CN105720166A - White-light LED chip preparation method - Google Patents
White-light LED chip preparation method Download PDFInfo
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- CN105720166A CN105720166A CN201410730677.0A CN201410730677A CN105720166A CN 105720166 A CN105720166 A CN 105720166A CN 201410730677 A CN201410730677 A CN 201410730677A CN 105720166 A CN105720166 A CN 105720166A
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Abstract
The invention provides a white-light LED chip preparation method, and the method is characterized in that the method comprises the steps: enabling blue-light LED chips to be arranged on a UV film; enabling the light-emitting surfaces of the blue-light LED chips to be attached to a fluorescent film, and forming white-light LED chips; placing high-reflection glue in a trench between the white-light LED chips, carrying out the vacuum defoamation, and carrying out baking and solidifying; cutting the high-reflection glue along the trench, and forming split white-light LED chips. According to the invention, the peripheries of the blue-light LED chips are coated with the high-reflection glue, so as to prevent the edges of the chips from emitting light, enable the manufactured white-light LED chips to be uniform in color, and avoid the leakage of blue light. In addition, the LED chip manufactured through the method is good in thermal conductivity, is small in light-emitting angle, and is low in cost, thereby enlarging the application range of the LED and the application convenience.
Description
Technical field
The invention belongs to technical field of semiconductors, the preparation method particularly relating to a kind of White-light LED chip.
Background technology
LED (LightEmittingDiode, light emitting diode) is the semiconductor device of a kind of solid-state that can convert electrical energy into visible ray, and it directly can be converted into luminous energy electric energy.LED is widely used as a kind of new lighting source material.White light LEDs is as a kind of new type light source, fast-developing because having the advantages such as response speed is fast, shock resistance good, life-span length, energy-conserving and environment-protective.It is widely used in the field such as beautification of landscape and indoor and outdoor lighting at present.
The main employing of current white light LEDs is coated with the technique of yellow fluorescent powder on blue chip, and detailed process is as follows: be first fixed on support by chip, is connected with support by chip electrode with gold thread on ultrasonic bonder；Negative pressure will be utilized after a certain proportion of fluorescent material and silica gel (or epoxy glue) Homogeneous phase mixing in vacuum machine to discharge bubble, then the mixture of powder Yu glue is coated on chip and heating makes it solidify, and then make white light LEDs finished product.But above-mentioned packaging technology is simply coated with one layer of fluorescent glue at chip surface, and chip surrounding be not coated with fluorescent glue, therefore there will be chip surrounding leakage blue light phenomenon, cause that the white light LED part being packaged into leakage blue light makes white light color uneven, often with yellow or blue hot spot.It addition, in some new applications, LED encapsulating products is required to have the features such as miniaturization, integrated, lighting angle is less.Therefore, it is necessary to provide a kind of new packaging technology to solve the problems referred to above.
Summary of the invention
The preparation method that the technical problem to be solved in the present invention is to provide a kind of White-light LED chip, the features such as it is good that white light LEDs obtained by this method not only has heat conductivity, and lighting angle is little, and the color even of white light LEDs, it is to avoid the phenomenon of leakage blue light.
In order to solve the technical problem of the present invention, the preparation method of a kind of White-light LED chip, the method includes: be arranged in by blue-light LED chip on UV film；Light-emitting surface paster fluorescent film at blue-light LED chip forms White-light LED chip；Height reflection glue is filled, after vacuum defoamation and baking-curing in groove between White-light LED chip；Along groove cutting height reflection glue, form single White-light LED chip.
Preferably, described blue-light LED chip is blue LED flip chip.
Preferably, the method also includes grinding high anti-glue so that it is height is concordant with described White-light LED chip.
Preferably, described high reflection glue includes containing white non fluorescent inert particle.
Preferably, described white non fluorescent inert particle is titanium dioxide
Beneficial effects of the present invention:
The present invention is coated with high anti-glue by the surrounding at blue-light LED chip, stops the luminescence of chip edge so that the white light LEDs color even made, it is to avoid the phenomenon of leakage blue light.It addition, the LED chip made by method provided by the invention has the advantages such as heat conductivity is good, lighting angle is little, cost is low, thus improve the range of application of LED and the convenience of use.
Accompanying drawing explanation
Fig. 1 a-1e is the preparation process schematic diagram of one embodiment of the invention；
Fig. 2 a-2c is the preparation process schematic diagram of another embodiment of the present invention.
Detailed description of the invention
Embodiment one
The present embodiment adopts following steps:
Blue LED flip chip 11 is arranged on UV film 12 according to certain spacing, flip-chip positive and negative electrode below, light-emitting area is in front, as shown in Figure 1a；Then being binded on the surface of blue LED flip chip 11 by chip mounter with the equirotal fluorescence diaphragm 13 of blue LED flip chip 11, blue LED flip chip 11 and the middle binder of fluorescence diaphragm 13 are silica gel 14, as shown in Figure 1 b；Anti-for height containing titanium dioxide glue 15 is filled in the groove between blue LED flip chip 11 baking-curing after vacuum defoamation, as illustrated in figure 1 c；Again through grinder, high anti-glue 15 is ground equally concordant with fluorescence diaphragm 13, as shown in Figure 1 d；Along groove cutting height reflection glue 15, it is thus achieved that single White-light LED chip, as shown in fig. le.
Embodiment two
The present embodiment adopts following steps: select the good fluorescent material diaphragm 23 of uniformity, it is attached on resistant to elevated temperatures UV film 22, fluorescent material diaphragm 23 is coated silica gel 24, the amount of this transparent silica gel 24 requires more accurate, avoid overflowing, capture blue LED flip chip 21 with bonder or separator, the light-emitting area of blue LED flip chip 21 is attached to fluorescent film sheet 23 surface, and baking-curing, as shown in Figure 2 a；With reflection white glue 25 high on point gum machine point in groove between blue LED flip chip 21, after vacuum defoamation and baking-curing, as shown in Figure 2 b；Glue 25, silica gel 24 and fluorescence diaphragm 23 is reflected along groove cutting height, it is thus achieved that single White-light LED chip, as shown in Figure 2 c with scribing machine.
The above; it is only the detailed description of the invention in the present invention; but protection scope of the present invention is not limited thereto, any people being familiar with this technology is in the technical scope that disclosed herein, the conversion that can readily occur in or replace all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claims.
Claims (5)
1. the preparation method of a White-light LED chip, it is characterised in that the method includes:
Blue-light LED chip is arranged on UV film；
Light-emitting surface paster fluorescent film at blue-light LED chip forms White-light LED chip；
Height reflection glue is filled, after vacuum defoamation and baking-curing in groove between White-light LED chip；
Along groove cutting height reflection glue, form single White-light LED chip.
2. the preparation method of a kind of White-light LED chip according to claim 1, it is characterised in that described blue-light LED chip is blue LED flip chip.
3. the preparation method of a kind of White-light LED chip according to claim 1, it is characterised in that the method also includes grinding high anti-glue so that it is height is concordant with described White-light LED chip.
4. the preparation method of a kind of White-light LED chip according to claim 1 or 3, it is characterised in that described high reflection glue includes containing white non fluorescent inert particle.
5. the preparation method of a kind of White-light LED chip according to claim 4, it is characterised in that described white non fluorescent inert particle is titanium dioxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410730677.0A CN105720166A (en) | 2014-12-05 | 2014-12-05 | White-light LED chip preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410730677.0A CN105720166A (en) | 2014-12-05 | 2014-12-05 | White-light LED chip preparation method |
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| CN105720166A true CN105720166A (en) | 2016-06-29 |
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| CN201410730677.0A Pending CN105720166A (en) | 2014-12-05 | 2014-12-05 | White-light LED chip preparation method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107681041A (en) * | 2016-08-01 | 2018-02-09 | 江西省晶瑞光电有限公司 | A kind of LED car lamp method for packing |
| CN108987556A (en) * | 2017-06-01 | 2018-12-11 | 晶能光电（江西）有限公司 | A kind of white chip |
| CN108987549A (en) * | 2017-06-01 | 2018-12-11 | 晶能光电（江西）有限公司 | A kind of white chip preparation method |
| CN109638003A (en) * | 2017-10-09 | 2019-04-16 | 晶能光电（江西）有限公司 | The preparation method of LED headlamp based on CSP white chip |
| CN109830474A (en) * | 2018-12-17 | 2019-05-31 | 江西省晶能半导体有限公司 | Glory LED core piece preparation method and glory LED lamp bead preparation method |
| CN109980066A (en) * | 2017-12-27 | 2019-07-05 | 晶能光电（江西）有限公司 | Fluorescent glue, white chip and preparation method thereof |
| CN109980068A (en) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
| CN109980069A (en) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
| CN109980072A (en) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
| CN112510137A (en) * | 2020-12-10 | 2021-03-16 | 广东聚科照明股份有限公司 | Production method of integrated lamp bead |
| CN113764547A (en) * | 2021-08-30 | 2021-12-07 | 东莞市中麒光电技术有限公司 | Manufacturing method of Mini-LED device |
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| CN201508856U (en) * | 2009-10-13 | 2010-06-16 | 华侨大学 | High-power white-light LED |
| CN103733335A (en) * | 2011-08-16 | 2014-04-16 | 皇家飞利浦有限公司 | LED mixing chamber with reflective walls formed in slots |
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Patent Citations (3)
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| JP2003273405A (en) * | 2002-03-19 | 2003-09-26 | Kyocera Corp | Light emitting device accommodating package |
| CN201508856U (en) * | 2009-10-13 | 2010-06-16 | 华侨大学 | High-power white-light LED |
| CN103733335A (en) * | 2011-08-16 | 2014-04-16 | 皇家飞利浦有限公司 | LED mixing chamber with reflective walls formed in slots |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107681041B (en) * | 2016-08-01 | 2020-04-07 | 江西省晶能半导体有限公司 | LED car lamp packaging method |
| CN107681041A (en) * | 2016-08-01 | 2018-02-09 | 江西省晶瑞光电有限公司 | A kind of LED car lamp method for packing |
| CN108987556A (en) * | 2017-06-01 | 2018-12-11 | 晶能光电（江西）有限公司 | A kind of white chip |
| CN108987549A (en) * | 2017-06-01 | 2018-12-11 | 晶能光电（江西）有限公司 | A kind of white chip preparation method |
| CN109638003A (en) * | 2017-10-09 | 2019-04-16 | 晶能光电（江西）有限公司 | The preparation method of LED headlamp based on CSP white chip |
| CN109980066A (en) * | 2017-12-27 | 2019-07-05 | 晶能光电（江西）有限公司 | Fluorescent glue, white chip and preparation method thereof |
| CN109980068A (en) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
| CN109980069A (en) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
| CN109980072A (en) * | 2017-12-27 | 2019-07-05 | 深圳市聚飞光电股份有限公司 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
| CN109980066B (en) * | 2017-12-27 | 2021-04-09 | 晶能光电（江西）有限公司 | Fluorescent glue, white light chip and preparation method thereof |
| CN109830474A (en) * | 2018-12-17 | 2019-05-31 | 江西省晶能半导体有限公司 | Glory LED core piece preparation method and glory LED lamp bead preparation method |
| CN109830474B (en) * | 2018-12-17 | 2023-07-11 | 江西省晶能半导体有限公司 | Preparation method of colored light LED chip and preparation method of colored light LED lamp beads |
| CN112510137A (en) * | 2020-12-10 | 2021-03-16 | 广东聚科照明股份有限公司 | Production method of integrated lamp bead |
| CN113764547A (en) * | 2021-08-30 | 2021-12-07 | 东莞市中麒光电技术有限公司 | Manufacturing method of Mini-LED device |
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Application publication date: 20160629 |
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