CN204019874U - For the jig structure of LED filament mold pressing encapsulation - Google Patents
For the jig structure of LED filament mold pressing encapsulation Download PDFInfo
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- CN204019874U CN204019874U CN201420463770.5U CN201420463770U CN204019874U CN 204019874 U CN204019874 U CN 204019874U CN 201420463770 U CN201420463770 U CN 201420463770U CN 204019874 U CN204019874 U CN 204019874U
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- led filament
- die
- led
- mold pressing
- filament
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Abstract
The utility model is disclosed is a kind of jig structure for LED filament mold pressing encapsulation, and its structure comprises upper die and lower die, and wherein upper die and lower die symmetry leaves space for placing the use of LED filament; The upper and lower mould of fixed alignment when four jiaos of places of upper die and lower die leave respectively card column and draw-in groove for matched moulds; Patrix top is aimed at placement LED filament spatial and is left hole for injecting glue, for injecting packaging plastic; Heater is equipped with in counterdie inside, has encapsulated for LED filament the moulding that is heating and curing after glue, facilitate upper and lower mould die sinking after LED filament take out smoothly.Advantage: with the tool of this kind of LED filament mold pressing encapsulation, mould inside once can be placed many LED filaments, can be to many LED filaments injecting glues simultaneously, and can make filament moulding immediately after injecting glue by internal heat, facilitate die sinking after LED filament take out smoothly.
Description
Technical field
The utility model relates to a kind of jig structure for LED filament mold pressing encapsulation, belong to LED filament encapsulation field.
Background technology
Along with the development of LED encapsulation technology, the application of LED is also more and more extensive, in LED encapsulation field, LED filament is that a kind of brand-new LED light source has the advantages such as high light efficiency, high aobvious finger, low cost, but in the encapsulation field of LED filament, adopt the technology modes such as some glue, encapsulating, pressing mold encapsulation at present more, but in gluing process process, glue amount is difficult to control, and the filament profile encapsulating out is poor; Better by encapsulating and pressing mold mode packaged LED filament uniformity, but production efficiency is lower, and die sinking process easily causes the damage of LED filament.Therefore, need a kind of technological improvement, improve the packaging technology of existing LED filament.
Summary of the invention
The utility model proposes a kind of jig structure for LED filament mold pressing encapsulation, its objective is the packaging technology in order to improve existing LED filament.
Technical solution of the present utility model: for the jig structure of LED filament mold pressing encapsulation, its structure comprises upper die and lower die, and wherein upper die and lower die symmetry leaves the space for placing LED filament; Four jiaos of places of patrix leave card column; Four jiaos of places of counterdie leave draw-in groove; The position that placement LED filament space is aimed on the top of patrix is hole for injecting glue; Heater is equipped with in counterdie inside.
The utlity model has following advantage:
1) tool that adopts this kind of LED filament mold pressing to encapsulate, mould inside once can be placed many LED filaments, can be to Multi-filament injecting glue simultaneously, production efficiency is high;
2) adopt the tool of this kind of LED filament mold pressing encapsulation, it can make LED filament moulding immediately after injecting glue by internal heat, facilitate die sinking after LED filament take out smoothly, reduce the damage to LED filament.
Brief description of the drawings
Fig. 1 is the inner plane schematic diagram of the tool counterdie of the utility model embodiment LED filament mold pressing encapsulation.
Fig. 2 is the overall structure schematic diagram of the tool of the utility model embodiment LED filament mold pressing encapsulation.
In figure 1 is counterdie; The 2nd, space; The 3rd, draw-in groove; The 4th, card column; The 5th, patrix; The 6th, heater; The 7th, hole for injecting glue.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, embodiment of the present utility model is elaborated.
Contrast accompanying drawing, for the jig structure of LED filament mold pressing encapsulation, comprises patrix 5 and counterdie 1, and wherein patrix 5 and counterdie 1 symmetry leave space for placing the use of LED filament; Fixed alignment upper/lower die when 1 four jiaos of places of patrix 5 and counterdie leave respectively card column 4 and draw-in groove 3 for matched moulds; Patrix 5 tops are aimed at placement LED filament spatial and are left hole for injecting glue 7, for injecting packaging plastic; Heater 6 is equipped with in counterdie 1 inside, for LED filament having been encapsulated to the moulding that is heating and curing after glue, facilitate upper and lower mould die sinking after LED filament take out smoothly.
When packaged LED filament, LED filament to be packaged is placed on to patrix 5 and counterdie 1 locus before, then matched moulds, fix standby upper and lower mold alignment by card column 4 and draw-in groove 3, by hole for injecting glue 7, packaging plastic is injected in patrix 5 and counterdie 1 space before for packaged LED filament, LED filament has been encapsulated be heating and curing after glue moulding by heater 6 heating, after moulding, upper and lower mould die sinking is taken out LED filament smoothly, completes encapsulation.
The above; it is only a specific embodiment of the present utility model; it is not the restriction of the utility model being made to other form; common variation and the replacement within the scope of technical scheme, carried out for those skilled in the art; do not departing under the prerequisite of the utility model creation design, any improvement of making all should be included in protection domain of the present utility model.
Claims (1)
1. for the jig structure of LED filament mold pressing encapsulation, it is characterized in that comprising upper die and lower die, wherein upper die and lower die symmetry leaves the space for placing LED filament; Four jiaos of places of patrix leave card column; Four jiaos of places of counterdie leave draw-in groove; The position that placement LED filament space is aimed on the top of patrix is hole for injecting glue; Heater is equipped with in counterdie inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420463770.5U CN204019874U (en) | 2014-08-18 | 2014-08-18 | For the jig structure of LED filament mold pressing encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420463770.5U CN204019874U (en) | 2014-08-18 | 2014-08-18 | For the jig structure of LED filament mold pressing encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204019874U true CN204019874U (en) | 2014-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420463770.5U Active CN204019874U (en) | 2014-08-18 | 2014-08-18 | For the jig structure of LED filament mold pressing encapsulation |
Country Status (1)
| Country | Link |
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| CN (1) | CN204019874U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070815A (en) * | 2015-09-06 | 2015-11-18 | 深圳市源磊科技有限公司 | Mold for making LED filaments and molding method |
| CN107042192A (en) * | 2017-03-27 | 2017-08-15 | 深圳市欧美亚科技有限公司 | LED flexibility filament support fixed jigs |
-
2014
- 2014-08-18 CN CN201420463770.5U patent/CN204019874U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070815A (en) * | 2015-09-06 | 2015-11-18 | 深圳市源磊科技有限公司 | Mold for making LED filaments and molding method |
| CN107042192A (en) * | 2017-03-27 | 2017-08-15 | 深圳市欧美亚科技有限公司 | LED flexibility filament support fixed jigs |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |