CN203521470U - LED silica gel chip packaging mould - Google Patents

Abstract

Provided is an LED silica gel chip packaging mould which comprises an upper mould and a lower mould. The upper mould is internally provided with upper mould space which is provided with multiple placing space used for accommodating LED chips. The lower mould is provided with multiple semicircular mould grooves which are corresponding to the placing space. Silica gel injection tubes communicated with the semicircular mould grooves are arranged below the semicircular mould grooves. A metal support is arranged between the upper mould and the lower mould and arranged in the upper mould space. Multiple base bodies arranged in the placing space are arranged below the metal support. A heat-radiating bench is accommodated in each base body. The heat-radiating benches are provided with accommodating grooves used for arranging the LED chips. Therefore, the LED silica gel chip packaging mould is simple in structure and convenient to use, and better LED silica gel chip packaging can be provided. Besides, the LED silica gel chip packaging mould is simple in operation and simplified in process, and thus cost is reduced.

Description

LED silica gel chip packaging mould

Technical field

The utility model relates to a kind of LED silica gel chip packaging mould.

Background technology

In LED silica gel chip packaging mould, the mould by ejection formation is by silica gel packaging in chip conventionally, and this structure exists the defect of packaging process complexity.

For this reason, designer of the present utility model is because above-mentioned defect, by concentrating on studies and designing, is comprehensively engaged in for a long time experience and the achievement of related industry for many years, and research and design goes out a kind of LED silica gel chip packaging mould, to overcome above-mentioned defect.

Utility model content

The technical problems to be solved in the utility model is: in LED silica gel chip packaging mould, the mould by ejection formation is by silica gel packaging in chip conventionally, and this structure exists the defect of packaging process complexity.

For addressing the above problem, the utility model discloses a kind of LED silica gel chip packaging mould, comprise mold and bed die, it is characterized in that:

In described mold, have mold space, described mold space has a plurality of shallow storage space of holding LED chip;

Described bed die has semicircle die cavity corresponding to a plurality of and described shallow storage space, and the below of described semicircle die cavity is provided with the silica gel ascending pipe being communicated with it;

Between described mold and bed die, be provided with metallic support, described metallic support is positioned at described mold space, the below of described metallic support is provided with a plurality of pedestals that are positioned at described shallow storage space, and each pedestal accommodates heat radiation platform, and described heat radiation platform has the holding tank of inserting for a LED chip.

Wherein: the both sides of described mold are provided with the first heating unit, the both sides of described bed die are provided with the second heating unit.

Known by said structure, LED silica gel chip packaging mould of the present utility model has following technique effect:

1, simple in structure, easy to use, good LED silica gel chip package can be provided;

2, easy and simple to handle, operation is simplified, and reduces costs.

Detailed content of the present utility model can obtain by explanation described later and institute's accompanying drawing.

Accompanying drawing explanation

Fig. 1 has shown the decomposing schematic representation of the utility model LED silica gel chip packaging mould.

Fig. 2 has shown the schematic diagram that the utility model LED silica gel chip packaging mould encapsulates.

Embodiment

Referring to Fig. 1 and Fig. 2, shown LED silica gel chip packaging mould of the present utility model.

Described LED silica gel chip packaging mould 9 comprises mold 90 and bed die 91, in described mold 90, there is mold space 901, described mold space 901 has a plurality of shallow storage space 902 of holding LED chip, described bed die 91 has semicircle die cavity 911 corresponding to a plurality of and described shallow storage space 902, and the below of described semicircle die cavity 911 is provided with the silica gel ascending pipe 912 being communicated with it.

Wherein, between described mold 90 and bed die 91, be provided with metallic support 5, described metallic support 5 is positioned at described mold space 901, the below of described metallic support 5 is provided with a plurality of pedestals 6 that are positioned at described shallow storage space 902, each pedestal 6 accommodates heat radiation platform 65, and described heat radiation platform 65 has the holding tank of inserting for a LED chip 7.

Wherein, the both sides of described mold 90 are provided with the first heating unit 94, and the both sides of described bed die 91 are provided with the second heating unit 95.

Known referring to Fig. 2, by being the silica gel of thickness liquid state after 912 pairs of half circular die cavity 911 injection heatings of silica gel ascending pipe, when injecting, mold and bed die are heated, avoided the temperature difference reaction when injecting, avoided the inhomogeneous of silica gel to solidify, after being full of, stopped the heating of heating unit, waited for that silica gel solidifies, after solidifying, directly form encapsulating structure, thereby avoided the complexity of operation.

Known by said structure, LED silica gel chip packaging mould tool of the present utility model has the following advantages:

1, simple in structure, easy to use, good LED silica gel chip package can be provided;

2, easy and simple to handle, operation is simplified, and reduces costs.

It is evident that above description and to record be only for example rather than in order to limit disclosure of the present utility model, application or use.Although described in an embodiment and be described in the drawings embodiment, but the optimal mode that the utility model does not limit by accompanying drawing example and the conduct of describing is in an embodiment thought to be at present to implement the specific examples of instruction of the present utility model, scope of the present utility model will comprise any embodiment of the specification that falls into above and appended claim.

Claims (2)

1. a LED silica gel chip packaging mould, comprises mold and bed die, it is characterized in that:

In described mold, have mold space, described mold space has a plurality of shallow storage space of holding LED chip;

Described bed die has semicircle die cavity corresponding to a plurality of and described shallow storage space, and the below of described semicircle die cavity is provided with the silica gel ascending pipe being communicated with it;

Between described mold and bed die, be provided with metallic support, described metallic support is positioned at described mold space, the below of described metallic support is provided with a plurality of pedestals that are positioned at described shallow storage space, and each pedestal accommodates heat radiation platform, and described heat radiation platform has the holding tank of inserting for a LED chip.

2. LED silica gel chip packaging mould as claimed in claim 1, is characterized in that: the both sides of described mold are provided with the first heating unit, and the both sides of described bed die are provided with the second heating unit.

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