that coating thickness is uneven, fluorescent material is degenerated or the degeneration of the packing colloid such as epoxy resin or silicones all can cause bright dipping uneven to a great extent; Also can have a strong impact on its hot spot simultaneously and cause white light colour temperature inconsistent etc. problem.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention is: how to make white light LEDs assembly uniform in light emission.
(2) technical scheme
For solving the problems of the technologies described above, the invention provides a kind of LED component, comprise: LED wafer, support, light outgoing sheet and the circuit for LED wafer being connected to external circuit, described support has groove, described smooth outgoing sheet is connected with described support, and forming package cavity with described groove, described LED wafer is positioned at the surface of described smooth outgoing sheet towards package cavity side, and the surface of described groove is reflecting surface.
Preferably, described LED wafer is bonded to the surface of described smooth outgoing sheet towards package cavity side.
Preferably, described circuit LED wafer being connected to external circuit comprises: heat-conductivity conducting glue, be arranged on described smooth outgoing sheet towards the transparency electrode on the surface of package cavity side, circuit layer is on the bracket set and connects the wire of described LED wafer and described transparency electrode, described smooth outgoing sheet is pasted onto on support by described electrically and thermally conductive adhesive, and forming described package cavity with described groove, described transparency electrode is connected by described electrically and thermally conductive adhesive with circuit layer.
Preferably, the surface of described groove is cambered surface or sphere.
Preferably, the cross section of package cavity that described groove and described smooth outgoing sheet are formed is trapezoidal or triangle.
Preferably, the surface of described groove is provided with the micro-structural of reflection ray.
Preferably, described LED wafer is blue LED wafers or UV LED wafer.
Preferably, described smooth outgoing sheet is made up of the transparent material doped with rare earth ion.
Preferably, described transparent material is transparent ceramic or yttrium-aluminium-garnet.
Preferably, in described smooth outgoing sheet doped with Ce, Tm and/or Eu element.
(3) beneficial effect
LED component of the present invention is inverted structure, the light that LED sends in package cavity reflection mixing after outgoing again, make the light of outgoing evenly.
Accompanying drawing explanation
Fig. 1 is a kind of LED component structural representation of prior art;
Fig. 2 is a kind of LED component structural representation of the embodiment of the present invention;
Fig. 3 is the light outgoing schematic diagram of LED component in Fig. 2;
Fig. 4 is the another kind of LED component structural representation of the embodiment of the present invention;
Fig. 5 is another LED component structural representation of the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Embodiment 1
The LED component structure of the present embodiment as shown in Figure 2, comprising: LED wafer 201, light outgoing sheet 204, support 207 and LED wafer 201 is connected to the circuit of external circuit.Support 207 has groove 208, and light outgoing sheet 204 is connected with support 207, and seals with groove 208 and form package cavity 209.LED wafer 201 is positioned at the surface of light outgoing sheet 204 towards package cavity 209 side, forms inverted structure.And the surface of groove 208 is reflecting surface (groove surfaces is coated with reflectorized material or itself is made up of reflectorized material).LED wafer 201 is generally blue light or UV LED wafer, and its surface scribbles the colloid of doping fluorescent powder.LED wafer 201 adopts the mode of bonding to be fixed on the surface of light outgoing sheet 204 towards package cavity 209 side." bonding " described here is a kind of known technology, namely, by the homogeneity of two panels surface cleaning, atomically flating or heterogeneous semiconductor material through surface clean and activation processing, directly combine under certain condition, by Van der Waals force, molecular force even atomic force make bonding chip become to be integrated.
Owing to adopting inverted structure, the white light that LED wafer 201 sends after the surface reflection of groove 208 from the outgoing of light outgoing sheet 204, as shown in Figure 3, the light of reflection fully can mix in package cavity 209, form uniform mixed light (in Fig. 3 shown in arrow), make the light of outgoing evenly, alleviate due to the uneven problem of the bright dipping that thickness of coating fluorescent dye is uneven, fluorescent material is degenerated to be caused to a certain extent; Also alleviate problems such as occurring hot spot and cause white light colour temperature inconsistent simultaneously.
In the present embodiment, circuit LED wafer being connected to external circuit comprises: electrically and thermally conductive adhesive 205, to be arranged on light outgoing sheet 204 towards the transparency electrode 203 on surface, package cavity 209 side, the gold thread 202(that is arranged on circuit layer 206 on support 207 and connects LED wafer 201 and transparency electrode 203 also can be other wire).Light outgoing sheet 204 is pasted onto on support 207 by electrically and thermally conductive adhesive 205 and forms package cavity 209, and transparency electrode 203 is connected by electrically and thermally conductive adhesive 205 with circuit layer 306.Gold thread 202, transparency electrode 203 and electrically and thermally conductive adhesive 205 form circuit LED wafer 201 being connected to external circuit, thus LED wafer 201 is connected with outside drive circuit.
Because light outgoing sheet 204 is bonded on support 207 by electrically and thermally conductive adhesive 205, both LED wafer was connected to the circuit of external circuit by convenient formation, reached again the sealing effectiveness identical with the packing colloid such as epoxy resin or silicones.And have good heat conductivility due to electrically and thermally conductive adhesive 205, alleviate further and cause epoxy resin or silicone encapsulation glue to degenerate the bright dipping problem of non-uniform caused because blue light or ultraviolet leds continue to light.
Embodiment 2
The LED component of the present embodiment is structurally substantially identical with the LED component structure of embodiment 1, as shown in Figure 2, comprising: LED wafer 201, light outgoing sheet 204, support 207 and LED wafer 201 is connected to the circuit of external circuit.Support 207 has groove 208, and light outgoing sheet 204 is connected with support 207, and seals with groove 208 and form package cavity 209.LED wafer 201 is positioned at the surface of light outgoing sheet 204 towards package cavity 209 side, forms inverted structure.And the surface of groove 208 is reflecting surface (groove surfaces is coated with reflectorized material or itself is made up of reflectorized material).
White light is sent in the colloid mode of blue light or UV LED wafer surface-coated doping fluorescent powder owing to adopting, the problem such as inevitably cause bright dipping uneven, in addition, blue light or UV LED wafer continue to light and can produce a large amount of heats, the colloid of doping fluorescent powder can reduce the thermal diffusivity of blue light or UV LED wafer, thus can reduce the life-span of blue light or UV LED wafer.
In order to thoroughly solve bright dipping problem of non-uniform, and improve the thermal diffusivity of LED component, in the present embodiment, LED wafer 201 is blue light or UV LED wafer, but does not need the colloid applying doping fluorescent powder, and light outgoing sheet 204 is the transparent material of doping with rare-earth ions.Because yttrium-aluminium-garnet (YAG) wafer of transparent ceramic or tetragonal crystal system can be easy to Uniform Doped rare earth ion, therefore, transparent material is preferably transparent ceramic wafer or the YAG wafer of the rare earth ion such as doped Ce, Tm and/or Eu.Therefore the doping with rare-earth ions in the phot-luminescence outgoing sheet 204 that sends of blue light or ultraviolet LED wafer obtains homogeneous gold-tinted or broadband light, thus obtains white light on the whole.
As shown in Figure 3, the Doped ions of its inside is excited to send each band of light (as: gold-tinted etc.) by light outgoing sheet 204 after the light reflection mixing that blue light or ultraviolet LED wafer send, the light excited and some blue light form white light, and this white light forms uniform planar light outgoing at the upper surface of light outgoing sheet 204.Wider relative to the LED component rising angle of embodiment 1 evenly.Avoid because blue light or ultraviolet leds continue to light the uneven and fluorescent grain coating of the bright dipping making fluorescent material degenerate the to cause white light colour temperature inconsistence problems caused such as uneven, the colloid of the surperficial uncoated doping fluorescent powder of LED wafer 201 in addition, LED wafer 201 can be dispelled the heat in time, be applicable to making powerful white light LED part, and the transparent material of doping with rare-earth ions is influenced by heat little, thus extend the useful life of LED component.
In above-mentioned two embodiments, in order to arrive different LED rising angles, support upper groove can be cambered surface or sphere, or the cross section of package cavity that groove and light outgoing sheet are formed is trapezoidal or triangle, its reflecting surface is plane, or the surface of groove is provided with the micro-structural of reflection ray, as: (scattering is better for some small cambered surfaces, sphere or tetrahedron, make reflect light can fully mix, and mixing evenly).
As shown in Figure 4, the cross section showing package cavity 209 ＇ that groove 208 ＇ of support 207 ＇ and light outgoing sheet 204 are formed is leg-of-mutton LED component.
As shown in Figure 5, groove 208 ＂ showing support 207 ＂ is provided with the LED component of micro-structural 210, and it is protruding spherical structure that groove 208 ＂ and light outgoing sheet 204 form package cavity 209 ＂ micro-structural 210.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (10)
1. a LED component, comprise: LED wafer, support, light outgoing sheet and the circuit for LED wafer being connected to external circuit, described support has groove, it is characterized in that, described smooth outgoing sheet is connected with described support, and forming package cavity with described groove, described LED wafer is positioned at the surface of described smooth outgoing sheet towards package cavity side, and the surface of described groove is reflecting surface;
Described circuit LED wafer being connected to external circuit comprises: electrically and thermally conductive adhesive, be arranged on described smooth outgoing sheet towards the transparency electrode on the surface of package cavity side, circuit layer is on the bracket set and connects the wire of described LED wafer and described transparency electrode, described smooth outgoing sheet is pasted onto on support by described electrically and thermally conductive adhesive, and forming described package cavity with described groove, described transparency electrode is connected by described electrically and thermally conductive adhesive with circuit layer.
2. LED component as claimed in claim 1, it is characterized in that, described LED wafer is bonded to the surface of described smooth outgoing sheet towards package cavity side.
3. LED component as claimed in claim 1, it is characterized in that, the surface of described groove is cambered surface.
4. LED component as claimed in claim 1, it is characterized in that, the surface of described groove is Internal Spherical Surface.
5. LED component as claimed in claim 1, it is characterized in that, the cross section of the package cavity that described groove and described smooth outgoing sheet are formed is trapezoidal or triangle.
6. LED component as claimed in claim 1, it is characterized in that, the surface of described groove is provided with the micro-structural of reflection ray.
7. the LED component according to any one of claim 1 ~ 6, is characterized in that, described LED wafer is blue LED wafers or UV LED wafer.
8. LED component as claimed in claim 7, it is characterized in that, described smooth outgoing sheet is made up of the transparent material doped with rare earth ion.
9. LED component as claimed in claim 8, it is characterized in that, described transparent material is transparent ceramic or yttrium-aluminium-garnet.
10. LED component as claimed in claim 6, is characterized in that, doped with Ce, Tm and/or Eu element in described smooth outgoing sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210484697.5A CN102969434B (en) | 2012-11-23 | 2012-11-23 | LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210484697.5A CN102969434B (en) | 2012-11-23 | 2012-11-23 | LED component |
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| Publication Number | Publication Date |
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| CN102969434A CN102969434A (en) | 2013-03-13 |
| CN102969434B true CN102969434B (en) | 2015-12-02 |
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| CN201210484697.5A Active CN102969434B (en) | 2012-11-23 | 2012-11-23 | LED component |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104681548B (en) * | 2015-03-03 | 2017-10-27 | 杭州士兰明芯科技有限公司 | A kind of LED ray structures and preparation method thereof |
| CN108400221A (en) * | 2018-04-28 | 2018-08-14 | 华南理工大学 | A kind of LED quantum dot light emittings device and its packaging method |
| CN109273578A (en) * | 2018-11-01 | 2019-01-25 | 深圳市灏天光电有限公司 | A kind of LED lamp holder structure and preparation method thereof |
| JP6794498B1 (en) * | 2019-06-04 | 2020-12-02 | 浜松ホトニクス株式会社 | Light emitting device and manufacturing method of light emitting device |
| JP7138149B2 (en) * | 2020-11-11 | 2022-09-15 | 浜松ホトニクス株式会社 | Light-receiving device and method for manufacturing light-receiving device |
| CN114843253A (en) * | 2021-02-02 | 2022-08-02 | 光宝科技股份有限公司 | Light emitting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569597A (en) * | 2011-08-20 | 2012-07-11 | 中国科学院福建物质结构研究所 | LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0251287A (en) * | 1988-08-12 | 1990-02-21 | Iwasaki Electric Co Ltd | Multicolor led |
| JP2002111070A (en) * | 2000-09-28 | 2002-04-12 | Toyoda Gosei Co Ltd | Reflective light-emitting diode |
| JP2005038870A (en) * | 2003-07-15 | 2005-02-10 | Iwasaki Electric Co Ltd | Light emitting diode lamp |
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- 2012-11-23 CN CN201210484697.5A patent/CN102969434B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569597A (en) * | 2011-08-20 | 2012-07-11 | 中国科学院福建物质结构研究所 | LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base |
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| CN102969434A (en) | 2013-03-13 |
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