CN202205806U - High-power light-emitting diode (LED) packaging structure - Google Patents
High-power light-emitting diode (LED) packaging structure Download PDFInfo
- Publication number
- CN202205806U CN202205806U CN2011201467925U CN201120146792U CN202205806U CN 202205806 U CN202205806 U CN 202205806U CN 2011201467925 U CN2011201467925 U CN 2011201467925U CN 201120146792 U CN201120146792 U CN 201120146792U CN 202205806 U CN202205806 U CN 202205806U
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- chip
- led
- cup
- fluorescent glue
- light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The utility model discloses a high-power light-emitting diode (LED) packaging structure, which comprises an LED luminous chip and an LED chip bracket, wherein fluorescent glue is coated on the surface of the chip; a lens covers the bracket; the thickness of the fluorescent glue coated on the surface of the chip is greater than that of the fluorescent glue coated on the side of the chip, so that the coated fluorescent glue forms an arc which has the radian consistent with that of the lens; the fluorescent glue is prepared by mixing small granules in large granular fluorescent powder, mixing and stirring the mixed fluorescent powder and silica gel for a period of time and vacuumizing; an angle alpha formed between a cup wall and a cup bottom of a bracket cup is 40 to 50 degrees, and the cup has the height h of 0.3 to 0.45mm; therefore, the LED emits light more uniformly, the light color quality is effectively improved, and the light spot problem is well solved.
Description
Technical field
The present invention relates to the LED technical field, particularly a kind of high-power LED encapsulation structure.
Background technology
LED is a light-emitting diode; It is a kind of luminescent device that can directly electric energy be converted into visible light and radiant energy; Light-emitting diode structure comprises the two large divisions: the conducting end of supporting part and opposed polarity; Be provided with wafer and fluorescent material in the supporting part, utilize gold thread to connect the electrode layer and the conducting end of wafer, accomplish packaging process at last.With the traditional lighting compared with techniques, leading superiority such as that this new type light source has is energy-efficient, long-life, small size, cost are low, environmental protection.LED commonly used at present utilizes the light of wafer to combine with the wavelength of fluorescent material, and then forms the existing effect of specific light color table.
Utilize the light conversion regime of led chip excitated fluorescent powder can realize the output of shades of colour light, this also is the main path that present LED realizes the illumination white light.Its basic principle is: under the effect of electricity, wafer sees through the light that fluorescent material penetrates and combines with the wavelength of fluorescent material, thereby forms specific photochromic.For example common white light LEDs mainly is to utilize the blue light single-chip to add yellow fluorescent powder, sees through yellow fluorescent material with the blue light that wafer was sent and penetrates, and combines through blue, gold-tinted ripple, forms the white light expression effect.
Yet LED often runs into yellow circle and hot spot problem when using at present, and Huang circle and the hot spot of LED directly have influence on illuminating effect.Causing a reason of yellow circle and hot spot is support; Because the structural relation of support and chip, chip sidelight emission more complicated can not directly excite peripheral light-emitting phosphor; But through ability and fluorescent material mixed luminescence after the multiple diffuse reflection; And because the refractive index of lens is different, cause the chip outside and chip center to produce the colour temperature disunity of white light, produce yellow circle and hot spot.
Causing the yellow circle and the Another reason of hot spot is fluorescent material.Utilization at present yellow fluorescent powder the most widely is the YAG series phosphor powder; This serial fluorescent powder grain size is all more than 17um; There are some defectives in they, and, powder reuniting big like particle is serious, appearance is hard, pattern is irregular, mobility of particle difference etc., and this causes the hot spot main cause just.Because their refractive index is different with the refractive index of silica gel more than or equal to 1.85, and the silica gel refractive index is generally about 1.5.Not because not matching of refractive index between the two; And the fluorescent powder grain size is much larger than the light scattering limit (30nm), and it is inconsistent with incident light scattering light wavelength (or frequency) to occur, thereby has light scattering on the fluorescent powder grain surface; Destroy uniformity of light, and then yellow circle and hot spot have occurred.
Summary of the invention
To above-mentioned defective, the object of the present invention is to provide a kind of LED fluorescent glue and led support, so that LED is luminous more even, effectively improve photochromic quality, solve yellow circle and hot spot problem better.
The technical scheme that the present invention proposes is: a kind of LED encapsulating structure; Comprise LED luminescence chip and led chip support; Chip surface applies fluorescent glue, and lens are stamped in the support top, and fluorescent glue is coated in chip surface position thickness greater than the sides of chip position; Make to apply fluorescent glue and form arc, its radian is consistent with institute lid lens radian.
Said support bowl cup wall of cup is 40 ° ~ 50 ° with the angle [alpha] of cup end formation, and a bowl cup height h is 0.3mm ~ 0.45mm.
Said chip size is 24mil * 24mil ~ 45mil * 45mil.
Said fluorescent glue vacuumizes processing formation through adding granule mixing in bulky grain fluorescent material after mixing back fluorescent material and combining to stir a period of time with silica gel.
Said bulky grain fluorescent material radius is 1.5 times of granule fluorescent material, and the bulky grain amount is a, and the granule amount is b, and the proportionate relationship of a and b is a/b=(a+b)/a or a2=bc, wherein c=a+b.
Be filled with filling gel between said fluorescent glue and the lens.
Led support of the present invention can make the maximum sidelight of chip (180 spend) through a bowl glass gradient, and is just approaching parallel with the chip surface light beam only through primary event, with 80 ~ 100 ° of bright dippings, guarantees that the emission of sidelight and chip surface light is unified, direct and fluorescent material mixed luminescence.The bowl cup degree of depth of described led support cooperates a bowl cup wall of cup gradient, i.e. a bowl cup wall of cup and a cup end angulation α can make to be coated in chip sides fluorescent material and evenly to distribute better.
Mix through in bulky grain fluorescent material, adding granule, the silica gel refractive index is brought up to more than 1.8, reduce light scattering, effectively improve photochromic quality, solve the hot spot problem better.In the bigger fluorescent material of particle size, mix small sized particles; Better cooperate the formation white light so that mix wavelength and the chip wavelength launched the back with bulky grain; And mixed refractive index is more near the silica gel refractive index, reduces light scattering, improves the fluorescent material uniformity effectively; Improve photochromic quality, repair hot spot.
Description of drawings
Fig. 1 is a LED encapsulation step flow chart.
Fig. 2 is test panel and LED position view.
Fig. 3 is the support vertical view.
Fig. 4 is the support sectional view.
Fig. 5 is a chip sides bright dipping sketch map.
Fig. 6 is a fluorescent material hybrid technique sketch map.
Fig. 7 is that phosphor surface applies and lens cover enlarged drawing.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.
Usually the LED encapsulation is that outer lead is connected on the electrode of led chip; Guarantee that correct electric and mechanical between semiconductor chip and lower circuit continue mutually; Protect led chip simultaneously; Do not allow it to receive machinery, heat, humidity and other all external shock, and play the effect that improves luminous efficiency.Referring to Fig. 1, LED encapsulation step flow process brief description is following.
1, solid brilliant, luminescence chip is fixed on the special support with elargol, and baking is heating and curing.
2, bonding wire is connected to outer lead on the electrode of led chip.
3, join glue, size particles fluorescent material and silica gel are carried out hybrid modulation in proportion, evenly stirred 10-15 minute, vacuumized 20 minutes, again fluorescent glue is coated in chip surface.
4, some fluorescent glue is put support (bowl cup) center with dispensing needle head with fluorescent glue, lets it cover on the chip surface uniformly.
5, baking, the purpose of baking are that fluorescent glue is solidified, and baking requires temperature is monitored, and prevents that batch property is bad.The temperature of fluorescent glue baking generally is controlled at 150 ℃, stoving time 30 minutes.Can adjust according to actual conditions.
6, lid lens adopt the lid lens machine of specialty to cover lens on the led chip automatically.
7, encapsulating injects filling gel to the semi-finished product of building lens.
8, baking lets filling gel fully solidify, and general condition is 120 ℃, stoving time 20 minutes.
9, beam split color separation, high-power packaged finished product is tested, and comprises leakage tests, relative colour temperature, light is well-illuminated, chromaticity coordinate x, y and the test of color rendering index stepping.
The embodiment of the invention is made a 1W white light LEDs, adopts the 350mA constant-current supply to drive voltage 3.0-3.6V.
Hot spot experiment test platform is through 9 some chromaticity coordinatess of 9 each LED of method test, to judge luminous spatially uniform on the single led outgoing hot spot all directions.
Experiment condition: adopt the 350mA constant-current supply to drive, about voltage 3.5V.LED is identical apart from the distance of screen, is 60cm, and the test used tool is: CHROMA METER CS-100 MINOLTA color colour difference meter.
The discreteness of chromaticity coordinate can be represented with the standard variance of the chromaticity coordinate of 9 test points of each LED; If the chromaticity coordinates of 9 test points is (
;
) (i=1; 2; 9); The chromaticity coordinates mean value of 9 test points be (
,
) then standard deviation be
:
Generally; Standard variance
value is below 0.01; Human eye is not easy to differentiate colourity difference, explains photochromic even.
The experiment test platform is based upon the darkroom, and purpose is to reduce the influence of ambient light, and is fixing on the wall LED earlier, places a white screen in its dead ahead, and the height of the center of screen is consistent with LED, screen and wall keeping parallelism.Test for ease and add up we chosen form foursquare 9 as representational measurement point.Test panel 50 and LED100 position are referring to Fig. 2.
Make a led chip support 10 according to requirement of experiment, the vertical view of support is referring to Fig. 3, and support bowl cup 20 wall of cups and cup end angulation α are referring to the sectional view of Fig. 4 support.Fig. 5 is a chip sides bright dipping sketch map, according to reflection law, and θ i=θ r (θ i incidence angle, θ r angle of reflection), normal 5 vertical wall of cups, incident ray 4 becomes emergent ray 6 after reflection, and bowl cup degree of depth h is wall of cup peak and the cup vertical height at the end.
After seeing through lens, light produces heterochromatic aperture or the hot spot that refraction forms in order more effectively to suppress simultaneously; The present invention also mixes through in bulky grain fluorescent material, adding granule; Wherein bulky grain fluorescent material 60 radiuses are 1.5 times of granule fluorescent material 70; Vacuumize processing (preventing bubble) formation fluorescent glue 7 mixing back fluorescent material 90 after 10-15 minute with combine stirring with silica gel 80, be coated in it on the support 10 then, fluorescent material hybrid technique sketch map is referring to Fig. 6.
Embodiment 1: angle [alpha] is 40 °, and a bowl cup degree of depth h is 0.3mm, LED luminescence chip 1 usefulness elargol is fixed on the support 10, and baking is heating and curing, and wherein chip size is 24mil * 24mil; Then gold thread 2 is welded on chip 1 positive and negative electrode; At chip 1 surface-coated fluorescent glue 7, see through heterochromatic aperture or the hot spot that lens 9 back generation refractions form then, be coated in chip 1 surface location thickness greater than the sides of chip position in order effectively to suppress light; Cause and apply fluorescent glue 7 formation arcs; Its radian is consistent with institute lid lens radian, and carries out baking molding, above support, covers lens 9; Inject filling gel 8, and carry out baking molding.Phosphor surface applies and lens cover enlarged drawing referring to Fig. 7.
Embodiment 2: angle [alpha] is 45 °, and a bowl cup degree of depth h is 0.35mm, luminescence chip 1 usefulness elargol is fixed on the support 10, and baking is heating and curing, and wherein chip size is 38mil * 38mil; Then gold thread 2 is welded on the chip positive and negative electrode; Apply fluorescent glue at chip surface then; In order effectively to suppress to produce heterochromatic aperture or the hot spot that refraction forms after light sees through lens; Be coated in chip surface position thickness greater than the sides of chip position; Cause to apply fluorescent glue 7 and form arcs, its radian is consistent with institute lid lens radian, and carries out baking molding.Above support, cover lens 9, inject filling gel 8, and carry out baking molding.
Embodiment 3: angle [alpha] is 50 °, and a bowl cup degree of depth h is 0.45mm, luminescence chip 1 usefulness elargol is fixed on the support 10, and baking is heating and curing, and wherein chip size is 45mil * 45mil; Then gold thread 2 is welded on the chip positive and negative electrode; Apply fluorescent glue at chip surface then; In order effectively to suppress to produce heterochromatic aperture or the hot spot that refraction forms after light sees through lens; Be coated in chip surface position thickness greater than the sides of chip position; Cause to apply fluorescent glue 7 and form arcs, its radian is consistent with institute lid lens radian, and carries out baking molding.Above support, cover lens 9, inject filling gel 8, and carry out baking molding.
Experiment shows, when angle [alpha]=40 ° ~ 50 °, incident ray 4 forms 80 ~ 100 ° of angles with reflection ray 6; After primary event, just can be approaching parallel with the chip surface light beam, guarantee that side light and chip surface light emission are unified; With 80 ~ 100 ° of bright dippings, direct and fluorescent material mixed luminescence.Bowl cup degree of depth h=0.3mm ~ 0.45mm can better fit bowl cup angle [alpha], makes to be coated in chip sides fluorescent material and evenly to distribute.
If the bulky grain amount is a, granule is b, below for behind the experiment a/b different proportion, through 9 hot spot test results:
| A/b | 1.2 | 1.3 | 1.4 | 1.5 | 1.6 | 1.7 | 1.8 | 1.9 |
| δ | 0.1348 | 0.0864 | 0.0145 | 0.0072 | 0.0074 | 0.0083 | 0.0234 | 0.0217 |
Experiment shows that the allocation proportion of bulky grain and granule meets the following a/b=of relation (a+b)/a or a2=bc, c=a+b wherein, and a/b=1.5 ~ 1.7 are preferred proportion.Bulky grain is with after granule fluorescent material mixes, because bulky grain is bigger than granule fluorescent material settling rate, and uses the high silica gel of viscosity to have the advantages that to suppress the bulky grain deposition; The uniformity of guaranteeing size particles so effectively distributes, and mixed refractive index brings up to more than 1.8 the silica gel refractive index more near the silica gel refractive index; Reduce light scattering; Improve the fluorescent material uniformity, improved photochromic quality, repaired hot spot.And mixed fluorescent material and silica gel are coated in chip surface position thickness greater than the sides of chip position; Cause and apply fluorescent glue formation arc; Its radian is consistent with institute lid lens radian, and so effective inhibition light produces heterochromatic aperture or the hot spot that refraction forms after seeing through lens, reduces light scattering; Improve photochromic quality, solved the hot spot problem better.
Led support of the present invention can make the maximum sidelight of chip (180 spend) through a bowl glass gradient, and is just approaching parallel with the chip surface light beam only through primary event, with 80 ~ 100 ° of bright dippings, guarantees that the emission of sidelight and chip surface light is unified, direct and fluorescent material mixed luminescence.The bowl cup degree of depth of described led support cooperates a bowl cup wall of cup gradient, i.e. a bowl cup wall of cup and a cup end angulation α can make to be coated in chip sides fluorescent material and evenly to distribute better.
Mix through in bulky grain fluorescent material, adding granule simultaneously; The uniformity of guaranteeing size particles so effectively distributes, and mixed refractive index brings up to more than 1.8 the silica gel refractive index more near the silica gel refractive index; Reduce light scattering; Improve the fluorescent material uniformity effectively, improve photochromic quality, repair hot spot.
Under the situation of spirit of the present invention and essence thereof, those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of claim of the present invention.
Claims (4)
1. high-power LED encapsulation structure; Comprise LED luminescence chip and led chip support, chip surface applies fluorescent glue, and lens are stamped in the support top; It is characterized in that; Fluorescent glue is coated in chip surface position thickness greater than the sides of chip position, makes to apply fluorescent glue and form arc, and its radian is consistent with institute lid lens radian.
2. high-power LED encapsulation structure as claimed in claim 1 is characterized in that the said support bowl cup wall of cup and the angle [alpha] of cup end formation are 40 ° ~ 50 °, and a bowl cup height h is 0.3mm ~ 0.45mm.
3. high-power LED encapsulation structure as claimed in claim 2 is characterized in that said chip size is 24mil * 24mil ~ 45mil * 45mil.
4. like each described high-power LED encapsulation structure of claim 1-3, it is characterized in that between said lens and the chip filling gel being arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201467925U CN202205806U (en) | 2011-05-10 | 2011-05-10 | High-power light-emitting diode (LED) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201467925U CN202205806U (en) | 2011-05-10 | 2011-05-10 | High-power light-emitting diode (LED) packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN202205806U true CN202205806U (en) | 2012-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201467925U Expired - Fee Related CN202205806U (en) | 2011-05-10 | 2011-05-10 | High-power light-emitting diode (LED) packaging structure |
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| CN (1) | CN202205806U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
-
2011
- 2011-05-10 CN CN2011201467925U patent/CN202205806U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120425 Termination date: 20150510 |
|
| EXPY | Termination of patent right or utility model |