CN102032483B - Light-emitting diode (LED) plane light source - Google Patents
Light-emitting diode (LED) plane light source Download PDFInfo
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- CN102032483B CN102032483B CN2010102929461A CN201010292946A CN102032483B CN 102032483 B CN102032483 B CN 102032483B CN 2010102929461 A CN2010102929461 A CN 2010102929461A CN 201010292946 A CN201010292946 A CN 201010292946A CN 102032483 B CN102032483 B CN 102032483B
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
The invention relates to a light-emitting diode (LED) plane light source, which is characterized in that a bearing body of light-emitters (chips) is the mirror surface of a hot good conductor mirror plate and is the light extraction side of the chips; the chips are stuck to a transparent thermally conductive insulating paste thin film coating at the mirror side of the hot good conductor mirror plate by electrically conductive silver paste; and the chips are connected with each other by directly connecting positive and negative leads with pads on the LED chips. Due to the reflecting function of the mirror of the hot good conductor mirror plate, the light extraction efficiency of the light extraction ends of the LED chips and the illuminance of the light emitting end are greatly improved. PECC treatment is carried out on the surface of the non-light extraction end of the hot good conductor mirror plate, thus further improving the heat dissipation conditions of the LED plane light source. The procedures causing environmental pollution such as etching are eliminated after removing the metal core printed circuit board (MCPCB). The chips are directly connected in series by leads, thus greatly improving the processing efficiency while saving the materials. The optical system and the heat dissipating system of the whole LED plane light source system are established on a more perfect platform while the cost is lowered.
Description
Technical field:
The present invention relates to the light source that uses in a kind of electric lighting, especially a kind ofly make illuminator with LED, first be connected into after the illuminator group in parallelly again between each illuminator (chip), and the supporting body of illuminator (chip) is that the specular surface of the good conductor minute surface sheet material of heat is the LED area source of chip light-emitting side.
Technical background:
As a kind of light source of electric lighting, traditional to make the method for illuminating source a kind of with LED chip be to adopt to separate LED lamp pearl and carry out color-division, then be connected into and in parallelly after the illuminator group be integrated into that module realizes.Another kind is to adopt after first chip being attached to the MCPCB plate after the making sheet etching on MCPCB (metal inner core PCB) plate of copper clad plate completing circuit processing and applying chip installation position on copper wire, again the electrode of chip and the deposited copper film patchboard on the etched circuit on the MCPCB plate are connected into the illuminator group, then are parallel on the major loop line that the deposited copper film on etched circuit makes and realize (namely adopting wafer directly-mounting type structure on the COB plate).Front a kind of mode solved preferably the aberration problem in the lighting source, but its light source light-emitting efficiency is also higher, but its manufacturing process automaticity is not high, and the labour consumes greatly, realizes comparatively difficulty of whole process automation.Rear a kind of mode is with regard to existing chip, after optical lens is processed for the second time, can satisfy the requirement of the especially commercial lighting of throwing light on, easily realize automated job, but in this mode, the heat radiation of LED chip is bad, and because MCPCB production itself need to be carried out outside the special processing such as gluing, calendering, also need the MCPCB plate is carried out special circuit processing such as taking a picture, making sheet, the chemical treatment of etching and plating one class, therefore form process farm labourer order many, and to the larger pollution of environment, therefore above-mentioned two kinds of form of light source all exist defective.
For this reason at Chinese invention patent application CN1873292, in a kind of LED luminescence unit is disclosed, this LED luminescence unit is coated with fluorescent material outward with the transparent single led chip of Epoxy Resin envelope, consists of luminescence unit.A plurality of luminescence units are in parallel and admittedly be enclosed in transparent epoxy resin on the conduction reflective surface of refractive body through wire.The positive pole of LED chip is connected through the negative pole of wire with the output of LED chip drive circuit with conduction reflective surface welding, the negative pole of LED chip, and the positive pole of LED chip drive circuit output is connected with the conduction reflective surface of refractive body through another wire, consists of super brightness line lamp.The good heat dispersion performance of this light source, but utilize refractive body conduction easily to cause short circuit and other hidden danger, and refractive body is exposed to and also easily produces oxidation in air and reduce reflecting effect.
Disclose a kind of method for packing of white light LED area lighting source module in Chinese invention patent application CN101137255A, it is comprised of processing steps such as making wiring board, die bond, bonding, the basic glue-line of encapsulation.The present invention adopts many particles low-power LED chip disperse to distribute in the circuit board, and overall package forms high-power LED light source together, makes thermal source disperse to distribute, and has reduced the caloric value on the unit are, and the radiating requirements standard is reduced.Wherein proposed with the technical scheme of copper-clad plate as wiring board, this scheme can increase by covering the copper layer radiating effect of wiring board, but due to the easily oxidizable of copper, PCB surface still need be done anti-oxidation processing, and whole wiring board still needs to cover copper on substrate, and it is made flow process and does not simplify.
Summary of the invention:
Purpose of the present invention: structure and processing method to existing LED area source are improved, provide a kind of structure simpler, manufacturing procedure is shorter, makes the LED area source under the prerequisite that quality improves, cost is lower, makes process more LED area source version and the processing method of environmental protection.
LED area source of the present invention, good conductor minute surface sheet material with heat, also have at least one pair of and the seal wire power supply outer electrode that insulate mutually of good conductor minute surface sheet material of heat on the good conductor minute surface sheet material of heat, every pair of seal wire power supply outer electrode comprises that a seal wire power supply draws positive electrode outward and a seal wire power supply draws negative electrode outward, be coated with the bright thermal conductive insulation glue of one deck on the mirrored sides of the good conductor minute surface sheet material of heat, LED chip is bonded on transparent thermal conductive insulation glue, each LED chip all has LED chip negative terminal pad and LED chip positive terminal pad, LED chip is connected in series between a pair of seal wire power supply outer electrode, wherein connect wire by chip between each LED chip negative terminal pad and LED chip positive terminal pad and connect the series connection that realizes LED chip, be coated with mixed fluorescent powder colloid coating on the good conductor minute surface sheet material of heat and LED chip, the colloid lens.
The preferred technical solution of the present invention is as follows:
Chip is pasted on transparent thermal conductive insulation glue film coating by conductive silver glue.
It is aluminum steel that chip connects wire, and aluminum steel is welded on LED chip positive terminal pad and LED chip negative terminal pad by cold welding.
The good conductor minute surface sheet material of heat is preferably specular aluminium sheet material.
Seal wire the first power supply outer electrode, seal wire second source outer electrode is the guide wire of the outer electrode butt welding of big section copper or copper alloy post and small bore copper or copper alloy wire, is convenient to outer electrode and is connected with major loop line conduction in parallel and big section copper or copper alloy post and the welding of chip lead-out wire.
In the present invention, can carry out corresponding also joint group plate for different Switching Power Supply input voltages and constant current parameter, use many to the power supply outer electrode, for example: being connected in parallel between seal wire the first power supply outer electrode and seal wire second source outer electrode welded with main shunt circuit line by outer electrode and is communicated with to realize.When adopting higher civil power directly as input voltage, seal wire electrode the first power supply outer electrode and seal wire second source outer electrode directly and the current-limiting circuit output on the external circuit major loop join, when this form is applicable to need to decorate as the building profile, the long occasion of continued access length, can greatly save and install and manufacturing expense.When external circuits adopts buffer circuit and have the low pressure access to require, for the surface of many mirrored sides with series connection illuminator group through the good conductor minute surface sheet material light source of the heat of transparent thermal conductive insulation glue thin film coated by seal wire the first power supply outer electrode with seal wire second source outer electrode is parallel joins and join with constant voltage constant current power after major loop is in parallel again, this form is applicable to the use occasion of low-voltage safety requirement, such as the fluorescent tube that the low pressure input requirements is arranged, lighting ball bubble etc.
Beneficial effect of the present invention is: the surface of applying chip is the good conductor minute surface sheet material reflective surface of the heat of surperficial transparent thermal conductive insulation glue film coating, and purpose is that the light that the light that chip sends projects with the opposing direction of bright dipping end is reflected specular into the illuminance that the bright dipping end strengthens light extraction efficiency and light ejecting end.
on the good conductor minute surface sheet material of employing heat, wafer directly-mounting type structure makes its working (machining) efficiency higher, easily be automated, employing applies transparent thermal conductive insulation glue film coating on the surface of the good conductor minute surface sheet material mirrored sides of heat, cancelled in the LED area source MCPCB as illuminator (chip) carrier, cancel on the MCPCB wiring board manufacturing procedures such as making sheet etching plating, simultaneously because wire bonds is directly used in chip chamber electrode series connection employing, make pad reduce 50%, thereby greatly improved working (machining) efficiency, due to the employing through the good conductor minute surface sheet material of the heat of transparent thermal conductive insulation glue film coating of the surface of mirrored sides, make the connection wire in process isolate and guarantee that reflective surface is not scratched with the good conductor minute surface sheet material insulation of heat, because transparent thermal conductive insulation glue film coating can not form larger thermal resistance as thin as a wafer between chip substrate and sheet material, because mirror reflection surface accounts for more than 90% of light source board area, make the exhausted major part of the light that projects on this face be reflected to the bright dipping end, the light extraction efficiency of LED chip bright dipping end and the illuminance of light ejecting end have greatly been improved, adopt the surface through the good conductor minute surface sheet material of the heat of transparent thermal conductive insulation glue film coating and the method that chip is pasted by conductive silver glue, thermal resistance on the heat dissipation channel of chip is reduced greatly is greatly improved the radiating state of chip PN junction, in order further to improve the radiating condition of LED area source, the non-bright dipping end of the good conductor minute surface sheet material of heat is carried out PECC (anode oxidation process that the discharge of plasma arc light strengthens) thus process the radiating condition that further improves the LED area source, the heat dissipation design of whole LED surface light source system is based upon on a new platform, through experimental verification under the same conditions, LED surface light source system thermal equilibrium temperature after said method is processed descends more than 8 ℃, make the fault probability of occurrence of whole LED surface light source system descend nearly one times.
And due to the covering of transparent thermal conductive insulation glue film coating and mixed fluorescent powder colloid coating, colloid lens, in use can be because of not oxidized and reduce reflectance and electric conductivity after the good conductor minute surface sheet material of heat and LED chip connecting line are capped.
Further, if use specular aluminium sheet material, can obtain better heat dispersion, and because the oxidation resistent susceptibility of aluminium plate is better than the materials such as copper material, uselessly do preservative treatment on the surface, and be difficult for reducing reflectance because of oxidation in process.
Further use aluminum steel can save cost with respect to gold thread as the LED chip connecting line, and adopt aluminum steel to be convenient to adopt the mode of cold welding to weld, the mode of cold welding can be avoided the impact of localized hyperthermia on LED chip and minute surface sheet material in the fusion weld process, avoids the oxidation of LED chip infringement and minute surface sheet material.
Content of the present invention is further described in conjunction with following embodiment.But content of the present invention is not limited only to related content in embodiment.
Description of drawings:
Fig. 1 is the structural representation of LED area source strip cloth sheet
Fig. 2 is the longitudinal profile enlarged drawing of LED area source strip cloth sheet
Fig. 3 is the structure chart of LED area source dot matrix cloth sheet
Fig. 4 is the longitudinal profile enlarged drawing of LED area source dot matrix cloth sheet
The specific embodiment:
Embodiments of the invention 1, as shown in Figure 1, a kind of structure of LED area source strip cloth sheet has: seal wire the first power supply outer electrode 1; The LED chip 2 of strip cloth sheet; The LED chip positive terminal pad 4 of strip cloth sheet; The LED chip negative terminal pad 5 of strip cloth sheet; The chip that the positive terminal pad 4 of series connection different LED chip 2 is connected with negative terminal pad connects wire 3; Seal wire second source outer electrode 6.
As shown in Figure 2, the mixed fluorescent powder colloid coating 7 that applies on the LED chip 2 of the good conductor minute surface sheet material 16 of tabular heat and strip cloth sheet, wherein the good conductor minute surface sheet material 16 of heat can be metallic mirror surface sheet material or the minute surface sheet materials of ceramic material such as minute surface aluminium sheet or copper coin nickel plating; And the colloid lens 8 of mixed fluorescent powder colloid coating 7 strip cloth sheets; The PECC rete 9 of strip cloth sheet; The electrode of strip cloth sheet is introduced insulation sleeve 10; The chip applying heat conduction elargol coating 11 of strip cloth sheet; The transparent thermal conductive insulation glue film coating 12 of strip cloth sheet; The good conductor minute surface sheet material 13 of strip heat; The first parallel conducting wire 14 of strip cloth sheet; The second parallel conducting wire 15 of strip cloth sheet.
Embodiments of the invention 2, as shown in Figure 3, a kind of structure of LED planar light source dot matrix cloth sheet has: the good conductor minute surface sheet material 16 of tabular heat; Seal wire power supply outer electrode 17; The LED chip 18 of dot matrix cloth sheet; The chip of dot matrix cloth sheet connects wire 19; The LED chip positive terminal pad 20 of dot matrix cloth sheet; The LED chip negative terminal pad 21 of dot matrix cloth sheet;
The mixed fluorescent powder colloid coating 22 of dot matrix cloth sheet as shown in Figure 4; The colloid lens 23 of dot matrix cloth sheet; The transparent thermal conductive insulation glue film coating 24 of dot matrix cloth sheet; The PECC rete 25 of dot matrix cloth sheet; The electrode of dot matrix cloth sheet is introduced insulation sleeve 26; The parallel conducting wire 27 of dot matrix cloth sheet; The chip applying heat conduction elargol 28 of dot matrix cloth sheet.
Making of the present invention realizes in the following manner: to the structure of LED planar light source strip cloth sheet, at first the good conductor sheet material punching with minute surface heat becomes the rectangular of given size; After again the non-specular surface side surface of the good conductor minute surface sheet material of punch forming heat being fastened relatively, with the chimeric adhesive tape of rectangular surrounding, periphery is completely sealed, then with its whole immersion in liquid, make whole minute surface aluminium sheet apply transparent thermal conductive insulation glue film coating 12, take out and solidify; The rectangular chimeric adhesive tape of minute surface aluminium sheet is removed again with after relative fastening the in mirrored sides surface, with the chimeric adhesive tape of rectangular surrounding, make periphery be completely sealed the rear PECC rete 9 that non-specular surface is partly carried out PECC (anode oxidation process that the discharge of plasma arc light strengthens) processing formation strip cloth sheet; After carrying out integrated grinding to seal wire the first power supply outer electrode 1 with to the big section copper alloy column solder joint of seal wire second source outer electrode 6 with upper part, chemical nickel plating; Again complete on punch press the minute surface aluminium sheet after processing is carried out the stamping-out moulding after, then the seal wire power supply is introduced good conductor minute surface sheet material series connection seat hole shape that post is pressed into heat the first parallel conducting wire 14 of cloth sheet into strips; It is to introduce insulation sleeve 10 by the electrode of strip cloth sheet to realize with the rectangular insulation of the good conductor minute surface sheet material of heat for the second parallel conducting wire 15 of strip cloth sheet; Again the good conductor minute surface sheet material 13 of the strip heat that makes is put into and implemented a some glue die bond on integrated fixture, the chip 11 applying heat conduction elargol that are about to strip cloth sheet are coated to chip needs the fixed position, implement die bond post-drying fixed chip, then on wire bonder, the chip of LED chip 2 use the strip cloth sheets of strip cloth sheet is connected wire 3 with the LED chip negative terminal pad 5 of the LED4 strip cloth sheet of the strip cloth sheet weld connections of connecting; The illuminator group of again series connection being completed is connected with seal wire the first power supply outer electrode 1 and seal wire second source outer electrode 6 and is welded to connect; Again with its integrated be placed on point gum machine implement, the generation of the colloid lens 8 of the mixed fluorescent powder colloid coating 7 of strip cloth sheet and strip cloth sheet, baking makes the LED area source after colloid is solidified.
Structure to LED area source dot matrix cloth sheet: at first the good conductor minute surface sheet material punching with heat becomes the rectangular of given size; After again the non-specular surface side surface of the good conductor minute surface sheet material of punch forming heat being fastened relatively, with the chimeric adhesive tape of rectangular surrounding, periphery is completely sealed, then with its whole immersion in liquid, make the good conductor minute surface sheet material of whole heat apply transparent thermal conductive insulation glue film coating 24, take out and solidify; The rectangular chimeric adhesive tape of the good conductor minute surface sheet material of heat is removed again with after relative fastening the in mirrored sides surface, with the chimeric adhesive tape of rectangular surrounding, make periphery be completely sealed the rear PECC rete 25 that non-specular surface is partly carried out PECC (anode oxidation process that the discharge of plasma arc light strengthens) processing formation dot matrix cloth sheet; After the big section copper alloy column solder joint of seal wire power supply outer electrode 17 is carried out integrated grinding with upper part, chemical nickel plating; Again complete on punch press the minute surface aluminium sheet after processing is carried out the stamping-out moulding after, the electrode 26 of insert formula cloth sheet is introduced insulation sleeves and seal wire power supply outer electrode 17 is pressed into the parallel conducting wire 27 that minute surface aluminium sheet series connection insulating base hole forms dot matrix cloth sheet again, and it is to introduce insulation sleeves by the electrode 26 of dot matrix cloth sheet to realize with the rectangular insulation of the good conductor minute surface sheet material of heat; The good conductor minute surface sheet material 16 of the tabular heat that will make is again put into and is implemented some glue die bond on integrated fixture.Be about to dot matrix cloth sheet LED chip 18 use dot matrix cloth sheets chip applying heat conduction elargol 28 be coated to chip need fixed positions, implement die bond post-drying fixed chip, then on wire bonder, the chip of LED chip 18 use the dot matrix cloth sheets of dot matrix cloth sheet is connected wire 19 with the LED chip negative terminal pad 21 of the LED chip positive terminal pad 20 of dot matrix cloth sheet and the dot matrix cloth sheet weld connections of connecting; The illuminator group of again its series connection being completed is connected with seal wire power supply outer electrode 17 and is welded to connect; Again with integrated be placed on point gum machine implement, the generation of the colloid lens 23 of the mixed fluorescent powder colloid coating 22 of dot matrix cloth sheet and dot matrix cloth sheet, baking makes the LED area source after colloid is solidified.
Claims (7)
1. LED area source is characterized in that: this LED area source has the good conductor minute surface sheet material of heat, also have at least one pair of and the seal wire power supply outer electrode that insulate mutually of good conductor minute surface sheet material of heat on the good conductor minute surface sheet material of heat, every pair of seal wire power supply outer electrode comprises that a seal wire power supply draws positive electrode outward and a seal wire power supply draws negative electrode outward, be coated with the layer of transparent thermal conductive insulation glue on the mirrored sides of the good conductor minute surface sheet material of heat, LED chip is bonded on transparent thermal conductive insulation glue, each LED chip all has LED chip negative terminal pad and LED chip positive terminal pad, LED chip is connected in series between a pair of seal wire power supply outer electrode, wherein connect wire by chip between each LED chip negative terminal pad and LED chip positive terminal pad and connect the series connection that realizes LED chip, it is aluminum steel that described chip connects wire, aluminum steel is welded on LED chip negative terminal pad and LED chip positive terminal pad by cold welding, be coated with mixed fluorescent powder colloid coating on the good conductor minute surface sheet material of heat and LED chip, the colloid lens.
2. LED area source as claimed in claim 1, it is characterized in that: seal wire power supply outer electrode is the soft lead-in wire of butt welding variable cross-section.
3. LED area source as claimed in claim 1, it is characterized in that: LED chip is bonded on transparent thermal conductive insulation glue by the heat conduction elargol.
4. LED area source as claimed in claim 1, it is characterized in that: the good conductor minute surface sheet material of described heat is specular aluminium sheet material.
5. LED area source as claimed in claim 1 is characterized in that: the back side of the mirrored sides of the good conductor minute surface sheet material of heat is non-bright dipping side, is coated with the PECC rete on non-bright dipping side.
6. LED area source as claimed in claim 1, it is characterized in that: described cold welding is pressure welding.
7. method of making LED area source claimed in claim 1 comprises following steps:
A, at first the good conductor sheet material plate punching with minute surface heat becomes given size and shape;
B, the non-specular surface side surface of the good conductor minute surface sheet material of punch forming heat is fastened relatively after, with the chimeric adhesive tape of sheet material surrounding, periphery is completely sealed, again with its whole immersion in thermal conductive insulation glue liquid, make the good conductor minute surface sheet material of whole heat apply transparent thermal conductive insulation glue film coating, take out and solidify;
C, with the chimeric adhesive tape of the good conductor minute surface sheet material of heat remove again the mirrored sides surface is fastened relatively after, with the chimeric adhesive tape of sheet material surrounding, periphery is completely sealed non-specular surface is partly carried out PECC processes and form the PECC rete afterwards;
D, the big section copper alloy column solder joint of seal wire power supply outer electrode is carried out nickel dam with upper part process, again after the good conductor minute surface sheet material of completing the heat after front operation is processed on punch press carries out the stamping-out moulding, insulation processing is carried out in a hole of connecting, then seal wire power supply outer electrode is pressed into the good conductor minute surface sheet material formation seal wire power supply outer electrode of heat;
The good conductor minute surface sheet material of e, the heat that will make is again put on integrated fixture, implements a some glue die bond;
F, again on wire bonder, independently LED chip positive and negative electrode pad and seal wire power supply outer electrode are connected and are welded to connect with each with chip both positive and negative polarity connecting line to the LED chip positive and negative electrode pad on each chip;
G, again with its on point gum machine with colloid to the chip of the LED chip group of series connection be connected wire and cover fully;
After the LED chip group of h, series connection was parallel on the major loop line, after the glue-line of enforcement phosphor gel was cast in glue-filling slot, baking made the LED area source after colloid is solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102929461A CN102032483B (en) | 2010-09-27 | 2010-09-27 | Light-emitting diode (LED) plane light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102929461A CN102032483B (en) | 2010-09-27 | 2010-09-27 | Light-emitting diode (LED) plane light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102032483A CN102032483A (en) | 2011-04-27 |
| CN102032483B true CN102032483B (en) | 2013-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102929461A Expired - Fee Related CN102032483B (en) | 2010-09-27 | 2010-09-27 | Light-emitting diode (LED) plane light source |
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| CN (1) | CN102032483B (en) |
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| CN103363378A (en) * | 2012-03-28 | 2013-10-23 | 苏州世鼎电子有限公司 | Method for manufacturing LED backlight module by aid of liquid glue |
| CN103115258A (en) * | 2012-12-31 | 2013-05-22 | 安徽问天量子科技股份有限公司 | Area light source with built-in light-emitting diode (LED) protective chips |
| CN103438378A (en) * | 2013-09-12 | 2013-12-11 | 彭雯 | LED (Light-Emitting Diode) lamp tube with large light flux and large light-emitting angle and manufacturing method thereof |
| CN103542298B (en) * | 2013-10-28 | 2016-03-23 | 汇高（广州）电子有限公司 | The LED fluorescent tube encapsulating structure that a kind of production efficiency is high |
| CN105470247B (en) * | 2015-12-31 | 2018-06-26 | 广东雷腾智能光电有限公司 | A kind of LED light source and its packaging method |
| WO2018027454A1 (en) * | 2016-08-08 | 2018-02-15 | 深圳市蓝月光电子科技有限公司 | Led light string |
| CN112705915B (en) * | 2020-01-21 | 2022-07-01 | 深圳市佳康捷科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN113497175B (en) * | 2020-04-02 | 2024-06-18 | 马思正 | High-temperature-conducting refrigerating chip |
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| CN101286508A (en) * | 2008-06-04 | 2008-10-15 | 徐泓 | High-power LED encapsulation structure |
| CN201363572Y (en) * | 2008-12-26 | 2009-12-16 | 黄金鹿 | LED light source module |
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| US8084777B2 (en) * | 2009-03-24 | 2011-12-27 | Bridgelux, Inc. | Light emitting diode source with protective barrier |
| CN201982991U (en) * | 2010-09-27 | 2011-09-21 | 陈炜旻 | Light-emitting diode (LED) area light source |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101286508A (en) * | 2008-06-04 | 2008-10-15 | 徐泓 | High-power LED encapsulation structure |
| CN201363572Y (en) * | 2008-12-26 | 2009-12-16 | 黄金鹿 | LED light source module |
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