CN203812906U

CN203812906U - LED chip packaging body

Info

Publication number: CN203812906U
Application number: CN201420109641.6U
Authority: CN
Inventors: 庄文荣; 陈兴保
Original assignee: SHANGHAI OPPEL LIGHTING CO Ltd
Current assignee: Ayura Terua Limited by Share Ltd
Priority date: 2014-03-12
Filing date: 2014-03-12
Publication date: 2014-09-03
Anticipated expiration: 2024-03-12

Abstract

The utility model relates to an LED chip packaging body, and belongs to the technical field of LED packaging preparation. The LED chip packaging body comprises a transparent substrate, an LED chip and conductor wires and the like. The LED chip which is originally used for positive packaging is disposed on the transparent substrate in an inverting manner, the light output rate of the LED chip is increased, and processes are saved.

Description

A kind of LED chip packaging body

Technical field

the utility model relates to a kind of LED chip packaging body, belongs to LED chip packaging body technical field.

Background technology

the Chinese meaning is light-emitting diode) be a kind of semiconductor that can be luminous energy by electric energy conversion, it has changed the luminous principle luminous with electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and adopts electroluminescence.LED and ordinary incandescent lamp, spiral energy-saving lamp and T5 three-color fluorescent lamp are contrasted, result shows: the light efficiency of ordinary incandescent lamp is 12lm/W, life-span is less than 2000 hours, the light efficiency of spiral energy-saving lamp is 60lm/W, life-span is less than 8000 hours, T5 fluorescent lamp is 96lm/W, and the life-span is approximately 10000 hours.And the white light LEDs light efficiency that diameter is 5 millimeters can exceed 150lm/W in theory, the life-span can be greater than 100000 hours.

learn from progressively eliminating incandescent lamp route map news briefing, National Development and Reform Commission, Department of Commerce, General Administration of Customs, State Administration for Industry & Commerce, State General Administration for Quality Supervision combine and have printed and distributed " about nonimportation progressively and sell the bulletin of ordinary lighting incandescent lamp "." bulletin " determined from 1 day October in 2012, according to watt level progressively nonimportation and sale ordinary lighting incandescent lamp stage by stage.

china is the production and consumption big country of illuminating product, and electricity-saving lamp, incandescent lamp output all occupy first place in the world, and incandescent lamp output in 2010 and domestic sales volume are respectively 38.5 hundred million and 10.7 hundred million.According to measuring and calculating, Chinese electric consumption on lighting accounts for 12% left and right of Analyzing Total Electricity Consumption, adopts efficient illumination products substitution incandescent lamp, and energy-saving and emission-reduction have a high potential.Progressively eliminate incandescent lamp, for promoting Chinese electric lighting industrial structure optimization and upgrading, promote to realize " 12 " target for energy-saving and emission-reduction task, to respond actively Global climate change significant.Force in market needs us to accelerate the development to ripe LED product.

(light-emitting diode) encapsulation refers to the encapsulation of luminescence chip, and comparing integrated antenna package has relatively big difference.The encapsulation of LED not only requirement can be protected wick, but also want can printing opacity.So the encapsulation of LED has special requirement to encapsulating material.

the selection of method for packing, material, structure and technique is mainly by chip structure, photoelectricity/mechanical property, specifically the factor such as application and cost determines.Through the development of more than 40 years, the developing stage such as stent-type (Lamp LED), SMD (SMD LED), power-type LED (Power LED) were successively experienced in LED encapsulation.Along with the increase of chip power, the particularly demand of solid-state illumination technical development, has proposed new, higher requirement to optics, calorifics, electricity and the mechanical structure etc. of LED encapsulation.In order effectively to reduce packaging thermal resistance, improve light extraction efficiency, must adopt brand-new technical thought to carry out package design.

high-power LED encapsulation is due to structure and complex process, and serviceability and the life-span, particularly large power white light LED that directly have influence on LED encapsulate the focus in study hotspot especially.The function of LED encapsulation mainly comprises: 1. mechanical protection, to improve reliability; 2. strengthen heat radiation, to reduce junction temperature of chip, improve LED performance; 3. optics control, improves light extraction efficiency, optimizes beam distribution; 4. power supply management, comprises that ac/dc changes, and power supply control etc.But the LED chip after how making us encapsulate reaches optimum efficiency, it is the most important thing of continuous input research in industry always.

Summary of the invention

the utility model provides a kind of novel LED chip packaging body, comprise patterned transparent glass substrate, the sputter conductor wire on transparent glass substrate, and be arranged at the LED chip on conductor wire, two electrodes of LED chip are fixed on transparent glass substrate by tin cream and electrically conduct with conductor wire, LED chip is inverted on transparent glass substrate, two electrodes of LED chip are filled up its difference in height by tin cream, and fixing by the tin cream on LED chip electrode and the cohesion of the tin cream on transparent glass substrate conductor wire.LED chip package body structure of the present utility model is simple, and technique is easy to realize.The utility model LED chip package body structure is similar to COB encapsulation, but differ from COB encapsulation, be different from the metal substrate of COB encapsulation, the utility model is luminous by utilizing transparency carrier to realize LED chip full angle, has further improved the light extraction efficiency of LED chip on traditional LED encapsulation technology basis.Difference is prepared with the circuit of COB encapsulation, the utility model utilizes direct sputter conductor wire on transparency carrier, realizing chip electrically conducts, and directly the electrode on LED chip and conductor wire are fixed bonding by tin cream, not only realize the fixing of chip, and also make chip realize and electrically conduct, thereby removed the some gold thread link in traditional handicraft from, not only saved technique and more saved cost.

the transparency carrier of LED chip packaging body described in the utility model can be selected from transparent sapphire substrate, transparent glass substrate, transparent ceramic substrate etc., preferably clear glass substrate, more preferably patterned transparent glass substrate.

conductor wire on the transparency carrier of the LED chip packaging body described in the utility model, for being directly used in electrically conducting of LED chip, the conductor wire of sputter on transparency carrier is mutual disconnection, not conducting mutually at fixed chip place.For making chip light-emitting efficiency reach best, preferably at chip place only chip electrode corresponding position sputter conductor wire, all sputter conductor wires not of other positions corresponding to chip.

conductor wire on the transparency carrier of the LED chip packaging body described in the utility model, is realized and being electrically conducted by chip between adjacent wires.

lED chip packaging body described in the utility model LED chip used is positive cartridge chip or flip-chip, but is easy to realize angle from cost and technique, and we more preferably select to utilize positive cartridge chip.

lED chip packaging body described in the utility model, described LED chip is inverted on transparency carrier, because the N utmost point on LED chip prepares by chip being etched to N layer, so the LED chip P utmost point and the N utmost point be not on same horizontal plane, but for LED chip can be flat on substrate, two electrodes of LED chip are filled up its difference in height by tin cream, and fixing by the tin cream on LED chip electrode and the cohesion of the tin cream on transparency carrier conductor wire.

excited completely by fluorescent material for making the LED chip packaging body described in the utility model go out luminous energy, LED chip packaging body of the present utility model further comprises the fluorescent adhesive layer that is coated on chip and transparency carrier surface, for the light that excites LED chip packaging body to send.

Brief description of the drawings

accompanying drawing of the present utility model is for the utility model is further illustrated, but not restriction to invention scope of the present utility model.

fig. 1, the utility model list chips LED chip packaging body generalized section.

fig. 2, the utility model LED chip packaging body cut-away section schematic diagram.

fig. 3, the utility model sheet-shaped LED chip packing-body schematic top plan view.

fig. 4, the thread LED chip packaging body of the utility model schematic top plan view.

1, LED chip, 2, LED chip electrode, 3, tin cream, 4, conductor wire, 5, transparency carrier, 6, fluorescent glue.

Embodiment

embodiment of the present utility model is for the utility model is further illustrated, but not restriction to invention scope of the present utility model.

Embodiment

for LED chip bright dipping is not stopped, we choose the substrate of transparent glass substrate as our packaging LED chips, choose the positive cartridge chip of LED, for make between LED chip and and power supply between electrically conduct, the position that we will paste according to the LED chip amount that will use and LED chip, the copper conducting wire figure of sputter on transparent glass substrate, sputter continues to be heated to 200 DEG C behind complete copper conducting wire, after making copper circuit surface form protective oxide layer, on the figure of conducting wire, pass through tin cream fixed L ED chip, for preventing that LED chip from departing from conductor wire sticking in LED chip in transparency carrier process, the present invention for the tin cream of fixed L ED chip be first respectively on the figure of conducting wire by corresponding fixed L ED chip electrode location point tin cream, and on LED chip electrode also on tin cream, and the tin cream on electrode fill up P the difference in height of N electrode, by making conducting wire figure, tin cream on LED chip electrode makes the tin cream cohesion fusion of two places through Reflow Soldering heating, realizing LED chip and conductor wire pastes fixing and can electrically conduct, finally at chip and transparency carrier surface-coated fluorescent glue, completed the preparation of LED chip packaging body.

Claims

1. a LED chip packaging body, it is characterized in that comprising patterned transparent glass substrate, the sputter conductor wire on transparent glass substrate, and be arranged at the LED chip on conductor wire, two electrodes of LED chip are fixed on transparent glass substrate by tin cream and electrically conduct with conductor wire, LED chip is inverted on transparent glass substrate, two electrodes of LED chip are filled up its difference in height by tin cream, and fixing by the tin cream on LED chip electrode and the cohesion of the tin cream on transparent glass substrate conductor wire.

2. LED chip packaging body according to claim 1, it is characterized in that adjacent conductive line by between LED chip realize electrically conduct.

3. LED chip packaging body according to claim 1 and 2, is characterized in that described LED chip packaging body further comprises fluorescent adhesive layer, is coated on LED chip and transparent glass substrate surface.