CN208538851U - Multi-panel bonding LED filament - Google Patents

Multi-panel bonding LED filament Download PDF

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Publication number
CN208538851U
CN208538851U CN201820983746.2U CN201820983746U CN208538851U CN 208538851 U CN208538851 U CN 208538851U CN 201820983746 U CN201820983746 U CN 201820983746U CN 208538851 U CN208538851 U CN 208538851U
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China
Prior art keywords
mounting
led
chip
filament
mounting plate
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CN201820983746.2U
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Chinese (zh)
Inventor
周志海
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Zhejiang Refond Optoelectronics Co Ltd
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Zhejiang Refond Optoelectronics Co Ltd
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Priority to CN201820983746.2U priority Critical patent/CN208538851U/en
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Abstract

The utility model belongs to field of LED illumination, disclose multi-panel bonding LED filament, including the mounting plate with pin and the packing colloid being covered on the mounting plate, the surface of the mounting plate at least the first mounting surface and the second mounting surface, first mounting surface and the second mounting surface are oppositely arranged and are installed with several LED chips respectively.The surface of mounting plate is equipped with the first mounting surface and the second mounting surface being oppositely arranged, LED chip is respectively and fixedly provided on first mounting surface and the second mounting surface, the LED filament of this structure can realize that multi-panel die bond bonding wire shines, the whole light efficiency for improving filament efficiently solves the problems, such as that filament product different location is photochromic inconsistent.And this kind of construction packages LED filament shine when, filament integral heat sink is uniform, can effectively be promoted filament product use power and reliability.

Description

Multi-panel bonding LED filament
Technical field
The utility model relates to field of LED illumination, and in particular to multi-panel bonding LED filament.
Background technique
LED light has the advantages that energy conservation and environmental protection and will not generate ultraviolet light, infrared ray and radiation, is typical green illumination Lamps and lanterns, LED light have become the primary illumination light source of daily life.In existing LED filament, LED chip is welded in the one of mounting plate admittedly Face, the front of filament is bad with the photochromic consistency in the back side under working environment, and in order to improve the brightness of LED filament, work as LED filament When the LED chip that upper mounting plate single side welds admittedly is more, specific power density increases, and the heat of LED chip fever concentrates on PN junction On, if heat dissipation is uneven, junction temperature is increased, and will lead to luminous efficiency decline.
Therefore, it is necessary to provide a kind of LED filament structure that can effectively improve LED filament overall brightness.
Utility model content
The utility model provides a kind of multi-panel bonding LED filament, overcomes and solves in the prior art as raising LED light Color consistency and the bad problem of heat dissipation generated, the LED filament have the photochromic consistency of multi-panel high, and it is uniform beneficial to radiate Effect.
The utility model is to solve a kind of technical solution that its technical problem provides to be:
Multi-panel bonding LED filament, including the mounting plate with pin and the packing colloid being covered on the mounting plate, institute The surface for stating mounting plate includes at least the first mounting surface and the second mounting surface, and first mounting surface and the second mounting surface are set relatively It sets and is bonded with several LED chips respectively.
As an improvement of the above technical solution, the LED chip is also installed at least one side of the mounting plate.
As a further improvement of the above technical scheme, be mounted on the LED chip first mounting surface, second Any two face serial or parallel connection in mounting surface and side.
As an improvement of the above technical solution, the mounting plate includes multiple substrates, and the surface composition of the substrate is at least The surface of the mounting plate including first mounting surface and the second mounting surface.
As an improvement of the above technical solution, the two neighboring LED chip series connection and/or parallel connection on same plane.
As an improvement of the above technical solution, the LED chip position on first mounting surface and the second mounting surface Identical or dislocation arrangement.
As an improvement of the above technical solution, the LED chip on first mounting surface and the second mounting surface is equidistant Arrangement or non-equidistant arrangement.
As an improvement of the above technical solution, the LED chip is positive cartridge chip, flip-chip, one in vertical chip Kind is a variety of.
As a further improvement of the above technical scheme, the face that the LED chip is installed on the mounting plate is equipped with conduction Layer, the device on the mounting plate passes through the conductive layer or the conducting of the electric connection line on the conductive layer.
As an improvement of the above technical solution, the mounting plate is ceramics, in sapphire, glass, metal, high molecular material It is one or more.
The advantageous effects of the utility model are: the surface of mounting plate is equipped with the first mounting surface and second being oppositely arranged It is mounted on LED chip on mounting surface, the first mounting surface and the second mounting surface, the LED filament of the structure can realize multi-panel die bond Bonding wire shines, and improves the whole light efficiency of filament, efficiently solves the problems, such as that filament product different location is photochromic inconsistent.And have When having the LED filament of the encapsulating structure to shine, filament integral heat sink is uniform, and can effectively promote filament product uses power and can By property.
Detailed description of the invention
Illustrate the technical scheme in the embodiment of the utility model in order to clearer, it below will be to required in embodiment description Attached drawing to be used briefly describes.
Fig. 1 is the structural schematic diagram of one embodiment of the multi-panel bonding LED filament of the utility model.
Fig. 2 is the structural schematic diagram of the another embodiment of the multi-panel bonding LED filament of the utility model.
Fig. 3 is the structural schematic diagram of the another embodiment of the multi-panel bonding LED filament of the utility model.
Specific embodiment
It is carried out with reference to embodiments with technical effect of the attached drawing to the design of the utility model, specific structure and generation clear Chu is fully described by, to fully understand the purpose of this utility model, scheme and effect.It should be noted that in the feelings not conflicted The features in the embodiments and the embodiments of the present application can be combined with each other under condition.Furthermore used in the utility model it is upper, Under, the descriptions such as left and right be only in opposite figure for each component part mutual alignment relation of the utility model.
It should be noted that the diagram in the present embodiment only illustrates the basic conception of the utility model in a schematic way, because The component in relation to the utility model is not to draw according to element shapes, size and the number when implementing in this diagram.
Fig. 1 is the structural schematic diagram of one embodiment of the multi-panel bonding LED filament of the utility model, and Fig. 2 is that this is practical The structural schematic diagram of the another embodiment of novel multi-panel bonding LED filament, Fig. 3 are the multi-panel bonding LED lamp of the utility model The structural schematic diagram of the another embodiment of silk.
Referring to figs. 1 to Fig. 3, a kind of multi-panel bonding LED filament is shown, including the mounting plate 110 with pin 150 and is covered It is placed on the packing colloid 120 on 110 surface of mounting plate, mounting plate 110 includes at least the first mounting surface 111 and the second mounting surface 112, First mounting surface 111 and the second mounting surface 112 are oppositely arranged, and are bonded with several LED chips respectively.
The utility model is so-called " multi-panel ", including more than two sides or two sides.
In the embodiment of multi-panel bonding LED filament shown in fig. 1, the first mounting surface 111 of mounting plate 110 and the second installation Several LED chips are mounted on face 112, the spacing between two adjacent LEDs chip on each mounting surface is equal, can also Unequal distance, specific arrangement mode is with no restriction.And connected in series or in parallel between two adjacent LEDs chip, i.e., often On a mounting surface between LED chip can whole serial or parallel connections, be also possible to the connection type that series, parallel coexists.
In addition, the cross section of mounting plate 110 can be the polygonized structures such as triangle, rectangle.In addition to the first mounting surface 111, except the second mounting surface 112, also at least one side of mountable LED chip on mounting plate 110.Therefore the first peace The bonding of LED chip serial or parallel connection in dress face 111, the second mounting surface 112 and side 113 on any two face, the i.e. multi-panel LED chip can be multi-panel parallel connection, be also possible to multi-panel series connection.
In the present embodiment, the LED chip on the first mounting surface 111 and the second mounting surface 112 can be set in same position It sets, can also shift to install.And LED chip is flip-chip, positive cartridge chip 130, can also be vertical chip, it can on each face The LED chip of same type is installed, also mountable different types of LED chip, the LED core sheet type on any two face can also It is inconsistent.It is connected between positive cartridge chip 130 and positive cartridge chip 130 by conductor wire 140.In the present embodiment, the first mounting surface 111 It is positive cartridge chip 130 with the LED chip on the second mounting surface 112.
When LED chip is vertical chip or flip-chip, the vertical chip is installed on mounting plate or the face of flip-chip is set There is conductive layer.Certainly two adjacent LEDs on positive cartridge chip or the same face can also be installed in the mounting surface for being provided with conductive layer Chip type is different, such as vertical chip, flip-chip or positive cartridge chip are mounted in a manner of multiple combinations with conductive layer Face on.Device such as LED chip on mounting plate pass through conductive layer or the conducting of the electric connection line on conductive layer, i.e. conductive layer On can bonding wire realize and be electrically connected with power supply or other electrical parts, can also directly pass through conductive layer realization electrical connection.Electric connection line It can be conductive terminal, and while being not provided with conductive terminal is also able to achieve conducting.
In embodiment shown in Fig. 2, the LED chip on the first mounting surface 211 and the second mounting surface 212 is upside-down mounting Chip 230, the face that flip-chip 230 is installed on mounting plate 210 are equipped with conductive layer, and flip-chip 230 directly passes through conductive layer Realize its electric connection, and in the present embodiment the first mounting surface 211 and the flip-chip 230 on the second mounting surface 212 position It is identical.In embodiment illustrated in fig. 3, the LED chip on the first mounting surface 311 is positive cartridge chip 331, the second mounting surface 312 On LED chip be flip-chip 332, and the first mounting surface 311 is identical with the position of LED chip on the second mounting surface 312.
When LED chip is vertical chip, one end of vertical chip is connect with conductive layer, and the other end is welded with conductor wire, and The conductor wire is connect with conductive layer or vertical chip, and arrangement mode is with no restriction.
It should be noted that opposite LED chip in Fig. 2 and Fig. 3 on the first mounting surface and the second mounting surface can be with It shifts to install, i.e. the first mounting surface need not be identical with LED chip position corresponding on the second mounting surface.In another implementation Example in, be also fixed with LED chip at least one side of mounting plate, the LED chip can for vertical chip, flip-chip or Positive cartridge chip, two adjacent LEDs chip-in series or parallel connection on side, and LED chip fixed on side can be with the first mounting surface Or the second LED chip serial or parallel connection on mounting surface.
In embodiment shown in figure 1, the first mounting surface 111, the second mounting surface 112 of a LED filament mounting plate 110 It is respectively fixed with LED chip at least one side 113, in addition, mounting plate 110 further includes multiple substrates, group after substrate die bond The LED filament for forming multifaceted light-emitting is closed, the omnibearing luminous purpose of LED filament equally may be implemented.More substrate in combination realize peace In the embodiment of loading board multi-panel bonding LED chip, substrate is preferably two pieces, then the first mounting surface and the second mounting surface of mounting plate The surface that respectively two pieces of substrates are used for die bond.Mounting plate 110 be ceramics, sapphire, glass, metal, high molecular material one Kind is a variety of, such as the composite material of the high molecular materials such as BT plate, FPC or fiberboard or high molecular material and other materials.It is glimmering Light powder is packaged in packing colloid 120.Pin 150 is connected to the both ends of mounting plate 110, one end of pin 150 and installation Plate 110 is fixedly connected, and the other end extends to be connected to power supply outside packing colloid 120.In addition to this, on pin 150 or conductive layer It is connected with the electric connection line of conducting mounting plate 110, the specific connection type of electric connection line is welding, i.e. 110 both ends of mounting plate Electric connection line can be both welded on pin 150, can also be directly welded on conductive layer to realize circuit on mounting plate 110 Conducting.For Fig. 2 into embodiment illustrated in fig. 3, same design is can also be used in mounting plate.
The utility model carries out die bond bonding wire with the back side even side in the front of traditional filament mounting plate, without introducing The omnibearing luminous of LED filament can be realized in other techniques, and front and back all carries out solid solder joint glue and can effectively increase The distance between LED chip, avoiding excessively concentrating because of heat causes LED filament heat dissipation bad, can effectively promote making for LED filament With power and reliability.
Although specifically showing and describing the utility model in conjunction with preferred embodiment, those skilled in the art is answered This is understood, in the spirit and scope for not departing from the utility model defined by described claims, in form and details On the utility model can be made a variety of changes, be the protection scope of the utility model.

Claims (10)

1. multi-panel bonding LED filament, which is characterized in that including the mounting plate with pin and the envelope being covered on the mounting plate Colloid is filled, the surface of the mounting plate includes at least the first mounting surface and the second mounting surface, first mounting surface and the second peace Dress face is oppositely arranged and is bonded with several LED chips respectively.
2. multi-panel bonding LED filament according to claim 1, which is characterized in that the LED chip is also installed on the peace On at least one side of loading board.
3. multi-panel bonding LED filament according to claim 2, which is characterized in that be mounted on the described of the LED chip Any two face serial or parallel connection in first mounting surface, the second mounting surface and side.
4. multi-panel bonding LED filament according to claim 1, which is characterized in that the mounting plate includes multiple substrates, institute State surface of the surface composition including at least first mounting surface and the mounting plate of the second mounting surface of substrate.
5. multi-panel bonding LED filament according to any one of claims 1 to 4, which is characterized in that adjacent on same plane Two LED chip series connection and/or parallel connection.
6. multi-panel bonding LED filament according to claim 1, which is characterized in that first mounting surface and the second installation The LED chip position on face is identical or dislocation is arranged.
7. multi-panel bonding LED filament according to claim 1, which is characterized in that first mounting surface and the second installation The LED chip on face is equidistantly arranged or non-equidistant arrangement.
8. multi-panel bonding LED filament according to claim 1, which is characterized in that the LED chip be positive cartridge chip, fall One of cartridge chip, vertical chip are a variety of.
9. multi-panel bonding LED filament according to claim 8, which is characterized in that install the LED core on the mounting plate The face of piece is equipped with conductive layer, and the device on the mounting plate passes through the conductive layer or the electric connection line on the conductive layer Conducting.
10. multi-panel bonding LED filament according to claim 1, which is characterized in that the mounting plate be ceramics, sapphire, One of glass, metal, high molecular material are a variety of.
CN201820983746.2U 2018-06-25 2018-06-25 Multi-panel bonding LED filament Active CN208538851U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820983746.2U CN208538851U (en) 2018-06-25 2018-06-25 Multi-panel bonding LED filament

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820983746.2U CN208538851U (en) 2018-06-25 2018-06-25 Multi-panel bonding LED filament

Publications (1)

Publication Number Publication Date
CN208538851U true CN208538851U (en) 2019-02-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820983746.2U Active CN208538851U (en) 2018-06-25 2018-06-25 Multi-panel bonding LED filament

Country Status (1)

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CN (1) CN208538851U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108922880A (en) * 2018-06-25 2018-11-30 浙江瑞丰光电有限公司 Multi-panel bonding LED filament

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108922880A (en) * 2018-06-25 2018-11-30 浙江瑞丰光电有限公司 Multi-panel bonding LED filament

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