CN205810849U - A kind of packaging body - Google Patents
A kind of packaging body Download PDFInfo
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- CN205810849U CN205810849U CN201620523267.3U CN201620523267U CN205810849U CN 205810849 U CN205810849 U CN 205810849U CN 201620523267 U CN201620523267 U CN 201620523267U CN 205810849 U CN205810849 U CN 205810849U
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Abstract
The utility model proposes a kind of packaging body, relate to LED encapsulation technology field.Described packaging body is rectangular structure, the medium position of described packaging body is provided with the heat dissipation channel through described packaging body along the end face of packaging body to bottom surface, described heat dissipation channel be respectively provided on two sides with four pads, the end face of described packaging body is provided with the projection as reflector sidewall, and described projection is located at the edge of packaging body.The two foot encapsulation of this packaging body, it is possible to replace ceramic package completely, greatly reduce packaging cost, and better heat-radiation effect；Two feet and octal encapsulation can not only encapsulate LED lamp bead, the encapsulation to various integrated circuits and opto-electronic device can also be realized, this packaging body uses EMC or SMC material to make, there is good thermostability, weatherability and uv-resistance, encapsulate from planar package to each angle rising angle, comprehensive, convenient for production, cost is excellent, and yield is high.
Description
Technical field
This utility model relates to LED encapsulation technology field, particularly refers to a kind of packaging body.
Background technology
LED encapsulation encapsulation requirement can not only protect LED luminescence chip, but also can reach the requirement of printing opacity, so LED encapsulation has special requirement to material.The material that used of LED encapsulation is broadly divided into three kinds the most on the market, one, PPA modified plastics, and as PPA3528, PPA5050 encapsulate, but above encapsulation can only accomplish the power within 0.5W, and it is big to cross high temperature Reflow Soldering, light decay；Its two, PCT thermoplastic, as PCT2835, PCT3030, PCT5050 encapsulate, single above-mentioned encapsulation all can only accomplish the power within 1.0W, and it is big to cross high temperature Reflow Soldering, light decay；Its three, aluminium oxide ceramics, aluminium nitride ceramics, as pottery 3535 and 5050 encapsulate, the each side index of the encapsulation of above-mentioned employing pottery is outstanding, it is possible to the power accomplished is relatively big, but cost intensive, and during the molding of mould top, it is difficult to the angle that molding is different, produce yield the lowest.
Utility model content
For the deficiencies in the prior art, the utility model proposes a kind of packaging body, this packaging body uses EMC or SMC material to make, there is good thermostability, weatherability and uv-resistance, encapsulate from planar package to each angle rising angle, comprehensive, convenient for production, cost is excellent, yield is high, the two foot encapsulation that this packaging body uses simultaneously, it is possible to replace ceramic package completely, greatly reduce packaging cost, and better heat-radiation effect.
To achieve these goals, the technical scheme that this utility model is taked is as follows:
The utility model proposes a kind of packaging body, described packaging body is rectangular structure, the medium position of described packaging body is provided with the heat dissipation channel through described packaging body along the end face of packaging body to bottom surface, described heat dissipation channel be respectively provided on two sides with four pads, the end face of described packaging body is provided with the projection as reflector sidewall, and described projection is located at the edge of packaging body.
Further, described packaging body uses EMC or SMC material to make.
The beneficial effects of the utility model:
Packaging body the most of the present utility model uses octal encapsulation or the encapsulation of two feet, the two foot encapsulation of especially EMC or SMC3939, its pad locations can be completely covered the pad locations of pottery 3535, and area also has increase, this makes EMC or SMC3939 encapsulation can replace pottery 3535 encapsulation completely, owing to EMC or SMC has good thermostability, weatherability and uv-resistance, and price is than as little as one times of pottery, so this utility model is on the premise of ensureing original ceramic 3535 each side premium properties, greatly reduce the cost of LED encapsulation；
Packaging body the most of the present utility model uses EMC or SMC material, enable to encapsulation from planar package to each angle rising angle, comprehensive, encapsulate the encapsulation from plane, to 120 degree of molding go out light, 90 degree go out light, 60 degree go out light angularly, comprehensive, convenient for production, cost is excellent, and yield is high.
3. this utility model is additionally provided with a heat dissipation channel in the centre position of packaging body so that this utility model can not only encapsulate LED lamp bead, moreover it is possible to encapsulate various integrated circuit and opto-electronic device, and for they provide a good heat dissipation channel.
Accompanying drawing explanation
Fig. 1 is the top surface structure schematic diagram of a kind of packaging body of this utility model；
Fig. 2 is the bottom surface structure schematic diagram of a kind of packaging body of this utility model；
Fig. 3 is the side view diagram of a kind of packaging body of this utility model；
Fig. 4 is EMC or the pad locations figure of SMC3939 bis-foot encapsulation；
Fig. 5 is EMC or pad locations figure and the ceramic 3535 pad locations comparison diagrams of the encapsulation of SMC3939 bis-foot；
Fig. 6 a, 6b are the structural representation after the encapsulation of a kind of packaging body of this utility model.
Wherein, 1-heat dissipation channel, 2-pad, 3-is protruding, the pad locations of 10-EMC or SMC3939 encapsulation, the pad locations of 11-pottery 3535.
Detailed description of the invention
For making the purpose of this utility model embodiment, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in this utility model embodiment, technical scheme in this utility model embodiment is clearly and completely described, obviously, described embodiment is a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
As background technology is introduced, existing LED encapsulation uses PPA modified plastics, PCT thermoplastic and pottery, but owing to PPA, PCT can not super-high-currents, high temperature Reflow Soldering can not be crossed and light decay is big, and pottery is frangible, difficult forming, cost intensive, and molding different angles are not easy, produce yield low.Based on this, the utility model proposes a kind of packaging body, this packaging body uses EMC or SMC material to make.
With reference to shown in Fig. 1-3, existing packaging body is substantially the same, all in rectangular structure on contour structures the packaging body that this utility model is proposed with on market.Difference is, packaging body of the present utility model position in the middle is provided with the heat dissipation channel 1 along the end face of packaging body to bottom surface through packaging body, this heat dissipation channel 1 can provide good heat dissipation channel for LED lamp bead etc., it is respectively provided on two sides with four pads 2 at above-mentioned heat dissipation channel, as pad 2 is with heat dissipation channel 1, all through packaging body.Technique scheme in the both sides of heat dissipation channel 1 by being respectively arranged with four pads 2, packaging body is made to form octal encapsulation, this version makes this packaging body can not only encapsulate LED lamp bead, various integrated circuit and opto-electronic device can also be encapsulated, the particularly integrated circuit of optical device and power-type integrated circuit, the existence of heat dissipation channel 1 makes packaging body can provide good heat dissipation environment for said integrated circuit or opto-electronic device.The packaging body of this utility model utility model uses EMC or SMC material to make, and size is from 3.1mm*3.1mm, 3.9mm*3.9mm, then arrives 5.1mm*5.1mm, 7.1mm*7.1mm.Wherein, 3939 encapsulation of EMC or SMC are suitable for the LED lamp bead of the RGBW of encapsulation small-medium size, when needing carry bigger power or encapsulate the LED lamp bead of more powerful RGBW, only need to encapsulate larger sized lamp bead according to above technical scheme.
Particularly, packaging body of the present utility model also includes two foot encapsulation, the two foot packaging bodies of EMC or SMC3939, its pad locations figure is as shown in Figure 4, understand compared with the pad locations of pottery 3535 excellent with former each performance parameter index for the pad locations of the two foot packaging bodies of EMC or SMC3939, with reference to Fig. 5, the pad locations 10 of EMC or SMC3939 encapsulation can be completely covered the pad locations 11 of pottery 3535, and area also has increase, this makes EMC or SMC3939 encapsulation can replace pottery 3535 encapsulation completely, also can replace K1/K2 completely and imitate lumen packages.Owing to EMC or SMC has good thermostability, weatherability and uv-resistance, and price is than as little as one times of pottery, so this utility model is on the premise of ensureing original ceramic 3535 each side premium properties, greatly reduces the cost of LED encapsulation.Certainly, the encapsulation of 5151,7171 can also take said structure form, and the most corresponding load power can be bigger, and heat radiation can be more preferably.Certainly, above-mentioned two foot packaging bodies also are able to encapsulate various integrated circuit and opto-electronic device.
In addition to the above, compared with traditional pottery 3535, owing to ceramic material is frangible, it is difficult to the various angle of molding, but this utility model can be good at solving the problems referred to above.Packaging body of the present utility model uses EMC or SMC material, enable to encapsulation from planar package to each angle rising angle, comprehensive, encapsulate from the encapsulation of plane, to 120 degree of molding go out light, 90 degree go out light, 60 degree go out light angularly, with reference to Fig. 6 a, 6b, comprehensive, convenient for production, cost is excellent, and yield is high.
It should be noted that be provided with the projection 3 as reflector sidewall on the end face of packaging body, protruding 3 are located at the edge of packaging body.Above-mentioned protruding 3 during packaging body molding, additionally it is possible to play a part firm molding glue.
Packaging body of the present utility model is also combined with various reflector, is applied to different occasions as circular, oval, square, it is possible to allow secondary light-distribution become more free and relaxed.Reflection cavity uses silver-plated, gold-plated etc., also allows the LED of various wave band play optimum performance.
This utility model develops brand-new mould-forming process, and after mould preparation molding, the first various angle of molding, then cut, production efficiency is high, and yield is high, and each index is fully controllable.
The above; it is only detailed description of the invention of the present utility model; but protection domain of the present utility model is not limited thereto; any those familiar with the art is in the technical scope that this utility model discloses; change can be readily occurred in or replace, all should contain within protection domain of the present utility model.Therefore, protection domain of the present utility model should described be as the criterion with scope of the claims.
Claims (2)
1. a packaging body, described packaging body is rectangular structure, it is characterized in that, the medium position of described packaging body is provided with along the end face of packaging body to bottom surface through the heat dissipation channel of described packaging body (1), described heat dissipation channel (1) be respectively provided on two sides with four pads (2), the end face of described packaging body is provided with the projection (3) as reflector sidewall, and described projection (3) is located at the edge of packaging body.
A kind of packaging body the most according to claim 1, it is characterised in that described packaging body uses EMC or SMC material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620523267.3U CN205810849U (en) | 2016-06-02 | 2016-06-02 | A kind of packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620523267.3U CN205810849U (en) | 2016-06-02 | 2016-06-02 | A kind of packaging body |
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| Publication Number | Publication Date |
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| CN205810849U true CN205810849U (en) | 2016-12-14 |
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| CN201620523267.3U Active CN205810849U (en) | 2016-06-02 | 2016-06-02 | A kind of packaging body |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870299A (en) * | 2016-06-02 | 2016-08-17 | 深圳市磊立捷光电有限公司 | Package |
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2016
- 2016-06-02 CN CN201620523267.3U patent/CN205810849U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870299A (en) * | 2016-06-02 | 2016-08-17 | 深圳市磊立捷光电有限公司 | Package |
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