CN205303446U - Smooth distance sensor packaging structure of an encapsulated moulding - Google Patents
Smooth distance sensor packaging structure of an encapsulated moulding Download PDFInfo
- Publication number
- CN205303446U CN205303446U CN201521099708.3U CN201521099708U CN205303446U CN 205303446 U CN205303446 U CN 205303446U CN 201521099708 U CN201521099708 U CN 201521099708U CN 205303446 U CN205303446 U CN 205303446U
- Authority
- CN
- China
- Prior art keywords
- chip
- transparent
- salient point
- resin plate
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Light Receiving Elements (AREA)
Abstract
The utility model discloses a smooth distance sensor packaging structure of an encapsulated moulding, packaging structure mainly comprise base plate, chip, transparent glued membrane, transparent resin plate, welding wire, black resin and bump, the transparent resin plate that the one side has the bump is through transparent glued membrane and the laminating of chip upper surface, black resin parcel base plate upper surface, chip, transparent glued membrane, transparent resin plate and welding wire expose the bump. The utility model discloses an only need once encapsulation type, practice thrift the investment.
Description
Technical field
This utility model relates to optical sensor package technical field, specifically the electrical distance sensor-packaging structure of an a kind of encapsulated moulding.
Background technology
The encapsulation of current optical sensor interferes owing to avoid launching light and accepting light, must realize again light source and launches and receive, so often to do a transparent enclosure and once completely cut off light-source encapsulation, to realize light source normal transmission but non-interference.
Problems with is currently mainly run into for optical sensor package:
(1) twice encapsulating mould investment is huge, and complex process;
(2) owing to packaging process is relatively more, yield loss is bigger.
Utility model content
For above-mentioned prior art Problems existing, this utility model provides the electrical distance sensor-packaging structure of an a kind of encapsulated moulding, and this utility model only need to once encapsulate i.e. molding, investment reduction.
A kind of electrical distance sensor-packaging structure of encapsulated moulding, mainly it is made up of substrate, chip, transparent adhesive film, transparent resin plate, welding wire, black resin and salient point, described chip is connected with substrate by welding wire, described transparent resin plate one side has salient point, another side posts transparent adhesive film, transparent resin plate, by transparent adhesive film and chip upper surface laminating, described black resin parcel upper surface of base plate, chip, transparent adhesive film, transparent resin plate and welding wire, exposes salient point.
The manufacture method of the electrical distance sensor-packaging structure of encapsulated moulding, specifically carries out in accordance with the following steps:
The first step, Prefabricated salient point lamella lucida, including transparent resin plate and salient point thereon;
Second step, does not have the one side patch transparent adhesive film of salient point at transparent resin plate;
3rd step, cuts into separate unit by salient point lamella lucida;
4th step, core pressure welding on chip, described chip is connected with substrate by welding wire;
5th step, the separate unit of salient point lamella lucida and chip laminating, transparent resin plate is by transparent adhesive film and chip upper surface laminating;
6th step, plastic packaging spills salient point protection chip, black resin parcel upper surface of base plate, chip, transparent adhesive film, transparent resin plate and welding wire, exposes salient point.
The advantage of this utility model:
1, the transparent plastic packaging of chip is invested without mould;
2, product encapsulation motility increases, it is possible to achieve the adjustment of light source focus;
3, production technology simplifies, and UPH improves.
Accompanying drawing explanation
Fig. 1 is Prefabricated salient point lamella lucida schematic diagram;
Fig. 2 is salient point lamella lucida back side rubberizing film schematic diagram;
Fig. 3 is that salient point lamella lucida cuts into cell schematics;
Fig. 4 is that on chip, core pressure welding completes schematic diagram;
Fig. 5 is separate unit and the chip laminating schematic diagram of salient point lamella lucida;
Fig. 6 is that plastic packaging spills salient point protection chip schematic diagram.
In figure, 1 is substrate, and 2 is chip, and 3 is transparent adhesive film, and 4 is transparent resin plate, and 5 is welding wire, and 6 is black resin, and 7 is salient point.
Detailed description of the invention
A kind of electrical distance sensor-packaging structure of encapsulated moulding, mainly it is made up of substrate 1, chip 2, transparent adhesive film 3, transparent resin plate 4, welding wire 5, black resin 6 and salient point 7, described chip 2 is connected with substrate 1 by welding wire 5, described transparent resin plate 4 one side has salient point 7, another side posts transparent adhesive film 3, transparent resin plate 4 is by transparent adhesive film 3 and the laminating of chip 2 upper surface, described black resin parcel substrate 1 upper surface, chip 2, transparent adhesive film 3, transparent resin plate 4 and welding wire 5, expose salient point 7.
The manufacture method of the electrical distance sensor-packaging structure of encapsulated moulding, specifically carries out in accordance with the following steps:
The first step, Prefabricated salient point lamella lucida, including transparent resin plate 4 and salient point thereon 7, as shown in Figure 1;
Second step, does not have the one side patch transparent adhesive film 3 of salient point 7, as shown in Figure 2 at transparent resin plate 4;
3rd step, cuts into separate unit by salient point lamella lucida, as shown in Figure 3;
4th step, core pressure welding on chip, described chip 2 is connected with substrate 1 by welding wire 5, as shown in Figure 4;
5th step, the separate unit of salient point lamella lucida and chip laminating, transparent resin plate 4 is by transparent adhesive film 3 and the laminating of chip 2 upper surface, as shown in Figure 5;
6th step, plastic packaging spills salient point protection chip, black resin parcel substrate 1 upper surface, chip 2, transparent adhesive film 3, transparent resin plate 4 and welding wire 5, exposes salient point 7, as shown in Figure 6.
Claims (1)
1. the electrical distance sensor-packaging structure of an once encapsulated moulding, it is characterized in that, main by substrate (1), chip (2), transparent adhesive film (3), transparent resin plate (4), welding wire (5), black resin (6) and salient point (7) composition, described chip (2) is connected with substrate (1) by welding wire (5), described transparent resin plate (4) one side has salient point (7), another side posts transparent adhesive film (3), transparent resin plate (4) is by transparent adhesive film (3) and the laminating of chip (2) upper surface, described black resin parcel substrate (1) upper surface, chip (2), transparent adhesive film (3), transparent resin plate (4) and welding wire (5), expose salient point (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521099708.3U CN205303446U (en) | 2015-12-25 | 2015-12-25 | Smooth distance sensor packaging structure of an encapsulated moulding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521099708.3U CN205303446U (en) | 2015-12-25 | 2015-12-25 | Smooth distance sensor packaging structure of an encapsulated moulding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205303446U true CN205303446U (en) | 2016-06-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521099708.3U Active CN205303446U (en) | 2015-12-25 | 2015-12-25 | Smooth distance sensor packaging structure of an encapsulated moulding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205303446U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470213A (en) * | 2015-12-25 | 2016-04-06 | 华天科技（西安）有限公司 | Light distance sensor packaging structure formed by once packaging molding and manufacturing method thereof |
-
2015
- 2015-12-25 CN CN201521099708.3U patent/CN205303446U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470213A (en) * | 2015-12-25 | 2016-04-06 | 华天科技（西安）有限公司 | Light distance sensor packaging structure formed by once packaging molding and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huatian Science and Technology (Nanjing) Co.,Ltd. Assignor: HUATIAN TECHNOLOGY (XI'AN) Co.,Ltd. Contract record no.: X2021610000004 Denomination of utility model: One time packaging structure of optical distance sensor Granted publication date: 20160608 License type: Common License Record date: 20210526 |