CN209418538U - A kind of packaging structure of light source of high power LED - Google Patents
A kind of packaging structure of light source of high power LED Download PDFInfo
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- CN209418538U CN209418538U CN201822151618.4U CN201822151618U CN209418538U CN 209418538 U CN209418538 U CN 209418538U CN 201822151618 U CN201822151618 U CN 201822151618U CN 209418538 U CN209418538 U CN 209418538U
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- thermal conductivity
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- light source
- pedestal
- high power
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Abstract
The utility model discloses a kind of packaging structure of light source of high power LED, including thermal conductivity pedestal, the thermal conductivity two sides of base is fixedly installed with bracket respectively, thermal conductivity pedestal upper end is fixedly installed with LED blue light flip chip, die bond solder paste is coated between thermal conductivity pedestal upper end outer surface and LED blue light flip chip lower end outside surface, LED crystal upper end outer surface is fixedly installed yellow fluorescence colloid, the pedestal upper end is fixedly installed with optical lens, thermal conductivity pedestal lower end is fixedly installed with pcb board, the thermal conductivity pedestal middle inside is fixedly installed partition.The simple using effect of the utility model structure is good, considerably reduces the failure risk of device in use, improves the reliability of the device.
Description
Technical field
The utility model relates to light source lighting technical field, specially a kind of packaging structure of light source of high power LED.
Background technique
High-power point light source is widely used in various commercial illumination mainly as illumination electron-like element at present, such as big
The illumination of power outdoor road lamp, room lighting, Landscape Lighting and other illumination applications etc., conventional high-power point light source, to light
The reliability in source has very big requirement, is usually made of LED high-power support and LED wafer, using bonding gold thread by LED wafer
Electrode is bonded with stent conduction coating, realizes electrically conducting, two bracket pins of exterior design, are used in cradling function area
The pad connection of light source internal circuit and external PCB circuit board is connected, so that external drive source current can pass through bracket pin
It is conducting to LED wafer, LED is lighted and shines, but the LED light source encapsulating structure of this mode is due to using gold thread to be bonded, when big function
Rate LED can generate a large amount of heat when shining, and cause to be easy to pull in lens interior fluorescent glue and lens filling glue expanded by heating
Gold thread causes bonding gold thread fracture, is more frivolous bendable in addition there are the bracket pin that a great problem is exactly light source
It rolls over metal to constitute, easily causes pin warpage when light source transhipment or application end patch are to pcb board, will lead to light source in this way
Pin with application end PCB contact pads are bad causes light source and pcb board rosin joint, lead to the dead lamp of LED failure.
Utility model content
The purpose of this utility model is to provide a kind of packaging structure of light source of high power LED, to solve above-mentioned background technique
The problem of middle proposition.
To achieve the above object, the utility model provides the following technical solutions: a kind of packaging structure of light source of high power LED,
Including thermal conductivity pedestal, the thermal conductivity pedestal, the two sides of base is fixedly installed with bracket, the thermal conductivity respectively
Pedestal upper end is fixedly installed with LED blue light flip chip, and thermal conductivity pedestal upper end outer surface and the upside-down mounting of LED blue light are brilliant
Die bond solder paste is coated between piece lower end outside surface, LED crystal upper end outer surface is fixedly installed yellow fluorescent glue
Body, the pedestal upper end are fixedly installed with optical lens, and the thermal conductivity base bottom is fixedly installed with pcb board, described to lead
Thermal conducting pedestal middle inside is fixedly installed partition.
Preferably, the material of the partition and bracket is PPA plastics, and partition is used to be isolated the positive and negative anodes of pedestal, PPA plastics
It can be indeformable non-discolouring when passing through reflow soldering process.
Preferably, the thermal conductivity base bottom is fixedly connected by solder reflow process with pcb board, real after Reflow Soldering
Existing high-intensity welding, realization device are connected with external circuit.
Preferably, the thermal conductivity base material is copper product, and copper product has good thermal conductivity.
Preferably, transparent filling gel is fixedly installed inside the optical lens, transparent filling gel can be used for mentioning
The light-out effect of device is risen, and light emitting angle can be kept.
Compared with prior art, the utility model has the beneficial effects that
1, the utility model changes the light that conventional light source needs to be bonded gold thread connecting bracket and chip by whole device
Source encapsulating structure, so that prevent causes to be bonded gold thread fracture caused by time structure since encapsulation glue expanded by heating generates stress
Risk.
2, the utility model is connect by thermal conductivity pedestal with pcb board bracket, is changed typical high power point light source and is adopted
The bracket pin warpage issues caused by pinned supporting structure considerably reduce the failure wind of light source in use
Danger, improves the reliability of the light source.
Detailed description of the invention
Fig. 1 is a kind of packaging structure of light source of high power LED overall structure diagram of the utility model；
Fig. 2 is the enlarged view in a kind of packaging structure of light source of high power LED Fig. 1 of the utility model at A；
Fig. 3 is a kind of packaging structure of light source of high power LED top view of the utility model.
In figure: 1, thermal conductivity pedestal；2, bracket；3, LED blue light flip chip；4, die bond solder paste；5, yellow fluorescent glue
Body；6, optical lens；7, pcb board；8, partition；9, transparent filling gel.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of packaging structure of light source of high power LED, including
Thermal conductivity pedestal 1,1 two sides of thermal conductivity pedestal are fixedly installed with bracket 2,1 upper end of thermal conductivity pedestal respectively
LED blue light flip chip 3 is fixedly installed with, under the 1 upper end outer surface of thermal conductivity pedestal and LED blue light flip chip 3
It is coated with die bond solder paste 4 between the outer surface of end, LED crystal upper end outer surface is fixedly installed yellow fluorescence colloid 5,
2 upper end of bracket is fixedly installed with optical lens 6, and 1 bottom of thermal conductivity pedestal is fixedly installed with pcb board 7, described to lead
1 middle inside of thermal conducting pedestal is fixedly installed partition 8.
The material of the partition 8 and bracket 2 is PPA plastics, and partition 8 is used to be isolated the positive and negative anodes of pedestal, and PPA plastics can be with
Indeformable non-discolouring when passing through reflow soldering process, 1 bottom of thermal conductivity pedestal passes through solder reflow process and pcb board 7
It is fixedly connected, realizes that high-intensity welding, realization device are connected with external circuit after Reflow Soldering, 1 material of thermal conductivity pedestal
For copper product, copper product has good thermal conductivity, is fixedly installed transparent filling gel inside the optical lens 6
9, transparent filling gel 9 can be used for the light-out effect of lifting device, and can keep light emitting angle.
Working principle: the present apparatus is using LED blue light flip chip 3 and 1 knot of thermal conductivity pedestal being divided into two by partition 8
Structure, LED flip chip are directly welded at the positive and negative anodes of thermal conductivity pedestal 1, and not needing gold thread bonding can realize that LED is led
It is logical, so that thermal conductivity pedestal 1 carries thermally conductive and conductive effect simultaneously, thoroughly solve using bonding gold thread bring gold thread
Fracture causes the risk of the dead lamp of LED, while eliminating pin, directly uses SMT equipment by 1 bottom of thermal conductivity pedestal in application end
On portion's pad patch to PCB pad, no longer there are light source pin warpage issues, thoroughly solves application end paster pin warpage and lead
It causes in 7 problem of faulty soldering of pcb board, is device energized conductor, LED blue light after conducting finally by pcb board 7 and thermal conductivity pedestal 1
Flip chip 3, which shines, excites yellow fluorescence colloid 5 to issue white light, while transparent filling gel 9 can go out light efficiency with lifting device
Fruit, and light emitting angle can be kept, whole device change caused by the structure of conventional light source due to encapsulation glue be heated it is swollen
The swollen stress that generates leads to the risk for being bonded gold thread fracture, and here it is a kind of packaging structure of light source of high power LED of the utility model
Working principle.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of packaging structure of light source of high power LED, including thermal conductivity pedestal (1), it is characterised in that: the thermal conductivity base
Seat (1) two sides are fixedly installed with bracket (2) respectively, and it is brilliant that thermal conductivity pedestal (1) upper end is fixedly installed with the upside-down mounting of LED blue light
Piece (3) is smeared between thermal conductivity pedestal (1) the upper end outer surface and LED blue light flip chip (3) lower end outside surface
Have die bond solder paste (4), LED crystal upper end outer surface is fixedly installed yellow fluorescence colloid (5), on the bracket (2)
End is fixedly installed with optical lens (6), and thermal conductivity pedestal (1) bottom is fixedly installed with pcb board (7), described thermally conductive to lead
Electric pedestal (1) middle inside is fixedly installed partition (8).
2. a kind of packaging structure of light source of high power LED according to claim 1, it is characterised in that: the partition (8) and branch
The material of frame (2) is PPA plastics.
3. a kind of packaging structure of light source of high power LED according to claim 1, it is characterised in that: the thermal conductivity base
Seat (1) bottom is fixedly connected by solder reflow process with pcb board (7).
4. a kind of packaging structure of light source of high power LED according to claim 1, it is characterised in that: the thermal conductivity base
Seat (1) material is copper product.
5. a kind of packaging structure of light source of high power LED according to claim 1, it is characterised in that: the optical lens (6)
Inside is fixedly installed transparent filling gel (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822151618.4U CN209418538U (en) | 2018-12-21 | 2018-12-21 | A kind of packaging structure of light source of high power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822151618.4U CN209418538U (en) | 2018-12-21 | 2018-12-21 | A kind of packaging structure of light source of high power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209418538U true CN209418538U (en) | 2019-09-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822151618.4U Active CN209418538U (en) | 2018-12-21 | 2018-12-21 | A kind of packaging structure of light source of high power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209418538U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112902053A (en) * | 2021-01-20 | 2021-06-04 | 深圳市华富洋照明科技有限公司 | Waterproof LED wall washer lamp with dangerous power-off structure |
| CN114630494A (en) * | 2022-05-12 | 2022-06-14 | 之江实验室 | Interconnection structure of wafer integrated system and top PCB and manufacturing method thereof |
-
2018
- 2018-12-21 CN CN201822151618.4U patent/CN209418538U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112902053A (en) * | 2021-01-20 | 2021-06-04 | 深圳市华富洋照明科技有限公司 | Waterproof LED wall washer lamp with dangerous power-off structure |
| CN114630494A (en) * | 2022-05-12 | 2022-06-14 | 之江实验室 | Interconnection structure of wafer integrated system and top PCB and manufacturing method thereof |
| CN114630494B (en) * | 2022-05-12 | 2022-08-09 | 之江实验室 | Interconnection structure of wafer integration system and top PCB and manufacturing method thereof |
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