CN202523761U - Led packaging structure - Google Patents
Led packaging structure Download PDFInfo
- Publication number
- CN202523761U CN202523761U CN2012200823946U CN201220082394U CN202523761U CN 202523761 U CN202523761 U CN 202523761U CN 2012200823946 U CN2012200823946 U CN 2012200823946U CN 201220082394 U CN201220082394 U CN 201220082394U CN 202523761 U CN202523761 U CN 202523761U
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- lens
- solid
- support
- solid acrylic
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Abstract
The utility model discloses a LED packaging structure which comprises a support and a lens. A wafer is fixed on a solid crystal position of the support. The solid acrylic lens is adopted. The solid acrylic lens is fixed and covers on the support. Because the lens is the solid acrylic lens and is solid and transparent, silica gel is not needed to be filled into and a traditional process of filling the silica gel is omitted. Production efficiency is increased and a problem that a bubble is easy to be generated in the traditional packaging structure during filling the silica gel is avoided. And a process yield rate is increased. Because the lens is the solid acrylic lens, a water vapour can be isolated and there is no harm to a fluorescent powder so that a service life of a product is prolonged.
Description
Technical field
The utility model relates to the improvement of the encapsulating structure of a kind of LED.
Background technology
The supporting structure of common high-power LED encapsulation structure comprises the silver-plated heating column of copper, pin and PPA (polyphthalamide) injection moulding, and is during encapsulation, solid brilliant on the silver-plated heating column of copper; Both positive and negative polarity links to each other with pin with gold thread; Put glue again, add plastic lens again, fill lens with silica gel; Another kind of with mould bar moulding encapsulation, lens are all used silica gel.This kind encapsulating structure is easy to generate bubble when having following shortcoming: A, lens filling gel, makes process rate be difficult to control; The easy moisture absorption of the silica gel of B, encapsulation, steam can damage fluorescent material, and silica gel and PPA bonding force are not enough, in the Reflow Soldering processing procedure, cause breaking off because of thermal expansion easily.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of LED encapsulating structure, and this LED encapsulating structure not only can improve process yields and yield, and can completely cut off the injury of steam to fluorescent material, again and simple in structure, easy to implement.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of LED encapsulating structure comprises support and lens, and wafer is fixed on the solid brilliant position of support, and said lens are solid acrylic lens, and said solid acrylic lens fixedly are covered on the said support.
The utility model for the further technical scheme that solves its technical problem and adopt is:
Said solid acrylic lens are bonded on the said support.
The beneficial effect of the utility model is: the lens of the LED encapsulating structure of the utility model adopt solid acrylic lens, and solid acrylic lens fixedly are covered on the support, because lens are solid acrylic lens; It is solid transparent; Therefore need not filling gel, saved the processing procedure of traditional filling gel, not only improved generation efficient; And be prone to produce the problem of bubble when having avoided conventional package structure filling gel, improved process rate; Because lens are solid acrylic lens, can completely cut off steam, and fluorescent material is not had injury, have improved the useful life of product.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Embodiment
Below through the embodiment of specific instantiation explanation the utility model, the personage who is familiar with this skill can be understood the advantage and the effect of the utility model easily by the content that this specification disclosed.The utility model also can other different mode be implemented, and, under the category that discloses from the utility model that is not contrary to, can give different modifications and change that is.
Embodiment: a kind of LED encapsulating structure, comprise support and lens, wafer is fixed on the solid brilliant position of support, and said lens are solid acrylic lens 1, and said solid acrylic lens 1 are bonded on the said support 2.Because lens are solid acrylic lens, are solid transparents, therefore need not filling gel; Saved the processing procedure of traditional filling gel; Not only improve generation efficient, and be prone to produce the problem of bubble when having avoided conventional package structure filling gel, improved process rate; Because lens are solid acrylic lens, can completely cut off steam, and fluorescent material is not had injury, have improved the useful life of product.
The foregoing description is merely illustrative the utility model principle and effect thereof, but not is used to limit the utility model.The rights protection scope of the utility model should be listed like claims.
Claims (2)
1. a LED encapsulating structure comprises support and lens, and wafer is fixed on the solid brilliant position of support, and it is characterized in that: said lens are solid acrylic lens (1), and said solid acrylic lens fixedly are covered on the said support (2).
2. LED encapsulating structure according to claim 1 is characterized in that: said solid acrylic lens (1) are bonded on the said support (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200823946U CN202523761U (en) | 2012-03-07 | 2012-03-07 | Led packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200823946U CN202523761U (en) | 2012-03-07 | 2012-03-07 | Led packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202523761U true CN202523761U (en) | 2012-11-07 |
Family
ID=47106692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200823946U Expired - Fee Related CN202523761U (en) | 2012-03-07 | 2012-03-07 | Led packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202523761U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569617A (en) * | 2012-03-07 | 2012-07-11 | 昆山翰辉电子科技有限公司 | LED encapsulation structure |
-
2012
- 2012-03-07 CN CN2012200823946U patent/CN202523761U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569617A (en) * | 2012-03-07 | 2012-07-11 | 昆山翰辉电子科技有限公司 | LED encapsulation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20130307 |