CN107275320A - High-temperature-resistant LED light source - Google Patents
High-temperature-resistant LED light source Download PDFInfo
- Publication number
- CN107275320A CN107275320A CN201710694126.7A CN201710694126A CN107275320A CN 107275320 A CN107275320 A CN 107275320A CN 201710694126 A CN201710694126 A CN 201710694126A CN 107275320 A CN107275320 A CN 107275320A
- Authority
- CN
- China
- Prior art keywords
- chip
- light source
- support
- high temperature
- silver paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims abstract description 17
- 239000004332 silver Substances 0.000 claims abstract description 17
- 239000000565 sealant Substances 0.000 claims abstract description 11
- 239000012530 fluid Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 241000218202 Coptis Species 0.000 claims description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 7
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract 8
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Radiation-Therapy Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a high-temperature-resistant LED light source, which comprises silver paste lines and wafers, wherein the silver paste lines are fixed on a bracket through high temperature, the wafers are fixed on the bracket surface of the silver paste lines, the wafers are connected with each other through gold wires, the front surface of the bracket is sealed through front adhesive at high temperature, the back surface of the bracket is sealed through back adhesive at high temperature, the wafers are arranged into a plurality of groups, the wafers between adjacent groups are alternately arranged, the wafers in each group are arranged at equal intervals, the silver paste lines are composed of connecting circuit sheets and circuit strips, the connecting circuit sheets are arranged at the end parts of the bracket, one ends of the connecting circuit sheets, far away from the bracket, are connected with the circuit strips, the connecting gold wires between the wafers and the wafers are connected in oblique lines, one end of the bracket extends out a sealant, the other end of the bracket is flush with the sealant, one, the other side is fixed by sealant. The high-temperature-resistant LED light source is small in power, high in brightness and capable of emitting light at 360 degrees.
Description
Technical field
The invention belongs to LED/light source technical field, and in particular to a kind of high temperature resistant LED/light source.
Background technology
Under the elevated once again background of worry of Present Global energy shortage, save the energy be we face in future it is important
Problem, in lighting field, the application of LED luminous products is just attract the sight of common people, and LED is used as a kind of new green light source
The trend of product, necessarily future development, novel illumination light source epoch of the 21st century by entrance using LED as representative.LED ball
Bubble light fixture is compared with incandescent lamp, and its maximum motive force of development is exactly the advantage of energy-conserving and environment-protective.The fast development of preceding LED industry,
Through causing part LED illumination product price to be less than incandescent lamp or equivalent level so that ordinary people man can receive, and
Brightness is also superior to incandescent lamp bulb.Such as：Plastic ball, paster car aluminium, Down lamp etc..Develop with the continuation of industry, the leap of technology
Break through, application is widelyd popularize, LED light efficiency is also being improved constantly, and price constantly drops.The appearance of new combined type tube core,
Also the power of single led pipe (module) is allowed to improve constantly.Current LED/light source is unstable in the presence of lighting, and heat dispersion is not good etc.
Problem.
The content of the invention
It is an object of the invention to provide a kind of high temperature resistant LED/light source, to solve the problems mentioned in the above background technology.
To achieve the above object, the present invention provides following technical scheme：A kind of high temperature resistant LED/light source, including silver paste circuit
And chip, silver paste circuit is fixed on support by high temperature, and the chip is fixed on the stent cover of silver paste circuit, described
Connected between chip and chip by gold thread, the front of the support is by front glue elevated-temperature seal, and the reverse side of support passes through anti-
Face glue elevated-temperature seal.
It is preferred that, the chip is set to some groups, and the chip between adjacent sets is in being arranged alternately, and the chip in every group is in
It is placed equidistant.
It is preferred that, silver paste circuit is made up of connection line piece with circuit bar, and the connection line piece is arranged on support
End, the one end of the connection line piece away from support is connected with circuit bar.
It is preferred that, the connection gold thread between the chip and chip is connected in oblique line.
It is preferred that, fluid sealant is stretched out in one end of the support, and the other end is flush with fluid sealant.
It is preferred that, the one side of the chip is fixed on support, and another side is fixed by fluid sealant.
It is preferred that, the support is the support that sapphire is made.
The technique effect and advantage of the present invention：The high temperature resistant LED/light source, power is small, and brightness is high, and 360 degree light；Electric light turns
Change efficiency high（Close to 60%）, environmental protection, long lifespan（Up to 100,000 hours）, operating power wattage is low, switch the lossless longevity repeatedly
Life, small volume, heating are less, brightness is high, sturdy and durable, be easy to light modulation, color is various, light beam concentrates stabilization, it is no-delay to start.
Brief description of the drawings
Fig. 1 is profile of the invention；
Fig. 2 is structural representation of the invention.
In figure：1 support, 2 chips, 3 gold threads, 4 silver paste circuits, 5 front glue, 6 reverse side glue.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
It is described the invention provides a kind of high temperature resistant LED/light source as shown in Figure 1-2, including silver paste circuit 4 and chip 2
Silver paste circuit 4 is fixed on support 1 by high temperature, and the chip 2 is fixed on the stent cover of silver paste circuit 4, the chip 2 with
Connected between chip 2 by gold thread 3, the front of the support 1 is by the elevated-temperature seal of front glue 5, and the reverse side of support 1 passes through reverse side
The elevated-temperature seal of glue 6.
The chip 2 is set to some groups, and the chip 2 between adjacent sets is in being arranged alternately, and the chip 2 in every group is in equidistant
Set, silver paste circuit 4 is made up of connection line piece with circuit bar, and the connection line piece is arranged on the end of support 1, institute
State the one end of connection line piece away from support 1 to be connected with circuit bar, the connection gold thread 3 between the chip 2 and chip 2 is in oblique line
Fluid sealant is stretched out in connection, one end of the support 1, and the other end is flush with fluid sealant, and the one side of the chip 2 is fixed on support
On 1, another side is fixed by fluid sealant, and the support 1 is the support that sapphire is made, it is not easy to scratching, and hardness is high, light transmittance
Height, good heat conductivity.
A kind of high temperature resistant LED/light source that the present invention is provided, power is small, and brightness is high, and 360 degree light；Electric light transformation efficiency is high
（Close to 60%）, environmental protection, long lifespan（Up to 100,000 hours）, operating power wattage is low, switch lossless life-span, volume repeatedly
Small, heating is less, brightness is high, sturdy and durable, be easy to light modulation, color is various, light beam concentrates stabilization, it is no-delay to start.
Finally it should be noted that：The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic,
Within the spirit and principles of the invention, any modification, equivalent substitution and improvements made etc., should be included in the present invention's
Within protection domain.
Claims (7)
1. a kind of high temperature resistant LED/light source, including silver paste circuit（4）And chip（2）, it is characterised in that：Silver paste circuit（4）It is logical
Cross high temperature and be fixed on support（1）On, the chip（2）It is fixed on silver paste circuit（4）Stent cover on, the chip（2）With crystalline substance
Piece（2）Between pass through gold thread（3）Connection, the support（1）Front pass through front glue（5）Elevated-temperature seal, support（1）Reverse side
Pass through reverse side glue（6）Elevated-temperature seal.
2. a kind of high temperature resistant LED/light source according to claim 1, it is characterised in that：The chip（2）It is set to some
Chip between group, adjacent sets（2）In being arranged alternately, the chip in every group（2）In being placed equidistant.
3. a kind of high temperature resistant LED/light source according to claim 1, it is characterised in that：Silver paste circuit（4）By connecting line
Road piece is constituted with circuit bar, and the connection line piece is arranged on support（1）End, the connection line piece is away from support（1）
One end be connected with circuit bar.
4. a kind of high temperature resistant LED/light source according to claim 1, it is characterised in that：The chip（2）With chip（2）It
Between connection gold thread（3）Connected in oblique line.
5. a kind of high temperature resistant LED/light source according to claim 1, it is characterised in that：The support（1）One end stretch out it is close
Sealing, the other end is flush with fluid sealant.
6. a kind of high temperature resistant LED/light source according to claim 1, it is characterised in that：The chip（2）One side be fixed on
Support（1）On, another side is fixed by fluid sealant.
7. a kind of high temperature resistant LED/light source according to claim 1, it is characterised in that：The support（1）It is made up of sapphire
Support.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710694126.7A CN107275320A (en) | 2017-08-15 | 2017-08-15 | High-temperature-resistant LED light source |
| PCT/CN2017/108168 WO2019033561A1 (en) | 2017-08-15 | 2017-10-28 | High temperature resistant led light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710694126.7A CN107275320A (en) | 2017-08-15 | 2017-08-15 | High-temperature-resistant LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107275320A true CN107275320A (en) | 2017-10-20 |
Family
ID=60080252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710694126.7A Pending CN107275320A (en) | 2017-08-15 | 2017-08-15 | High-temperature-resistant LED light source |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107275320A (en) |
| WO (1) | WO2019033561A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019033561A1 (en) * | 2017-08-15 | 2019-02-21 | 陈广明 | High temperature resistant led light source |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103123950A (en) * | 2013-02-06 | 2013-05-29 | 深圳市蓝科电子有限公司 | LED light source packaging structure and packaging method |
| CN103872034A (en) * | 2014-03-21 | 2014-06-18 | 长春希达电子技术有限公司 | Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source |
| CN205140981U (en) * | 2015-10-31 | 2016-04-06 | 嘉兴市上村电子有限公司 | Sapphire base plate LED filament |
| CN205335288U (en) * | 2016-01-12 | 2016-06-22 | 江西联创光电科技股份有限公司 | No tin cream flip -chip LED filament |
| CN205606201U (en) * | 2016-01-28 | 2016-09-28 | 李安格 | Novel LED filament |
| CN207217529U (en) * | 2017-08-15 | 2018-04-10 | 陈广明 | high temperature resistant L ED light source |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015126021A (en) * | 2013-12-25 | 2015-07-06 | 日亜化学工業株式会社 | Light emitting device and lighting system |
| CN107275320A (en) * | 2017-08-15 | 2017-10-20 | 陈广明 | High-temperature-resistant LED light source |
-
2017
- 2017-08-15 CN CN201710694126.7A patent/CN107275320A/en active Pending
- 2017-10-28 WO PCT/CN2017/108168 patent/WO2019033561A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103123950A (en) * | 2013-02-06 | 2013-05-29 | 深圳市蓝科电子有限公司 | LED light source packaging structure and packaging method |
| CN103872034A (en) * | 2014-03-21 | 2014-06-18 | 长春希达电子技术有限公司 | Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source |
| CN205140981U (en) * | 2015-10-31 | 2016-04-06 | 嘉兴市上村电子有限公司 | Sapphire base plate LED filament |
| CN205335288U (en) * | 2016-01-12 | 2016-06-22 | 江西联创光电科技股份有限公司 | No tin cream flip -chip LED filament |
| CN205606201U (en) * | 2016-01-28 | 2016-09-28 | 李安格 | Novel LED filament |
| CN207217529U (en) * | 2017-08-15 | 2018-04-10 | 陈广明 | high temperature resistant L ED light source |
Non-Patent Citations (1)
| Title |
|---|
| 周志敏 编著: "《汽车LED照明驱动电路设计实例》", 31 January 2012 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019033561A1 (en) * | 2017-08-15 | 2019-02-21 | 陈广明 | High temperature resistant led light source |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019033561A1 (en) | 2019-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171020 |
|
| RJ01 | Rejection of invention patent application after publication |