CN104518067A - Long-life LED light-emitting module and processing method thereof - Google Patents
Long-life LED light-emitting module and processing method thereof Download PDFInfo
- Publication number
- CN104518067A CN104518067A CN201410359043.9A CN201410359043A CN104518067A CN 104518067 A CN104518067 A CN 104518067A CN 201410359043 A CN201410359043 A CN 201410359043A CN 104518067 A CN104518067 A CN 104518067A
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- led
- crystalline substance
- transparent base
- fluorescent material
- annular ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention provides a long-life LED light-emitting module and a processing method thereof. The LED light-emitting module comprises a transparent base, multiple LED dies and fluorescent powder rubber layers. The LED dies are bound on the front of the transparent base and arranged and bound according to at least one annular ring. The first fluorescent powder rubber layer covers the back of the transparent base. The second fluorescent powder rubber layer coats the front of the transparent base and is divided into at least one circular fluorescent powder rubber ring, the fluorescent powder rubber rings are in one-to-one correspondence to the annular rings, and each fluorescent powder rubber ring covers all the LED dies of the corresponding annular ring. The problem of LED lamp failure caused by the fact that gold wires of the LED light source module are disconnected under the impact of cyclic stress due to thermal expansion and contraction of the rubber layers is solved.
Description
Technical field
The present invention relates to LED illuminating module and processing method, particularly relate to a kind of long-life LED illuminating module and processing method.
Background technology
The packaging technology of the current main flow of LED is MCOB, and this technology is formed by naked for LED wafer is directly fixed on substrate with die bond insulating cement nation, then on the naked wafer of LED, applies the color conversion that phosphor gel carries out bright dipping.In order to realize 360 degree of illumination effects of LED illuminating module, usual substrate adopts transparency carrier, determines the side of the naked crystalline substance of LED in the non-nation of substrate, is also coated with and is covered with the color conversion that phosphor gel carries out bright dipping.As patent of invention " 201310244265.1 ", a kind of LED ball bulb of omnirange bright dipping, its LED chip is fixing on the transparent substrate with die bond insulating cement, described LED chip surface and the transparency carrier back side cover fluorescent material glue-line, the blue light components that LED chip sends by described fluorescent material is converted into gold-tinted, and gold-tinted and blue light form white light.
But there are the following problems: the large-area surface covering the naked crystalline substance of LED of fluorescent glue for the packaging technology of this kind of employing MCOB, when LED works, the heat of the naked crystalline substance of its LED is directly delivered on fluorescent adhesive layer, fluorescent adhesive layer expanded by heating now, the highest from the glue-line temperature close to light source, its amplitude expanded is maximum, from the place away from light source, its amplitude expanded is relatively little, the internal stress skewness of glue-line, causes also being born uneven pulling force by the gold thread that fluorescent adhesive layer covers; Equally, when LED is extinguished, from the fluorescent adhesive layer close to the naked crystalline substance of LED because heat is concentrated, heat radiation is comparatively slow, the place away from the naked crystalline substance of LED, and heat radiation a little hurry up, now also cause the internal stress skewness of glue-line, the gold thread connecting different chip bears uneven pulling force.When LED is in the switching state of switch, gold thread bears the impact of pulsating stress and may disconnect, thus causes the inefficacy of LED.
Summary of the invention
The object of the invention is to cause gold thread to disconnect under the impact of pulsating stress due to expanding with heat and contract with cold of glue-line and the problem causing LED to lose efficacy to solve LED light source module gold thread.
The present invention realizes one of by the following technical programs:
A kind of long-life LED illuminating module, comprising:
Transparent base;
The naked crystalline substance of plurality of LEDs, nation to fix on transparent base front and fixed by least one annular ring arrangement nation;
First fluorescent material glue-line, covers the transparent base back side; And
Second fluorescent material glue-line, be coated in transparent base front and be divided into the fluorescent material cushion rubber of at least one cast, at least one fluorescent material cushion rubber and at least one annular ring one_to_one corresponding, each fluorescent material cushion rubber all covers on the naked crystalline substance of all LED of a corresponding annular ring.
Among one embodiment: the naked crystalline substance of described plurality of LEDs is fixed by multiple annular ring arrangement nation, and the circumferential interval of the naked crystalline substance of all LED of each annular ring is arranged, leaves gap between every two adjacent rings fluorescent material cushion rubber.
Among one embodiment: described transparent base is rounded, the naked crystalline substance of plurality of LEDs is fixed by multiple annular ring arrangement nation also by concentric garden layout centered by the transparent base center of circle.
Among one embodiment: described in cover the top edge of the cross section of the phosphor gel part on the naked crystalline substance of each LED curved, form the light cup of LED.
Among one embodiment: described transparency carrier is provided with public both positive and negative polarity, the lead-in wire two ends of the naked crystalline substance string of LED connect public both positive and negative polarity respectively.
Among one embodiment: first, second phosphor gel layer thickness described is all less than 5mm.
Among one embodiment: the material of described transparency carrier is have the one in the transparent ceramic of high thermal conductivity, devitrified glass or monocrystalline.
Among one embodiment: the naked crystalline substance of LED of described each annular ring forms the naked crystalline substance string of LED, connects the gold thread of the naked crystalline substance of LED in the naked crystalline substance string of phosphor gel circuit covering LED.
The present invention is two realizations by the following technical programs:
A kind of long-life LED illuminating module processing method, comprising:
Step 1: preparation transparent base;
Step 2: the naked crystalline substance of plurality of LEDs, to fix on transparent base front with bonder nation and fixed by least one annular ring arrangement nation;
Step 3: at transparent base backside coating first fluorescent material glue-line; Be divided into the fluorescent material cushion rubber of at least one cast, at least one fluorescent material cushion rubber and at least one annular ring one_to_one corresponding at transparent base front surface coated second fluorescent material glue-line, each fluorescent material cushion rubber all covers on the naked crystalline substance of all LED of a corresponding annular ring.
Compared with prior art, the invention has the beneficial effects as follows: the present invention evenly arranges on the transparent substrate by naked for LED crystalline substance being divided circle, fluorescent adhesive layer is divided equally circle arrangement, reduce the internal stress that glue-line produces owing to expanding with heat and contract with cold thus, reduce the uneven stressed of gold thread, thus extend the life-span of LED.
Accompanying drawing explanation
Fig. 1 is the cutaway view of this LED illuminating module.
Fig. 2 is that the naked crystalline substance of this LED illuminating module connects distribution schematic diagram.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to Fig. 1, Fig. 1 depicts the cutaway view of LED illuminating module, comprises transparent base 2, naked brilliant 4, first fluorescent material glue-line 1 and the second fluorescent material glue-line of plurality of LEDs.
Described transparent base 2 is rounded, and the material of described transparency carrier 2 is have the one in the transparent ceramic of high thermal conductivity, devitrified glass or monocrystalline.
Described plurality of LEDs Luo Jing 4 nation to fix on transparent base 1 front and fixed by least one annular ring arrangement nation, and among the present embodiment, plurality of LEDs naked brilliant 4 is fixed by three annular rings arrangement nations arranged centered by transparent base 1 center of circle and by concentric garden.The naked brilliant 4 circumferential intervals of all LED of each annular ring are arranged.
Described first fluorescent material glue-line 1 uniform fold is at transparent base 2 back side.Described first fluorescent material glue-line 1 thickness is less than 5mm.
Described second fluorescent material glue-line, be coated in transparent base 2 front, it is not that entirety is coated in transparent base 2, but according to the naked distribution of brilliant 4, divide circle coating, specifically, be divided into the fluorescent material cushion rubber 3 of three circle casts, three circle fluorescent material cushion rubber 3 and three circle annular ring one_to_one corresponding, each fluorescent material cushion rubber 3 all covers on all LED naked brilliant 4 of a corresponding annular ring.Leaving gap 7 between every two adjacent rings fluorescent material cushion rubber 3, is part 8 in the fluorescent material cushion rubber 3 of the interior circle.Best, described in cover the top edge of the cross section of the phosphor gel part on each LED naked brilliant 4 curved, form the light cup of LED, be conducive to improving the naked luminous efficiency of brilliant 4.Described second fluorescent material glue-line all thickness is less than 5mm.As shown in Figure 1, narrower gap is left between every two adjacent rings fluorescent material cushion rubber 3 better.
Please refer to Fig. 2, the naked crystalline substance that Fig. 2 depicts LED illuminating module connects distribution schematic diagram.Described transparency carrier 2 is provided with public both positive and negative polarity 6, and public electrode 6 is fixed in transparent base 2, and be formed as the naked crystalline substance string of LED after being connected by gold thread 5 between naked brilliant 4, unification is electrically connected on public electrode 6.The LED naked brilliant 4 of described each annular ring forms the naked crystalline substance string of LED, and fluorescent material cushion rubber 3 covers the gold thread 5 connecting the naked crystalline substance of LED in the naked crystalline substance string of LED.
The present invention, by point circle arrangement of LED naked brilliant 4 in transparent base 2, realizes point circle coating to fluorescent material glue-line.Due to point circle coating of fluorescent material glue-line, leave gap, the narrowed thickness of glue-line between circle and circle, the internal stress that fluorescent material glue-line produces owing to expanding with heat and contract with cold reduces, thus the fatigue stress acted on gold thread 5 reduces, and therefore the probability that gold thread 5 disconnects reduces.
Sample of the present invention is through the 5h that is energized continuously, and after the life-span accelerated test of power-off 1h, its life-span is greater than more than 7 days, is coated in about 3 days life-span accelerated tests in transparent base 2 much larger than fluorescent material glue-line entirety.
A kind of long-life LED illuminating module processing method, comprising:
Step 1: preparation transparent base;
Step 2: the naked crystalline substance of plurality of LEDs, to fix on transparent base front with bonder nation and fixed by least one annular ring arrangement nation;
Step 3: at transparent base backside coating first fluorescent material glue-line; Be divided into the fluorescent material cushion rubber of at least one cast, at least one fluorescent material cushion rubber and at least one annular ring one_to_one corresponding at transparent base front surface coated second fluorescent material glue-line, each fluorescent material cushion rubber all covers on the naked crystalline substance of all LED of a corresponding annular ring.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a long-life LED illuminating module, is characterized in that: comprising:
Transparent base;
The naked crystalline substance of plurality of LEDs, nation to fix on transparent base front and fixed by least one annular ring arrangement nation;
First fluorescent material glue-line, covers the transparent base back side; And
Second fluorescent material glue-line, be coated in transparent base front and be divided into the fluorescent material cushion rubber of at least one cast, at least one fluorescent material cushion rubber and at least one annular ring one_to_one corresponding, each fluorescent material cushion rubber all covers on the naked crystalline substance of all LED of a corresponding annular ring.
2. long-life LED illuminating module as claimed in claim 1, is characterized in that: the naked crystalline substance of described plurality of LEDs is fixed by multiple annular ring arrangement nation, and the circumferential interval of the naked crystalline substance of all LED of each annular ring is arranged, leaves gap between every two adjacent rings fluorescent material cushion rubber.
3. long-life LED illuminating module as claimed in claim 2, is characterized in that: described transparent base is rounded, and the naked crystalline substance of plurality of LEDs is fixed by multiple annular ring arrangement nation also by concentric garden layout centered by the transparent base center of circle.
4. long-life LED illuminating module as claimed in claim 1, is characterized in that: described in cover the top edge of the cross section of the phosphor gel part on the naked crystalline substance of each LED curved, form the light cup of LED.
5. long-life LED illuminating module as claimed in claim 1, is characterized in that: described transparency carrier is provided with public both positive and negative polarity, and the lead-in wire two ends of the naked crystalline substance string of LED connect public both positive and negative polarity respectively.
6. long-life LED illuminating module as claimed in claim 1, is characterized in that: first, second phosphor gel layer thickness described is all less than 5mm.
7. long-life LED illuminating module as claimed in claim 1, is characterized in that: the material of described transparency carrier is have the one in the transparent ceramic of high thermal conductivity, devitrified glass or monocrystalline.
8. long-life LED illuminating module as claimed in claim 1, is characterized in that: the naked crystalline substance of LED of described each annular ring forms the naked crystalline substance string of LED, connects the gold thread of the naked crystalline substance of LED in the naked crystalline substance string of phosphor gel circuit covering LED.
9. a long-life LED illuminating module processing method, is characterized in that: comprising:
Step 1: preparation transparent base;
Step 2: the naked crystalline substance of plurality of LEDs, to fix on transparent base front with bonder nation and fixed by least one annular ring arrangement nation;
Step 3: at transparent base backside coating first fluorescent material glue-line; Be divided into the fluorescent material cushion rubber of at least one cast, at least one fluorescent material cushion rubber and at least one annular ring one_to_one corresponding at transparent base front surface coated second fluorescent material glue-line, each fluorescent material cushion rubber all covers on the naked crystalline substance of all LED of a corresponding annular ring.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410359043.9A CN104518067B (en) | 2014-07-25 | 2014-07-25 | A kind of long-life LED illuminating modules and its processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410359043.9A CN104518067B (en) | 2014-07-25 | 2014-07-25 | A kind of long-life LED illuminating modules and its processing method |
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| Publication Number | Publication Date |
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| CN104518067A true CN104518067A (en) | 2015-04-15 |
| CN104518067B CN104518067B (en) | 2017-07-14 |
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| CN201410359043.9A Active CN104518067B (en) | 2014-07-25 | 2014-07-25 | A kind of long-life LED illuminating modules and its processing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364613A (en) * | 2019-06-06 | 2019-10-22 | 佛山市中昊光电科技有限公司 | A kind of COB light source and its manufacturing method |
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
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| JP2000353406A (en) * | 1999-06-08 | 2000-12-19 | Shinichi Kobayashi | Lamp made of many light emitting diode chips |
| JP2004035997A (en) * | 2002-07-03 | 2004-02-05 | Tao:Kk | Light emitting and transmitting plated product |
| CN102306699A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Integrated light-emitting diode (LED) packaging structure |
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| CN203131496U (en) * | 2013-01-25 | 2013-08-14 | 江苏汉莱科技有限公司 | Light-emitting diode (LED) all-dimensional three-dimensional luminous light source and LED illumination lamp manufactured with same |
| CN204118114U (en) * | 2014-07-25 | 2015-01-21 | 吴鼎鼎 | A kind of long-life LED illuminating module |
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2014
- 2014-07-25 CN CN201410359043.9A patent/CN104518067B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000353406A (en) * | 1999-06-08 | 2000-12-19 | Shinichi Kobayashi | Lamp made of many light emitting diode chips |
| JP2004035997A (en) * | 2002-07-03 | 2004-02-05 | Tao:Kk | Light emitting and transmitting plated product |
| CN102306699A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Integrated light-emitting diode (LED) packaging structure |
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| CN203131496U (en) * | 2013-01-25 | 2013-08-14 | 江苏汉莱科技有限公司 | Light-emitting diode (LED) all-dimensional three-dimensional luminous light source and LED illumination lamp manufactured with same |
| CN204118114U (en) * | 2014-07-25 | 2015-01-21 | 吴鼎鼎 | A kind of long-life LED illuminating module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364613A (en) * | 2019-06-06 | 2019-10-22 | 佛山市中昊光电科技有限公司 | A kind of COB light source and its manufacturing method |
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
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| Publication number | Publication date |
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| CN104518067B (en) | 2017-07-14 |
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Effective date of registration: 20170608 Address after: 351100 Yongchun County of Fujian province Guangxi town Jinsha Village No. 20 Applicant after: Lin Peiqiang Address before: 351100, Fujian, Putian province Chengxiang district under the state million Photoelectric Technology Co., Ltd. No. 8 Building Applicant before: Wu Dingding |
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Effective date of registration: 20190919 Address after: 221300 Jiangsu city of Xuzhou province Pizhou City Tiefu Industrial Zone Patentee after: Xuzhou Taiming Electric Co., Ltd. Address before: 351100 Yongchun County of Fujian province Guangxi town Jinsha Village No. 20 Patentee before: Lin Pei Qiang |
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