CN204596777U - Based on LED light source and the LED silk of face-down bonding - Google Patents
Based on LED light source and the LED silk of face-down bonding Download PDFInfo
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- CN204596777U CN204596777U CN201520296900.5U CN201520296900U CN204596777U CN 204596777 U CN204596777 U CN 204596777U CN 201520296900 U CN201520296900 U CN 201520296900U CN 204596777 U CN204596777 U CN 204596777U
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Abstract
The utility model discloses the LED light source based on face-down bonding and LED silk, the upper side of substrate is provided with solder layer, described solder layer is provided with blue light flip-chip, described blue light flip-chip is enclosed with fluorescent colloid, the downside of described substrate is provided with coating pad.The utility model have employed flip-chip bonding process technology and is welded on substrate by blue light flip-chip, can in order to avoid beat gold thread, promote bonding wire yield, thus reduce the loss sending light of blue chip, promote light efficiency, and use bankruptcy solder technology make the filament after encapsulation can luminous intensity in 360 degree of circumference evenly, lighting angle is larger, achieves high brightness, high reliability, high power density.
Description
Technical field
The utility model relates to LED light source, particularly a kind of LED light source based on face-down bonding and LED silk.
Background technology
Existing LED technical products mainly contains Lamp(straight cutting), SMD(surface mount device), COB(chip on board packaging), high-power, the integrated high-power of imitative lumen etc.Its product all passes through routing processing procedure, gold thread is used to be connected with substrate, its reliability is not high, the timbering material major part of product used uses the materials such as copper alloy (C194), injection moulding PPA (high temperature resistant nylon) material, copper base, aluminium base, but above-mentioned material thermal resistance is large, do not cross high-voltage safety test, therefore, packaging technology is all adopt some powder machine (that conventional is Japan musashi DS300) to put glue substantially, uses plane formula point glue packaging technology.
Be limited to the constraint of the aspects such as conventional LED package technology, material, technique, the defect that conventional package series products mainly exists has: one, thermal resistance is comparatively large, brightness is not high, light decay is larger; Two, plane formula point glue packaging technology exists that efficiency is slow, yield is low, production cost is high; Three, copper base, aluminium base class wrapper resistance toly to force down, are difficult to by national safety standard; Also there is low, the not resistance to instantaneous large-current of power, the defects such as antistatic effect is little in the LED light source that four, tradition is closed.
Thus prior art need to improve.
Utility model content
In view of above-mentioned the deficiencies in the prior art part, the purpose of this utility model is to provide the LED light source based on face-down bonding and LED silk, can improve the lighting angle of LED light source,
In order to achieve the above object, the utility model takes following technical scheme:
A kind of LED light source based on face-down bonding, comprise substrate, the upper side of described substrate is provided with the first coating pad, described first coating pad is provided with solder layer, described solder layer is provided with blue light flip-chip, described blue light flip-chip is enclosed with fluorescent colloid, the downside of described substrate is provided with the second coating pad.
Described based in the LED light source of face-down bonding, the side of described fluorescent colloid is provided with box dam glue-line.
Described based in the LED light source of face-down bonding, described substrate is aluminium nitride substrate.
Described based in the LED light source of face-down bonding, the length of described substrate is 2.04mm, the width of substrate is 1.64mm, the thickness of substrate is 0.35mm.
Described based in the LED light source of face-down bonding, the thickness of described LED light source is not more than 0.52mm.
A kind of LED silk, comprises at least one as above based on the LED light source of face-down bonding.
Compared to prior art, the LED light source based on face-down bonding that the utility model provides and LED silk, the upper side of substrate is provided with solder layer, described solder layer is provided with blue light flip-chip, described blue light flip-chip is enclosed with fluorescent colloid, the downside of described substrate is provided with coating pad.The utility model have employed flip-chip bonding process technology and is welded on substrate by blue light flip-chip, can in order to avoid beat gold thread, promote bonding wire yield, thus reduce the loss sending light of blue chip, promote light efficiency, and use bankruptcy solder technology make the filament after encapsulation can luminous intensity in 360 degree of circumference evenly, lighting angle is larger, achieves high brightness, high reliability, high power density.
Accompanying drawing explanation
The cross section structure schematic diagram of the LED light source based on face-down bonding that Fig. 1 provides for the utility model first preferred embodiment.
Fig. 2 provides the LED light source principle of luminosity figure based on face-down bonding for the utility model first embodiment.
The cross section structure schematic diagram of the LED light source based on face-down bonding that Fig. 3 provides for the utility model second preferred embodiment.
Embodiment
The utility model provides LED light source based on face-down bonding and LED silk, for making the purpose of this utility model, technical scheme and effect clearly, clearly, further describes the utility model referring to the accompanying drawing embodiment that develops simultaneously.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, the cross section structure schematic diagram of the LED light source based on face-down bonding that Fig. 1 provides for the utility model first preferred embodiment.As shown in Figure 1, the LED light source based on face-down bonding that the utility model first preferred embodiment provides comprises substrate 10, the upper side of described substrate 10 is provided with the first coating pad 41, described first coating pad 41 is provided with solder layer 20, described solder layer 20 is provided with blue light flip-chip 30, described blue light flip-chip 30 is enclosed with fluorescent colloid 40, the downside of described substrate 10 is provided with the second coating pad 50, for LED light source dress is pasted on circuit boards.Blue light flip-chip 30 welds on the substrate 10 by the utility model, can exempt to beat gold thread, promote bonding wire yield, then have employed plane molding (molded) fluorescent gum forming technique and give me a little fluorescent glue, make fluorescent colloid 40 thickness thinner, realize LED light source ultrathin, and by bankruptcy solder technology welding blue light flip-chip 30, also can make the filament after encapsulation can luminous intensity in 360 degree of circumference evenly, lighting angle is larger, and its lighting angle is as shown in Figure 2.
Please continue to refer to Fig. 1, do thinner to make LED light source, described substrate 10 is aluminium nitride substrate, and this aluminium nitride substrate is high temperature resistant, low thermal resistance, the heavy current impact of resistance to momentary pulse (1.5A), good insulation preformance, and product can cross national safety standard.And because aluminium nitride substrate is high temperature resistant, substrate 10 can do thinner by low thermal resistance, thus make the light source thickness slimming that encapsulates, and heat sinking function is better.
In the present embodiment, the length of described substrate 10 is 2.04mm, the width of substrate 10 is 1.64mm, the thickness of substrate 10 is 0.35mm, and the thickness of LED light source is not more than 0.52mm after packaging, realizes LED light source ultrathin.
The second preferred embodiment that the utility model provides, as shown in Figure 3, the difference of itself and above-mentioned first preferred embodiment is only, the side of described fluorescent colloid 40 is provided with box dam glue-line 60, dispensing technology point fluorescent glue directly can be used by using box dam glue-line 60, simple production technique, improves production efficiency.
In order to better understand the utility model, below the manufacture craft of the LED light source based on face-down bonding of the present utility model is described:
Aluminium nitride substrate, blue light flip-chip and solder layer are first provided, solder layer are imprinted on die bond on substrate, adopt flip chip technologies to be welded on aluminium nitride substrate by blue light flip-chip, clean afterwards; After preparing fluorescent glue, using Molding(molded) moulding process puts fluorescent glue on blue light flip-chip, and toast afterwards, make each LED light source cutting and separating afterwards again, then carry out test light splitting and after packaging can shipment.
The utility model have employed ultra-thin ceramic substrate and decreases substrate thickness and use Molding (molded) moulding process to make fluorescent colloid thickness can do thinner, realize the slimming of LED light source, and aluminium nitride substrate low thermal resistance, the heavy current impact of resistance to momentary pulse (1.5A), good insulation preformance, product can cross national safety standard.
The utility model, by being directly welded on substrate by blue light flip-chip, being exempted to beat gold thread, is promoted bonding wire yield, and reduces the loss that chip sends light, promotes light efficiency, realizes high brightness, high reliability, high power density.
Separately, the utility model adopts disposable " plane molding molding technology thereof ", simplifies tradition and first puts molding technique after glue, ensures that colour consistency is good, makes production efficiency and produce yield to be all significantly improved.
The utility model is also corresponding provides a kind of LED silk, and it comprises at least one LED light source based on face-down bonding.Because this LED light source has been described in detail above, do not repeating herein.
Be understandable that; for those of ordinary skills; can be equal to according to the technical solution of the utility model and utility model design thereof and replace or change, and all these change or replace the protection range that all should belong to the claim appended by the utility model.
Claims (6)
1. the LED light source based on face-down bonding, comprise substrate, it is characterized in that, the upper side of described substrate is provided with the first coating pad, described first coating pad is provided with solder layer, described solder layer is provided with blue light flip-chip, described blue light flip-chip is enclosed with fluorescent colloid, the downside of described substrate is provided with the second coating pad.
2. the LED light source based on face-down bonding according to claim 1, is characterized in that, the side of described fluorescent colloid is provided with box dam glue-line.
3. the LED light source based on face-down bonding according to claim 1, is characterized in that, described substrate is aluminium nitride substrate.
4. the LED light source based on face-down bonding according to claim 1-3 any one, is characterized in that, the length of described substrate is 2.04mm, the width of substrate is 1.64mm, the thickness of substrate is 0.35mm.
5. the LED light source based on face-down bonding according to claim 4, is characterized in that, the thickness of described LED light source is not more than 0.52mm.
6. a LED silk, is characterized in that, comprises at least one as claimed in claim 1 based on the LED light source of face-down bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520296900.5U CN204596777U (en) | 2015-05-08 | 2015-05-08 | Based on LED light source and the LED silk of face-down bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520296900.5U CN204596777U (en) | 2015-05-08 | 2015-05-08 | Based on LED light source and the LED silk of face-down bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204596777U true CN204596777U (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520296900.5U Expired - Fee Related CN204596777U (en) | 2015-05-08 | 2015-05-08 | Based on LED light source and the LED silk of face-down bonding |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575957A (en) * | 2016-02-22 | 2016-05-11 | 易美芯光（北京）科技有限公司 | COB light source for white light LED |
| CN111208669A (en) * | 2018-11-21 | 2020-05-29 | 深圳市百柔新材料技术有限公司 | Light-emitting diode backlight plate and manufacturing method thereof |
-
2015
- 2015-05-08 CN CN201520296900.5U patent/CN204596777U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575957A (en) * | 2016-02-22 | 2016-05-11 | 易美芯光（北京）科技有限公司 | COB light source for white light LED |
| CN111208669A (en) * | 2018-11-21 | 2020-05-29 | 深圳市百柔新材料技术有限公司 | Light-emitting diode backlight plate and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 |