CN203839411U - Molding die for carrying out die pressing and integrated packaging on LED light source - Google Patents
Molding die for carrying out die pressing and integrated packaging on LED light source Download PDFInfo
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- CN203839411U CN203839411U CN201420187970.2U CN201420187970U CN203839411U CN 203839411 U CN203839411 U CN 203839411U CN 201420187970 U CN201420187970 U CN 201420187970U CN 203839411 U CN203839411 U CN 203839411U
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- light source
- led light
- mould
- die
- integrated packaging
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a molding die for carrying out die pressing and integrated packaging on an LED light source. The molding die for carrying out die pressing and integrated packaging on the LED light source is used for packaging LED chips and comprises a bearing plate, a frame and a die body, wherein the LED chip is arranged on the bearing plate, and the frame is matched with the bearing plate so as to define an accommodating space; and the overall dimension of the die body is matched with that of the accommodating space, the lower surface is provided with a plurality of die cavity units, and the die cavity units are arranged in a mode of corresponding to positions of the LED chips. Another aspect of the molding die is that advantages of an injection molding method are well reserved, control for the size of the LED light source is enabled to be more accurate, good consistence in size is ensured, the contact ratio of the center of the overall dimension of the packaged LED light source and the center of the chip can be accurately controlled, and both the production efficiency and the precision can be greatly improved.
Description
Technical field
The utility model relates to LED former, more particularly, relates to a kind of mould of mold pressing integrated packaging LED light source.
Background technology
The manufacture craft that the continuous searching of industry can be reduced production costs for the trend that LED changes at a low price, LED is adopted by industry gradually without advantages such as encapsulation technology are low with its cost, centrality good, Reliability is high, optics control is flexible.So-called LED is not to have saved whole encapsulation link without encapsulation technology, and typically refers to the technique of having saved gold thread encapsulation, and it can't omit the silica gel that covers chip.The forming method without packaged LED in correlation technique mainly contains two kinds: excision forming and mould molding (being injection mo(u)lding).
Excision forming refers to first a plurality of LED chips compartment of terrain is arranged in a plane, the more whole silica gel that applies, then heating solidifies silica gel, and finally the mode by cutting forms independently encapsulated LED light source particle.In the method, due to the elasticity of silica gel self, make cut lengths restive, center and chip center's registration of the encapsulated LED light source overall dimension after cutting are not good, paster skew while easily causing SMT.
The mould first providing with the corresponding die cavity of overall dimension of being and not being packaged LED is provided mould molding, then LED chip is prevented in mould, after coating silica gel, and in silica gel curing and demolding, forms independently without packaged LED.The method is compared with excision forming, can guarantee preferably, without center and the chip center of packaged LED overall dimension, has good registration.Yet what produce due to the method is independent part without packaged LED, the later stage also will be carried out the operations such as braid again and just can be carried out paster operation, bothersome effort.
Utility model content
The technical problems to be solved in the utility model is, a kind of mould of mold pressing integrated packaging LED light source is provided.
For solving the problems of the technologies described above, the utility model has adopted following technical scheme: a kind of mould of mold pressing integrated packaging LED light source, for packaging LED chips, comprises loading plate, encloses frame and die body; Described LED chip is arranged on this loading plate, described in enclose frame and coordinate with described loading plate, define an accommodation space; The overall dimension of described die body and described accommodation space are suitable, and lower surface is formed with several die cavity unit, the position setting of the corresponding described LED chip in described die cavity unit.
In certain embodiments, described die body comprises some binder removals hole, and described some binder removals hole is arranged at respectively between adjacent die cavity unit, with deaeration and the unnecessary transparent encapsulation material such as silica gel.
In certain embodiments, this mould also comprises upper cover, and this upper cover convexes with some thimbles, and these thimbles are corresponding with described some binder removals hole respectively, and both sizes are suitable.
In certain embodiments, described some die cavity cell array formulas are arranged.
In certain embodiments,, described in enclose frame and be cylindric, described die body is rounded tabular, and the diameter of described die body with described in to enclose the internal diameter of frame suitable.
The beneficial effects of the utility model comprise:
1) retain well the advantage of injection molding forming method, made the control of LED light source size more accurate, guaranteed good dimensional uniformity, and can accurately control center and chip center's registration of encapsulated LED light source overall dimension.
2) final products are the encapsulated LED light source that full wafer is arranged, and can directly utilize existing die bond equipment to carry out paster operation to this encapsulated LED light source light source, and without braid again, production efficiency and precision all can improve greatly.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the section decomposing schematic representation of the mould of the mold pressing integrated packaging LED light source in the utility model the first embodiment;
Fig. 2 is the planar structure schematic diagram of loading plate shown in Fig. 1;
Fig. 3 is the planar structure schematic diagram that encloses frame shown in Fig. 1;
Fig. 4 is the planar structure schematic diagram of die body shown in Fig. 1;
Fig. 5 is the planar structure schematic diagram of upper cover shown in Fig. 1;
Fig. 6 is structural representation when LED flip-chip is sticked on loading plate by hot stripping film;
Fig. 7 is fixed to hot stripping film structural representation when peripheral by enclosing frame;
Fig. 8 is the structural representation injecting in enclosing frame after silica gel;
Fig. 9 is structural representation when die body is pressed in the silica gel enclosing in frame;
Figure 10 is the schematic diagram in the die body demoulding;
Schematic diagram when Figure 11 is heating loading plate.
Embodiment
Below in conjunction with specific embodiment and Figure of description, the utility model is described in further details.
Fig. 1 shows the decomposing schematic representation of the mould 1 of the mold pressing integrated packaging LED light source in the utility model the first embodiment, as shown in the figure, this mould 1 can be used for moulding integrated encapsulated LED light source, this integrated packaging LED light source directly (without braid again) for the operation of follow-up paster, its can comprise for be placed on loading plate 10 on a workbench (not shown), for be positioned on loading plate 10 enclose frame 20, for filling in the die body 30 that encloses in frame 20 and for coordinate to remove the upper cover 40 of binder removal hole silica gel with die body 30.
Together consult Fig. 1 and Fig. 2, loading plate 10 in certain embodiments can be rounded tabular, and comprise a smooth upper surface 11 and the lower surface relative with upper surface 11, and this upper surface 11 can be for placing LED chip, and this lower surface can be for lying against on a workbench.This loading plate 10 can adopt the metal materials such as aluminium, iron to make.Understandably, loading plate 10 is not limited to circular tabular, and it can be also square or irregularly shaped.
Together consult Fig. 1 and Fig. 3, enclose frame 20 and can be cylindric at some embodiment, it can coordinate with loading plate 10, defines a columned accommodation space.The internal diameter that encloses frame 20 is less than the diameter of loading plate 10.Preferably, the external diameter that encloses frame 20 is less than the diameter of loading plate 10.Understandably, enclose frame 20 and be not limited to and be cylindric, when needing rectangular other shapes such as grade of integrated packaging LED light source of moulding, this encloses frame 20 also can rectangular or other shapes.
Together consult Fig. 4, die body 30 is roughly rounded tabular in certain embodiments, and its diameter is slightly less than the internal diameter that encloses frame 20, so that this die body 30 can closely be put into, carries out mold pressing action in above-mentioned accommodation space.Die body 30 can comprise the lower surface 31 of a flat-satin and the upper surface 33 relative with this lower surface 31, on this lower surface 31, along die body 30 thickness direction indents, be formed with most rectangle die cavity unit 310, these die cavity unit 310 for example, are arranged according to predetermined rule (rectangular array), form the die cavity of this die body 30.The shape of each die cavity unit 310 is consistent with final encapsulated LED light source overall dimension.In addition, be also formed with most binder removal holes 35 on die body 30, these binder removal holes 35 are through to upper surface 33 by lower surface 31, and lay respectively between adjacent die cavity unit 310, for the process in mold pressing, get rid of unnecessary silica gel.Understandably, these die cavity unit 310 can rounded array as required, and its size can be identical, also can be different.
Together consult Fig. 1 and Fig. 5, upper cover 40 comprises upper cover body 41 and most thimbles 43.Upper cover body 41 can be rounded tabular at some embodiment, and the diameter of its diameter and die body 30 is suitable.These thimbles 43 are erected on the lower surface of upper cover body 41, and arrange in the binder removal hole 35 of corresponding die body 30.The diameter of thimble 43 and binder removal hole 35 are suitable, so that thimble 43 can closely insert in binder removal hole 35, the silica gel in binder removal hole 35 are released.
This mould 1 in use, first, need to be made enclosure space by the workbench (not shown) at this mould 1 place, in this mould 1 is housed in completely.Secondly, utilize vacuum pump to vacuumize workbench, make its interior mould 1 and silica gel in vacuum state.This loading plate 10 can be fixed on workbench by fastening assembly, this encloses frame 20 can be arranged at loading plate 10 tops up or down by guide rod assembly (not shown), this die body 30 also can be arranged at the top of enclosing frame 20 up or down by guide rod assembly, 40 tops that can be fixed on die body 30 of upper cover.This encloses moving up and down of frame 20 and this die body 30, can adopt conventional electronic or manual control system to control, and to realize forming operation, at this, is just not described in detail.Understandably, because the undersized of die body 30 is enclosed the internal diameter of frame 20 in this, die body 30 also can move to the top of enclosing frame 20.
The utility model also provides the forming method of mold pressing integrated molding encapsulated LED light source, and this forming method adopts above-mentioned mould 1 moulding LED light source, and it can comprise the steps:
A, as shown in Figure 6, first uses hot stripping film (Tape) 50 that most LED flip-chips (flip-chip) 60 are bonded on the upper surface 11 of loading plate 10 temporarily; Hot stripping film 50 is rounded, and its diameter is less than the internal diameter that encloses frame 20.This LED flip-chip 60 is arranged into the array corresponding with the position of the die cavity unit 310 of die body 30 on hot stripping film 50.Understandably, this forming method is not limited to the moulding of LED flip-chip (flip-chip).Also be not limited to the situation that a die cavity unit 310 can only encapsulate a LED chip.Die cavity unit 310 correspondences, accommodate under the situation of a plurality of LED chips, this forming method and mould thereof also can be fixed on substrate the packed LED chip with gold thread for encapsulation.Again understandably, this forming method is also not limited to the hot stripping film of application as LED supporting body, and it also can adopt other carrying diaphragm to realize.The effect of hot stripping film 50 is mainly to make the LED chip after moulding to be stripped from, in the situation that LED chip has been fixed on substrate or wiring board, and can be without this hot stripping film 50.
B, as shown in Figure 7, is then fixed to the upper surface 11 of loading plate 10 by enclosing frame 20, and is centered around hot stripping film 50 peripheries.
C, as shown in Figure 8, then the silica gel 70 that is just mixed with fluorescent material injects and encloses frame 20.Understandably, in certain embodiments, silica gel 70 also can adopt other the transparent encapsulation material such as transparent epoxy resin to substitute.
D, release agent (for example, Teflon) is sprayed to the inner surface of the die cavity unit 310 of die body 30, is beneficial to the demoulding.
E, the workbench at mould 1 place is made to enclosure space (not shown), this enclosure space is accommodated this mould 1, and recycling vacuum pump vacuumizes this enclosure space, makes die body 30 and silica gel 70 in vacuum state.
F, as shown in Figure 9, pressing die body 30 and loading plate 10 closures, be separated into most silica gel unit 71 by silica gel 70 downwards, and LED flip-chip 60 is immersed in silica gel unit 71; Now, unnecessary silica gel 72 enters the binder removal hole 35 on die body 30.
G, give mould 1 heating, silica gel unit 71 is solidified, LED flip-chip 60 is fixed in silica gel unit 71.
H, as shown in figure 10, die body 30 is lifted, die body 30 and silica gel unit 71 are departed from, and with upper cover 40 closures, now, the binder removal hole 35 that the thimble 41 of upper cover 40 inserts die body 30, the unnecessary silica gel 72 residuing in binder removal hole 35 is ejected by the thimble 41 of upper cover 40, to use the next time of mould 1.Understandably, also can adopt other structure to substitute upper cover 40, as long as can realize the object of removing unnecessary silica gel 72.
I, as shown in figure 11, finally heats loading plate 10, makes the bonding one side of hot stripping film 50 and loading plate 10 lose viscosity, the integral type encapsulated LED light source just can be made into.Understandably, this forming method also can, for making non-white light source, for example, need only and not add fluorescent material at silica gel 70.
Forming method in the utility model at least possesses following advantage:
1) retain well the advantage of injection molding forming method, made the control of LED light source size more accurate, guaranteed good dimensional uniformity, and can accurately control center and chip center's registration of encapsulated LED light source overall dimension.
2) final products are the encapsulated LED light source that full wafer is arranged, and can directly utilize existing die bond equipment to carry out paster operation to this encapsulated LED light source, and without braid again, production efficiency and precision all can improve greatly.
Owing to being provided with this binder removal hole 35, unnecessary silica gel can being discharged from, thereby guaranteeing that the dimensional accuracy of LED light source of final molding is higher.
It should be pointed out that for those skilled in the art, in several improvements and modifications that do not depart under the utility model principle prerequisite, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (5)
1. a mould for mold pressing integrated packaging LED light source, for packaging LED chips, is characterized in that, comprises loading plate, encloses frame and die body; Described LED chip is arranged on this loading plate, described in enclose frame and coordinate with described loading plate, define an accommodation space; The overall dimension of described die body and described accommodation space are suitable, and lower surface is formed with several die cavity unit, the position setting of the corresponding described LED chip in described die cavity unit.
2. the mould of mold pressing integrated packaging LED light source according to claim 1, is characterized in that, described die body comprises some binder removals hole, and described some binder removals hole is arranged at respectively between adjacent die cavity unit.
3. the mould of mold pressing integrated packaging LED light source according to claim 2, is characterized in that, this mould also comprises upper cover, and this upper cover convexes with some thimbles, and these thimbles are corresponding with described some binder removals hole respectively, and both sizes are suitable.
4. according to the mould of the mold pressing integrated packaging LED light source described in claims 1 to 3 any one, it is characterized in that, also comprise workbench and vacuum pump, this workbench is provided with enclosure space to accommodate this mould, and this vacuum pump is for vacuumizing this workbench.
5. according to the mould of the mold pressing integrated packaging LED light source described in claims 1 to 3 any one, it is characterized in that, also comprise carrying diaphragm, this carrying diaphragm is attached to described LED chip the upper surface of loading plate temporarily.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420187970.2U CN203839411U (en) | 2014-04-18 | 2014-04-18 | Molding die for carrying out die pressing and integrated packaging on LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420187970.2U CN203839411U (en) | 2014-04-18 | 2014-04-18 | Molding die for carrying out die pressing and integrated packaging on LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203839411U true CN203839411U (en) | 2014-09-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420187970.2U Withdrawn - After Issue CN203839411U (en) | 2014-04-18 | 2014-04-18 | Molding die for carrying out die pressing and integrated packaging on LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203839411U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943764A (en) * | 2014-04-18 | 2014-07-23 | 立达信绿色照明股份有限公司 | Mold and method for forming mold-pressing integrally-packaged LED light source |
| WO2017028417A1 (en) * | 2015-08-18 | 2017-02-23 | 江苏诚睿达光电有限公司 | Process method using thermoplastic resin photoconverter to bond-package led by rolling |
-
2014
- 2014-04-18 CN CN201420187970.2U patent/CN203839411U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943764A (en) * | 2014-04-18 | 2014-07-23 | 立达信绿色照明股份有限公司 | Mold and method for forming mold-pressing integrally-packaged LED light source |
| CN103943764B (en) * | 2014-04-18 | 2018-10-26 | 漳州立达信灯具有限公司 | It is molded the molding die and forming method of integrated packaging LED light source |
| WO2017028417A1 (en) * | 2015-08-18 | 2017-02-23 | 江苏诚睿达光电有限公司 | Process method using thermoplastic resin photoconverter to bond-package led by rolling |
| US10546980B2 (en) | 2015-08-18 | 2020-01-28 | Jiangsu Cherrity Optronics Co., Ltd. | Process method using thermoplastic resin photoconverter to bond-package LED by rolling |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170216 Address after: 363999 Fujian city of Zhangzhou province Ji Shan village of Changtai County Development Zone No. 1006 Xingtai pond Patentee after: ZHANGZHOU LEEDARSON LIGHTING CO., LTD. Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Patentee before: Leedarson Green Lighting Co., Ltd. |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20140917 Effective date of abandoning: 20181026 |
|
| AV01 | Patent right actively abandoned |