CN208566353U - A kind of light source device structure - Google Patents

Abstract

The utility model discloses a kind of light source device structures, including substrate, LED light source, conductive circuit layer, the first electrical contact and the second electrical contact are provided on the substrate, first electrical contact and the second electrical contact are separately positioned on the positive back side of substrate, and first electrical contact and the second electrical contact are electrically connected with the positive and negative anodes of LED light source respectively.LED light source is directly electrically connected by conductive circuit layer with the first electrical contact in the utility model, it is electrically connected simultaneously by conductive circuit layer and via hole and the second electrical contact, first electrical contact and the second electrical contact are respectively placed in the tow sides of substrate by the utility model, effectively increase the effective area of the first electrical contact and the second electrical contact, is connect by the other modes realization other than lead with the energization of other electric components convenient for entire light source device.The utility model is for the luminescent device as LED lamp.

Description

A kind of light source device structure

Technical field

The utility model relates to LED light source component technical field of structures.

Background technique

Traditional car light by incandescent lamp, halogen lamp, xenon lamp to today LED light, with LED technology day increasingly Exhibition, LED light source is significantly improved in the performance of light efficiency and light distribution, so that LED light source becomes luminous component on current car light Preferential selection.

Application No. is 201710081115.1 patent documents to disclose a kind of flip LED car light, which includes base Plate, conductive circuit layer, linked circuits layer, box dam glue, chip unit and latasuture glue；The conduction is fixedly installed in the substrate top Line layer, the side at the top of the conductive circuit layer are fixedly installed the linked circuits layer for connecting positive and negative power supply line, institute It states and is provided with the circle box dam glue at the top of conductive circuit layer, be arranged at intervals in the conductive circuit layer in the box dam glue Several chip units, the gap between the box dam glue and each chip unit are filled with the side seal glue；Each institute Stating chip unit includes a flip LED light source, and the bottom of each flip LED light source and conductive circuit layer welding are solid Fixed, the top of each flip LED light source, which is pasted, fixes a cover board.

From explanatory note and attached drawing disclosed in the patent document, it is not difficult to find out that two pads on substrate are arranged at base The same face of plate and coplanar with chip unit, the considerations of for product cost, the limited area of substrate illustrates two pads Size is seriously restricted, and often can only realize substrate pads and other electric components by conducting wire in this case (such as power supply) be electrically connected, and can not enable substrate pads have directly with other electric components realize be electrically connected can Can, this is also the structure of light source device on existing most of lamps and lanterns.

Utility model content

Technical problem to be solved by the utility model is: how to pass through the existing structure for changing light source device, increase substrate Bonding pad area makes light source device have the possibility that can be directly realized by the connection that is powered without using lead with external electrical component.

The solution that the utility model solves its technical problem is:

A kind of light source device structure, including substrate are provided with LED light source, conductive circuit layer, first electrical on the substrate Contact and the second electrical contact, the LED light source, conductive circuit layer and the first electrical contact are being arranged at substrate just The back side of substrate is arranged in face, second electrical contact, wherein first electrical contact and the second electrical contact are practical On refer to the pad being disposed on the substrate, the conductive circuit layer actually refers to the copper conductor that covers on substrate, described to lead Electric line layer and LED light source are electrically connected, and first electrical contact is directly electrically connected with conductive circuit layer, second electricity Gas contact is electrically connected by via hole and conductive circuit layer, i.e., described first electrical contact and the second electrical contact respectively with The positive and negative anodes of LED light source are electrically connected.

As a further improvement of the above technical scheme, be additionally provided with conducting boss on the substrate, the conducting boss with The first electrical contact being disposed on the substrate is fixedly connected, wherein the conducting boss is fixed on substrate by silver paste.

As a further improvement of the above technical scheme, the LED light source is provided with multiple, multiple LED light source phases Mutual parallel connection is serially connected.

As a further improvement of the above technical scheme, the LED light source is COB packaged light source.

As a further improvement of the above technical scheme, the LED light source surface is covered with fluorescence diaphragm, the fluorescent film Piece is made of glass material or ceramic material.

As a further improvement of the above technical scheme, the substrate front side is provided with white adhesive layer, the white adhesive layer covering In region of the substrate front side in addition to LED light source and the first electrical contact.

As a further improvement of the above technical scheme, the height of the white adhesive layer is greater than LED light source height and fluorescent film The sum of piece height 4/5 and be less than the sum of LED light source height and fluorescence diaphragm height.

As a further improvement of the above technical scheme, the LED light source can also be CSP packaged light source.

As a further improvement of the above technical scheme, Zener diode, the Zener two are additionally provided on the substrate Pole pipe and conductive circuit layer are electrically connected.

The beneficial effects of the utility model are: LED light source passes through conductive circuit layer and the first electrical touching in the utility model Point is directly electrically connected, while being electrically connected by conductive circuit layer and via hole and the second electrical contact, and the utility model will First electrical contact and the second electrical contact are respectively placed in the tow sides of substrate, effectively increase the first electrical contact and second The effective area of electrical contact is realized and other electric components convenient for entire light source device by the other modes other than lead Be powered connection.

The utility model is for the luminescent device as LED lamp.

Detailed description of the invention

It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing to be used is briefly described.Obviously, described attached drawing is a part of the embodiment of the utility model, rather than complete Portion's embodiment, those skilled in the art without creative efforts, can also be obtained according to these attached drawings it His design scheme and attached drawing.

Fig. 1 is the light source device structural schematic diagram (including white adhesive layer) of the utility model；

Fig. 2 is the light source device structural schematic diagram (not including white adhesive layer) of the utility model；

Fig. 3 is the light source device side view (not including white adhesive layer) of the utility model.

Specific embodiment

It is carried out below with reference to technical effect of the embodiment and attached drawing to the design of the utility model, specific structure and generation It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field Art personnel other embodiments obtained without creative efforts belong to the model of the utility model protection It encloses.In addition, all connection/connection relationships being previously mentioned in text, not singly refer to that component directly connects, and referring to can be according to specific reality Situation is applied, by adding or reducing couple auxiliary, Lai Zucheng more preferably coupling structure.Each technology in the invention is special Sign, can be with combination of interactions under the premise of not conflicting conflict.

Referring to Fig.1~Fig. 3 is set on the substrate 1 the utility model discloses a kind of light source device structure, including substrate 1 It is equipped with LED light source 2, conductive circuit layer 3, the first electrical contact 9 and the second electrical contact 5, the LED light source 2, conducting wire Layer 3 and the first electrical contact 9 are arranged at the front of substrate 1, and the back side of substrate 1 is arranged in second electrical contact 5, Described in the first electrical contact 9 and the second electrical contact 5 actually refer to that pad on substrate 1, the conduction is arranged Line layer 3 actually refers to the copper conductor that covers on substrate 1, and the conductive circuit layer 3 is electrically connected with LED light source 2, and described the One electrical contact 9 is directly electrically connected with conductive circuit layer 3, and second electrical contact 5 passes through 3 electricity of via hole and conductive circuit layer Property connection, i.e., described first electrical contact 9 and the second electrical contact 5 are electrically connected with the positive and negative anodes of LED light source 2 respectively.Tool Body, LED light source 2 is directly electrically connected by conductive circuit layer 3 and the first electrical contact 9 in the utility model, is passed through simultaneously Conductive circuit layer 3 and via hole and the second electrical contact 5 are electrically connected, and the utility model is by the first electrical contact 9 and second Electrical contact 5 is respectively placed in the tow sides of substrate 1, effectively increases the significant surface of the first electrical contact 9 and the second electrical contact 5 Product is connect by the other modes realization other than lead with the energization of other electric components convenient for entire light source device, such as can Then to utilize tin cream by light source using a metal component as the medium for the connection that is powered between light source device and external power supply 1 back side of the substrate fitting of device is fixed in the metal component, and the energization connection of light source device and external power supply is realized with this.

It is further used as preferred embodiment, in specific embodiment of the present invention, is additionally provided with and leads on the substrate 1 Electric boss 4, the conducting boss 4 is fixedly connected with the first electrical contact 9 of setting on substrate 1, wherein the conducting boss 4 It is fixed on substrate 1 by silver paste.By the setting of the conducting boss 4 in specific embodiment of the present invention, further The convenience of light source device and external electrical component installation connection is improved, such as light source device can be by conducting boss 4 to be clamped Or the mode abutted is fixed on a metal component, using the metal component as light source device and external electrical portion The energization medium of part.

As the first embodiment of LED light source 2 described in the utility model, what the LED light source 2 preferentially selected is COB (plate Upper chip) packaged light source.

Based on the above embodiment, 2 surface of LED light source described in the utility model is covered with fluorescence diaphragm 6, the fluorescence diaphragm 6 be made of glass material or ceramic material.Wherein the fluorescent film piece 6 is mainly used for optimizing going out for light source device Light makes light source device have the effect of exporting white light, the heating conduction and heat resistance of fluorescence diaphragm 6 described in the utility model It is got well than CSP (chip-scale) LED encapsulation packaging plastic used, the high temperature resistance of light source device can be effectively improved.

Based on the above embodiment, 1 front of substrate described in the utility model is provided with white adhesive layer 7, and the white adhesive layer 7 is covered on Region of 1 front of substrate in addition to LED light source 2 and the first electrical contact 9.Specifically, white glue used in the white adhesive layer 7 is anti- Rate height is penetrated, heating conduction is preferable, covers white adhesive layer 7 in 2 surrounding of LED light source, helps to improve light efficiency, while can effectively prevent It is gone here and there outside the blue light of LED light source 2.

Further, the utility model requires the height of the white adhesive layer 7, if 7 height of white adhesive layer is insufficient, Or can exist and go here and there phenomenon outside certain blue light, if white adhesive layer 7 is excessively high, corresponding cost can also be improved, while can also make light source The light that device is exported excessively is concentrated, into excessively multiple comparative experiments, white adhesive layer 7 described in specific embodiment of the present invention Height is greater than the 4/5 of the sum of 2 height of LED light source and 6 height of fluorescence diaphragm and is less than 2 height of LED light source and 6 height of fluorescence diaphragm The sum of.

As the second embodiment of LED light source 2 described in the utility model, the LED light source 2 is it is also an option that CSP (chip Grade) packaged light source.

It is further used as preferred embodiment, for the antistatic property for improving the light source device, is prevented in light source device Being caused by electrostatic breakdown the phenomenon that damaging occurs in LED light source 2 in part installation process, in specific embodiment of the present invention, institute It states and is additionally provided with Zener diode 8 on substrate 1, the Zener diode 8 is electrically connected with conductive circuit layer 3.

In addition the manufacturing process of light source device described in the utility model is as follows, and the first step utilizes scaling powder by LED light It places on substrate 1, using melting down carry out eutectic in source 2；Second step is solidified conducting boss 4 on substrate 1 using silver paste At first electrical contact 9；Fluorescence diaphragm 6 is covered on LED light source 2 and carries out curing operation by third step；4th step utilizes white 2 surrounding of LED light source carries out enclosing white wall operation glue on substrate 1, forms white adhesive layer 7 after cooling.

The better embodiment of the utility model is illustrated above, but the invention be not limited to it is described Embodiment, those skilled in the art can also make various equivalent changes without departing from the spirit of the present invention Type or replacement, these equivalent variation or replacement are all included in the scope defined by the claims of the present application.

Claims (9)

1. a kind of light source device structure, it is characterised in that: including substrate (1), be provided on the substrate (1) LED light source (2), Conductive circuit layer (3), the first electrical contact (9) and the second electrical contact (5), the LED light source (2), conductive circuit layer (3) And first electrical contact (9) be arranged at the front of substrate (1), back of the second electrical contact (5) setting in substrate (1) Face, the conductive circuit layer (3) and LED light source (2) are electrically connected, and first electrical contact (9) is directly and conductive circuit layer (3) it is electrically connected, second electrical contact (5) is electrically connected by via hole and conductive circuit layer (3).

2. a kind of light source device structure according to claim 1, it is characterised in that: be additionally provided with conduction on the substrate (1) Boss (4), the conducting boss (4) are fixedly connected with the first electrical contact (9) being arranged on substrate (1).

3. a kind of light source device structure according to claim 1, it is characterised in that: the LED light source (2) is provided with more A, multiple LED light sources (2) are parallel with one another or are serially connected.

4. a kind of light source device structure according to claim 1, it is characterised in that: the LED light source (2) is COB encapsulation Light source.

5. a kind of light source device structure according to claim 4, it is characterised in that: LED light source (2) surface is covered with Fluorescence diaphragm (6), the fluorescence diaphragm (6) is made of glass material or ceramic material.

6. a kind of light source device structure according to claim 5, it is characterised in that: substrate (1) front is provided with white Glue-line (7), the white adhesive layer (7) are covered on area of substrate (1) front in addition to LED light source (2) and the first electrical contact (9) Domain.

7. a kind of light source device structure according to claim 6, it is characterised in that: the height of the white adhesive layer (7) is greater than LED light source (2) highly with fluorescence diaphragm (6) height the sum of 4/5 and be less than LED light source (2) highly with fluorescence diaphragm (6) height The sum of.

8. a kind of light source device structure according to claim 1, it is characterised in that: the LED light source (2) is CSP encapsulation Light source.

9. a kind of light source device structure according to any one of claims 1 to 8, it is characterised in that: on the substrate (1) also It is provided with Zener diode (8), the Zener diode (8) and conductive circuit layer (3) are electrically connected.