CN207116469U - A kind of high-power ultraviolet LED Vacuum Package device - Google Patents
A kind of high-power ultraviolet LED Vacuum Package device Download PDFInfo
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- CN207116469U CN207116469U CN201721016413.4U CN201721016413U CN207116469U CN 207116469 U CN207116469 U CN 207116469U CN 201721016413 U CN201721016413 U CN 201721016413U CN 207116469 U CN207116469 U CN 207116469U
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- ultraviolet led
- reflector
- substrate
- terminal pad
- package device
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Abstract
The utility model discloses a kind of high-power ultraviolet LED Vacuum Package device, including substrate, reflector, sheet glass and at least one ultraviolet LED chip；The bottom of substrate is provided with positive terminal pad, negative terminal pad and radiator, and radiator is located at the centre of positive terminal pad and negative terminal pad, and the upper surface of substrate is provided with crystal bonding area and adhesion zone；Reflector is fixed on the adhesion zone of substrate, and ultraviolet LED chip is fixed on the crystal bonding area of substrate, and the positive pole of ultraviolet LED chip is connected with positive terminal pad, and the negative pole of ultraviolet LED chip is connected with negative terminal pad, and sheet glass is covered on reflector and Nian Jie with reflector.The utility model realizes the high-power encapsulation of ultraviolet LED, is more suitable for using in the case of the high-power UV solidification fields of needs or demand are efficient.The utility model is also encapsulated using full-inorganic material vacuum, is adapted to the encapsulation of 200 420nm all bands LED wafers.
Description
Technical field
LED encapsulation fields are the utility model is related to, particularly a kind of high-power ultraviolet LED Vacuum Package device.
Background technology
Shallow ultraviolet LED application is relatively more in the prior art, it can be common that 3535 ceramic packages, but package dimension it is less than normal be difficult
Accomplish more high-power；No matter outside other grey violet or ultraviolet, 1-3W LED components encapsulating material is to select molding silicon mostly
Glue, device use for a long time easily cause silica gel yellow, rupture or even come off.Silica gel packaging is only suitable for the outer small-power product of grey violet
Use.Therefore prior art bottleneck can not realize it is high-power, can not effectively solve destruction of the ultraviolet light to material.
The content of the invention
Technical problem to be solved in the utility model is overcome the deficiencies in the prior art and provided outside a kind of high-power purple
LED Vacuum Package devices, the utility model fully achieve the package requirements of relatively high power.
The utility model uses following technical scheme to solve above-mentioned technical problem：
According to the utility model proposes a kind of high-power ultraviolet LED Vacuum Package device, including substrate, reflector, glass
Glass piece and at least one ultraviolet LED chip；The bottom of substrate is provided with positive terminal pad, negative terminal pad and radiator, and radiator is located at
The centre of positive terminal pad and negative terminal pad, the upper surface of substrate are provided with crystal bonding area and adhesion zone；Wherein,
Reflector is fixed on the adhesion zone of substrate, and ultraviolet LED chip is fixed on the crystal bonding area of substrate, ultraviolet LED chip
Positive pole be connected with positive terminal pad, the negative pole of ultraviolet LED chip is connected with negative terminal pad, sheet glass be covered on reflector and with
Reflector is bonded；Reflector rim of a cup has step shape design, and shoulder height is consistent with glass sheet thickness, and sheet glass is fixed on reflection
Cause glass sheet surface with reflector surface at grade on the step of cup.
It is described as a kind of high-power further prioritization scheme of ultraviolet LED Vacuum Package device described in the utility model
The surface of reflector is smooth.
It is described as a kind of high-power further prioritization scheme of ultraviolet LED Vacuum Package device described in the utility model
Reflector is aluminum reflector.
It is described as a kind of high-power further prioritization scheme of ultraviolet LED Vacuum Package device described in the utility model
The wave band of ultraviolet LED chip is 200-420nm.
It is described as a kind of high-power further prioritization scheme of ultraviolet LED Vacuum Package device described in the utility model
Sheet glass is safety glass piece.
It is described as a kind of high-power further prioritization scheme of ultraviolet LED Vacuum Package device described in the utility model
The material of substrate is aluminium oxide ceramics.
The utility model compared with prior art, has following technique effect using above technical scheme：
（1）Positive pole, negative terminal pad and radiator are included using base plate bottom, substrate front side includes crystal bonding area and adhesion zone；
Substrate is to do circuit on its surface as base material by aluminium oxide ceramics, circuit by copper metal as bottom, the electronickelling in layers of copper
With silver or gold；
（2）Upper surface of base plate designs crystal bonding area and adhesion zone, adhesion zone are used for adhesive base plate and reflector；
（3）Using aluminum reflector, substitute plastic material in the market；
（4）Reflector rim of a cup has a step shape design, and shoulder height is consistent with glass sheet thickness；
（5）Encapsulated using safety glass piece, mechanical shock resistance is strong；
（6）Reflector rim of a cup periphery parcel sheet glass so that product avoids vacuum breaker or glass caused by the external force of side
The damaged failure risk of piece；
(7）UV LED chip (200nm-420nm) any wave band can be selected in chip；
（8）Device inside is not affected by the external environment the life-span, the utility model uses ceramic substrate, aluminium into vacuum state
The full-inorganic encapsulating material of reflector and glass processed overcomes to be broken regardless of the material that still ultraviolet light long-term irradiation is brought outside grey violet
It is bad, then large-size ceramic substrate of arranging in pairs or groups, the package requirements of relatively high power are fully achieved, realize the application of relatively high power demand
Occasion.
Brief description of the drawings
Fig. 1 is substrate front side structure.
Fig. 2 is base plate bottom structure.
Fig. 3 is that aluminum reflects cup structure.
Fig. 4 is the schematic diagram after aluminum reflector is bonded on substrate.
Fig. 5 is the finished device after die bond wire-bonding package.
Reference is construed to：1 is substrate, and 2 be crystal-bonding adhesive, and 3 be ultraviolet LED chip, and 4 be bonding gold wire, and 5 be bonding
Agent, 6 be safety glass piece, and 7 be aluminum reflector, and 8 be substrate crystal bonding area, and 9 be substrate wire welding area, and 10 be substrate bonding area, 11
It is radiator for the positive terminal pad of base plate bottom, 12,13 be the negative terminal pad of base plate bottom.
Embodiment
The technical solution of the utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in figure 5, a kind of high-power ultraviolet LED Vacuum Package device of the present utility model, including substrate 1, aluminum are anti-
Penetrate cup 7, safety glass piece 6 and at least one ultraviolet LED chip 3；The bottom of substrate is provided with positive terminal pad 11, the and of negative terminal pad 13
Radiator 12, radiator are located at the centre of positive terminal pad and negative terminal pad, and the upper surface of substrate is provided with crystal bonding area 8 and adhesion zone
10；Wherein,
Reflector is fixed on the adhesion zone of substrate, and ultraviolet LED chip is fixed on the crystal bonding area of substrate, ultraviolet LED chip
Positive pole be connected with positive terminal pad, the negative pole of ultraviolet LED chip is connected with negative terminal pad, sheet glass be covered on reflector and with
Reflector is bonded.Reflector is aluminum reflector.Reflector rim of a cup has step shape design, shoulder height and glass sheet thickness one
Cause, sheet glass, which is fixed on the step of reflector, causes glass sheet surface and reflector surface at grade, reflector cup
Mouth periphery parcel sheet glass so that product avoids the vacuum breaker caused by the external force of side or the failure risk of sheet glass breakage.
If Fig. 1 is substrate front side structure, if Fig. 2 is base plate bottom structure, such as the structure that Fig. 3 is aluminum reflector.Fig. 4 is
Aluminum reflector be bonded on substrate after schematic diagram.
The utility model is overcome not using substrate for the full-inorganic encapsulating material of ceramic substrate, aluminum reflector and glass
The material damage that still ultraviolet light long-term irradiation is brought outside pipe grey violet, then large-size ceramic substrate of arranging in pairs or groups, are fully achieved larger
The package requirements of power.Realize the application scenario of relatively high power demand.
A kind of manufacture method of high-power ultraviolet LED Vacuum Package device, comprises the following steps：
Step 1: bonding agent 5 is printed on into substrate bonding area using printing process, it is uniform that coating need to be printed.
Step 2: aluminum reflection cup base is fixed on substrate bonding area, as shown in Figure 4；
Step 3: the substrate of bonding aluminum reflector is inserted into oven cooking cycle solidification bonding agent；
It is fixed Step 4: the substrate of bonding aluminum reflector is placed in bonder using high heat conduction crystal-bonding adhesive 2
Ultraviolet LED chip；
Step 5: the semi-finished product of admittedly complete LED wafer are inserted into oven cooking cycle makes die bond adhesive curing；
Step 6: the semi-finished product for solidifying completion are placed in into the enterprising bonding wire of line unit B alloy wire 4 of bonding equipment, 9 be substrate wire welding area,
The both positive and negative polarity of ultraviolet LED chip is set to distinguish connecting substrate both positive and negative polarity pad；
Step 7: after bonding wire semi-finished product be placed in vacuum environment decline safety glass be bonded on aluminum reflector and solidify row
Into finished device；The finished device being illustrated in figure 5 after die bond wire-bonding package.
Step 8: finished device is classified according to voltage, brightness and wavelength after examining.
By surface treated aluminum reflection cup base and ceramic substrate front adhesion zone combination and be bonded；Metacoxal plate
Crystal bonding area carries out die bond routing operation；Last safety glass piece is bonded in above aluminum reflector under vacuum conditions is formed
LED component.The utility model can encapsulate plurality of LEDs chip using 5*5mm large-size substrate, be adapted to 5-10W operations；Use pottery
Porcelain material substrate also can preferably radiate.The utility model realizes the high-power encapsulation of ultraviolet LED, is more suitable for needing high power
UV solidification field or demand it is efficient in the case of use.The utility model is also encapsulated using full-inorganic material vacuum, is fitted
Close the encapsulation of 200-420nm all bands LED wafer.
Adhesion zone is used for adhesive base plate and aluminum reflection cup base in the substrate, both is manage it integrally.
The bonding agent needs more than 200 DEG C of good airproof performance and high temperature resistant.
The sheet glass is handled through tempering, increases its mechanical impact strength.
The aluminum reflector is through surface grinding process, is gone into smooth high reflection cup.
Ultraviolet LED chip is fixed using high heat conduction crystal-bonding adhesive, and uses bonding equipment welding both positive and negative polarity pad.
Safety glass piece is covered on aluminum reflector and is bonded under vacuum conditions, is gone into Vacuum Package closed unit
Part.
The reflector is aluminum material, and makes it have highlighted, high reflection characteristic by surface treatment.
Sheet glass is glass material, is handled by tempering, and mechanical shock resistance is non-breakable by force.
In addition to the implementation, the utility model can also have other embodiment, all to use equivalent substitution or equivalent change
The technical scheme to be formed is changed, is all fallen within the protection domain of the requires of the utility model.
Claims (6)
1. a kind of high-power ultraviolet LED Vacuum Package device, it is characterised in that including substrate, reflector, sheet glass and at least one
Individual ultraviolet LED chip；The bottom of substrate is provided with positive terminal pad, negative terminal pad and radiator, and radiator is located at positive terminal pad and born
The centre of pole pad, the upper surface of substrate are provided with crystal bonding area and adhesion zone；Wherein,
Reflector is fixed on the adhesion zone of substrate, and ultraviolet LED chip is fixed on the crystal bonding area of substrate, and ultraviolet LED chip is just
Pole is connected with positive terminal pad, and the negative pole of ultraviolet LED chip is connected with negative terminal pad, sheet glass be covered on reflector and with reflection
Cup bonding；Reflector rim of a cup has step shape design, and shoulder height is consistent with glass sheet thickness, and sheet glass is fixed on reflector
Cause glass sheet surface with reflector surface at grade on step.
A kind of 2. high-power ultraviolet LED Vacuum Package device according to claim 1, it is characterised in that the reflector
Surface to be smooth.
A kind of 3. high-power ultraviolet LED Vacuum Package device according to claim 1, it is characterised in that the reflector
For aluminum reflector.
A kind of 4. high-power ultraviolet LED Vacuum Package device according to claim 1, it is characterised in that the ultraviolet LED
The wave band of chip is 200-420nm.
A kind of 5. high-power ultraviolet LED Vacuum Package device according to claim 1, it is characterised in that the sheet glass
For safety glass piece.
6. a kind of high-power ultraviolet LED Vacuum Package device according to claim 1, it is characterised in that the substrate
Material is aluminium oxide ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721016413.4U CN207116469U (en) | 2017-08-15 | 2017-08-15 | A kind of high-power ultraviolet LED Vacuum Package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721016413.4U CN207116469U (en) | 2017-08-15 | 2017-08-15 | A kind of high-power ultraviolet LED Vacuum Package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207116469U true CN207116469U (en) | 2018-03-16 |
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ID=61571483
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| CN201721016413.4U Active CN207116469U (en) | 2017-08-15 | 2017-08-15 | A kind of high-power ultraviolet LED Vacuum Package device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527978A (en) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | A kind of high-power ultraviolet LED Vacuum Package device and its manufacture method |
-
2017
- 2017-08-15 CN CN201721016413.4U patent/CN207116469U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527978A (en) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | A kind of high-power ultraviolet LED Vacuum Package device and its manufacture method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180806 Address after: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Patentee after: Wenrui Photoelectric Co., Ltd., Jiangsu Address before: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Patentee before: Jiangsu Wenrun Optoelectronic Technology Co., Ltd. |
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| TR01 | Transfer of patent right |