CN107394033A - LED filament manufacturing process and LED filament - Google Patents
LED filament manufacturing process and LED filament Download PDFInfo
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- CN107394033A CN107394033A CN201710590674.5A CN201710590674A CN107394033A CN 107394033 A CN107394033 A CN 107394033A CN 201710590674 A CN201710590674 A CN 201710590674A CN 107394033 A CN107394033 A CN 107394033A
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- led filament
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 238000005452 bending Methods 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 10
- 239000002002 slurry Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
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- 238000005286 illumination Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A kind of LED filament manufacturing process provided by the invention and LED filament, are related to electric lighting field.LED filament manufacturing process includes：Through hole is opened up respectively in the both positive and negative polarity connection end of substrate；The pin body of LED filament is passed through into corresponding through hole；Bending pin passes the end of through hole, pressing is carried out to the ends of bending pins and forms fixed part, pin is bonded with substrate and form fixed part through the position of substrate by bending pin, LED filament pin is set to be bonded with substrate closer, it will not be fallen off because of situations such as high temperature, the situation such as rosin joint, LED filament manufacturing process provided by the invention and LED filament, pin consolidates with substrate connection, even if high temperature causes solder to melt, pin will not also depart from substrate, LED filament normal work can be made, so as to improve the service life of LED filament.
Description
Technical field
The present invention relates to electric lighting field, in particular to a kind of LED filament manufacturing process and LED filament.
Background technology
LED (light emitting diode) is a kind of semiconductor device for the solid-state that can convert electrical energy into visible ray
Part, electricity directly can be converted into light by it.It is related to bulb, fluorescent tube, desk lamp, solar energy lamp, brightening landscape, family with field
In terms of the daily household electrical appliances such as electrical appliance.LED is as a kind of new lighting source, with the aobvious of energy-conservation, health, environmental protection and long lifespan
Work feature, receive the favor of numerous people and vigorously supporting for country.
In the LED of prior art, LED filament is with pin by being welded to connect.But LED filament is in use,
The temperature of LED flexibilities filament and pin weld can continue to raise, and after temperature rise, solder may melt, so as to cause LED
Come off and disconnect between filament and pin, LED filament is disconnected with miscellaneous part, result in LED filament can not be normal
It is luminous, so as to reduce the service life of LED filament.
The content of the invention
In view of this, the purpose of the embodiment of the present invention is to provide a kind of LED filament manufacturing process, to improve above-mentioned ask
Topic.
The another object of the embodiment of the present invention is to provide a kind of LED filament, to improve the problem of above-mentioned.
The embodiments of the invention provide a kind of LED filament manufacturing process, the LED filament manufacturing process is included in substrate
Both positive and negative polarity connection end opens up through hole respectively；Each pin body of LED filament is passed through into a corresponding through hole；Bend pin sheet
Body passes the end of through hole, and carrying out pressing to the ends of bending pins forms fixed part, so that pin is bonded with substrate.
Further, the LED filament manufacturing process also includes：Packaging LED chips are fixed using substrate, in the substrate
Surface coating primer form primer layer, in the primer layer, multiple LED chips are set；Will be the multiple with metal contact wires
LED chip serial or parallel connection；Metal contact wires at the both ends of the substrate are starched using tin or tin wire bond connects.
Further, the LED filament manufacturing process also includes：It is equal using silica gel or epoxide-resin glue and fluorescent material stirring
The substrate, LED chip are coated after even, form adhesive layer；The fluorescent material configured is coated on the adhesive layer.
Further, the fluorescent material includes at least one of bloom, rouge and powder or green powder.
A kind of LED filament, the LED filament are made of LED filament manufacturing process, and the LED filament includes substrate, drawn
Pin and through hole, the pin include pin body and fixed part, and the fixed part is bonded with the substrate, and the pin body is worn
The part for going out the through hole is connected with the fixed part, and the width of the fixed part is more than the through hole.
Further, the LED filament includes multiple LED chips and metal contact wires, and the LED chip is arranged at institute
Substrate is stated, the metal contact wires connect multiple LED chips, and the both ends of the metal contact wires are electrically connected with the pin and is respectively,
The LED filament also includes adhesive layer, and the adhesive layer coats the substrate and LED chip.
Further, the LED filament also includes tin pulp layer, and the LED filament is additionally provided with tin slurry or tin silk, the tin
Slurry or tin silk are used to connect metal contact wires, and welding substrate and pin body.
Further, the fixed part is bending structure.
Further, the fixed part is seven shape structures.
Further, the pin body welds with the substrate.
Compared with the prior art, the invention has the advantages that：
A kind of LED filament manufacturing process provided by the invention and LED filament, are opened up respectively in the both positive and negative polarity connection end of substrate
Through hole；The pin body of LED filament is passed through into corresponding through hole；Bending pin passes the end of through hole, to the end of bending pins
Portion carries out pressing and forms fixed part, pin is bonded with substrate and forms fixed part, institute through the position of substrate by bending pin
State fixed part to be bonded with the substrate, so that LED filament pin is bonded closer with substrate, will not be sent out because of situations such as high temperature
Situation, LED filament manufacturing process provided by the invention and LED filament, the pins such as life comes off, rosin joint consolidate with substrate connection, i.e.,
High temperature is set to cause solder to melt, pin will not also depart from substrate, can make LED filament normal work, so as to improve LED
The service life of silk.
To enable the above objects, features and advantages of the present invention to become apparent, preferred embodiment cited below particularly, and coordinate
Appended accompanying drawing, is described in detail below.
Brief description of the drawings
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.The present invention implementation being generally described and illustrated herein in the accompanying drawings
The component of example can be configured to arrange and design with a variety of.Therefore, the reality of the invention to providing in the accompanying drawings below
The detailed description for applying example is not intended to limit the scope of claimed invention, but is merely representative of the selected implementation of the present invention
Example.Based on the embodiment in the present invention, those of ordinary skill in the art are obtained under the premise of creative technique improvement is not made
The every other embodiment obtained, belongs to the scope of protection of the invention.
Fig. 1 shows LED filament manufacturing process flow diagram provided in an embodiment of the present invention.
Fig. 2 show in LED filament manufacturing process provided in an embodiment of the present invention by the pin body of LED filament through pair
Step schematic diagram before the through hole answered.
Fig. 3 shows the sealing flow chart of steps of LED filament manufacturing process provided in an embodiment of the present invention.
Fig. 4 is the structural representation of LED filament provided in an embodiment of the present invention.
Fig. 5 is the local structural representation at II in Fig. 4 of the embodiment of the present invention.
Fig. 6 is the multi-angled view of LED filament first provided in an embodiment of the present invention.
Fig. 7 is the structural representation of the substrate of LED filament provided in an embodiment of the present invention.
Fig. 8 is the structural representation of the pin for the LED filament that the embodiment of the present invention one provides.
Icon：100-LED filaments；110- substrates；112- through holes；113- tin is starched；120-LED chips；130- pins；132-
Pin body；134- fixed parts；140- metal contact wires；150- adhesive layers.
Embodiment
Below in conjunction with accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Ground describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Generally exist
The component of the embodiment of the present invention described and illustrated in accompanying drawing can be configured to arrange and design with a variety of herein.Cause
This, the detailed description of the embodiments of the invention to providing in the accompanying drawings is not intended to limit claimed invention below
Scope, but it is merely representative of the selected embodiment of the present invention.Based on embodiments of the invention, those skilled in the art are not doing
The every other embodiment obtained on the premise of going out creative technique improvement, belongs to the scope of protection of the invention.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.
In the description of the invention, it is necessary to which explanation, term " on ", " under ", "left", "right", " interior ", " outer " etc. indicate
Orientation or position relationship be based on orientation shown in the drawings or position relationship, or the invention product using when usually put
Orientation or position relationship, be for only for ease of the description present invention and simplify description, rather than instruction or imply signified device
Or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
In the description of the invention, it is also necessary to explanation, unless otherwise clearly defined and limited, term " setting ",
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or one
Connect body；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirect by intermediary
It is connected, can is the connection of two element internals.
In the description of the invention, it is also necessary to explanation, herein, such as first and second or the like relation art
Language is used merely to make a distinction an entity or operation with another entity or operation, and not necessarily requires or imply this
Any this actual relation or order be present between a little entities or operation.The term such as term " level ", " vertical ", " pendency "
It is not offered as requiring part abswolute level or pendency, but can be slightly tilted.As " level " only refers to that its direction is relative " perpendicular
It is more horizontal for directly ", it is not to represent that the structure must be fully horizontal, but can be slightly tilted.Term " comprising ",
"comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process including a series of elements,
Method, article or equipment not only include those key elements, but also the other element including being not expressly set out, or also wrap
Include as this process, method, article or the intrinsic key element of equipment.In the absence of more restrictions, by sentence " including
One ... " key element that limits, it is not excluded that also exist in the process including the key element, method, article or equipment another
Outer identical element.For the ordinary skill in the art, above-mentioned term can be understood in the present invention with concrete condition
Concrete meaning.
Below in conjunction with the accompanying drawings, some embodiments of the present invention are elaborated.It is following in the case where not conflicting
Feature in embodiment and embodiment can be mutually combined.
First embodiment
Present embodiments provide a kind of LED filament manufacturing process.Referring to Fig. 1, Fig. 1 shows what the present embodiment provided
The flow chart of LED filament manufacturing process.
Step S10：Through hole 112 is opened up respectively in the both positive and negative polarity connection end of substrate 110.
Substrate 110 is LED chip 120, metal contact wires 140, pin 130 and the carrier of sealing.Substrate 110 can select
Transparent sapphire AL203 is selected, it is also an option that boronation glass, metal copper sheet, FPC flexible PCBs and other remaining ceramic materials
Material, the present invention are not limited this.For light extraction efficiency, transparent sapphire boronation glass is better than sheet metal.
The technique that the present embodiment provides can select to process sapphire boronation glass as substrate 110.In remaining embodiment
In, different materials can also be selected according to the actual requirements as substrate 110.Chemical cleavage or physics punching by way of
The anode connection terminal of substrate 110 and negative pole connection end open up through hole 112 respectively, for example, can make 110 corresponding position of substrate
Physics cutting, such as the mode such as drill bit punching, laser cutting are carried out, to realize the effect for opening up through hole 112.
S20：Each pin body 132 of LED filament 100 is passed through into a corresponding through hole.
Each pin body 132 of LED filament 100 is passed into a corresponding through hole 112, the pin body
132 one end is used to be connected with tin pulp layer 113, and so as to be connected with the remaining circuit component of substrate 110, the other end is used for conduct
The port connection electric signal of LED filament 100.If it is only simply to press the low-heat of pin 130 at the both ends of LED filament 100
It is bonded in the tin pulp layer 113 at the both ends of substrate 110, it is difficult to ensure that it is firmly connected, when the high temperature Jing Guo remaining technique scorches, draws
Pin 130 is easy to collapse with tin pulp layer 113, forms dry joint, causes subsequently to wait light fixture product after transport shakes after upper electricity
Light fixture such as does not work at the consequence.
Also include die bond step before step S20.Referring to Fig. 2, die bond step includes：
S101：Packaging LED chips 120 are fixed using substrate 110.
Primer is coated in the first face of the substrate 110, to form primer layer；In the substrate 110, multiple LED cores are set
Piece 120, for example, at least three LED chip 120.The multiple uniform intervals of LED chip 120 are arranged at the primer layer.Primer
The siliceous primer of transparent heat conduction either tin slurry etc. can be selected.Such as KER-300/TAD-5000, or the reflection siliceous primer of heat conduction
KER-3200/TAD-5700 etc..
S102：Using metal contact wires 140 by the multiple serial or parallel connection of LED chip 120.
Metal contact wires 140 can select 99.99% metal contact wires or other metal contact wires 140.Series connection can be protected
The size of current that card flows through each LED chip 120 is identical, using identical LED chip 120, then can ensure each LED core
The luminous power of piece 120 is identical, and brightness is identical；By the way of in parallel, the voltage at each both ends of LED chip 120 is identical and more
Individual LED chip 120 does not interfere with one another, even if some LED chip 120 breaks down, does not interfere with whole LED filament 100
Illumination effect.
S103：The metal contact wires 140 and the through hole 112 are passed through into the welding of tin slurry 113.
Metal contact wires 140 are connected by tin slurry 113 and are connected with the through hole 112 at the both ends of substrate 110, so that LED core
Piece 120 and connection pin 130.It can also be welded from tin silk, this is not limited by the present invention.Fig. 4 and Fig. 6 is referred to,
Fig. 4 shows the schematic diagram of LED filament 100.
The LED filament manufacturing process also includes sealing step.Sealing step includes S104~S105.Refer to Fig. 3.
The substrate 110 of LED filament 100 must have preferable rigidity, transparency, therefore in theory should be in substrate 110
First face and the second face are respectively provided with LED chip 120, but in order to follow considering for brief, economic principle and packaging technology, Yu Ben
In embodiment, the LED chip 120 of the LED filament 100 is only arranged at the first one side of substrate 110, but not limited to this.Yu Ben
The In remaining embodiment of invention, the LED chip 120 can also be arranged at the positive and negative two sides of substrate 110, to reach best
Illumination effect.
S104：Substrate 110 and LED chip 120 are wrapped after being stirred using silica gel or epoxide-resin glue with fluorescent material
Cover, form adhesive layer 150.
The LED chip 120 and the substrate 110 are coated using crystal-bonding adhesive by point gum machine, make tin pulp layer 113 aobvious
Expose outside for connecting pin 130.
Crystal-bonding adhesive requires that thermal conductivity factor is high, it is desirable to more than thermal conductivity factor 0.2W (mk).The major function of crystal-bonding adhesive is used for
Fixed LED chip 120, crystal-bonding adhesive can select encapsulation glue；Silica gel or epoxide-resin glue etc..
S105：The fluorescent material configured is coated on the adhesive layer.
Whole colloid is coated using fluorescent material, prevents LED chip 120 is luminous from producing leakage.Can by different fluorescent material
To realize different illumination effects, usually, conventional fluorescent material includes bloom, rouge and powder and green powder etc., passes through different proportion
The uniform mixing of bloom, rouge and powder and green powder can form remaining fluorescent material of different colours, send out LED filament 100 to reach
Go out the effect of different colours light.In the present embodiment, the fluorescent material includes at least one of bloom, rouge and powder and green powder.
S30:Bending passes the pin body 132 of through hole 112, and pressing formation is carried out to the part of pin body 132 of bending
Fixed part 134, pin 130 is set to be bonded with substrate 110.
The pin 130 is pressed, the pin 130 is formed fixed part 134, is made on pin 130 and substrate 110
Tin pulp layer 113 contact fitting.It is understood that the Breadth Maximum of the fixed part 134 is more than the Breadth Maximum of through hole, make
Pin body 132 pass through through hole 112 after, fixed part 134 can be not passed through through hole 112, so that the both ends of pin body 132
It is located at the both sides of substrate 110 respectively, the tin for making pin 130 be not easy on substrate 110 starches situations such as rosin joint occurs, comes off.
In the present embodiment, the fixed part 134, which can press, is arranged to bending structure, but not limited to this, in remaining reality
Apply in example, the fixed part 134 can also press the structure for being set to other shapes, such as door shape, can be with base
The automatic press of plate 110 is engaged, firmly connection.The fixed part 134 may be arranged as seven fonts, but not limited to this, with this reality
Apply the equivalent scheme of example, or can reach the present embodiment effect within protection scope of the present invention.
The material of the pin 130 can select material conductive, that thermal conductivity is good, such as the material such as copper nickel plating.
It should be noted that even if being provided with fixed part 134, the pin 130 can still press with the tin pulp layer 113
Welding, for example, the pin body 132 can be starched with the tin by the welding manner of scolding tin be fixedly connected with substrate 110 with up to
To optimal using effect.So as to which even if scolding tin comes off, fixed part 134 can still fix pin 130.
The manufacturing process provided by the present embodiment, the stable LED filament 100 of attachment structure, pin 130 can be produced
The through hole 112 of end and substrate 110, which coordinates, more to be fastened, and is made the cooperation between pin 130 and substrate 110 more stable, is especially existed
Environment temperature raises, and when the scolding tin for making to connect between substrate 110 and pin 130 dissolves, fixed part 134 buckles with substrate 110
The structure that formula coordinates can ensure that pin 130 keeps connecting with the plate of substrate 110.
Second embodiment
Referring to Fig. 4, present embodiments providing a kind of LED filament 100, the LED filament 100 that the present embodiment provides can carry
The service life of high LED filament 100.
In the present embodiment, LED filament 100 includes substrate 110, multiple LED chips 120, metal contact wires 140, pin
130 and adhesive layer 150, LED chip 120 be arranged at the substrate 110, metal contact wires 140 connect multiple LED chips 120,
Pin 130 is fixedly connected with substrate 110.Adhesive layer 150 wraps up LED chip 120, substrate 110 and metal contact wires 140.
LED chip 120 is welded on the substrate 110 by the way of upside-down mounting, and the electrode of the LED chip 120 is direct
The substrate 110 is welded in, without bonding wire, reduces manufacturing procedure, improves process velocity.And avoid in positive cartridge chip
Luminous efficiency is influenceed because electrode ties up light-emitting area, extends the service life of chip, improves the thermal conductivity of chip, is reduced
Because of rosin joint caused by bonding wire, weldering etc. partially is bad, so as to improving product yield.
Fig. 5 and Fig. 6 are referred to, in the present embodiment, through hole 112 is provided with substrate 110, pin 130 passes through through hole 112
It is fixedly connected with substrate 110.
In the present embodiment, two through holes 112 are provided with substrate 110, referring to Fig. 7, two through holes 112 are set respectively
At the both ends of substrate 110.
It should be noted that in the present embodiment, two through holes 112 are separately positioned on the both ends of substrate 110, but unlimited
In this, in other embodiments of the invention, two through holes 112 can be located at the optional position of substrate 110, with the present embodiment etc.
Same scheme, can reach the effect of the present embodiment, within the scope of the present invention.
In the present embodiment, pin 130 is two, and a pin 130 is fixed through a through hole 112 with substrate 110.Institute
The both ends for stating substrate 110 are coated with tin pulp layer 113, the tin pulp layer 113 of described each corresponding connection one end of pin 130.
Referring to Fig. 8, in the present embodiment, pin 130 includes pin body 132 and fixed part 134, pin body 132
Through through hole 112, it is fixedly connected with substrate 110, the side of pin body 132 passes the part of through hole 112 and fixed part 134 connects
Connect.
Preferably, the periphery of pin body 132 matches with the inwall of through hole 112.I.e. in the present embodiment, pin body
132 periphery and the interior contact of through hole 112.
In the present embodiment, pin body 132 is interference fitted with through hole 112.Pin body 132 and through hole 112 can be made
Engaging, makes pin body 132 be fixed with through hole 112.
It should be noted that in the present embodiment, pin body 132 is interference fitted with through hole 112, but not limited to this,
In other embodiments of the invention, pin body 132 can coordinate with the gap of through hole 112, the scheme being equal with the present embodiment,
The effect of the present embodiment can be reached, within the scope of the present invention.
In the present embodiment, the Breadth Maximum of fixed part 134 is more than the Breadth Maximum of through hole 112.Fixed part 134 can be
The shape of rule, or irregular shape, either regular shape or irregular shape, fixed part 134 may
There are multiple width, the Breadth Maximum of fixed part 134 refers to width maximum in the width dimensions of fixed part 134.
Be readily appreciated that, the shape of through hole 112 is probably rule, it is also possible to it is irregular, no matter the shape of through hole 112
It is regular or irregular, through hole 112 may all have multiple width, and the Breadth Maximum of through hole 112 refers to the width of through hole 112
Spend width scales maximum in size.
The Breadth Maximum of fixed part 134 is more than the Breadth Maximum of through hole 112.After pin body 132 is passed through through hole 112,
Fixed part 134 cannot pass through through hole 112, so that the both ends of pin body 132 are located at the both sides of substrate 110 respectively.Make to draw
Pin 130 is not easy to come off with substrate 110.
In this embodiment, fixed part 134 is bending structure.
It should be noted that in the present embodiment, fixed part 134 is bending structure, but not limited to this, the present invention's
In other embodiment, fixed part 134 can be other structures, such as spherical etc., the scheme being equal with the present embodiment, Neng Gouda
To the effect of the present embodiment, within the scope of the present invention.
In the present embodiment, fixed part 134 can be seven fonts.
It should be noted that in the present embodiment, fixed part 134 is seven fonts, but not limited to this, in its of the present invention
In his embodiment, fixed part 134 can also be the other shapes such as T fonts, the scheme being equal with the present embodiment, can reach this reality
The effect of example is applied, within the scope of the present invention.
In the present embodiment, fixed part 134 is held in substrate 110 close to the side of substrate 110, i.e., in the present embodiment,
Fixed part 134 supports close to the side of substrate 110 and substrate 110.
It should be noted that in the present embodiment, fixed part 134 is held in substrate 110 close to the side of substrate 110, but
This is not limited to, in other embodiments of the invention, fixed part 134 can not support with substrate 110, be equal with the present embodiment
Scheme, the effect of the present embodiment can be reached, within the scope of the present invention.
In the present embodiment, pin body 132 has big end and small end, and big end is connected with fixed part 134, pin body
132 width is gradually decreased by big hold to small end.Pin body 132 can be made during being threaded through, gradually and through hole
112 lockings.
In the present embodiment, pin body 132 is fixedly connected by way of welding with substrate 110.
Preferably, in the present embodiment, pin body 132 is fixedly connected by the welding manner of scolding tin with substrate 110.I.e.
Scolding tin makes pin body 132 be fixed with substrate 110 at through hole 112.
In the present embodiment, covered in the both sides scolding tin of substrate 110, i.e. both sides.Pin body can be fixed from both sides
132, improve the fixed effect of pin 130.
It should be noted that in the present embodiment, in the both sides scolding tin of substrate 110, but not limited to this, the present invention's
In other embodiment, that is, unilateral scolding tin, the scheme being equal with the present embodiment, it be able to can reach in the side scolding tin of substrate 110
The effect of the present embodiment, within the scope of the present invention.
In the present embodiment, adhesive layer 150 is made after adding fluorescent material uniform stirring by silica gel or epoxy resin.But
Not limited to this, in other embodiments of the invention, the scheme being equal with the present embodiment, the effect of the present embodiment can be reached
, within the scope of the present invention.
The operation principle for the LED filament 100 that the present embodiment provides：In the present embodiment, one end of pin body 132 is with consolidating
Determine portion 134 to connect, the other end passes through through hole 112, and the Breadth Maximum of fixed part 134 is more than the Breadth Maximum of through hole 112 so that Gu
Determine portion 134 and cannot pass through through hole 112, after the energization of LED filament 100, because the temperature rise of pad causes pad
Solder melt, pin 130 will not also disconnect with substrate 110.
3rd embodiment
A kind of LED filament lamp is present embodiments provided, LED filament lamp includes circuit board and first embodiment or second
LED filament 100 described in embodiment, the LED filament 100 and circuit board electrical connection.
A kind of LED filament manufacturing process, LED filament and LED filament lamp provided by the invention in summary, are related to illumination
Appliance field.LED filament manufacturing process includes：Through hole is opened up respectively in the both positive and negative polarity connection end of substrate；By the pin of LED filament
Body passes through corresponding through hole；Bending pin passes the end of through hole, and carrying out pressing to the ends of bending pins forms fixed part,
Pin is bonded with substrate and form fixed part through the position of substrate by bending pin, LED filament pin is bonded with substrate
It is closer, it will not be fallen off because of situations such as high temperature, situation, LED filament manufacturing process provided by the invention and the LED such as rosin joint
Filament, pin consolidate with substrate connection, even if high temperature causes solder to melt, pin will not also depart from substrate, can make LED
Silk normal work, so as to improve the service life of LED filament.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of LED filament manufacturing process, it is characterised in that the LED filament manufacturing process includes：
Through hole is opened up respectively in the both positive and negative polarity connection end of substrate；
Each pin body of LED filament is passed through into a corresponding through hole；
Bending passes the pin body of through hole, and carrying out pressing to the pin body part of bending forms fixed part so that pin with
Substrate is bonded.
2. LED filament manufacturing process as claimed in claim 1, it is characterised in that in each pin sheet by LED filament
Before body passes through a corresponding through hole, in addition to die bond step：
Packaging LED chips are fixed using substrate：On the surface of the substrate, coating primer forms primer layer, is set in the primer layer
Put multiple LED chips；
With metal contact wires by the multiple LED chip serial or parallel connection；
Metal contact wires at the both ends of the substrate are starched using tin or tin wire bond connects.
3. LED filament manufacturing process as claimed in claim 1, it is characterised in that the metal at the both ends of the substrate connects
Line also includes sealing step after being connect using tin slurry or tin wire bond：
The substrate, LED chip are coated after being stirred using silica gel or epoxide-resin glue with fluorescent material, form adhesive layer；
The fluorescent material configured is coated on the adhesive layer.
4. LED filament manufacturing process as claimed in claim 3, it is characterised in that the fluorescent material includes bloom, rouge and powder or green
At least one of powder.
5. a kind of LED filament, it is characterised in that the LED filament is using the technique system as described in claim any one of 1-4
Into the LED filament includes substrate, pin and through hole, and the pin includes pin body and fixed part, the fixed part and institute
Substrate fitting is stated, the part that the pin body passes the through hole is connected with the fixed part, the width of the fixed part
More than the through hole.
6. LED filament as claimed in claim 5, it is characterised in that the LED filament includes multiple LED chips and metal
Connecting line, the LED chip are arranged at the substrate, and the metal contact wires are by multiple LED chip serial or parallel connections, the gold
The both ends of category connecting line are electrically connected with the pin and is respectively, and the LED filament also includes adhesive layer, and the adhesive layer coats the substrate
And LED chip.
7. LED filament as claimed in claim 5, it is characterised in that the LED filament is additionally provided with tin slurry or tin silk, described
Tin is starched or tin silk is used to connect metal contact wires, and the tin slurry or tin silk are additionally operable to welding substrate and pin body.
8. LED filament as claimed in claim 5, it is characterised in that the fixed part is bending structure.
9. LED filament as claimed in claim 8, it is characterised in that the fixed part is seven shape structures.
10. LED filament as claimed in claim 5, it is characterised in that the pin body welds with the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590674.5A CN107394033A (en) | 2017-07-19 | 2017-07-19 | LED filament manufacturing process and LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590674.5A CN107394033A (en) | 2017-07-19 | 2017-07-19 | LED filament manufacturing process and LED filament |
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| CN107394033A true CN107394033A (en) | 2017-11-24 |
Family
ID=60335819
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710590674.5A Pending CN107394033A (en) | 2017-07-19 | 2017-07-19 | LED filament manufacturing process and LED filament |
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| CN107835567A (en) * | 2017-11-29 | 2018-03-23 | 苏州晶品新材料股份有限公司 | A kind of ceramic substrate and ceramic substrate component |
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