CN203553163U - Improved LED silica gel chip packaging structure - Google Patents
Improved LED silica gel chip packaging structure Download PDFInfo
- Publication number
- CN203553163U CN203553163U CN201320706383.5U CN201320706383U CN203553163U CN 203553163 U CN203553163 U CN 203553163U CN 201320706383 U CN201320706383 U CN 201320706383U CN 203553163 U CN203553163 U CN 203553163U
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- CN
- China
- Prior art keywords
- silica gel
- mould bases
- led
- modified form
- cover body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
- H01L2224/48479—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Led Device Packages (AREA)
Abstract
An improved LED silica gel chip packaging structure is used for packaging an LED silica gel chip. The LED silica gel chip contains a round glass bracket; the upper surface of the glass bracket is fixed with at least two parallel blue-ray LED light-emitting chips; the glass bracket is also provided with a cover body; the cover body is arranged around the blue-ray LED light-emitting chips and is provided with a cone hole, wherein the top of the cone hole is larger than the bottom of the cone hole; the packaging structure comprises a mould base; the mould base leans against a surface of the cover body; the upper surface of the mould base is provided with a hemispheric groove; the circumference of the groove is provided with a protrusion part, wherein a section of the protrusion part is triangle; the middle part of the mould base has a tapered injection hole; and a side part of the protrusion pat of the mould base is provided with an air hole which penetrates through upper and lower surfaces of the mould base. Therefore, in the utility model, the mould base is used to realize the combined packaging of the hemispheric and triangular silica gel, so that the chip can improve the light irradiation effect.
Description
Technical field
The utility model relates to a kind of modified form LED silicon core chip package.
Background technology
In existing LED luminescence chip, conventionally adopt mould to encapsulate, it is semicircle that the colloid of encapsulation is generally, although semicircular encapsulating structure is relatively simple, light transmission is single, the light scattering effect of light-emitting component is single, is difficult to obtain better illumination effect.
For this reason, designer of the present utility model is because above-mentioned defect, by concentrating on studies and designing, is comprehensively engaged in for a long time experience and the achievement of related industry for many years, and research and design goes out a kind of modified form LED silicon core chip package, to overcome above-mentioned defect.
Utility model content
The technical problems to be solved in the utility model is: semicircular encapsulating structure is relatively simple, but light transmission is single, and the light scattering effect of light-emitting component is single, is difficult to obtain better illumination effect.
For addressing the above problem, the utility model discloses a kind of modified form LED silicon core chip package, one LED silica gel chip is encapsulated, described LED silica gel chip comprises circular glass supporter, the upper surface of described glass supporter is installed with one at least two blue-ray LED luminescence chip arranged side by side, on described glass supporter, also occupies and has a cover body, and described cover body is around described blue-ray LED luminescence chip, in it, there is a up big and down small conical through-hole, it is characterized in that:
Described modified form LED silicon core chip package comprises a mould bases, and described mould bases is connected to the surface of described cover body, forms a molding space for silica gel injection moulding between described mould bases and glass supporter;
The upper surface of described mould bases has a hemispheric inner groovy, it is leg-of-mutton protuberance that the periphery of described inner groovy has cross section, the middle part of described mould bases has a taper hand-hole, and the sidepiece of the protuberance of described mould bases is provided with the air vent hole that connects mould bases upper and lower surface.
Wherein: also comprise a silica gel injection device that carries out silica gel injection from described taper hand-hole.
Wherein: described silica gel injection device is automatic implanter, have heater automatically to inject in described automatic implanter after heating silica gel, described automatic implanter is electric piston formula implanter.
Wherein: described silica gel injection device is soft silica gel container, its bottom has heater, thereby can after heating silica gel, manually inject.
Known by said structure, modified form LED silicon core chip package of the present utility model has following technique effect:
1, the combination that has realized semicircle and triangle silica gel by specific mould bases encapsulates, and makes chip improve light radiation response;
2, simple in structure, production process is simple, colloid excellent bonding performance.
Detailed content of the present utility model can obtain by explanation described later and institute's accompanying drawing.
Accompanying drawing explanation
Fig. 1 has shown the structural representation of the LED silica gel chip that the utility model encapsulates.
Fig. 2 has shown the schematic diagram of the utility model modified form LED silicon core chip package.
Embodiment
Referring to Fig. 2, shown modified form LED silicon core chip package of the present utility model.
Described modified form LED silicon core chip package encapsulates a LED silica gel chip, referring to Fig. 1, described LED silica gel chip comprises circular glass supporter 11, described glass supporter 11 peripheries have the light shielding part (many vertical line parts in figure) of the one of being incorporated into, the upper surface of described glass supporter 11 is installed with one at least two blue-ray LED luminescence chip 15 arranged side by side, described glass supporter 11 has been embedded at least one bonding jumper 14, and described blue-ray LED luminescence chip 15 is wired to described bonding jumper by one.
Wherein, the bottom of described glass supporter 11 is installed with reflector 16, to improve light reflection effect.
On described glass supporter 11, also occupy and have a cover body 12, described cover body is around described blue-ray LED luminescence chip 15, in it, have a up big and down small conical through-hole, the one-tenth that is provided with injection moulding in described conical through-hole is positioned at the silica gel glasses lamella 13 outside described blue-ray LED luminescence chip.
Described silica gel glasses lamella 13 comprises body, the upper surface centre position of described body has extended upward a hemispherical projections 17, it is leg-of-mutton focusing projection 18 that described body is formed with cross section in the surrounding of hemispherical projections 17, and the described projection 18 that focuses on has the inclined-plane that tilts towards described hemispherical projections 17.
Described modified form LED silicon core chip package comprises a mould bases 21, and described mould bases 21 is connected to the surface of described cover body 12, forms a molding space for silica gel injection moulding between described mould bases 21 and glass supporter 11.
The upper surface of described mould bases 21 has a hemispheric inner groovy 22, it is leg-of-mutton protuberance 23 that the periphery of described inner groovy 22 has cross section, the middle part of described mould bases 21 has a taper hand-hole 24, and the sidepiece of the protuberance 23 of described mould bases 21 is provided with the air vent hole 25 that connects mould bases 21 upper and lower surfaces.
An and silica gel injection device (not shown) that carries out silica gel injection from described taper hand-hole 24.
Wherein, described silica gel injection device is automatic implanter, has heater automatically to inject after heating silica gel in described automatic implanter, and described automatic implanter is electric piston formula implanter.
Wherein, described silica gel injection device can be soft silica gel container, and its bottom has heater, thereby can after heating silica gel, manually inject.
Thus, after injecting by silica gel, be formed at the glomerate light scattering effect of hemispherical projections shape on LED chip, focus on projection and the light of periphery is concentrated on to middle part ejaculation, form thus the ejaculation effect that a middle part light is strengthened.
Known by said structure, modified form LED silicon core chip package tool of the present utility model has the following advantages:
1, adopt semicircle and leg-of-mutton combination astigmatism, improved light radiation response;
2, simple in structure, production process is simple, colloid excellent bonding performance.
It is evident that above description and to record be only for example rather than in order to limit disclosure of the present utility model, application or use.Although described in an embodiment and be described in the drawings embodiment, but the optimal mode that the utility model does not limit by accompanying drawing example and the conduct of describing is in an embodiment thought to be at present to implement the specific examples of instruction of the present utility model, scope of the present utility model will comprise any embodiment of the specification that falls into above and appended claim.
Claims (4)
1. a modified form LED silicon core chip package, one LED silica gel chip is encapsulated, described LED silica gel chip comprises circular glass supporter, the upper surface of described glass supporter is installed with one at least two blue-ray LED luminescence chip arranged side by side, on described glass supporter, also occupy and have a cover body, described cover body, around described blue-ray LED luminescence chip, has a up big and down small conical through-hole in it, it is characterized in that:
Described modified form LED silicon core chip package comprises a mould bases, and described mould bases is connected to the surface of described cover body, forms a molding space for silica gel injection moulding between described mould bases and glass supporter;
The upper surface of described mould bases has a hemispheric inner groovy, it is leg-of-mutton protuberance that the periphery of described inner groovy has cross section, the middle part of described mould bases has a taper hand-hole, and the sidepiece of the protuberance of described mould bases is provided with the air vent hole that connects mould bases upper and lower surface.
2. modified form LED silicon core chip package as claimed in claim 1, is characterized in that: also comprise a silica gel injection device that carries out silica gel injection from described taper hand-hole.
3. modified form LED silicon core chip package as claimed in claim 2, it is characterized in that: described silica gel injection device is automatic implanter, in described automatic implanter, have heater automatically to inject after heating silica gel, described automatic implanter is electric piston formula implanter.
4. modified form LED silicon core chip package as claimed in claim 2, is characterized in that: described silica gel injection device is soft silica gel container, and its bottom has heater, thereby can after heating silica gel, manually inject.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320706383.5U CN203553163U (en) | 2013-11-11 | 2013-11-11 | Improved LED silica gel chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320706383.5U CN203553163U (en) | 2013-11-11 | 2013-11-11 | Improved LED silica gel chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553163U true CN203553163U (en) | 2014-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320706383.5U Expired - Fee Related CN203553163U (en) | 2013-11-11 | 2013-11-11 | Improved LED silica gel chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553163U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253403A (en) * | 2013-06-25 | 2014-12-31 | 国家电网公司 | An apparatus and method for installing a 220 kV line arrester in a live working state |
-
2013
- 2013-11-11 CN CN201320706383.5U patent/CN203553163U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253403A (en) * | 2013-06-25 | 2014-12-31 | 国家电网公司 | An apparatus and method for installing a 220 kV line arrester in a live working state |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20141111 |
|
| EXPY | Termination of patent right or utility model |