CN103307483A - LED light source module based on printed circuit board - Google Patents
LED light source module based on printed circuit board Download PDFInfo
- Publication number
- CN103307483A CN103307483A CN2013102159234A CN201310215923A CN103307483A CN 103307483 A CN103307483 A CN 103307483A CN 2013102159234 A CN2013102159234 A CN 2013102159234A CN 201310215923 A CN201310215923 A CN 201310215923A CN 103307483 A CN103307483 A CN 103307483A
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- Prior art keywords
- led light
- light source
- pcb
- source module
- led
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Abstract
The invention discloses an LED light source module based on a printed circuit board (PCB). The LED light source module comprises a PCB, a packaging layer and N LED light-emitting chips, wherein N is an integer; 2*N bonding pads are arranged on the PCB; the electrodes of the LED light-emitting chips are connected onto the bonding pads of the PCB to form the tandem or shunt-wound arrays of the N LED light-emitting chips; and the packaging layer is packaged on the LED light-emitting chips. The LED light source module can be extensively produced, is divided into standard modules according to light distribution and circuit design, and has the characteristics of large light-emitting angle, flexible design, capability of achieving flexible curling and the like.
Description
Technical field
The present invention relates to the light emitting diode field, specifically, relate to a kind of led light source module based on printed circuit board (PCB) (PCB).
Background technology
LED has the advantages such as energy-saving and environmental protection, the life-span is long, volume is little, is the light source of new generation after incandescent lamp, fluorescent lamp and high-intensity gas discharge lamp, and LED is more and more wide in the application market of lighting field.
Common flexible LED strip normally is welded in LED SMD lamp pearl on the flexible PCB by surface mount process (SMT) in the market, also can add the protection glue-line in lamp pearl outside in the time of necessary, finally forms flexible lamp strip.Flexible LED strip can arbitrarily bend moulding, and can receive and cutting, and good decorating effect can be widely used in indoor and outdoors decoration and the illuminations such as household, building, automobile decoration.
When the bead weld of LED SMD lamp is connected on the flexible PCB, because heat-sinking capability is limited, can't carry the LED SMD lamp pearl (being generally less than 0.2W) of relatively high power, and the lighting angle of common SMD lamp pearl only can reach 120 degree, limit the lighting angle of lamp bar and illuminated effect.
201220236149.6 the direct die bond bonding wire of led chip on the flexible PCB plate, has been improved the heat dispersion of flexible LED strip to a certain extent.Dead lamp lost efficacy but the bonding wire mode easily causes LED in lamp bar bending process, finally affected the life-span of LED lamp bar.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of led light source module based on PCB is provided, can realize that high reliability, high heat-sinking capability and wide-angle are luminous.
It is more obvious that purpose of the present invention and effect will become: a kind of led light source module based on PCB, and it comprises pcb board, encapsulated layer and N LED luminescence chip, N is integer; Have 2N pad on the pcb board, the electrode of LED luminescence chip is connected on the pad of pcb board, forms the array of the series and parallel of N LED luminescence chip, and encapsulated layer is encapsulated on the LED luminescence chip.
Compared with prior art, the invention has the beneficial effects as follows: among the present invention, contain the strong AlN of thermal conductivity, Al in the PCB substrate
2O
3The heat conduction composition can improve the heat dispersion of flexible LED light source module.Led chip links to each other with the PCB pad by electrode welding, can improve the reliability of LED module; By the shape on encapsulated layer surface, design chips top, can optimize the light efficiency of light source; Technique of the present invention has reduced support and the welding process of SMD lamp pearl simultaneously, has reduced cost.
Description of drawings
Fig. 1 is the cross-sectional view of the described led light source module based on PCB of embodiment 1;
Among the figure, pcb board 1, LED luminescence chip 2, encapsulated layer 3, pad 4.
The specific embodiment
As shown in Figure 1, the present invention is based on the led light source module of PCB, comprise pcb board 1, encapsulated layer 3 and N LED luminescence chip 2, N is integer; Have 2N pad 4 on the pcb board 1, the electrode of LED luminescence chip 2 is connected on the pad 4 of pcb board 1, forms the array of the series and parallel of N LED luminescence chip 2, and encapsulated layer 3 is encapsulated on the LED luminescence chip 2.
Pcb board 1 can improve the heat dispersion of flexible LED light source module.
The electrode of LED luminescence chip 2 is connected on the pad 4 of pcb board 1 by scolding tin or AuSn or SnBiAg Eutectic Layer.
Can mix fluorescent material in the encapsulated layer and adjust light emission color temperature, the luminous intensity distribution of certain shape needing to realize can be designed in the surface of encapsulated layer.
The led light source module based on PCB that mode of the present invention prepares, adopt the design of flip-chip (flip chip), the weldering of metal eutectic, heat conduction PCB base material, the passage of heat radiation is more unimpeded, not only improved the reliability of light source module, the chip that original 20mA can also be driven, add large driven current density to 30mA, improved the power density of light source, can strengthen light output 50%.
Claims (1)
1. the led light source module based on PCB is characterized in that, it comprises pcb board (1), encapsulated layer (3) and N LED luminescence chip (2), and N is integer; Have 2N pad (4) on the pcb board (1), the electrode of LED luminescence chip (2) is connected on the pad (4) of pcb board (1), form the array of the series and parallel of N LED luminescence chip (2), encapsulated layer (3) is encapsulated on the LED luminescence chip (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102159234A CN103307483A (en) | 2013-06-03 | 2013-06-03 | LED light source module based on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102159234A CN103307483A (en) | 2013-06-03 | 2013-06-03 | LED light source module based on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103307483A true CN103307483A (en) | 2013-09-18 |
Family
ID=49133009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102159234A Pending CN103307483A (en) | 2013-06-03 | 2013-06-03 | LED light source module based on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103307483A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106530978A (en) * | 2016-11-18 | 2017-03-22 | 曾广祥 | LED display screen and manufacturing method thereof |
| CN108490683A (en) * | 2018-03-12 | 2018-09-04 | 安徽芯瑞达科技股份有限公司 | A kind of novel backlight module backlight and preparation method thereof |
| EP3614044A1 (en) * | 2018-08-22 | 2020-02-26 | Dura Operating, LLC | Preformed light guide with pockets for light emitting diodes mounted to a printed circuit board |
Citations (8)
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| CN1961431A (en) * | 2003-12-09 | 2007-05-09 | 吉尔科有限公司 | Surface mount light emitting chip packaging piece |
| CN101619814A (en) * | 2009-07-24 | 2010-01-06 | 重庆大学 | Directly embedded high-power LED illumination module |
| CN102222757A (en) * | 2010-04-15 | 2011-10-19 | 三星Led株式会社 | Light emitting diode package, lighting apparatus having the same, and method for manufacturing light emitting diode package |
| CN102338307A (en) * | 2010-07-19 | 2012-02-01 | 惠州元晖光电有限公司 | Phosphor coating films and lighting apparatuses using the same |
| CN102364685A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof |
| US20120098021A1 (en) * | 2010-10-20 | 2012-04-26 | Advanced Optoelectronic Technology, Inc. | Led package |
| CN202601729U (en) * | 2012-05-31 | 2012-12-12 | 深圳市华高光电科技有限公司 | LED (Light-Emitting Diode) encapsulating structure |
| CN203309586U (en) * | 2013-06-03 | 2013-11-27 | 杭州杭科光电股份有限公司 | LED (Light Emitting Diode) light source module based on printed circuit board |
-
2013
- 2013-06-03 CN CN2013102159234A patent/CN103307483A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1961431A (en) * | 2003-12-09 | 2007-05-09 | 吉尔科有限公司 | Surface mount light emitting chip packaging piece |
| CN101619814A (en) * | 2009-07-24 | 2010-01-06 | 重庆大学 | Directly embedded high-power LED illumination module |
| CN102222757A (en) * | 2010-04-15 | 2011-10-19 | 三星Led株式会社 | Light emitting diode package, lighting apparatus having the same, and method for manufacturing light emitting diode package |
| CN102338307A (en) * | 2010-07-19 | 2012-02-01 | 惠州元晖光电有限公司 | Phosphor coating films and lighting apparatuses using the same |
| US20120098021A1 (en) * | 2010-10-20 | 2012-04-26 | Advanced Optoelectronic Technology, Inc. | Led package |
| CN102364685A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | Lead-free LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN202601729U (en) * | 2012-05-31 | 2012-12-12 | 深圳市华高光电科技有限公司 | LED (Light-Emitting Diode) encapsulating structure |
| CN203309586U (en) * | 2013-06-03 | 2013-11-27 | 杭州杭科光电股份有限公司 | LED (Light Emitting Diode) light source module based on printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106530978A (en) * | 2016-11-18 | 2017-03-22 | 曾广祥 | LED display screen and manufacturing method thereof |
| CN108490683A (en) * | 2018-03-12 | 2018-09-04 | 安徽芯瑞达科技股份有限公司 | A kind of novel backlight module backlight and preparation method thereof |
| EP3614044A1 (en) * | 2018-08-22 | 2020-02-26 | Dura Operating, LLC | Preformed light guide with pockets for light emitting diodes mounted to a printed circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Hangzhou City, Zhejiang province 311121 Yuhang District Xianlin Street Xian Xing Lu 31, No. 33 Applicant after: Hangzhou Hangke Photoelectric Co., Ltd. Address before: Hangzhou City, Zhejiang province 310012 Dengyun Road No. 425 Lilda Building 5 floor Applicant before: Hangzhou Hangke Photoelectric Co., Ltd. |
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| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130918 |