CN103872034A - Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source - Google Patents
Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source Download PDFInfo
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- CN103872034A CN103872034A CN201410109152.5A CN201410109152A CN103872034A CN 103872034 A CN103872034 A CN 103872034A CN 201410109152 A CN201410109152 A CN 201410109152A CN 103872034 A CN103872034 A CN 103872034A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The invention relates to a total-angle light emitting LED light source based on a light transmittance substrate and a packaging method of the total-angle light emitting LED light source. LED chips of the light source adhere to the light transmittance substrate through die attachment adhesive and connected with an electric conduction electrode through a wire. A primary packaging mixed powder colloid and a secondary packaging mixed powder colloid are located on the front face and the back face of the light transmittance substrate respectively, and the parts close to the edges of the two sides of the light transmittance substrate are in an arc shape. The packaging method of the light source includes the steps that the die attachment adhesive is used for fixing the LED chips on the light transmittance substrate to be baked; the wire is used for connecting the LED chips with the electric conduction electrode; the front face of the light transmittance substrate is coated with mixed powder adhesive points to be dried after self leveling, so that the primary packaging mixed powder colloid is obtained; after the light transmittance substrate is turned over, the back face of the light transmittance substrate is coated with mixed powder adhesive points to be dried after self-leveling, so that the secondary mixed powder colloid is obtained. The LED light source is good in color temperature evenness and controllability, and because the mixed powder colloids are in an arc shape on the edges of the light transmittance substrate, the phenomenon that dark spaces exist when the LED light source emits light is improved.
Description
Technical field
The invention belongs to LED illuminating source technical field, relate to a kind of full angle emitting led light source and method for packing thereof based on transparent substrates.
Background technology
LED illuminating product is a kind of novel green light source, and its life-span length, energy-saving and environmental protection, the feature that light efficiency is high make it in illumination market, capture huge advantage always; And in recent years, LED illuminating product has progressed into the universal stage of market.
Traditional LED illuminating product, its implementation is mainly on radiator substrate (take aluminium base, copper base as representative), fixing blue led chip, and then fluorescent material colloid mixture is coated on LED chip, the blue light that blue led chip is sent, excite through fluorescent material, finally form white light, reach the object of illumination.
Along with reaching its maturity and development of LED lighting technology, in recent years, a kind of LED encapsulation technology based on transparent substrates and products thereof, had appeared in domestic LED illuminating industry and market.
The existing LED illuminating product based on transparent substrates, it,, with respect to the LED illuminating product of traditional heat-radiating substrate, has huge advantage.Traditional heat-radiating substrate (copper base, aluminium base), due to its lighttight characteristic, thus the rising angle of its light source, in theory only to reach 180 °.
And the existing LED illuminating product based on transparent substrates encapsulation, due to the light transmission features of its substrate, the rising angle of its illuminating product can reach 360 ° in theory, and light efficiency will exceed much with respect to the LED illuminating product of traditional heat-dissipating substrate.
LED light source based on transparent substrates encapsulation is with respect to the LED light source of traditional heat-dissipating substrate package, and due to the difference of the main carriers of both implementations, the former has huge advantage, but in itself, also exists some defects.
In prior art, LED chip mostly is single distribution, or distributes with parallel regular matrix type between LED chip 2
(1) colour temperature is inhomogeneous: in actual production, owing to mixing arogel packaging technology and completing with post-drying by a spot printing, be blended in the displacement that the fluorescent powder grain in colloid occurs towards terrestrial gravitation one side in time because of gravity, the fluorescent material of top is to transparent substrates sedimentation, the fluorescent material of below is to mixed arogel lower edge sedimentation, and side fluorescent material amount is little, thereby transparent substrates LED product exists the inhomogeneous phenomenon of colour temperature.
(2) there is luminous dark space: in actual production, complete mainly with the technique such as cutting after the mixed arogel of justifying spot printing, the mixed arogel body section of transparent substrates edge is the right angle that does not have radian, the luminous flux that LED chip side radiation goes out is subject to excessively exciting and occurs to shade or Yellowing, thereby transparent substrates LED product exists luminous dark space, in the light-emitting zone of light source, there is obviously region on the low side of light intensity.
(3) blue light overflows: because crystal-bonding adhesive is transparent, do not mix fluorescent material, the blue light that send LED chip bottom produces diffuse reflection in transparent substrates, and the light overflowing from transparent substrates side exists colour temperature higher (being blueness) phenomenon because not being subject to fluorescent material and exciting or excited by fluorescent material.
(4) LED chip mostly is single distribution, or distributes with parallel regular matrix type between LED chip, and light efficiency is low.
Summary of the invention
The technical problem that the present invention will solve is to provide and a kind ofly can greatly weakens excessively exciting of LED chip ambient light, improves light source luminescent and exist the full angle emitting led light source based on transparent substrates of dark area effect.
In order to solve the problems of the technologies described above, the full angle emitting led light source based on transparent substrates of the present invention comprises transparent substrates, multiple LED chips, and conductive electrode, the once mixed arogel body of encapsulation, secondary encapsulation mixes arogel body; Described LED chip is adhesively fixed on transparent substrates by crystal-bonding adhesive, and each LED chip is connected with conductive electrode by wire; Once the mixed arogel body of encapsulation is positioned at the front of transparent substrates, and the mixed arogel body of secondary encapsulation is positioned at the reverse side of transparent substrates; Once encapsulating near the both sides of the edge place of transparent substrates, the mixed arogel body of mixed arogel body and secondary encapsulation is curved.
Described crystal-bonding adhesive is the mixed powder crystal-bonding adhesive that is mixed with fluorescent material.
In described mixed powder crystal-bonding adhesive, the weight ratio of crystal-bonding adhesive and fluorescent material is 1:0.01～2, and the coordinate of fluorescent material is x=0.358～0.677, y=0.323～0.570.White color coordinate after exciting is x=0.3078～0.4073, y=0.3198～0.3288.
Described LED chip is adhesively fixed on the front of transparent substrates and is interspersed.
Described LED chip is adhesively fixed on the obverse and reverse of transparent substrates, and LED chip on obverse and reverse is all interspersed.
Another technical problem that the present invention will solve is to provide a kind of method for packing of the above-mentioned full angle emitting led light source based on transparent substrates.
In order to solve the problems of the technologies described above, the method for packing of the full angle emitting led light source based on transparent substrates of the present invention comprises the steps:
Step 1: the position that crystal-bonding adhesive point is coated in to corresponding each LED chip on transparent substrates;
Step 2: each LED chip is fixed on crystal-bonding adhesive and is dried;
Step 3: each LED chip is connected with conductive electrode with wire;
Step 4: mixed arogel point is coated on the front of transparent substrates, makes its edge at transparent substrates rely on surface tension Self-leveling to form certain radian, then dry, obtain once encapsulating mixed arogel body in transparent substrates front;
Step 5: transparent substrates upset is made to its reverse side upward; Mixed arogel point is coated on the reverse side of transparent substrates, makes its edge at transparent substrates rely on surface tension Self-leveling to form certain radian, then dry, obtain the mixed arogel body of secondary encapsulation at transparent substrates reverse side.
Beneficial effect:
1, the present invention adopts secondary encapsulation technique, make the fluorescent material in the mixed arogel in transparent substrates two sides all tend to LED chip sedimentation, the mixed arogel ratio in both sides that has solved transparent substrates is difficult to the problem of controlling flexibly, and the color temperature uniformity of LED light source and controllability are improved greatly.
2, because LED chip is when luminous, the luminous flux of its side is less than its positive luminous flux, and the present invention adopts the mixed arogel of spot printing and relies on the mode of surface tension Self-leveling, makes mixed arogel form certain radian in the edge of transparent substrates.Because the thickness of the mixed arogel at radian place is less, the phenomenon that LED chip lateral emitting is excessively excited weakens greatly, has greatly improved the luminous phenomenon that has dark space of LED light source.
3, adopt the mixed powder crystal-bonding adhesive LED chip that is adhesively fixed, solved LED chip when luminous, because of the blue light overflow problem of diffuse reflection in transparent substrates (not excited by fluorescent material) generation.
4, LED chip is interspersed on transparent substrates, compares under same parameter and condition, and light efficiency is enhanced.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Fig. 1 a is full angle emitting led light source embodiment 1 end view based on transparent substrates of the present invention.
Fig. 1 b is full angle emitting led light source embodiment 1 vertical view based on transparent substrates of the present invention.
Fig. 1 c is full angle emitting led light source embodiment 1 front view based on transparent substrates of the present invention.
Fig. 2 a is full angle emitting led light source embodiment 2 end views based on transparent substrates of the present invention.
Fig. 2 b is full angle emitting led light source embodiment 2 vertical views based on transparent substrates of the present invention.
Fig. 2 c is full angle emitting led light source embodiment 2 front views based on transparent substrates of the present invention.
Embodiment
The method for packing concrete steps of the full angle emitting led light source based on transparent substrates of the present invention are as follows:
Step 1: the position that mixed powder crystal-bonding adhesive point is coated in to corresponding each LED chip on transparent substrates;
Step 2: each LED chip is fixed on mixed powder crystal-bonding adhesive and is dried;
Step 3: every LEDs chip is connected after (for convenience of description, take series connection as example, setting forth in the present invention) with wire, then conductive electrode is connected with wire with two close LEDs chips;
Step 4: mixed arogel point is coated on the front of transparent substrates, makes the edge of mixed arogel at transparent substrates, rely on surface tension Self-leveling, form certain radian at the edge of transparent substrates, then dry and obtain once encapsulating mixed arogel body;
Step 5: transparent substrates 6 upsets are made to its reverse side upward, mixed arogel point is coated on the reverse side of transparent substrates 6, makes the edge of mixed arogel at transparent substrates 6, rely on surface tension Self-leveling, edge at transparent substrates 6 forms certain radian, then dries and obtains the mixed arogel body of secondary encapsulation.
As shown in Fig. 1 a, Fig. 1 b, Fig. 1 c, the full angle emitting led light source based on transparent substrates of making according to the method described above comprises transparent substrates 6, multiple LED chips 2, and conductive electrode 5, the once mixed arogel body 3 of encapsulation, secondary encapsulation mixes arogel body 7; Each LED chip 2 is adhesively fixed on the front of transparent substrates 6 by mixed powder crystal-bonding adhesive 1, and each LED chip 2 distribution that is staggered; Each LED chip 2 is cascaded by wire 4, and conductive electrode 5 is connected with two close LEDs chip 2 use wires 4; Once the mixed arogel body 3 of encapsulation is packaged in the front of transparent substrates 6, curved at the front edge place near transparent substrates 6, and the mixed arogel body 7 of secondary encapsulation is packaged in the reverse side of transparent substrates 6, curved in the reverse side edge near transparent substrates 6.Wherein crystal-bonding adhesive is epoxide-resin glue, and in mixed powder epoxide-resin glue, the weight ratio of crystal-bonding adhesive and fluorescent material is 1:1, and the coordinate of fluorescent material is x=0.571, y=0.447.White color coordinate after exciting is x=0.3576, y=0.3243.
As shown in Fig. 1 a, Fig. 1 b, Fig. 1 c, the full angle emitting led light source based on transparent substrates of making according to the method described above comprises transparent substrates 6, multiple LED chips 2, and conductive electrode 5, the once mixed arogel body 3 of encapsulation, secondary encapsulation mixes arogel body 7; Each LED chip 2 is adhesively fixed on the front of transparent substrates 6 by mixed powder crystal-bonding adhesive 1, and each LED chip 2 distribution that is staggered; Each LED chip 2 is cascaded by wire 4, and conductive electrode 5 is connected with two close LEDs chip 2 use wires 4; Once the mixed arogel body 3 of encapsulation is packaged in the front of transparent substrates 6, curved at the front edge place near transparent substrates 6, and the mixed arogel body 7 of secondary encapsulation is packaged in the reverse side of transparent substrates 6, curved in the reverse side edge near transparent substrates 6.Wherein crystal-bonding adhesive 1 is the mixture of epoxy resin and silica gel, and in described mixed powder crystal-bonding adhesive, the weight ratio of crystal-bonding adhesive and fluorescent material is 1:0.01, and the coordinate of fluorescent material is x=0.358, y=0.323.White color coordinate after exciting is x=0.3078, y=0.3198.
As shown in Fig. 2 a, Fig. 2 b, Fig. 2 c, the full angle emitting led light source based on transparent substrates of making according to the method described above comprises transparent substrates 6, multiple LED chips 2, and conductive electrode 5, the once mixed arogel body 3 of encapsulation, secondary encapsulation mixes arogel body 7; Each LED chip 2 is adhesively fixed on the obverse and reverse of transparent substrates 6 by crystal-bonding adhesive 1, and the LED chip 2 of obverse and reverse is all staggered arranged distribution; Each LED chip 2 is cascaded by wire 4, and conductive electrode 5 is connected with two close LEDs chip 2 use wires 4; Once the mixed arogel body 3 of encapsulation is packaged in the front of transparent substrates 6, curved at the front edge place near transparent substrates 6, and the mixed arogel body 7 of secondary encapsulation is packaged in the reverse side of transparent substrates 6, curved in the reverse side edge near transparent substrates 6.Wherein crystal-bonding adhesive 1 is epoxide-resin glue, and in mixed powder epoxide-resin glue, the weight ratio of crystal-bonding adhesive and fluorescent material is 1:2, and the coordinate of fluorescent material is x=0.677, y=0.570.White color coordinate after exciting is x=0.4073, y=0.3288.
Claims (6)
1. the full angle emitting led light source based on transparent substrates, comprise transparent substrates (6), multiple LED chips (2), conductive electrode (5), it is upper that described LED chip (2) is adhesively fixed on transparent substrates (6) by crystal-bonding adhesive (1), and each LED chip (2) is connected with conductive electrode (5) by wire (4); Characterized by further comprising the mixed arogel body (3) of once encapsulation, secondary encapsulation mixes arogel body (7); Once the mixed arogel body (3) of encapsulation is positioned at the front of transparent substrates (6), and the mixed arogel body (7) of secondary encapsulation is positioned at the reverse side of transparent substrates (6); Once encapsulating near the both sides of the edge place of transparent substrates (6), the mixed arogel body (7) of mixed arogel body (3) and secondary encapsulation is curved.
2. the full angle emitting led light source based on transparent substrates according to claim 1, is characterized in that described crystal-bonding adhesive (1) is for being mixed with the mixed powder crystal-bonding adhesive of fluorescent material.
3. the full angle emitting led light source based on transparent substrates according to claim 2, it is characterized in that in described mixed powder crystal-bonding adhesive, the weight ratio of crystal-bonding adhesive and fluorescent material is 1:0.01～2, and the coordinate of fluorescent material is x=0.358～0.677, y=0.323～0.570.
4. the full angle emitting led light source based on transparent substrates according to claim 1, is characterized in that described LED chip (2) is adhesively fixed on the front of transparent substrates (6) and is interspersed.
5. the full angle emitting led light source based on transparent substrates according to claim 1, is characterized in that described LED chip (2) is adhesively fixed on the obverse and reverse of transparent substrates (6), and LED chip (2) on obverse and reverse is all interspersed.
6. a method for packing for the full angle emitting led light source based on transparent substrates as claimed in claim 1, is characterized in that comprising the steps:
Step 1: the position that crystal-bonding adhesive point is coated in to the upper corresponding each LED chip of transparent substrates (6);
Step 2: each LED chip (2) is fixed on crystal-bonding adhesive (1) and is dried;
Step 3: use wire (4) that each LED chip (2) is connected with conductive electrode (5);
Step 4: will mix arogel point and be coated on the front of transparent substrates (6), make its edge at transparent substrates (6) rely on surface tension Self-leveling to form certain radian, then dry, obtain once encapsulating mixed arogel body (3) in transparent substrates (6) front;
Step 5: transparent substrates (6) upset is made to its reverse side upward; To mix arogel point and be coated on the reverse side of transparent substrates (6), and make its edge at transparent substrates (6) rely on surface tension Self-leveling to form certain radian, then dry, obtain the mixed arogel body (7) of secondary encapsulation at transparent substrates (6) reverse side.
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104091879A (en) * | 2014-07-25 | 2014-10-08 | 胡溢文 | LED chip packaging structure with two luminous surfaces |
| CN104091866A (en) * | 2014-07-25 | 2014-10-08 | 胡溢文 | Method for preparing LED lamp filament of horizontal flip-chip |
| CN105280782A (en) * | 2015-11-05 | 2016-01-27 | 深圳市超频三科技股份有限公司 | Lamp, flaky luminous body and manufacturing method thereof |
| CN105443997A (en) * | 2015-12-18 | 2016-03-30 | 贵州联尚科技有限公司 | LED lamp and production process thereof |
| CN105762255A (en) * | 2016-04-06 | 2016-07-13 | 卓广实业（上海）有限公司 | High-power LED point light source applied to high-quality lighting |
| CN106555942A (en) * | 2015-09-29 | 2017-04-05 | 上海德士电器有限公司 | LED light source module and the bubble shape lamp including which |
| CN107275320A (en) * | 2017-08-15 | 2017-10-20 | 陈广明 | High-temperature-resistant LED light source |
| CN109713106A (en) * | 2018-11-15 | 2019-05-03 | 浙江英特来光电科技有限公司 | A kind of LED light source and its dispensing method |
| CN110058511A (en) * | 2019-04-12 | 2019-07-26 | 东莞市坤信实业有限公司 | A kind of solar energy clock |
| CN115064618A (en) * | 2022-08-17 | 2022-09-16 | 苏州晶台光电有限公司 | COB module packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104091866B (en) * | 2014-07-25 | 2017-02-15 | 胡溢文 | Method for preparing LED lamp filament of horizontal flip-chip |
| CN104091866A (en) * | 2014-07-25 | 2014-10-08 | 胡溢文 | Method for preparing LED lamp filament of horizontal flip-chip |
| CN104091879A (en) * | 2014-07-25 | 2014-10-08 | 胡溢文 | LED chip packaging structure with two luminous surfaces |
| CN106555942A (en) * | 2015-09-29 | 2017-04-05 | 上海德士电器有限公司 | LED light source module and the bubble shape lamp including which |
| CN105280782A (en) * | 2015-11-05 | 2016-01-27 | 深圳市超频三科技股份有限公司 | Lamp, flaky luminous body and manufacturing method thereof |
| CN105443997A (en) * | 2015-12-18 | 2016-03-30 | 贵州联尚科技有限公司 | LED lamp and production process thereof |
| CN105762255A (en) * | 2016-04-06 | 2016-07-13 | 卓广实业（上海）有限公司 | High-power LED point light source applied to high-quality lighting |
| CN105762255B (en) * | 2016-04-06 | 2018-11-09 | 卓广实业（上海）有限公司 | A kind of great power LED point light source of high-quality illumination application |
| CN107275320A (en) * | 2017-08-15 | 2017-10-20 | 陈广明 | High-temperature-resistant LED light source |
| CN109713106A (en) * | 2018-11-15 | 2019-05-03 | 浙江英特来光电科技有限公司 | A kind of LED light source and its dispensing method |
| CN110058511A (en) * | 2019-04-12 | 2019-07-26 | 东莞市坤信实业有限公司 | A kind of solar energy clock |
| CN115064618A (en) * | 2022-08-17 | 2022-09-16 | 苏州晶台光电有限公司 | COB module packaging method |
| CN115064618B (en) * | 2022-08-17 | 2022-11-29 | 苏州晶台光电有限公司 | COB module packaging method |
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