CN213425008U

CN213425008U - LED packaging structure

Info

Publication number: CN213425008U
Application number: CN202021963385.9U
Authority: CN
Inventors: 支柱
Original assignee: Shenzhen Lepower Opto Electronics Co ltd
Current assignee: Shenzhen Lepower Opto Electronics Co ltd
Priority date: 2020-09-09
Filing date: 2020-09-09
Publication date: 2021-06-11
Anticipated expiration: 2030-09-09

Abstract

The embodiment of the utility model discloses LED packaging structure, a substrate, be equipped with the circuit layer, the pad, set up on the circuit layer, the chip, be fixed in on the pad, the chip is located pad central zone, enclose the frame spare, be located circuit layer edge zone, and enclose the frame spare and fix on the circuit layer, enclose the frame spare and set up around the pad, enclose frame spare and chip interval setting, the closing cap, be fixed in on enclosing the frame spare, the closing cap, enclose frame spare and base plate and enclose into one and hold the chamber, pad and chip all set up and hold the intracavity, and it is filled with nitrogen gas to hold the intracavity, with to the closing cap, enclose frame spare and base plate and carry out the eutectic welding. Through making the closing cap with enclose the frame welding together, add nitrogen gas during the welding, need not to add the welding material that contains a large amount of organic substances, the ultralow organic substance's of its product content when having realized LED purple light encapsulation to make the life greatly increased of LED purple light product.

Description

LED packaging structure

Technical Field

The utility model relates to a LED encapsulates technical field, especially relates to a LED packaging structure.

Background

The traditional packaging mode (ceramic bracket, PCT bracket, EMC and the like) for LED violet light packaging on the market at present adopts silica gel for sealing, and has the defects that the traditional packaging mode (ceramic bracket, PCT bracket, EMC and the like) is not suitable for packaging low-waveband violet LED chips (UVB, UVC), and the violet light is divided into UVA, UVB and UVC, the traditional packaging mode for packaging the violet light LED by adopting the silica gel is only suitable for packaging LED violet light chips with higher UVA wavebands, and the light transmittance of the silica gel is poor in the low wavebands, particularly the light transmittance of the silica gel is lower than 50% in the light wave below 360nm, and the silica gel belongs to organic materials, so that the molecular structure of the silica gel is changed and the silica gel is invalid due to the influence of the violet light, and organic matter residues are left.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide an LED package structure.

An LED packaging structure comprises a substrate provided with a circuit layer;

the bonding pad is arranged on the circuit layer;

the chip is fixed on the bonding pad and is positioned in the central area of the circuit layer;

the surrounding frame piece is positioned on the edge area of the circuit layer, is fixed on the circuit layer, is arranged around the bonding pad and is arranged at intervals with the chip;

the sealing cover is fixed on the enclosing frame piece, the sealing cover, the enclosing frame piece and the substrate are enclosed to form an accommodating cavity, the bonding pad and the chip are arranged in the accommodating cavity, and nitrogen is filled in the accommodating cavity to perform eutectic welding on the sealing cover, the enclosing frame piece and the substrate.

The bonding layer is arranged between the surrounding frame piece and the circuit layer, so that the surrounding frame piece and the circuit layer are bonded together.

And a gold-plated layer is arranged on the surface of the circuit layer and fixedly connected with the bonding layer.

The welding device further comprises a metal welding flux layer, wherein the metal welding flux layer is arranged between the enclosing frame piece and the sealing cover, and the enclosing frame piece is connected with the sealing cover in a welding mode.

Wherein, the metal solder layer is a tin-gold solder layer.

And a gold plating layer is arranged on the surface of the surrounding frame piece, and the gold plating layer is connected with the metal solder layer in a welding manner.

And a tin-gold solder layer is arranged on the bonding pad, and the chip is connected with the bonding pad in a welding way.

Wherein, the tow sides of base plate all are equipped with the circuit layer, openly circuit layer and reverse side be equipped with respectively on the circuit layer openly pad and reverse side the pad.

Wherein the cover is a sapphire cover.

Wherein, the chip is a purple light diode.

The utility model discloses, following beneficial effect will have: the utility model discloses a with the closing cap with enclose frame welded fastening, use during the welding and fill the nitrogen welding, then need not to add the welding material that contains a large amount of organic substances, the ultralow organic substance's of its product content when having realized LED purple light encapsulation to make the life greatly increased of LED purple light product.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

fig. 1 is a schematic diagram of an LED package structure according to an embodiment of the present invention;

fig. 2 is a cross-sectional view a-a of the inorganic LED package structure shown in fig. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 and fig. 2, an LED package structure is provided, which includes a substrate 10, a bonding pad 20, a chip 30, a frame 50, and a cover 60, wherein a circuit layer 11 is disposed on the substrate 10, the bonding pad 20 is disposed on the circuit layer 11, the chip 40 is fixed on the bonding pad 20, and the chip 40 is located in a central region of the circuit layer 11. Enclose frame 50 and be located circuit layer 11 marginal zone, enclose frame 50 and fix on circuit layer 11, enclose frame 50 and set up around pad 20, enclose frame 50 and chip 40 looks interval setting, closing cap 60 is fixed on enclosing frame 50, closing cap 60, enclose frame 50 and base plate 10 and enclose into one and hold the chamber, pad 20 and chip 40 all set up and hold the intracavity, and it is filled with nitrogen gas to hold the intracavity, with to cover 60, enclose frame 50 and base plate 10 and carry out the eutectic welding.

In this embodiment, base plate 10 and enclose frame 50 material and be aluminium nitride, and closing cap 60 has the material of high light transmissivity, high strength structural nature, and welding or other fixed modes are all more firm, use when welding closing cap 60 and enclosing frame 50 and fill nitrogen welding, need not to add the welding material that contains a large amount of organic substances, the ultralow organic substance's of its product when having realized LED purple light encapsulation content to make the life greatly increased of LED purple light product.

As shown in figures 1 and 2 of the drawings,

and an adhesive layer 70, wherein the adhesive layer 70 is arranged between the frame surrounding member 50 and the circuit layer 11, so as to adhere the frame surrounding member 50 and the circuit layer 11 together. The surface of the circuit layer 11 is provided with a gold plating layer, and the gold plating layer is fixedly connected with the bonding layer 80. The adhesive is used because the adhesive is simple, convenient and not easy to loosen, energy is easy to transfer among all parts, and the adhesive does not need to be heated and pressurized when being used instantly, and has the characteristics of quick curing and high bonding strength.

Preferably, a metal solder layer 80 is further included, and the metal solder layer 80 is disposed between the frame member 50 and the cover 60. The metal solder layer 80 is a tin-gold solder layer. The surface of the frame 50 is provided with a gold plating layer, and the gold plating layer is connected with the metal solder layer 80 by welding. A tin-gold solder layer is arranged on the bonding pad 20, and the chip 40 is connected with the bonding pad 20 in a welding mode. In order to prevent the surrounding frame piece 50 and the sealing cover 60 and the chip 40 and the bonding pad 20 from being loosened or even falling off when the LED purple light packaging is in use, the tin-gold solder is used and welded with the gold-plated layer arranged on the surface of the surrounding frame piece 50, and the surrounding frame piece 50 and the circuit layer 11 are fixed together through the gold-plated layer, so that the substrate 10 and the surrounding frame piece 50 are connected into a whole.

Preferably, the front and back surfaces of the substrate 10 are provided with the

circuit layers

11 and 12, and the front circuit layer 11 and the back circuit layer 12 are provided with the front pads 20 and the back pads 30, respectively. The

circuit layers

11 and 12 are arranged on the front side and the back side of the substrate 10, so that the space of the substrate 10 is better utilized, the front side and the back side of the substrate 10 can be respectively designed according to actual conditions, the back side bonding pads 30 of the back side circuit layers 12 respectively form heat conduction bonding pads and electrodes, the bonding pads have the function of heat conduction, and the electrodes have the function of electricity conduction, so that the design is convenient, and the packaging is simple.

Preferably, the cover 60 is a sapphire cover, and the cover 60 plate is made of a metal oxide cover with high light transmittance and high strength structure. The metal oxide may be aluminum oxide (AL2O3) commonly known as sapphire, or may be other metal oxides, and the material of the cap 60 may be adjusted according to different production requirements.

Preferably, the chip 40 is a violet diode. The utility model discloses a mainly solve purple light diode's encapsulation problem, also be applicable to other similar encapsulation technical problem certainly, no longer give unnecessary details here one by one.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims

1. An LED package structure, comprising:

a substrate provided with a circuit layer;

the bonding pad is arranged on the circuit layer;

2. The LED package structure of claim 1, further comprising an adhesive layer disposed between said frame member and said wiring layer to adhere said frame member and said wiring layer together.

3. The LED package structure of claim 2, wherein a gold plating layer is disposed on the surface of the circuit layer, and the gold plating layer is fixedly connected to the adhesive layer.

4. The LED package structure of claim 1, further comprising a metal solder layer disposed between the frame surrounding member and the cover, wherein the frame surrounding member is soldered to the cover.

5. The LED package structure of claim 4, wherein the metal solder layer is a tin-gold solder layer.

6. The LED package structure of claim 4, wherein the surface of the frame member is provided with a gold plating layer, and the gold plating layer is connected with the metal solder layer by soldering.

7. The LED package structure of claim 1, wherein a tin-gold solder layer is disposed on the bonding pad, and the chip is connected to the bonding pad by soldering.

8. The LED package structure of claim 1, wherein the circuit layer is disposed on both the front and back surfaces of the substrate, and the front and back pads are disposed on the front and back circuit layers, respectively.

9. The LED package structure of claim 1, wherein said cover is a sapphire cover.

10. The LED package structure of claim 1, wherein the chip is a violet diode.