CN105140378A - LED package structure and technology employing glass fluorescence sheet - Google Patents

LED package structure and technology employing glass fluorescence sheet Download PDF

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Publication number
CN105140378A
CN105140378A CN201510586216.5A CN201510586216A CN105140378A CN 105140378 A CN105140378 A CN 105140378A CN 201510586216 A CN201510586216 A CN 201510586216A CN 105140378 A CN105140378 A CN 105140378A
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CN
China
Prior art keywords
glass
led
fluorescent sheet
glass fluorescent
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510586216.5A
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Chinese (zh)
Inventor
张俊福
申崇渝
孙国喜
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Shineon Beijing Technology Co Ltd
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Shineon Beijing Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shineon Beijing Technology Co Ltd filed Critical Shineon Beijing Technology Co Ltd
Priority to CN201510586216.5A priority Critical patent/CN105140378A/en
Publication of CN105140378A publication Critical patent/CN105140378A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention discloses a LED package structure employing a glass fluorescence sheet. The LED package structure employing a glass fluorescence sheet comprises a glass fluorescence sheet, the glass fluorescence sheet is covered with fixed crystal glue, LED chips are fixed on the fixed crystal glue, and gaps between the LED chips are filled with filling glues. According to the LED package structure employing the glass fluorescence sheet, the luminescent materials and the glass are uniformly mixed together to form the glass fluorescence sheet, and the LED package is realized by employing good oxygen isolation and humidty isolation functions of the glass, therefore the problem of isolating the oxygen and the water vapor in the process of the LED package is solved, and the steps of the LED package are greatly simplified so as to effectively improve the production efficiency and the yield rate and the consistency of products.

Description

LED packaging structure and process adopting glass fluorescent sheet
Technical Field
The invention relates to an LED packaging structure and a process, in particular to an LED packaging structure and a process adopting a glass fluorescent sheet.
Background
At present, white light LEDs are packaged by using transparent silica gel and fluorescent powder, and there are three types of silica gel dispensing methods, namely dispensing, potting and molding. The three modes have the problems of silica gel yellowing, high-temperature cracking, no curing in case of sulfur and the like, and because the LED fluorescent powder and the bracket silvered reflecting layer are easy to be oxidized to cause light attenuation, how to adopt a simple method to completely isolate water vapor and the like in air has great significance for the LED. In addition, gold wires are easily broken due to the influence of thermal expansion and cold contraction of the silica gel and the support, the defects occur, the concentration ratio of the LED prepared by a dispensing mode is dispersed due to the reasons of fluorescent powder precipitation, uneven mixing, bubbles and the like, and the current LED packaging needs too many factors to be controlled, so that the technological requirement is strict, and the defects occur easily. Meanwhile, the cost of the LED light source package is difficult to reduce in the current process mode, and the LED cost is greatly reduced by means of a simplified LED package process and a package process innovation.
Disclosure of Invention
The invention mainly solves the technical problems in the prior art, and provides a cam deburring method and a cam deburring device.
The technical problem of the invention is mainly solved by the following technical scheme:
the invention provides a glass fluorescent sheet which is formed by mixing and sintering fluorescent powder and glass.
As a preferred embodiment of the invention, the thickness of the glass fluorescent sheet ranges from 75um to 200 um.
The invention also provides an LED packaging process adopting the glass fluorescent sheet, which comprises the following steps:
a) preparing the glass fluorescent sheet;
b) coating the glass fluorescent sheet with a die bond adhesive by using a mask on the glass fluorescent sheet;
c) fixing an LED chip on the glass fluorescent sheet coated with the die attach adhesive;
d) filling the gaps among the LED chips with filling glue;
e) baking and curing;
f) and cutting.
As a preferred embodiment of the invention, the LED chip is inversely arranged on the glass fluorescent sheet.
As a preferred embodiment of the invention, the thickness of the glass fluorescent sheet ranges from 75um to 200 um.
As a preferred embodiment of the present invention, the LED chip is a flip chip.
The invention also provides an LED packaging structure adopting the glass fluorescent sheet, which comprises the glass fluorescent sheet, wherein the glass fluorescent sheet is coated with a die bonding adhesive, LED chips are fixed above the die bonding adhesive, and filling adhesive is filled in gaps among the LED chips.
As a preferred embodiment of the present invention, the LED chip is flip-chip mounted on the die attach adhesive.
As a preferred embodiment of the invention, the thickness of the glass fluorescent sheet ranges from 75um to 200 um.
As a preferred embodiment of the present invention, the LED chip is a flip chip.
According to the LED packaging structure adopting the glass fluorescent sheet, the luminescent material and the glass are uniformly mixed together to prepare the glass fluorescent sheet, and the LED is packaged by utilizing the good oxygen and moisture isolation function of the glass, so that the problem of isolating oxygen and water vapor in the LED packaging process can be solved, the LED packaging step can be greatly simplified, and the production efficiency, the product yield and the consistency are effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an LED package structure using a glass fluorescent sheet according to the present invention;
FIG. 2 is a schematic process diagram of a portion of the LED package structure of FIG. 1 using a glass phosphor plate;
wherein,
1. an LED package structure; 2. a glass fluorescent sheet; 3. die bonding glue; 4. an LED chip; 5. and filling glue.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention will be more clearly and clearly defined.
As shown in fig. 1, the LED package structure 1 using the glass fluorescent sheet includes a glass fluorescent sheet 2, a die attach adhesive 3 is coated on the glass fluorescent sheet 2, an LED chip 4 is fixed above the die attach adhesive 3, the LED chip 4 is inversely mounted above the die attach adhesive 3, and a filling adhesive 5 is filled in a gap between the LED chips 4. It should be noted that, during the coating of the die attach adhesive 3, a patterned mask or a mask sheet or the like needs to be used to implement the patterned coating of the die attach adhesive. The filling glue can act as optical reflection or block light, and can be made of different materials, such as TiO2Reflective white glue of (1), and the like.
The glass fluorescent sheet 2 is a specially made glass material, and is generally formed by mixing and sintering fluorescent powder and glass, and the thickness range is 75um-200 um. Of course, other thickness dimensions are possible. In addition, in addition to the phosphor, other luminescent materials such as quantum dots may be mixed into the positive glass, for example, a luminescent material having an excitation wavelength of 360nm to 500nm and an emission wavelength of 400nm to 760 nm. Especially, the quantum dot material can not only improve the light color performance of the traditional LED, but also obviously improve the color reduction capability of the LED, and even can reach 110% of NTSC in the backlight field.
The LED packaging process using the glass fluorescent sheet is described below, and as shown in fig. 2, the process includes the following steps:
a) preparing a glass fluorescent sheet 2;
b) coating a die bond adhesive 3 on the glass fluorescent sheet 2 by using a mask;
c) fixing an LED chip 4 on the glass fluorescent sheet 2 coated with the die bonding glue 3;
d) filling glue 5 is filled in gaps among the LED chips 4;
e) baking and curing;
f) and cutting.
In addition, the subsequent steps may also include testing, packaging and the like. Note that, as used herein, the LED chip 4 is a flip chip. Generally, LED chips are classified into a horizontal structure, a vertical structure, and a flip structure, according to their structures. When the die bonding is carried out, the flip chip needs to be overturned to be fixed on the glass fluorescent sheet because the light-emitting surface of the flip chip is on the front surface, and the flip chip needs to be overturned to carry out the die bonding operation in the process flow.
The LED packaging structure and the process adopting the glass fluorescent sheet have the following advantages that:
1. due to the adoption of the mode of combining the chip-scale packaging with the glass fluorescent sheet, the current LED packaging process is greatly simplified, the stability and uniformity problems of products are improved, the LED production can be completed by only 6 simple steps, the product yield is greatly improved, and the cost is greatly reduced. In addition, the method saves glue preparation and repeated glue amount preparation processes, so that the glue dispensing operation time in the LED packaging process can be greatly shortened, even reaches more than 50%, and the production efficiency is remarkably improved. In addition, the invention reduces the stock of the raw materials for LED packaging to the utmost, can realize the customized requirements of different customers by only preparing 4 direct materials, and greatly reduces the requirements of the storage environment and the storage cost of the raw materials of the LED.
2. The use of such packaging techniques allows the LED to be more flexible in its dimensioning, no longer subject to the raw material production limitations of multiple suppliers.
3. At present, materials such as silica gel or epoxy resin are adopted in the LED industry to package LEDs, and chemical materials such as silica gel and epoxy resin have high-temperature yellowing risk. Due to the characteristics of high temperature resistance, no color change and the like of the glass, the packaging yield of the LED is improved, and the service life of the LED light source can be prolonged. Because routing and a bracket are omitted in the process, the reliability of the LED light source is greatly improved, and the defects caused by gold thread breakage and yellowing of the bracket and silica gel do not exist. Because routing and a bracket are omitted, the equipment cost and the labor cost are reduced, and the comprehensive cost is reduced by at least 30%.
4. For the LED produced by the traditional dispensing mode, the viscosity of the silica gel is changed to be viscous along with the change of time, and the silica gel needs a certain time for curing, so that the fluorescent powder in the silica gel is precipitated, the concentration of a light source is reduced, and the yield is reduced. In addition, in the conventional LED packaging, glue amount allocation needs to be repeated for many times during glue dispensing, so that the process is complex, variable factors are large, the efficiency is low and the like. Meanwhile, the glue dispensing amount is influenced by factors such as air source stability, glue amount change in the needle cylinder, temperature change, needle head glue carrying, inaccurate glue dispensing time and the like, so that the glue dispensing amount is unstable, and the yield of products is reduced. The fluorescent powder is not sealed by silica gel any more, but the fluorescent powder material or the quantum dot material is directly mixed and sintered into the glass to form the glass fluorescent sheet, and the glass sheet is used for packaging the light source instead of the traditional silica gel mixed fluorescent powder mode, so that the problem of isolating oxygen and water vapor in the traditional LED packaging process is solved, and the fluorescent powder precipitation phenomenon when the silica gel is cured in the current silica gel and fluorescent powder scheme is also effectively avoided.
5. The glue surface of the traditional LED is difficult to achieve an ideal flat glue surface, and is usually concave, so that the central brightness of an LED light source is low, the light distribution is influenced, and the consistency is poor. The LED packaging structure adopting the glass fluorescent sheet thoroughly solves the problem of concave, the central brightness of the LED light source is improved, the light distribution is uniform, and the consistency is good.
6. The transmittance of the glass is higher than that of silica gel, the fluorescent powder is not easy to change after the glass seeds are uniformly mixed and sintered, the color space distribution and the luminescence of light are more uniform, and the light-emitting efficiency is higher. The optical performance of the LED is improved.
7. Since the glass phosphor sheet can be cut without loss, the LED package will be reduced by at least 60% loss.
Without being limited thereto, any changes or substitutions that are not thought of through the inventive work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims (10)

1. The glass fluorescent sheet is characterized in that the glass fluorescent sheet (2) is formed by mixing and sintering fluorescent powder and glass.
2. The glass phosphor plate according to claim 1, wherein the thickness of the glass phosphor plate (2) is in the range of 75um to 200 um.
3. An LED packaging process adopting a glass fluorescent sheet is characterized by comprising the following steps:
a) preparing a glass phosphor sheet (2) as defined in claim 1;
b) coating a crystal fixing glue (3) on the glass fluorescent sheet (2) by using a mask;
c) fixing an LED chip (4) on the glass fluorescent sheet (2) coated with the die bonding glue (3);
d) filling glue (5) is filled into gaps among the LED chips (4);
e) baking and curing;
f) and cutting.
4. The LED packaging process using the glass fluorescent sheet as claimed in claim 3, wherein the LED chip (4) is flip-chip mounted on the glass fluorescent sheet (2).
5. The LED packaging process using the glass fluorescent sheet as claimed in claim 3 or 4, wherein the thickness of the glass fluorescent sheet (2) is in the range of 75um-200 um.
6. The LED packaging process adopting the glass fluorescent sheet as claimed in claim 5, wherein the LED chip (4) is a flip chip.
7. The LED packaging structure with the glass fluorescent sheet is characterized in that the LED packaging structure (1) with the glass fluorescent sheet comprises the glass fluorescent sheet (2) as claimed in claim 1, a die bonding adhesive (3) is coated on the glass fluorescent sheet (2), LED chips (4) are fixed above the die bonding adhesive (3), and filling adhesive (5) is filled in gaps among the LED chips (4).
8. The LED packaging structure adopting the glass fluorescent sheet as claimed in claim 7, wherein the LED chip (4) is flip-chip mounted on the die attach adhesive (3).
9. The LED packaging structure adopting the glass fluorescent sheet as claimed in claim 7 or 8, wherein the thickness of the glass fluorescent sheet (2) is in the range of 75um-200 um.
10. The LED package structure with glass phosphor plate as defined in claim 9, wherein said LED chip (4) is a flip chip.
CN201510586216.5A 2015-09-15 2015-09-15 LED package structure and technology employing glass fluorescence sheet Pending CN105140378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510586216.5A CN105140378A (en) 2015-09-15 2015-09-15 LED package structure and technology employing glass fluorescence sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510586216.5A CN105140378A (en) 2015-09-15 2015-09-15 LED package structure and technology employing glass fluorescence sheet

Publications (1)

Publication Number Publication Date
CN105140378A true CN105140378A (en) 2015-12-09

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106981557A (en) * 2017-04-07 2017-07-25 光创空间(深圳)技术有限公司 The method for packing and encapsulating structure of a kind of optoelectronic semiconductor chip
CN108447963A (en) * 2018-04-28 2018-08-24 中国人民大学 A kind of the CSP light-source structures and preparation method of crystallo-luminescence
CN108490689A (en) * 2018-04-11 2018-09-04 陈官海 A kind of LED backlight light source and preparation method thereof of ultra-thin specular removal
CN108735879A (en) * 2018-07-26 2018-11-02 易美芯光(北京)科技有限公司 A kind of SMD encapsulating structures containing quantum dot

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102442781A (en) * 2010-09-30 2012-05-09 惠州晶宝光电科技有限公司 LED packaging material, preparation method and application thereof
CN102709445A (en) * 2012-06-02 2012-10-03 王双喜 Light-emitting diode (LED) packaging structure with fluorescent glass layer
CN102723424A (en) * 2012-05-25 2012-10-10 苏州晶品光电科技有限公司 Method for preparing fluorescent wafer for LED (light-emitting diode)
CN102730980A (en) * 2012-07-04 2012-10-17 张国生 High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof
CN102969435A (en) * 2012-12-04 2013-03-13 深圳市优信光科技有限公司 LED (Light-Emitting Diode) with sapphire substrate inversion structure
TW201532316A (en) * 2014-02-07 2015-08-16 Achrolux Inc Package structure and manufacturing method thereof
CN205104517U (en) * 2015-09-15 2016-03-23 易美芯光(北京)科技有限公司 Adopt LED packaging structure of glass fluorescence piece

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102442781A (en) * 2010-09-30 2012-05-09 惠州晶宝光电科技有限公司 LED packaging material, preparation method and application thereof
CN102723424A (en) * 2012-05-25 2012-10-10 苏州晶品光电科技有限公司 Method for preparing fluorescent wafer for LED (light-emitting diode)
CN102709445A (en) * 2012-06-02 2012-10-03 王双喜 Light-emitting diode (LED) packaging structure with fluorescent glass layer
CN102730980A (en) * 2012-07-04 2012-10-17 张国生 High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof
CN102969435A (en) * 2012-12-04 2013-03-13 深圳市优信光科技有限公司 LED (Light-Emitting Diode) with sapphire substrate inversion structure
TW201532316A (en) * 2014-02-07 2015-08-16 Achrolux Inc Package structure and manufacturing method thereof
CN205104517U (en) * 2015-09-15 2016-03-23 易美芯光(北京)科技有限公司 Adopt LED packaging structure of glass fluorescence piece

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106981557A (en) * 2017-04-07 2017-07-25 光创空间(深圳)技术有限公司 The method for packing and encapsulating structure of a kind of optoelectronic semiconductor chip
CN108490689A (en) * 2018-04-11 2018-09-04 陈官海 A kind of LED backlight light source and preparation method thereof of ultra-thin specular removal
CN108447963A (en) * 2018-04-28 2018-08-24 中国人民大学 A kind of the CSP light-source structures and preparation method of crystallo-luminescence
CN108735879A (en) * 2018-07-26 2018-11-02 易美芯光(北京)科技有限公司 A kind of SMD encapsulating structures containing quantum dot

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