CN203983275U - A kind of can 360 ° of luminous LED filament light sources - Google Patents
A kind of can 360 ° of luminous LED filament light sources Download PDFInfo
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- CN203983275U CN203983275U CN201420351089.1U CN201420351089U CN203983275U CN 203983275 U CN203983275 U CN 203983275U CN 201420351089 U CN201420351089 U CN 201420351089U CN 203983275 U CN203983275 U CN 203983275U
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- silica gel
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- sapphire substrate
- filament light
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Abstract
The utility model provide a kind of can 360 ° of luminous LED filament light sources, belong to technical field of lamps.It has solved the technical problems such as the little and poor heat resistance of existing 360 ° of luminous LED filament light sources power.This LED filament light sources comprises burden silica gel, sapphire substrate and some LED chips, sapphire substrate is installed on burden silica gel, sapphire substrate is provided with bonding silica gel, some LED chips be row spaced apart and all with bonding silica gel be connected, every two adjacent LEDs chip all electrically connects mutually by conductor wire, the two ends that the LED chip being together in series forms luminous element and luminous element are all fixed with the electrode slice electrically connecting mutually with LED chip, and burden silica gel, sapphire substrate and bonding silica gel are the transparent body.This LED filament light sources adopts sapphire substrate to have the advantages such as light efficiency is high, color rendering index is high, radiating treatment is convenient; In the time of good heat resistance, there is better toughness, can encapsulate more LED chip simultaneously, improve power.
Description
Technical field
The utility model belongs to technical field of lamps, relates to a kind of LED filament, particularly a kind of can 360 ° of luminous LED filament light sources.
Background technology
LED lamp is the lighting apparatus that utilizes lumination of light emitting diode, and light-emitting diode is a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, and it can directly be converted into light electricity.The heart of LED is a semi-conductive wafer, and one end of wafer is attached on a support, and one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.LED lighting source is mainly SMD, and DIP type is seldom used.The maximum SMD type of application is main mainly with copper stent, retort stand at present.Their common ground is both positive and negative polarity or heat radiation solder joint and aluminium base need be welded, and coordinates radiator to dispel the heat, to guarantee the life-span of LED.The lighting angle of LED lamp in the market only has 120 degree conventionally.
China's patent (CN 201007995 Y) discloses the LED lamp that a kind of all encapsulation and jointing material all adopt the comprehensive 360 ° of bright dippings of energy of transparent raw material, this LED lamp comprises shell, transparent enclosure resin, wire, LED chip, pin and substrate, LED chip is fixed on substrate, substrate is transparency carrier, is provided with transparent die bond glue-line between LED chip and substrate.
The LED lamp that above-mentioned patent provides adopts transparent raw material to make, and common transparent glass substrate thermal endurance is poor conventionally, once it is not good to use the filament light sources heat radiation of this type of glass to process, glass substrate very easily ruptures, and causes filament to damage.
Summary of the invention
The problems referred to above that the utility model exists for existing technology, provide a kind of can 360 ° of luminous LED filament light sources, technical problem to be solved in the utility model is: how a kind of 360 ° of luminous LED filament light sources can be provided and can improve its power and thermal endurance.
The purpose of this utility model can realize by following technical proposal:
A kind of can 360 ° of luminous LED filament light sources, it is characterized in that, described LED filament light sources comprises burden silica gel, sapphire substrate and some LED chips, described sapphire substrate is installed on described burden silica gel, described sapphire substrate is provided with bonding silica gel, it is spaced apart and be all connected with described bonding silica gel that some LED chips are row, every adjacent two described LED chips all electrically connect mutually by conductor wire, the two ends that the LED chip being together in series forms luminous element and luminous element are all fixed with the electrode slice electrically connecting mutually with LED chip, described burden silica gel, sapphire substrate and bonding silica gel are the transparent body.
Its principle is as follows: this LED filament light sources is designed to LED chip and is together in series, and filament two ends are respectively both positive and negative polarity, and the luminous element that middle LED chip series connection forms is the light-emitting area of 360 degree; Owing to having adopted transparent sapphire substrate, and transparent burden silica gel and bonding silica gel, after the one-sided packaging LED chips of sapphire is lighted, the back side is similarly light-emitting area, pipeline is from 360 ° of unscreened coming out of luminous element surrounding, with this, reach the luminous requirement of 360 degree, compared with prior art, this LED filament light sources has the advantages such as thermal resistance is low, light efficiency is high, color rendering index is high, radiating treatment is convenient than common SMD LED; With respect to general LED filament light sources, common LED filament light sources is used is mainly glass transparent substrate, and only fluorescent material is coated on the glass substrate both sides that 0.8mm is thick, because glass substrate thermal endurance is poor, once using the filament light sources heat radiation of this type of glass processes not good, glass substrate very easily ruptures, and causes filament to damage.On the other hand, common LED filament generally only has 25,28 LEDs chip packages, cannot accomplish more high-power, length also only has 38mm, common substrate is because the material cause technology of its thickness cannot reach, the utility model adopts transparent sapphire substrate, this LED chip is used Sapphire Substrate, LED chip encapsulation re-uses sapphire substrate, make LED chip have better thermal endurance, sapphire substrate adopts 1.2mm thickness, has better toughness, can encapsulate 25,28,32,36 LEDs chips, corresponding length maximum can be produced 60mm.
Above-mentioned can 360 ° of luminous LED filament light sources in, on described burden silica gel, scribble layer of fluorescent powder.After adopting fluorescent material, can utilize the high advantage of some wave band LED luminous efficiency to prepare the LED of its all band, to improve the luminous efficiency of this wave band.Secondly, the emission wavelength of LED is also difficult to accurately control, thereby the LED that can cause some wavelength can not get application and occurs waste, for example, while needing to prepare the LED of 470nm, what may prepare is from 455nm to the very wide LED of 480nm scope, emission wavelength can only be disposed or discarded with cheaper price at the LED at two ends, and adopts fluorescent material can these are so-called " waste product " to change into our needed color and utilized.The 3rd, after adopting fluorescent material, the photochromic meeting of some LED becomes softer or bright-coloured, to adapt to different application needs, in the technical program, during encapsulation, fluorescent material is coated in to the upper 360 degree scopes of sapphire substrate, and not only in the both sides of substrate, it is cylindrical that this technique makes filament outward appearance, more attractive in appearance, luminous more even.
Above-mentioned can 360 ° of luminous LED filament light sources in, described conductor wire is gold thread.This gold thread is to be that more than 99.99% material bonding wire drawing forms by Au purity, has wherein comprised the micro-trace elements such as Ag/Cu/Si/Ca/Mg; Gold thread plays the effect that a wire connects in LED encapsulation, and LED chip is together in series, and when On current, electric current enters chip by gold thread, makes chip light emitting; Spun gold has the advantages such as conductivity is large, corrosion-resistant, good toughness, other materials of comparing, and its maximum advantage is exactly non-oxidizability, and this is the main cause that gold thread is widely used in encapsulation.
Above-mentioned can 360 ° of luminous LED filament light sources in, described electrode slice is copper electrode sheet.
Compared with prior art, advantage of the present utility model is as follows:
1, this LED filament light sources has the advantages such as thermal resistance is low, light efficiency is high, color rendering index is high, radiating treatment is convenient than common SMD LED; In the time of good heat resistance, there is better toughness, can encapsulate more LED chip simultaneously, improve power.
2, in this LED filament light sources, fluorescent material is coated in the upper 360 degree scopes of sapphire substrate, and not only in the both sides of substrate, it is cylindrical that this technique makes filament outward appearance, more attractive in appearance, luminous more even.
Accompanying drawing explanation
Fig. 1 is the sectional structure schematic diagram of this LED filament light sources.
In figure, 1, burden silica gel; 2, sapphire substrate; 3, bonding silica gel; 4, LED chip; 5, electrode slice; 6, conductor wire; 7, fluorescent material.
Embodiment
Be below specific embodiment of the utility model by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiment.
As shown in Figure 1, this LED filament light sources comprises burden silica gel 1, sapphire substrate 2 and some LED chips 4, sapphire substrate 2 is installed on burden silica gel 1, sapphire substrate 2 is provided with bonding silica gel 3, some LED chips 4 be row spaced apart and all with bonding silica gel 3 be connected, every two adjacent LEDs chip 4 all electrically connects mutually by conductor wire 6, and as preferably, conductor wire 6 is gold thread; The LED at two ends is all fixed with electrode slice 5, and as preferably, electrode slice 5 is copper electrode sheet; Burden silica gel 1 and bonding silica gel 3 are transparent silica gel; In this LED filament light sources, on burden silica gel 1, also scribble fluorescent material 7, during encapsulation, fluorescent material 7 is coated in to the upper 360 degree scopes of sapphire substrate 2, and not only in the both sides of substrate, it is cylindrical that this technique makes filament outward appearance, more attractive in appearance, luminous more even.
Its principle is as follows: this LED filament light sources is designed to LED chip 4 and is together in series, and filament two ends are respectively both positive and negative polarity, and intermediate cylindrical is 360 degree light-emitting areas; Owing to having adopted transparent sapphire substrate 2, after the one-sided packaging LED chips 4 of sapphire is lighted, the back side is similarly light-emitting area, with this, reach the luminous requirement of 360 degree, compared with prior art, this LED filament light sources has the advantages such as thermal resistance is low, light efficiency is high, color rendering index is high, radiating treatment is convenient than common SMD LED; With respect to general LED filament light sources, common LED filament light sources is used is mainly glass transparent substrate, and only fluorescent material 7 is coated on the glass substrate both sides that 0.8mm is thick, because glass substrate thermal endurance is poor, once using the filament light sources heat radiation of this type of glass processes not good, glass substrate very easily ruptures, and causes filament to damage.On the other hand, common LED filament generally only has 25,28 LEDs chip 4 encapsulation, cannot accomplish more high-power, length also only has 38mm, common substrate is because the material cause technology of its thickness cannot reach, the utility model adopts transparent sapphire substrate 2, this LED chip 4 is used Sapphire Substrate, LED chip 4 encapsulation re-use sapphire substrate 2, make LED chip 4 have better thermal endurance, sapphire substrate 2 adopts 1.2mm thickness, has better toughness, can encapsulate 25,28,32,36 LEDs chips 4, corresponding length maximum can be produced 60mm.
After adopting fluorescent material 7, can utilize the high advantage of some wave band LED luminous efficiency to prepare the LED of its all band, to improve the luminous efficiency of this wave band.Secondly, the emission wavelength of LED is also difficult to accurately control, thereby the LED that can cause some wavelength can not get application and occurs waste, for example, while needing to prepare the LED of 470nm, what may prepare is from 455nm to the very wide LED of 480nm scope, emission wavelength can only be disposed or discarded with cheaper price at the LED at two ends, and adopts fluorescent material 7 can these are so-called " waste product " to change into our needed color and utilized.The 3rd, after adopting fluorescent material 7, the photochromic meeting of some LED becomes softer or bright-coloured, to adapt to different application needs.
Gold thread is to be that more than 99.99% material bonding wire drawing forms by Au purity, has wherein comprised the micro-trace elements such as Ag/Cu/Si/Ca/Mg; Gold thread plays the effect that a wire connects in LED encapsulation, and LED chip 4 is together in series, and when On current, electric current enters chip by gold thread, makes chip light emitting; Spun gold has the advantages such as conductivity is large, corrosion-resistant, good toughness, other materials of comparing, and its maximum advantage is exactly non-oxidizability, and this is the main cause that gold thread is widely used in encapsulation.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or supplements or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although more used 1 herein, burden silica gel; 2, sapphire substrate; 3, bonding silica gel; 4, LED chip; 5, electrode slice; 6, conductor wire; 7, the term such as fluorescent material, but do not get rid of the possibility of using other term.Use these terms to be only used to describe more easily and explain essence of the present utility model; They are construed to any additional restriction is all contrary with the utility model spirit.
Claims (4)
- One kind can 360 ° of luminous LED filament light sources, it is characterized in that, described LED filament light sources comprises burden silica gel (1), sapphire substrate (2) and some LED chips (4), described sapphire substrate (2) is installed on described burden silica gel (1), described sapphire substrate (2) is provided with bonding silica gel (3), it is spaced apart and be all connected with described bonding silica gel (3) that some LED chips (4) are row, every adjacent two described LED chips (4) all electrically connect mutually by conductor wire (6), the two ends that the LED chip being together in series (4) forms luminous element and luminous element are all fixed with the electrode slice (5) electrically connecting mutually with LED chip (4), described burden silica gel (1), sapphire substrate (2) and bonding silica gel (3) are the transparent body.
- According to claim 1 a kind of can 360 ° of luminous LED filament light sources, it is characterized in that, on described burden silica gel (1), scribble layer of fluorescent powder (7).
- According to claim 1 a kind of can 360 ° of luminous LED filament light sources, it is characterized in that, described conductor wire (6) is gold thread.
- According to claim 1 a kind of can 360 ° of luminous LED filament light sources, it is characterized in that, described electrode slice (5) is copper electrode sheet.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420351089.1U CN203983275U (en) | 2014-06-27 | 2014-06-27 | A kind of can 360 ° of luminous LED filament light sources |
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| CN201420351089.1U CN203983275U (en) | 2014-06-27 | 2014-06-27 | A kind of can 360 ° of luminous LED filament light sources |
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| CN203983275U true CN203983275U (en) | 2014-12-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803530A (en) * | 2016-11-22 | 2017-06-06 | 涂波 | A kind of formal dress chip manufacture technique |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803530A (en) * | 2016-11-22 | 2017-06-06 | 涂波 | A kind of formal dress chip manufacture technique |
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Effective date of registration: 20151210 Address after: 318001, 2-4 buildings, 3 buildings, 818 east development avenue, Jiaojiang District, Zhejiang, Taizhou Patentee after: ZHEJIANG FUSEN ELECTRONIC TECHNOLOGY CO., LTD. Address before: 318000 No. 818, east section, development avenue, Jiaojiang District, Zhejiang, Taizhou Patentee before: Zhejiang First Electronic Tech Co., Ltd. |