CN203521377U - Silica-gel chip packaging mould - Google Patents
Silica-gel chip packaging mould Download PDFInfo
- Publication number
- CN203521377U CN203521377U CN201320705206.5U CN201320705206U CN203521377U CN 203521377 U CN203521377 U CN 203521377U CN 201320705206 U CN201320705206 U CN 201320705206U CN 203521377 U CN203521377 U CN 203521377U
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- CN
- China
- Prior art keywords
- silica gel
- chip packaging
- silica
- mould
- chip
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- Expired - Fee Related
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Abstract
Provided is a silica-gel chip packaging mould which is used for chip packaging. The chip packaging comprises a support and multiple base bodies. The base bodies are arranged on the support in a grouping way. The mould comprises a substrate and multiple semicircular cover plates which are corresponding to the base bodies. The peripheries of the semicircular cover plates extend so that a protruding edge with an indent groove is formed. The indent groove of the protruding edge is used for embedding the substrate so that the semicircular cover plates are positioned on the substrate. The internal periphery of the protruding edge is provided with a protruding stand part. The top end of the base bodies is provided with an abutting surface which abuts against the protruding stand part. One side of the semicircular cover plates is provided with an injection hole which is arranged in an inclined way, and the other side is provided with a ventilation hole. The silica-gel chip packaging mould also comprises a silica-gel injection device which is provided with an extension tube stretching into the injection hole to inject silica-gel material. Therefore, the silica-gel chip packaging mould is simple in structure and convenient to use, and can provide better silica-gel chip packaging. Besides, the silica-gel chip packaging mould is simple in operation and simplified in process, and thus cost is reduced.
Description
Technical field
The utility model relates to a kind of silica gel chip packaging mould.
Background technology
In in chip manufacturing, the mould by ejection formation is by silica gel packaging in chip conventionally, and existing mould exists complex structure, the defect that packaging process is many.
For this reason, designer of the present utility model is because above-mentioned defect, by concentrating on studies and designing, is comprehensively engaged in for a long time experience and the achievement of related industry for many years, and research and design goes out a kind of silica gel chip packaging mould, to overcome above-mentioned defect.
Utility model content
The technical problems to be solved in the utility model is: the mould of ejection formation is by silica gel packaging in chip, and existing mould exists complex structure, the defect that packaging process is many.
For addressing the above problem, the utility model discloses a kind of silica gel chip packaging mould, for chip package, described chip package comprises support and a plurality of pedestal, described pedestal is mounted on described support, described pedestal is coated with one and has protruding heat radiation platform, in the projection of described heat radiation platform, is equipped with chip, and described chip is coated by layer of silica gel; It is characterized in that:
Described mould comprises substrate and a plurality of semicircle cover plate corresponding to described pedestal, the periphery of described semicircle cover plate extends a flange with inner groovy, and the inner groovy of described flange embeds so that described semicircle cover plate is positioned on described substrate for described substrate;
The inner peripheral of described flange has boss portion, and the top of described pedestal has the abutment face that is resisted against described boss portion;
One side of described semicircle cover plate has the hand-hole of oblique setting, and opposite side is provided with air-vent;
And a silica gel injection device, described silica gel injection device has and stretches into described hand-hole with the extension tube of Implanted Silicon sizing material.
Wherein: described support is that metal is made.
Wherein: described silica gel injection device has heater.
Known by said structure, silica gel chip packaging mould of the present utility model has following technique effect:
1, simple in structure, easy to use, good silica gel chip package can be provided;
2, easy and simple to handle, operation is simplified, and reduces costs.
Detailed content of the present utility model can obtain by explanation described later and institute's accompanying drawing.
Accompanying drawing explanation
Fig. 1 has shown the structural representation of the utility model silica gel chip packaging mould.
Fig. 2 has shown the schematic diagram after the separation of the utility model silica gel chip packaging mould.
Embodiment
Referring to Fig. 1 and Fig. 2, shown silica gel chip packaging mould of the present utility model.
Described silica gel chip packaging mould is for chip package, described chip package comprises support 10 and a plurality of pedestal 11, described pedestal 11 is mounted on described support 10, described pedestal 11 is coated with one and has protruding heat radiation platform 15, in the projection of described heat radiation platform 15, be equipped with chip 12, described chip 12 is coated by layer of silica gel 13.
Wherein, described support 10 is made for metal.
Wherein, described mould comprises substrate 20 and a plurality of semicircle cover plate 21 corresponding to described pedestal 11, the periphery of described semicircle cover plate 21 extends a flange with inner groovy, the inner groovy of described flange embeds for described substrate 20, so that described semicircle cover plate 21 is positioned on described substrate 20.
The inner peripheral of described flange has boss portion 212, and the top of described pedestal 11 has the abutment face 112 that is resisted against described boss portion 212, thus, by pedestal 11 being inserted in the boss portion 212 of flange, forms a semicircular molding space.
One side of described semicircle cover plate 21 has the hand-hole 213 of oblique setting, and opposite side is provided with air-vent.
And a silica gel injection device 3, described silica gel injection device 3 has and stretches into described hand-hole 213 with the extension tube 31 of Implanted Silicon sizing material 131.
Wherein, silica gel injection device 3 has heater.
Known referring to Fig. 1, by being the silica gel of thickness liquid state after injection heating in the molding space of 3 pairs of semicircles of silica gel injection device, gas discharges to avoid bubble from air-vent, being full of rear wait silica gel solidifies, after solidifying, substrate 20 is lifted, layer of silica gel and semicircle cover plate depart from, thereby complete whole processing procedure.
Known by said structure, silica gel chip packaging mould tool of the present utility model has the following advantages:
1, simple in structure, easy to use, good silica gel chip package can be provided;
2, easy and simple to handle, operation is simplified, and reduces costs.
It is evident that above description and to record be only for example rather than in order to limit disclosure of the present utility model, application or use.Although described in an embodiment and be described in the drawings embodiment, but the optimal mode that the utility model does not limit by accompanying drawing example and the conduct of describing is in an embodiment thought to be at present to implement the specific examples of instruction of the present utility model, scope of the present utility model will comprise any embodiment of the specification that falls into above and appended claim.
Claims (3)
1. a silica gel chip packaging mould, for chip package, described chip package comprises support and a plurality of pedestal, described pedestal is mounted on described support, described pedestal is coated with one and has protruding heat radiation platform, in the projection of described heat radiation platform, is equipped with chip, and described chip is coated by layer of silica gel; It is characterized in that:
Described mould comprises substrate and a plurality of semicircle cover plate corresponding to described pedestal, the periphery of described semicircle cover plate extends a flange with inner groovy, and the inner groovy of described flange embeds so that described semicircle cover plate is positioned on described substrate for described substrate;
The inner peripheral of described flange has boss portion, and the top of described pedestal has the abutment face that is resisted against described boss portion;
One side of described semicircle cover plate has the hand-hole of oblique setting, and opposite side is provided with air-vent;
And a silica gel injection device, described silica gel injection device has and stretches into described hand-hole with the extension tube of Implanted Silicon sizing material.
2. silica gel chip packaging mould as claimed in claim 1, is characterized in that: described support is that metal is made.
3. silica gel chip packaging mould as claimed in claim 1, is characterized in that: described silica gel injection device has heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320705206.5U CN203521377U (en) | 2013-11-08 | 2013-11-08 | Silica-gel chip packaging mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320705206.5U CN203521377U (en) | 2013-11-08 | 2013-11-08 | Silica-gel chip packaging mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203521377U true CN203521377U (en) | 2014-04-02 |
Family
ID=50380267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320705206.5U Expired - Fee Related CN203521377U (en) | 2013-11-08 | 2013-11-08 | Silica-gel chip packaging mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203521377U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552708A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Mold for producing heat-conduction silica gel sheet and use method of mold |
| CN104576555A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Power semiconductor module with heat conducting silicon sheet and manufacturing method for power semiconductor module |
-
2013
- 2013-11-08 CN CN201320705206.5U patent/CN203521377U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552708A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Mold for producing heat-conduction silica gel sheet and use method of mold |
| CN104576555A (en) * | 2014-06-24 | 2015-04-29 | 深圳青铜剑电力电子科技有限公司 | Power semiconductor module with heat conducting silicon sheet and manufacturing method for power semiconductor module |
| CN104552708B (en) * | 2014-06-24 | 2017-11-07 | 深圳青铜剑科技股份有限公司 | A kind of mould and its application method for making heat-conducting silica gel sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20141108 |
|
| EXPY | Termination of patent right or utility model |