CN205488203U - UV light source packaging structure - Google Patents
UV light source packaging structure Download PDFInfo
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- CN205488203U CN205488203U CN201620079553.5U CN201620079553U CN205488203U CN 205488203 U CN205488203 U CN 205488203U CN 201620079553 U CN201620079553 U CN 201620079553U CN 205488203 U CN205488203 U CN 205488203U
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- light source
- packaging structure
- luminescence chip
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- paste layer
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Abstract
The utility model is suitable for a light source packaging technique field provides a UV light source packaging structure, include the light source base plate, be in through the shaping of high temperature high pressure mode on the light source base plate and the circuit layer, printing or the point that have a solid crystalline region glue attached to gu the tin cream layer of crystalline region, face -down bonding are in luminescence chip on the tin cream layer to and combine through hot -pressing mode just be used for on the light source base plate covering the glass lens of luminescence chip. The utility model discloses a with the luminescence chip face -down bonding on the tin cream layer for the performance of light source is stable more, the thermal resistance is littleer, in addition, the use of material is glued to the reduction silica gel, resin etc. That light source packaging structure went up furthest in the encapsulation, very big reduction because of the radiation of ultraviolet itself leads to the speed of light source inefficacy, prolonged the life of light source.
Description
Technical field
This utility model belongs to light-source encapsulation technical field, particularly relates to a kind of UV illuminating source packaging structure.
Background technology
Ultraviolet light, is also UV (Ultra Violet), because the light of these wave bands is invisible for human eye
, UV purple light is the electromagnetic wave that wavelength ratio visible ray is short, longer than X-ray.
At present, the UV light source on market to be applied to printing, medical treatment and the field such as sterilization, but existing skill
UV-LED light source in art, because employing the glue materials such as more silica gel, resin in encapsulation, accelerates ultraviolet
The radiation of itself causes the speed of light source fails so that it is the lost of life.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, it is provided that a kind of UV light source envelope
Assembling structure, its performance is more stable, thermal resistance is less.
This utility model is achieved in that and provides a kind of UV illuminating source packaging structure, including light source substrate,
It is molded on described light source substrate and has the circuit layer of crystal bonding area by High Temperature High Pressure mode, print or some glue
It is attached to the tin paste layer of described crystal bonding area, face-down bonding luminescence chip on described tin paste layer, and passes through
Hot pressing mode is combined on described light source substrate and for covering the glass lens of described luminescence chip.
Preferably, described light source substrate is ceramic objects.
It is further preferred that described light source substrate is aluminium nitride ceramics product.
Further, described luminescence chip is welded on described tin paste layer by the way of Reflow Soldering.
Further, described luminescence chip is welded on described tin paste layer by the way of eutectic welds.
Implement UV illuminating source packaging structure of the present utility model, its by by luminescence chip face-down bonding at tin cream
On layer so that the performance of light source is more stable, thermal resistance is less；It addition, illuminating source packaging structure in encapsulation
The use reducing the glue material such as silica gel, resin of limits, greatly reduces because the radiation of ultraviolet itself causes
Light source fails speed, extend the service life of light source.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in this utility model embodiment, below will be to institute in embodiment
The accompanying drawing used is needed to be briefly described, it should be apparent that, the accompanying drawing in describing below is only this practicality
Some novel embodiments, for those of ordinary skill in the art, before not paying creative work
Put, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the top view of the UV illuminating source packaging structure that this utility model embodiment provides；
Fig. 2 is the sectional view of the UV illuminating source packaging structure that this utility model embodiment provides.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing
And embodiment, this utility model is further elaborated.Should be appreciated that described herein specifically
Embodiment, only in order to explain this utility model, is not used to limit this utility model.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, and it can be straight
It is connected on another element or may be simultaneously present centering elements.When an element is known as " being connected to "
Another element, it can be directly to another element or may be simultaneously present centering elements.
Also, it should be noted the orientation term such as left and right, upper and lower in this utility model embodiment, only
It is relative concept or with the normal operating condition of product as reference each other, and should not be regarded as that there is limit
Property processed.
As depicted in figs. 1 and 2, the UV illuminating source packaging structure that this utility model embodiment provides includes light source
Substrate 1, circuit layer 2, tin paste layer 3, luminescence chip 4 and glass lens 5.Wherein, circuit layer 1 passes through
High Temperature High Pressure mode is molded on light source substrate 1, and this circuit layer has crystal bonding area, specifically, and this circuit
Layer is 1 by rose copper punch forming, and according to flip-chip characteristics design.Tin paste layer 3 prints or some glue is attached to
On crystal bonding area, the Main Function of this tin paste layer is fixed chip, conduction and heat conduction.Luminescence chip 4 flip chip bonding
Being connected on tin paste layer 3, this luminescence chip 4 is the luminous component of product, uses the mode of die bond solder paste welding
Luminescence chip 4 is bonded on light source substrate 1.Glass lens 5 is combined in light source substrate by hot pressing mode
On 1 and be used for covering luminescence chip 4, specifically, glass lens 5 uses precision process manufacture, has good
Optical texture and the characteristic of resistance to UV, light source substrate 1 uses hot pressing mode to be combined with glass lens 5, glue
Material consumption is few；It is slightly larger than it addition, the glass lens 5 at luminescence chip 4 top uses precision process to produce
The space of luminescence chip 4 size.In this utility model embodiment, the shape of glass lens 5 is unrestricted,
Can determine according to actual needs.
This utility model embodiment by by luminescence chip 4 face-down bonding on tin paste layer 3 so that light source
Performance is more stable, thermal resistance is less；It addition, illuminating source packaging structure encapsulation on reduce to greatest extent silica gel,
The use of the glue materials such as resin, greatly reduce because of the radiation of ultraviolet itself cause light source fails speed,
Extend the service life of light source.
Preferably, in an embodiment of the present utility model, light source substrate 1 is made of ceramic materials.Pottery
Ceramic material is combined together to form light source substrate 1 by High Temperature High Pressure mode and circuit layer 2.
It is further preferred that light source substrate 1 is made up of aluminium nitride ceramics material, there is stronger uv-resistant energy
Power and heat conductivility.
Further, in an embodiment of the present utility model, luminescence chip 4 is by the way of Reflow Soldering
It is welded on tin paste layer 3.
Further, in another embodiment of the present utility model, the side that luminescence chip 4 is welded by eutectic
Formula is welded on tin paste layer 3.
In actual production, can arrange in array-like on a bulk of light source substrate 1 multiple separate
Circuit layer 2, and print on each circuit layer 2 or some glue attachment tin paste layer 3, then at each tin paste layer 3
Upper face-down bonding luminescence chip 4, and at the periphery cover glass lens 5 of each luminescence chip 4, and then formed
Multiple separate UV illuminating source packaging structures, then cut into same size by cutting by justifying light source
Specification list light source.
In sum, a kind of UV illuminating source packaging structure of this utility model embodiment, it is by by luminescence core
Sheet 4 face-down bonding is on tin paste layer 3 so that the performance of light source is more stable, thermal resistance is less；It addition, light
Source encapsulating structure reduces the use of the glue material such as silica gel, resin in encapsulation to greatest extent, greatly reduces
Because of the radiation of ultraviolet itself cause light source fails speed, extend the service life of light source.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model,
All any amendment, equivalent or improvement etc. made within spirit of the present utility model and principle, all should
Within being included in protection domain of the present utility model.
Claims (5)
1. a UV illuminating source packaging structure, it is characterised in that include light source substrate (1), by high temperature height
Pressure mode is molded over described light source substrate (1) above and to have the circuit layer (2) of crystal bonding area, prints or some glue
It is attached to the tin paste layer (3) of described crystal bonding area, face-down bonding luminescence chip on described tin paste layer (3)
(4), and it is combined in described light source substrate (1) by hot pressing mode above and to be used for covering described luminous core
The glass lens (5) of sheet (4).
2. UV illuminating source packaging structure as claimed in claim 1, it is characterised in that described light source substrate (1)
For ceramic objects.
3. UV illuminating source packaging structure as claimed in claim 2, it is characterised in that described light source substrate (1)
For aluminium nitride ceramics product.
4. the UV illuminating source packaging structure as described in any one of claim 1-3, it is characterised in that described luminescence
Chip (4) is welded on described tin paste layer (3) by the way of Reflow Soldering.
5. the UV illuminating source packaging structure as described in any one of claim 1-3, it is characterised in that described luminescence
Chip (4) is welded on described tin paste layer (3) by the way of eutectic welds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620079553.5U CN205488203U (en) | 2016-01-27 | 2016-01-27 | UV light source packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620079553.5U CN205488203U (en) | 2016-01-27 | 2016-01-27 | UV light source packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488203U true CN205488203U (en) | 2016-08-17 |
Family
ID=56618682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620079553.5U Active CN205488203U (en) | 2016-01-27 | 2016-01-27 | UV light source packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488203U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461613A (en) * | 2018-05-31 | 2018-08-28 | 深圳市瑞丰光电紫光技术有限公司 | A kind of UV-LED light sources and its lamps and lanterns |
-
2016
- 2016-01-27 CN CN201620079553.5U patent/CN205488203U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461613A (en) * | 2018-05-31 | 2018-08-28 | 深圳市瑞丰光电紫光技术有限公司 | A kind of UV-LED light sources and its lamps and lanterns |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Guangdong Xuyu optoelectronics Co. Ltd. Assignor: Xuyu Optoelectronics (Shenzhen) Limited by Share Ltd Contract record no.: 2018440020043 Denomination of utility model: UV light source packaging structure Granted publication date: 20160817 License type: Common License Record date: 20180423 |
|
| EE01 | Entry into force of recordation of patent licensing contract |