CN205335288U - No tin cream flip -chip LED filament - Google Patents
No tin cream flip -chip LED filament Download PDFInfo
- Publication number
- CN205335288U CN205335288U CN201620024545.0U CN201620024545U CN205335288U CN 205335288 U CN205335288 U CN 205335288U CN 201620024545 U CN201620024545 U CN 201620024545U CN 205335288 U CN205335288 U CN 205335288U
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- chip
- flip
- supporting frame
- shaped supporting
- bar
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- Expired - Fee Related
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Abstract
The utility model provides a no tin cream flip -chip LED filament, includes bar -shaped supporting frame, chip, its characterized in that, and bar -shaped supporting frame is transparent support, and the printing has a silver -plated printed circuit on it, and bar -shaped supporting frame's both ends are equipped with electrode pin, and the chip passes through gold -tin alloy electrode welded on silver -plated printed circuit, and the outer parcel of bar -shaped supporting frame has phosphor powder silica gel compound body. The utility model discloses a no tin cream flip -chip LED filament, adopt transparent support if: pottery, sapphire, glass etc. Have reduced luminous loss, have increased luminous efficacy, and face down chip's gold -tin alloy electrode beading has improved effect of thermal conductivity on the printed circuit of transparent support, increased the life -span of LED light source, externally wraps up phosphor powder silica gel compound body, make the luminous effect of filament more be close traditional bulb.
Description
Technical field
This utility model relates to flip LED filament, particularly to a kind of filament of flip LED without tin cream for manufacturing high efficiency of light extraction, high-termal conductivity LED filament lamp。
Background technology
LED light source has the features such as luminous efficiency height, energy-saving and environmental protection, life-span length, is referred to as " green illumination light source "。Flip LED has the advantageous characteristic such as high efficiency of light extraction, low thermal resistance, high reliability, and meanwhile, LED filament light fixture drives for 360 ° of angle luminescences, integrated high voltage, meets the advantages such as traditional illumination use habit。Therefore flip LED filament lamp becomes an important application direction of lighting technical field。
Flip LED filament product in the market, flip chip electrode and filament support electrode are welded by commonly used die bond solder paste, this technology major defect has: first, the heat conductivity of die bond solder paste is bad, the heat produced during chip operation is made quickly to conduct timely, will result in the performance of LED light source to decline with the life-span, and then affect the popularization and application of LED light source；Second, the consumption of die bond solder paste cannot be accurately controlled very much, will increase die bond bonding area, and then make some light cannot penetrate tin cream weld layer after causing die bond solder paste to be melted, and what affect filament support back goes out light intensity。
Summary of the invention
The purpose of this utility model be just to provide a kind of luminous loss less, heat conductivity is strong, the filament of flip LED without tin cream of long service life。
The filament of flip LED without tin cream of the present utility model, including bar shaped support, chip, it is characterized in that, bar shaped support is transparent rack, it is printed with silver print circuit, the two ends of bar shaped support are provided with electrode pin, and chip is by gold-tin alloy electrode welding on silver print circuit, and bar shaped support is wrapped with fluorescent powder silica gel mixture。
The filament of flip LED without tin cream of the present utility model, adopt transparent rack such as pottery, sapphire, glass etc., decrease luminous loss, add luminous efficiency, the gold-tin alloy electrode of flip-chip is directly welded on the printed circuit of transparent rack, improves heat-conducting effect, adds the life-span of LED light source, at outer wrap fluorescent powder silica gel mixture, make filament light-emitting effect closer to conventional bulb。
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is close-up schematic view in Fig. 1。
Detailed description of the invention
A kind of without tin cream flip LED filament, including bar shaped support 5, chip 2, it is characterized in that, bar shaped support 5 is transparent rack, it is printed with silver print circuit 6, the two ends of bar shaped support 5 are provided with electrode pin 1, and chip 2 is welded on silver print circuit 6 by gold-tin alloy electrode 4, and bar shaped support 5 is wrapped with fluorescent powder silica gel mixture 3。
As it is shown in figure 1, flip LED chips 2 in a word row or other forms be arranged on bar shaped support 5, the plurality of flip-chip 2 is to be connected in series or be connected in parallel。On bar shaped support on positive and negative silver print circuit 6 respectively on appropriate scaling powder, the positive and negative electrode of chip 2 is respectively aligned to positive and negative conducting end, the gold-tin alloy electrode 4 being made chip positive and negative electrode by scaling powder and reflow soldering process melts resolidification, thus the connection realized between the positive and negative electrode of chip positive and negative electrode and support silver print circuit。
Claims (1)
1. one kind without tin cream flip LED filament, including bar shaped support (5), chip (2), it is characterized in that: bar shaped support (5) is transparent rack, it is printed with silver print circuit (6), the two ends of bar shaped support (5) are provided with electrode pin (1), chip (2) is welded on silver print circuit (6) by gold-tin alloy electrode (4), and bar shaped support (5) is wrapped with fluorescent powder silica gel mixture (3)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620024545.0U CN205335288U (en) | 2016-01-12 | 2016-01-12 | No tin cream flip -chip LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620024545.0U CN205335288U (en) | 2016-01-12 | 2016-01-12 | No tin cream flip -chip LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205335288U true CN205335288U (en) | 2016-06-22 |
Family
ID=56210858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620024545.0U Expired - Fee Related CN205335288U (en) | 2016-01-12 | 2016-01-12 | No tin cream flip -chip LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205335288U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275320A (en) * | 2017-08-15 | 2017-10-20 | 陈广明 | High-temperature-resistant LED light source |
| CN108269901A (en) * | 2018-01-16 | 2018-07-10 | 深圳市晨日科技股份有限公司 | It is a kind of for LED upside-down mounting linear light sources of fluorescent tube and preparation method thereof |
-
2016
- 2016-01-12 CN CN201620024545.0U patent/CN205335288U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107275320A (en) * | 2017-08-15 | 2017-10-20 | 陈广明 | High-temperature-resistant LED light source |
| WO2019033561A1 (en) * | 2017-08-15 | 2019-02-21 | 陈广明 | High temperature resistant led light source |
| CN108269901A (en) * | 2018-01-16 | 2018-07-10 | 深圳市晨日科技股份有限公司 | It is a kind of for LED upside-down mounting linear light sources of fluorescent tube and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160622 Termination date: 20210112 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |