CN105336835A - LED packaging structure and packaging method thereof - Google Patents
LED packaging structure and packaging method thereof Download PDFInfo
- Publication number
- CN105336835A CN105336835A CN201510839817.2A CN201510839817A CN105336835A CN 105336835 A CN105336835 A CN 105336835A CN 201510839817 A CN201510839817 A CN 201510839817A CN 105336835 A CN105336835 A CN 105336835A
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- Prior art keywords
- led
- support
- bowl cup
- injecting glue
- hole
- Prior art date
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- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 26
- 238000005538 encapsulation Methods 0.000 claims description 21
- 239000005357 flat glass Substances 0.000 claims description 21
- 238000012856 packing Methods 0.000 claims description 14
- 241000218202 Coptis Species 0.000 claims description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000741 silica gel Substances 0.000 abstract description 2
- 229910002027 silica gel Inorganic materials 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses an LED packaging structure and packaging method thereof. The LED packaging structure comprises a square bracket, wherein an LED chip is arranged at the center of the bowl cup of the bracket; the electrodes of the LED chip are connected with the positive and negative electrodes of the bracket by golden lines; a step is arranged on the bowl cup wall of the bracket; glue filling holes are formed in the four corner of the step; each glue filling hole is communicated to the bottom of the bowl cup; a glass sheet is arranged on the step; one surface of the glass sheet is coated with fluorescent powder; the surface, coated with the fluorescent powder, of the glass sheet faces downwards. The LED packaging structure and the packaging method thereof can be used for not only solving a problem of a yellow ring of white light of an LED, but also solving a problem of luminance decay of the white light of the LED; silica gel is injected into the bowl cup of the bracket by the glue filling holes, the operation is convenient, and the fluorescent powder can not be concentrated near to the LED chip or the bottom of the bowl cup of the bracket, and therefore, the luminance decay of the LED chip, caused by long-time heating, is avoided, and from another point of view, the service life of the LED is prolonged.
Description
Technical field
The present invention relates to LED technology field, relate to a kind of LED encapsulation structure and method for packing thereof specifically.
Background technology
Light-emitting diode (LED) is a kind of semiconductor light sources, and LED has lot of advantages compared with other light source such as incandescent lamp, and LED has longer life-span, preferably stability, faster switching characteristic and lower energy consumption usually.Along with LED to go deep into the life of people day by day as light source of new generation, its application is also more and more extensive.In synthesize white light, the most frequently used mode places material for transformation of wave length in the LED wafer of blue light-emitting, such as yellow fluorescent powder, material for transformation of wave length layer in LED wafer can absorb the photon that some LED send, and they are changed the light that (down-convert) is visible wavelength downwards, thus produce the double-colored light source with blue and yellow wavelengths light.If the gold-tinted produced and blue light have correct ratio, so human eye can experience white light.
In the prior art, the packaging technology of LED generally comprises the steps such as die bond, bonding wire, gluing, baking, wherein fluorescent material is blended in silica gel by glue application step usually according to a certain percentage, with crossing spot gluing equipment, the mixture of fluorescent material and glue is coated in LED wafer, but, the problem of fluorescent material sedimentation is easily there is in Large stone fluorescent material in a glue process, make the skewness of fluorescent material in colloid, causing the white light LEDs encapsulated out to occur misalignment thus, is exactly usually said Huang circle phenomenon.In other technical scheme, gluing also can by the very uniform phosphor powder layer of guarantor's type paint-on technique LED wafer surface-coated, but, because the luminous intensity of blue LED wafers itself has the feature of non-equivalence for the coating of guarantor's type in the distribution in space, the blue light that intensity level is larger is short by the distance of fringe region phosphor powder layer by the distance ratio of central area phosphor powder layer, cause that central area color temperature value is high thus and fringe region color temperature value is low, there will be the problem of misalignment equally.And phosphor substance major part concentrates on bottom rack groove and LED chip annex, being heated for a long time there will be brightness decay, affects the LED life-span.
As shown in Figure 1, Conventional white LED is arranged in the bowl cup of the first support 12 by the first LED chip 11, be connected with support pin realizing circuit by the first gold thread 13, then packing colloid 14 on chip surface covers, packing colloid, generally by exciting yellow wavelengths fluorescent material and packaging plastic to mix, adding sometimes and exciting orange red or green wavelength fluorescent material.After fluorescent material absorption portion blue light, discharge the gold-tinted that wavelength is longer, then unabsorbed blue light becomes white light with yellow light mix.In prior art, white light LEDs mixed light is even not, and brightness is also lower, and phosphor substance major part concentrates on bottom rack groove and LED chip annex, is heated for a long time and there will be brightness decay, affect the LED life-span.
Summary of the invention
For deficiency of the prior art, the technical problem to be solved in the present invention there are provided a kind of LED encapsulation structure and method for packing thereof, and LED encapsulation structure of the present invention can solve the yellow circle problem of LED white light, with the problem solving the decay of LED white brightness.
For solving the problems of the technologies described above, the present invention is realized by following scheme: a kind of LED encapsulation structure, this LED encapsulation structure comprises support, support is square, described support bowl cup center is provided with LED chip, the electrode of LED chip is connected by gold thread with the both positive and negative polarity of support, the cup and bowl wall of support is provided with step, four angles of this step are respectively provided with a hole for injecting glue, each hole for injecting glue is communicated to bottom bowl cup, mounting glass sheet on step, the one side of described sheet glass is coated with fluorescent material, and sheet glass scribbles one of fluorescent material and faces down.
Further, described hole for injecting glue top, the hole for injecting glue diameter namely on step plane is greater than the hole for injecting glue diameter under step plane, and the hole for injecting glue on top is provided with breach, and this breach is communicated with step.
Further, described step is square step, and it is highly greater than the thickness of sheet glass.
A method for packing for LED encapsulation structure, this method for packing comprises the following steps:
1), bottom the bowl cup of support, carry out die bond bonding wire, be arranged on support bowl cup bottom centre position by LED chip, then the electrode of LED chip is connected by gold thread with the both positive and negative polarity of support;
2), the one side of sheet glass coats fluorescent material;
3), sheet glass is arranged on step place on support bowl cup, has one of fluorescent material to face down;
4), by hole for injecting glue note silicone fluid, the cavity of support bowl cup inside is filled full;
5), to support the rim of a bowl edge carry out flanging, sheet glass is fixed;
6), after silicone fluid solidification, encapsulation is completed.
Relative to prior art, the invention has the beneficial effects as follows: LED encapsulation structure of the present invention and method for packing not only solve the yellow circle problem of LED white light, also solve the problem of LED white brightness decay simultaneously, by hole for injecting glue, packaging silicon rubber is injected in support bowl cup, easy to operate, on the first coated glass sheet of fluorescent material, after installing sheet glass, carry out injecting glue again, fluorescent material would not concentrate near LED chip or bottom support bowl cup, therefore, avoid LED chip and be heated for a long time and there will be brightness decay, improve the LED life-span from another point of view.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is LED encapsulation structure schematic diagram in prior art.
Fig. 2 is supporting structure schematic diagram of the present invention.
Fig. 3 is supporting structure cutaway view of the present invention.
Fig. 4 is LED step 1 schematic diagram of the present invention.
Fig. 5 is LED step 2 of the present invention, step 3 schematic diagram.
Fig. 6 is that LED step 4 of the present invention illustrates that I schemes.
Fig. 7 is that LED step 4 of the present invention illustrates II figure.
Fig. 8 is LED step 5 schematic diagram of the present invention.
Mark in accompanying drawing: the first LED chip 11, first support 12, first gold thread 13, packing colloid 14, support 1-1, step 1-2, hole for injecting glue 1-3, gold thread 2-2, LED chip 2-3, sheet glass 2-4.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Please refer to accompanying drawing 2 ~ 3, a kind of LED encapsulation structure of the present invention, this LED encapsulation structure comprises support 1-1, support 1-1 is square, described support 1-1 bowl cup center is provided with LED chip 2-3, the electrode of LED chip 2-3 is connected by gold thread 2-2 with the both positive and negative polarity of support 1-1, the cup and bowl wall of support 1-1 is provided with step 1-2, four angles of this step 1-2 are respectively provided with a hole for injecting glue 1-3, each hole for injecting glue 1-3 is communicated to bottom bowl cup, mounting glass sheet 2-4 on step 1-2, the one side of described sheet glass 2-4 is coated with fluorescent material, sheet glass 2-4 scribbles one of fluorescent material and faces down.Described hole for injecting glue 1-3 top, the hole for injecting glue diameter namely on step 1-2 plane is greater than the hole for injecting glue diameter under step 1-2 plane, and the hole for injecting glue on top is provided with breach, and this breach is communicated with step 1-2.Stating step 1-2 is square step, and it is highly greater than the thickness of sheet glass 2-4, and this thickness is at least wanted can placing glass sheet 2-4.
Embodiment 1:
The method for packing of LED encapsulation structure of the present invention, this method for packing comprises the following steps:
Step 1, as shown in Figure 4, bottom the bowl cup of support 1-1, carry out die bond bonding wire, be arranged on support bowl cup bottom centre position by LED chip 2-3, then the electrode of LED chip 2-3 is connected by gold thread 2-2 with the both positive and negative polarity of support;
Step 2, as shown in Figure 5, the one side of sheet glass 2-4 coats fluorescent material;
Step 3, as shown in Figure 5, sheet glass 2-4 is arranged on the step 2-3 place on support 1-1 bowl cup, has one of fluorescent material to face down;
Step 4, as shown in Figure 6,7, notes silicone fluid by hole for injecting glue 1-3, the cavity of support 1-1 bowl cup inside is filled full;
Step 5, as shown in Figure 8, flanging is carried out to support 1-1 the rim of a bowl edge, sheet glass 2-4 is fixed;
Step 6, until silicone fluid solidification after, complete encapsulation.
LED encapsulation structure of the present invention and method for packing not only solve the yellow circle problem of LED white light, also solve the problem of LED white brightness decay simultaneously, by hole for injecting glue, packaging silicon rubber is injected in support bowl cup, easy to operate, on the first coated glass sheet of fluorescent material, after installing sheet glass, carry out injecting glue again, fluorescent material would not concentrate near LED chip or bottom support bowl cup, therefore, avoid LED chip to be heated for a long time and to there will be brightness decay, improve the LED life-span from another point of view.
The foregoing is only the preferred embodiment of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a LED encapsulation structure, this LED encapsulation structure comprises support (1-1), support (1-1) is square, described support (1-1) bowl cup center is provided with LED chip (2-3), the electrode of LED chip (2-3) is connected by gold thread (2-2) with the both positive and negative polarity of support (1-1), it is characterized in that: on the cup and bowl wall of support (1-1), be provided with step (1-2), four angles of this step (1-2) are respectively provided with a hole for injecting glue (1-3), each hole for injecting glue (1-3) is communicated to bottom bowl cup, at the upper mounting glass sheet (2-4) of step (1-2), the one side of described sheet glass (2-4) is coated with fluorescent material, sheet glass (2-4) scribbles one of fluorescent material and faces down.
2. a kind of LED encapsulation structure according to claim 1, it is characterized in that: described hole for injecting glue (1-3) top, namely the hole for injecting glue diameter on step (1-2) plane is greater than the hole for injecting glue diameter under step (1-2) plane, the hole for injecting glue on top is provided with breach, and this breach is communicated with step (1-2).
3. a kind of LED encapsulation structure according to claim 1, is characterized in that: described step (1-2) is square step, and it is highly greater than the thickness of sheet glass (2-4).
4. a method for packing for LED encapsulation structure, is characterized in that, this method for packing comprises the following steps:
1), bottom the bowl cup of support (1-1), carry out die bond bonding wire, be arranged on support bowl cup bottom centre position by LED chip (2-3), then the electrode of LED chip (2-3) is connected by gold thread (2-2) with the both positive and negative polarity of support;
2), the one side of sheet glass (2-4) coats fluorescent material;
3), sheet glass (2-4) is arranged on step (2-3) place on support (1-1) bowl cup, has one of fluorescent material to face down;
4), by hole for injecting glue (1-3) note silicone fluid, the cavity of support (1-1) bowl cup inside is filled full;
5), to support (1-1) the rim of a bowl edge carry out flanging, sheet glass (2-4) is fixed;
6), after silicone fluid solidification, encapsulation is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510839817.2A CN105336835A (en) | 2015-11-27 | 2015-11-27 | LED packaging structure and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510839817.2A CN105336835A (en) | 2015-11-27 | 2015-11-27 | LED packaging structure and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105336835A true CN105336835A (en) | 2016-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510839817.2A Pending CN105336835A (en) | 2015-11-27 | 2015-11-27 | LED packaging structure and packaging method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN105336835A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810795A (en) * | 2016-04-14 | 2016-07-27 | 宏齐光电子(深圳)有限公司 | Packaging structure for chip-scale packaged LED |
| CN107611118A (en) * | 2017-08-10 | 2018-01-19 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214770A (en) * | 2010-04-09 | 2011-10-12 | 海洋王照明科技股份有限公司 | Light-emitting diode (LED) planar light source support and light-emitting diode (LED) planar light source with same |
| CN102891235A (en) * | 2011-07-20 | 2013-01-23 | 山东华光光电子有限公司 | High-output low-attenuation white light LED (light emitting diode) and manufacturing method thereof |
| CN205159358U (en) * | 2015-11-27 | 2016-04-13 | 宏齐光电子(深圳)有限公司 | LED packaging structure |
-
2015
- 2015-11-27 CN CN201510839817.2A patent/CN105336835A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214770A (en) * | 2010-04-09 | 2011-10-12 | 海洋王照明科技股份有限公司 | Light-emitting diode (LED) planar light source support and light-emitting diode (LED) planar light source with same |
| CN102891235A (en) * | 2011-07-20 | 2013-01-23 | 山东华光光电子有限公司 | High-output low-attenuation white light LED (light emitting diode) and manufacturing method thereof |
| CN205159358U (en) * | 2015-11-27 | 2016-04-13 | 宏齐光电子(深圳)有限公司 | LED packaging structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810795A (en) * | 2016-04-14 | 2016-07-27 | 宏齐光电子(深圳)有限公司 | Packaging structure for chip-scale packaged LED |
| CN107611118A (en) * | 2017-08-10 | 2018-01-19 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method thereof |
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