CN205606201U - Novel LED filament - Google Patents
Novel LED filament Download PDFInfo
- Publication number
- CN205606201U CN205606201U CN201620115987.6U CN201620115987U CN205606201U CN 205606201 U CN205606201 U CN 205606201U CN 201620115987 U CN201620115987 U CN 201620115987U CN 205606201 U CN205606201 U CN 205606201U
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- China
- Prior art keywords
- led
- light source
- led chip
- silica gel
- substrate
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- Led Device Packages (AREA)
Abstract
The utility model relates to a novel LED filament adopts a bar base plate, and the word arrangement of LED chip is connected with the gold thread between the chip, with the direct suit of phosphor powder silicone tube outside above -mentioned light source. Extrude technology through the silica gel that thoughtlessly has phosphor powder and make and contain can be by the hollow tube of blue light LED fluorescence excitation powder, can direct suit on bar LED strip light source, of the subtracting production technology, efficient, practiced thrift the production time, luminous even simultaneously, ageing performance is good.
Description
Technical field
This utility model relates to LED illumination lamp, particularly relates to a kind of LED filament, belongs to technical field of LED illumination.
Background technology
LED is developed so far, and has realized the marketization significantly, and LED lamp, because of its special principle of luminosity, has a lot at present
Plant illumination mode.LED filament is exactly one therein, its good heat dissipation, and light efficiency is high, can achieve 360 ° of full angle luminescences,
And good looking appearance, production efficiency is high, is a kind of novel solid light source.
A kind of mode the most universal in the market is the LED lamp bead that SMD encapsulates to be welded on aluminum base circuit board, although conventional
Aluminium base heat can be derived, but Copper Foil therein and thermally conductive insulating layer have certain thermal resistance, passage of heat is not
Completely metallized, heat can not be derived completely.Chinese patent CN201964199 (title: a kind of LEDbulb lamp) is by LED
Light source and printed circuit board (PCB) weld horizontal on a heat sink, become the internal structure of bulb lamp, although can be formed well
Heat dissipation channel, but general lighting angle is less than 120 degree, and even if cover is upper expands light lampshade, the whole lamp of LEDbulb lamp is also impossible to reach
To 180 degree, side is penetrated almost without light.LED filament lamp is suggested as a kind of new illuminating product form, and it illuminates effect
Fruit is similar to electric filament lamp in tradition, is easily accepted by people, and it is all conducted in-depth research by the most a lot of units, China
The surface of patent ZL201320681651 (title: a kind of LED filament) each LED chip covers fluorescent material adhesive tape, also includes band
Casting glue described in the casting glue of spread powder is had substrate and fluorescent material adhesive tape to be wrapped.The technics comparing of this mode is complicated.Produce
Efficiency is low.Chinese patent CN203656666U (title: a kind of LED with electric filament lamp tungsten filament structure), fluorescent material is by tree
Fat is bonded in chip surface.Bonding required hardening time is long, and production efficiency ratio is relatively low.
Summary of the invention
For the defect of above-mentioned prior art, in order to expand the application of LED, this patent squeezes by being mixed with the silica gel of fluorescent material
Go out technique to make containing can be directly sleeved on bar-shaped LED strip source by the hollow pipe of blue-ray LED excitated fluorescent powder, simplify
Production technology, efficiency is high, has saved the production time, and the most luminous uniform, ageing properties is good.
Light source of the present utility model uses a kind of bar shaped substrate, chip word order, connects with gold thread between chip.By fluorescent material
Silica gel tube is directly sleeved on outside above-mentioned light source.
The technical solution of the utility model is:
A kind of New LED filament, its structure includes LED light source and fluorescent powder silica gel pipe;Described fluorescent powder silica gel pipe box is contained in LED
On light source;
Wherein LED light source includes LED chip group, gold thread, substrate and electrode;
Described substrate is glass, pottery or sapphire;Described LED chip group two ends connect two electrodes respectively;Described electrode
It is separately positioned on the two ends of substrate;
In described LED chip group, LED chip number is 8~20, for blue light, red LED chip or the two is alternately arranged,
It is fixed on substrate in line style, passes sequentially through gold thread between LED chip and connect;
The material of described fluorescent powder silica gel pipe is high-temperature silicon disulfide rubber resin, its uniform wall thickness, and thickness is 0.5~1mm, length
Cut out as equal with zig.
The utility model has the advantage of: need not encapsulate fluorescent material, but the fluorescent material silicon cut in advance in LED chip
Glue pipe socket is contained on LED light source.Production efficiency is high, and good product consistency, heat resistant performance is excellent, and illuminant color can be more
Change, luminous uniform.
Accompanying drawing explanation
Fig. 1. this utility model structural representation;
Wherein, 1, substrate;2, LED chip;3, anelectrode;4, negative electrode;5, fluorescent powder silica gel pipe.
Detailed description of the invention
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Embodiment 1
With reference to Fig. 1, the New LED filament of the present embodiment, its structure includes LED light source and fluorescent powder silica gel pipe;Described fluorescence
Powder silica gel tube is sleeved on LED light source;Wherein LED light source includes LED chip group, gold thread, substrate and electrode;
In described LED chip group, 8 blue-light LED chips are that line style is fixing on the glass substrate, pass sequentially through between LED chip
Gold thread connects;Described LED chip group two ends connect two electrodes respectively;Described electrode is separately positioned on the two ends of substrate;
The material of described fluorescent powder silica gel pipe is high-temperature silicon disulfide rubber resin, its uniform wall thickness, and thickness is 0.5mm, and length is cut
Cut out as equal with zig.After suit fluorescent powder silica gel pipe, the colour temperature of LED filament is 3000k.
Embodiment 2
The New LED filament of the present embodiment, its structure includes LED light source and fluorescent powder silica gel pipe;Described fluorescent powder silica gel pipe box
It is contained on LED light source;Wherein LED light source includes LED chip group, gold thread, substrate and electrode;
In described LED chip group, 8 blue-light LED chips and 8 red LED chips are alternately fixed on sapphire substrate in line style
On, pass sequentially through gold thread between LED chip and connect;Described LED chip group two ends connect two electrodes respectively;Described electrode divides
It is not arranged on the two ends of substrate;
The material of described fluorescent powder silica gel pipe is high-temperature silicon disulfide rubber resin, its uniform wall thickness, and thickness is 0.5mm, and length is cut
Cut out as equal with zig.After suit fluorescent powder silica gel pipe, the colour temperature of LED filament is 3000k.
Embodiment 3
The New LED filament of the present embodiment, its structure includes LED light source and fluorescent powder silica gel pipe;Described fluorescent powder silica gel pipe box
It is contained on LED light source;Wherein LED light source includes LED chip group, gold thread, substrate and electrode;
In described LED chip group, 20 blue-light LED chips are that line style is fixed on ceramic substrate, pass sequentially through between LED chip
Gold thread connects;Described LED chip group two ends connect two electrodes respectively;Described electrode is separately positioned on the two ends of substrate;
The material of described fluorescent powder silica gel pipe is high-temperature silicon disulfide rubber resin, its uniform wall thickness, and thickness is 1mm, and length is cut out
For equal with zig.After suit fluorescent powder silica gel pipe, the colour temperature of LED filament is 2700k.
Embodiment 4
The New LED filament of the present embodiment, its structure includes LED light source and fluorescent powder silica gel pipe;Described fluorescent powder silica gel pipe box
It is contained on LED light source;Wherein LED light source includes LED chip group, gold thread, substrate and electrode;
In described LED chip group, 10 blue-light LED chips are that line style is fixed on sapphire substrate, lead to successively between LED chip
Cross gold thread to connect;Described LED chip group two ends connect two electrodes respectively;Described electrode is separately positioned on the two ends of substrate;
The material of described fluorescent powder silica gel pipe is high-temperature silicon disulfide rubber resin, its uniform wall thickness, and thickness is 1mm, length
Cut out as equal with zig.After suit fluorescent powder silica gel pipe, the colour temperature of LED filament is 2700k.
Claims (2)
1. a New LED filament, its structure includes LED light source and fluorescent powder silica gel pipe;Described fluorescent powder silica gel
Pipe box is contained on LED light source;
Wherein LED light source includes LED chip group, gold thread, substrate and electrode;
Described substrate is glass, pottery or sapphire;Described LED chip group two ends connect two electrodes respectively;
Described electrode is separately positioned on the two ends of substrate;
In described LED chip group, LED chip number is 8~20, for blue light, red LED chip or the two
Alternately arranged, it is fixed on substrate in line style, passes sequentially through gold thread between LED chip and connect.
2. New LED filament as claimed in claim 1, it is characterised in that the material of described fluorescent powder silica gel pipe
For high-temperature silicon disulfide rubber resin, its uniform wall thickness, wall thickness is 0.5~1mm, and length is equal with zig.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620115987.6U CN205606201U (en) | 2016-01-28 | 2016-01-28 | Novel LED filament |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620115987.6U CN205606201U (en) | 2016-01-28 | 2016-01-28 | Novel LED filament |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205606201U true CN205606201U (en) | 2016-09-28 |
Family
ID=56961510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620115987.6U Expired - Fee Related CN205606201U (en) | 2016-01-28 | 2016-01-28 | Novel LED filament |
Country Status (1)
Country | Link |
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CN (1) | CN205606201U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107275320A (en) * | 2017-08-15 | 2017-10-20 | 陈广明 | High-temperature-resistant LED light source |
CN107742668A (en) * | 2017-10-07 | 2018-02-27 | 谭瑞银 | Easily changeable LED |
-
2016
- 2016-01-28 CN CN201620115987.6U patent/CN205606201U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107275320A (en) * | 2017-08-15 | 2017-10-20 | 陈广明 | High-temperature-resistant LED light source |
WO2019033561A1 (en) * | 2017-08-15 | 2019-02-21 | 陈广明 | High temperature resistant led light source |
CN107742668A (en) * | 2017-10-07 | 2018-02-27 | 谭瑞银 | Easily changeable LED |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20190128 |