CN105140378A - LED package structure and technology employing glass fluorescence sheet - Google Patents
LED package structure and technology employing glass fluorescence sheet Download PDFInfo
- Publication number
- CN105140378A CN105140378A CN201510586216.5A CN201510586216A CN105140378A CN 105140378 A CN105140378 A CN 105140378A CN 201510586216 A CN201510586216 A CN 201510586216A CN 105140378 A CN105140378 A CN 105140378A
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- China
- Prior art keywords
- glass
- led
- fluorescent sheet
- glass fluorescent
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011521 glass Substances 0.000 title claims abstract description 76
- 239000003292 glue Substances 0.000 claims abstract description 25
- 238000011049 filling Methods 0.000 claims abstract description 10
- 239000013078 crystal Substances 0.000 claims abstract 3
- 238000004806 packaging method and process Methods 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 13
- 238000012858 packaging process Methods 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000002955 isolation Methods 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 239000000741 silica gel Substances 0.000 description 15
- 229910002027 silica gel Inorganic materials 0.000 description 15
- 230000007547 defect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000002096 quantum dot Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013070 direct material Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention discloses a LED package structure employing a glass fluorescence sheet. The LED package structure employing a glass fluorescence sheet comprises a glass fluorescence sheet, the glass fluorescence sheet is covered with fixed crystal glue, LED chips are fixed on the fixed crystal glue, and gaps between the LED chips are filled with filling glues. According to the LED package structure employing the glass fluorescence sheet, the luminescent materials and the glass are uniformly mixed together to form the glass fluorescence sheet, and the LED package is realized by employing good oxygen isolation and humidty isolation functions of the glass, therefore the problem of isolating the oxygen and the water vapor in the process of the LED package is solved, and the steps of the LED package are greatly simplified so as to effectively improve the production efficiency and the yield rate and the consistency of products.
Description
Technical Field
The invention relates to an LED packaging structure and a process, in particular to an LED packaging structure and a process adopting a glass fluorescent sheet.
Background
At present, white light LEDs are packaged by using transparent silica gel and fluorescent powder, and there are three types of silica gel dispensing methods, namely dispensing, potting and molding. The three modes have the problems of silica gel yellowing, high-temperature cracking, no curing in case of sulfur and the like, and because the LED fluorescent powder and the bracket silvered reflecting layer are easy to be oxidized to cause light attenuation, how to adopt a simple method to completely isolate water vapor and the like in air has great significance for the LED. In addition, gold wires are easily broken due to the influence of thermal expansion and cold contraction of the silica gel and the support, the defects occur, the concentration ratio of the LED prepared by a dispensing mode is dispersed due to the reasons of fluorescent powder precipitation, uneven mixing, bubbles and the like, and the current LED packaging needs too many factors to be controlled, so that the technological requirement is strict, and the defects occur easily. Meanwhile, the cost of the LED light source package is difficult to reduce in the current process mode, and the LED cost is greatly reduced by means of a simplified LED package process and a package process innovation.
Disclosure of Invention
The invention mainly solves the technical problems in the prior art, and provides a cam deburring method and a cam deburring device.
The technical problem of the invention is mainly solved by the following technical scheme:
the invention provides a glass fluorescent sheet which is formed by mixing and sintering fluorescent powder and glass.
As a preferred embodiment of the invention, the thickness of the glass fluorescent sheet ranges from 75um to 200 um.
The invention also provides an LED packaging process adopting the glass fluorescent sheet, which comprises the following steps:
a) preparing the glass fluorescent sheet;
b) coating the glass fluorescent sheet with a die bond adhesive by using a mask on the glass fluorescent sheet;
c) fixing an LED chip on the glass fluorescent sheet coated with the die attach adhesive;
d) filling the gaps among the LED chips with filling glue;
e) baking and curing;
f) and cutting.
As a preferred embodiment of the invention, the LED chip is inversely arranged on the glass fluorescent sheet.
As a preferred embodiment of the invention, the thickness of the glass fluorescent sheet ranges from 75um to 200 um.
As a preferred embodiment of the present invention, the LED chip is a flip chip.
The invention also provides an LED packaging structure adopting the glass fluorescent sheet, which comprises the glass fluorescent sheet, wherein the glass fluorescent sheet is coated with a die bonding adhesive, LED chips are fixed above the die bonding adhesive, and filling adhesive is filled in gaps among the LED chips.
As a preferred embodiment of the present invention, the LED chip is flip-chip mounted on the die attach adhesive.
As a preferred embodiment of the invention, the thickness of the glass fluorescent sheet ranges from 75um to 200 um.
As a preferred embodiment of the present invention, the LED chip is a flip chip.
According to the LED packaging structure adopting the glass fluorescent sheet, the luminescent material and the glass are uniformly mixed together to prepare the glass fluorescent sheet, and the LED is packaged by utilizing the good oxygen and moisture isolation function of the glass, so that the problem of isolating oxygen and water vapor in the LED packaging process can be solved, the LED packaging step can be greatly simplified, and the production efficiency, the product yield and the consistency are effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an LED package structure using a glass fluorescent sheet according to the present invention;
FIG. 2 is a schematic process diagram of a portion of the LED package structure of FIG. 1 using a glass phosphor plate;
wherein,
1. an LED package structure; 2. a glass fluorescent sheet; 3. die bonding glue; 4. an LED chip; 5. and filling glue.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention will be more clearly and clearly defined.
As shown in fig. 1, the LED package structure 1 using the glass fluorescent sheet includes a glass fluorescent sheet 2, a die attach adhesive 3 is coated on the glass fluorescent sheet 2, an LED chip 4 is fixed above the die attach adhesive 3, the LED chip 4 is inversely mounted above the die attach adhesive 3, and a filling adhesive 5 is filled in a gap between the LED chips 4. It should be noted that, during the coating of the die attach adhesive 3, a patterned mask or a mask sheet or the like needs to be used to implement the patterned coating of the die attach adhesive. The filling glue can act as optical reflection or block light, and can be made of different materials, such as TiO2Reflective white glue of (1), and the like.
The glass fluorescent sheet 2 is a specially made glass material, and is generally formed by mixing and sintering fluorescent powder and glass, and the thickness range is 75um-200 um. Of course, other thickness dimensions are possible. In addition, in addition to the phosphor, other luminescent materials such as quantum dots may be mixed into the positive glass, for example, a luminescent material having an excitation wavelength of 360nm to 500nm and an emission wavelength of 400nm to 760 nm. Especially, the quantum dot material can not only improve the light color performance of the traditional LED, but also obviously improve the color reduction capability of the LED, and even can reach 110% of NTSC in the backlight field.
The LED packaging process using the glass fluorescent sheet is described below, and as shown in fig. 2, the process includes the following steps:
a) preparing a glass fluorescent sheet 2;
b) coating a die bond adhesive 3 on the glass fluorescent sheet 2 by using a mask;
c) fixing an LED chip 4 on the glass fluorescent sheet 2 coated with the die bonding glue 3;
d) filling glue 5 is filled in gaps among the LED chips 4;
e) baking and curing;
f) and cutting.
In addition, the subsequent steps may also include testing, packaging and the like. Note that, as used herein, the LED chip 4 is a flip chip. Generally, LED chips are classified into a horizontal structure, a vertical structure, and a flip structure, according to their structures. When the die bonding is carried out, the flip chip needs to be overturned to be fixed on the glass fluorescent sheet because the light-emitting surface of the flip chip is on the front surface, and the flip chip needs to be overturned to carry out the die bonding operation in the process flow.
The LED packaging structure and the process adopting the glass fluorescent sheet have the following advantages that:
1. due to the adoption of the mode of combining the chip-scale packaging with the glass fluorescent sheet, the current LED packaging process is greatly simplified, the stability and uniformity problems of products are improved, the LED production can be completed by only 6 simple steps, the product yield is greatly improved, and the cost is greatly reduced. In addition, the method saves glue preparation and repeated glue amount preparation processes, so that the glue dispensing operation time in the LED packaging process can be greatly shortened, even reaches more than 50%, and the production efficiency is remarkably improved. In addition, the invention reduces the stock of the raw materials for LED packaging to the utmost, can realize the customized requirements of different customers by only preparing 4 direct materials, and greatly reduces the requirements of the storage environment and the storage cost of the raw materials of the LED.
2. The use of such packaging techniques allows the LED to be more flexible in its dimensioning, no longer subject to the raw material production limitations of multiple suppliers.
3. At present, materials such as silica gel or epoxy resin are adopted in the LED industry to package LEDs, and chemical materials such as silica gel and epoxy resin have high-temperature yellowing risk. Due to the characteristics of high temperature resistance, no color change and the like of the glass, the packaging yield of the LED is improved, and the service life of the LED light source can be prolonged. Because routing and a bracket are omitted in the process, the reliability of the LED light source is greatly improved, and the defects caused by gold thread breakage and yellowing of the bracket and silica gel do not exist. Because routing and a bracket are omitted, the equipment cost and the labor cost are reduced, and the comprehensive cost is reduced by at least 30%.
4. For the LED produced by the traditional dispensing mode, the viscosity of the silica gel is changed to be viscous along with the change of time, and the silica gel needs a certain time for curing, so that the fluorescent powder in the silica gel is precipitated, the concentration of a light source is reduced, and the yield is reduced. In addition, in the conventional LED packaging, glue amount allocation needs to be repeated for many times during glue dispensing, so that the process is complex, variable factors are large, the efficiency is low and the like. Meanwhile, the glue dispensing amount is influenced by factors such as air source stability, glue amount change in the needle cylinder, temperature change, needle head glue carrying, inaccurate glue dispensing time and the like, so that the glue dispensing amount is unstable, and the yield of products is reduced. The fluorescent powder is not sealed by silica gel any more, but the fluorescent powder material or the quantum dot material is directly mixed and sintered into the glass to form the glass fluorescent sheet, and the glass sheet is used for packaging the light source instead of the traditional silica gel mixed fluorescent powder mode, so that the problem of isolating oxygen and water vapor in the traditional LED packaging process is solved, and the fluorescent powder precipitation phenomenon when the silica gel is cured in the current silica gel and fluorescent powder scheme is also effectively avoided.
5. The glue surface of the traditional LED is difficult to achieve an ideal flat glue surface, and is usually concave, so that the central brightness of an LED light source is low, the light distribution is influenced, and the consistency is poor. The LED packaging structure adopting the glass fluorescent sheet thoroughly solves the problem of concave, the central brightness of the LED light source is improved, the light distribution is uniform, and the consistency is good.
6. The transmittance of the glass is higher than that of silica gel, the fluorescent powder is not easy to change after the glass seeds are uniformly mixed and sintered, the color space distribution and the luminescence of light are more uniform, and the light-emitting efficiency is higher. The optical performance of the LED is improved.
7. Since the glass phosphor sheet can be cut without loss, the LED package will be reduced by at least 60% loss.
Without being limited thereto, any changes or substitutions that are not thought of through the inventive work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (10)
1. The glass fluorescent sheet is characterized in that the glass fluorescent sheet (2) is formed by mixing and sintering fluorescent powder and glass.
2. The glass phosphor plate according to claim 1, wherein the thickness of the glass phosphor plate (2) is in the range of 75um to 200 um.
3. An LED packaging process adopting a glass fluorescent sheet is characterized by comprising the following steps:
a) preparing a glass phosphor sheet (2) as defined in claim 1;
b) coating a crystal fixing glue (3) on the glass fluorescent sheet (2) by using a mask;
c) fixing an LED chip (4) on the glass fluorescent sheet (2) coated with the die bonding glue (3);
d) filling glue (5) is filled into gaps among the LED chips (4);
e) baking and curing;
f) and cutting.
4. The LED packaging process using the glass fluorescent sheet as claimed in claim 3, wherein the LED chip (4) is flip-chip mounted on the glass fluorescent sheet (2).
5. The LED packaging process using the glass fluorescent sheet as claimed in claim 3 or 4, wherein the thickness of the glass fluorescent sheet (2) is in the range of 75um-200 um.
6. The LED packaging process adopting the glass fluorescent sheet as claimed in claim 5, wherein the LED chip (4) is a flip chip.
7. The LED packaging structure with the glass fluorescent sheet is characterized in that the LED packaging structure (1) with the glass fluorescent sheet comprises the glass fluorescent sheet (2) as claimed in claim 1, a die bonding adhesive (3) is coated on the glass fluorescent sheet (2), LED chips (4) are fixed above the die bonding adhesive (3), and filling adhesive (5) is filled in gaps among the LED chips (4).
8. The LED packaging structure adopting the glass fluorescent sheet as claimed in claim 7, wherein the LED chip (4) is flip-chip mounted on the die attach adhesive (3).
9. The LED packaging structure adopting the glass fluorescent sheet as claimed in claim 7 or 8, wherein the thickness of the glass fluorescent sheet (2) is in the range of 75um-200 um.
10. The LED package structure with glass phosphor plate as defined in claim 9, wherein said LED chip (4) is a flip chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510586216.5A CN105140378A (en) | 2015-09-15 | 2015-09-15 | LED package structure and technology employing glass fluorescence sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510586216.5A CN105140378A (en) | 2015-09-15 | 2015-09-15 | LED package structure and technology employing glass fluorescence sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105140378A true CN105140378A (en) | 2015-12-09 |
Family
ID=54725658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510586216.5A Pending CN105140378A (en) | 2015-09-15 | 2015-09-15 | LED package structure and technology employing glass fluorescence sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105140378A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981557A (en) * | 2017-04-07 | 2017-07-25 | 光创空间（深圳）技术有限公司 | The method for packing and encapsulating structure of a kind of optoelectronic semiconductor chip |
| CN108447963A (en) * | 2018-04-28 | 2018-08-24 | 中国人民大学 | A kind of the CSP light-source structures and preparation method of crystallo-luminescence |
| CN108490689A (en) * | 2018-04-11 | 2018-09-04 | 陈官海 | A kind of LED backlight light source and preparation method thereof of ultra-thin specular removal |
| CN108735879A (en) * | 2018-07-26 | 2018-11-02 | 易美芯光（北京）科技有限公司 | A kind of SMD encapsulating structures containing quantum dot |
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| CN102442781A (en) * | 2010-09-30 | 2012-05-09 | 惠州晶宝光电科技有限公司 | LED packaging material, preparation method and application thereof |
| CN102709445A (en) * | 2012-06-02 | 2012-10-03 | 王双喜 | Light-emitting diode (LED) packaging structure with fluorescent glass layer |
| CN102723424A (en) * | 2012-05-25 | 2012-10-10 | 苏州晶品光电科技有限公司 | Method for preparing fluorescent wafer for LED (light-emitting diode) |
| CN102730980A (en) * | 2012-07-04 | 2012-10-17 | 张国生 | High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof |
| CN102969435A (en) * | 2012-12-04 | 2013-03-13 | 深圳市优信光科技有限公司 | LED (Light-Emitting Diode) with sapphire substrate inversion structure |
| TW201532316A (en) * | 2014-02-07 | 2015-08-16 | Achrolux Inc | Package structure and manufacturing method thereof |
| CN205104517U (en) * | 2015-09-15 | 2016-03-23 | 易美芯光（北京）科技有限公司 | Adopt LED packaging structure of glass fluorescence piece |
-
2015
- 2015-09-15 CN CN201510586216.5A patent/CN105140378A/en active Pending
Patent Citations (7)
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| CN102442781A (en) * | 2010-09-30 | 2012-05-09 | 惠州晶宝光电科技有限公司 | LED packaging material, preparation method and application thereof |
| CN102723424A (en) * | 2012-05-25 | 2012-10-10 | 苏州晶品光电科技有限公司 | Method for preparing fluorescent wafer for LED (light-emitting diode) |
| CN102709445A (en) * | 2012-06-02 | 2012-10-03 | 王双喜 | Light-emitting diode (LED) packaging structure with fluorescent glass layer |
| CN102730980A (en) * | 2012-07-04 | 2012-10-17 | 张国生 | High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof |
| CN102969435A (en) * | 2012-12-04 | 2013-03-13 | 深圳市优信光科技有限公司 | LED (Light-Emitting Diode) with sapphire substrate inversion structure |
| TW201532316A (en) * | 2014-02-07 | 2015-08-16 | Achrolux Inc | Package structure and manufacturing method thereof |
| CN205104517U (en) * | 2015-09-15 | 2016-03-23 | 易美芯光（北京）科技有限公司 | Adopt LED packaging structure of glass fluorescence piece |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981557A (en) * | 2017-04-07 | 2017-07-25 | 光创空间（深圳）技术有限公司 | The method for packing and encapsulating structure of a kind of optoelectronic semiconductor chip |
| CN108490689A (en) * | 2018-04-11 | 2018-09-04 | 陈官海 | A kind of LED backlight light source and preparation method thereof of ultra-thin specular removal |
| CN108447963A (en) * | 2018-04-28 | 2018-08-24 | 中国人民大学 | A kind of the CSP light-source structures and preparation method of crystallo-luminescence |
| CN108735879A (en) * | 2018-07-26 | 2018-11-02 | 易美芯光（北京）科技有限公司 | A kind of SMD encapsulating structures containing quantum dot |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151209 |
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