CN105576107B - LED encapsulation structure and its method for packing - Google Patents
LED encapsulation structure and its method for packing Download PDFInfo
- Publication number
- CN105576107B CN105576107B CN201410528562.3A CN201410528562A CN105576107B CN 105576107 B CN105576107 B CN 105576107B CN 201410528562 A CN201410528562 A CN 201410528562A CN 105576107 B CN105576107 B CN 105576107B
- Authority
- CN
- China
- Prior art keywords
- cavity
- catoptric arrangement
- arrangement part
- led
- led encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of LED encapsulation structure and its method for packing, LED encapsulation structure includes:Catoptric arrangement part, the catoptric arrangement part have cavity, and the open top connected with the cavity and bottom opening are respectively arranged with the upper surface of the catoptric arrangement part and lower surface；LED flip chip, the LED flip chip are located in the cavity, and the electrode surface of the LED flip chip is towards the bottom opening；And packing colloid, the packing colloid are filled in the cavity to encapsulate the LED flip chip.The LED encapsulation structure of the present invention, the light that flip-chip is sent can be directly emitted downwards from bottom opening, the light part sent upwards can be emitted directly through packing colloid, the upward another part light projection sent on the inwall of cavity by reflection after can also pass through fluorescence packing colloid, overall light efficiency height.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of LED encapsulation structure and its method for packing.
Background technology
LED has significant energy-conservation and life-span advantage as a forth generation lighting source.
LED encapsulation is a key link obtaining high-quality LED illumination light source, existing flip chip mounting method just like
Lower two kinds：First, use the week side of boss and top of fluorescence packing colloid (mixture of fluorescent material and silica gel) 2 directly in flip-chip 1
It is packaged (as shown in Figure 1), the inhomogeneities that this encapsulating structure is mixed due to fluorescent material, stress causes product report during cutting
Useless rate is high.Second, the week side of boss of flip-chip 1 is sealed (such as Fig. 2 using vertical plastic material 3, top using fluorescence packing colloid 4
It is shown).For this encapsulating structure because the vertical plastic material 21 of the week side of boss forms heat to the multiple reflections of light, light efficiency is low.
The content of the invention
For above-mentioned state of the art, the technical problems to be solved by the invention are, there is provided a kind of simple in construction, light
Damage low LED encapsulation structure and its method for packing.
In order to solve the above-mentioned technical problem, a kind of LED encapsulation structure provided by the present invention, including：
Catoptric arrangement part, the catoptric arrangement part have cavity, in the upper surface of the catoptric arrangement part and lower surface point
The open top connected with the cavity and bottom opening are not provided with；
LED flip chip, the LED flip chip is located in the cavity, and the electrode surface court of the LED flip chip
To the bottom opening；And
Packing colloid, the packing colloid are filled in the cavity to encapsulate the LED flip chip.
In one of the embodiments, the catoptric arrangement part is moulding.
In one of the embodiments, the longitudinal section of the inwall of the cavity is in herringbone.
In one of the embodiments, inwardly projecting flange is provided with the inwall of the cavity bottom, the LED falls
The either flush of the electrode surface of cartridge chip and the flange.
In one of the embodiments, the lateral surface of the catoptric arrangement part hangs down with the upper surface and the lower surface
Directly.
In one of the embodiments, the electrode of the LED flip chip stretches out from the bottom opening, and the electrode
End face it is concordant with the lower surface.
In one of the embodiments, it is mixed with fluorescent material in the packing colloid.
In one of the embodiments, the top surface of the packing colloid is concordant with the upper surface of the catoptric arrangement part.
A kind of method for packing of above-mentioned LED encapsulation structure provided by the present invention, comprises the following steps：
A, it is molded to form catoptric arrangement part sheet material using plastic material, it is in square on the catoptric arrangement part sheet material to have some
The cavity of battle array arrangement；
B, counterdie is pasted on the lower surface of the catoptric arrangement part sheet material, closes the bottom opening of the cavity；
C, the flip-chip is put into the cavity and carries out die bond, the electrode of the flip-chip abuts against the bottom
On film；
D, encapsulating material is injected in the cavity, forms the packing colloid；
E, packing colloid described in baking-curing；
F, cut the catoptric arrangement part sheet material and form the catoptric arrangement part；And
G, the counterdie is removed.
In one of the embodiments, in step f, the high-temperature machining under baking temperature, and it is cut to the carrier film thickness
1/2~3/4 at.
In one of the embodiments, in step a, the plastic material is modified poly- terephthalate p-phenylenediamine plastics,
Poly terephthalic acid 1,4-CHDM ester resin or epoxy film resin.
Compared with prior art, LED encapsulation structure of the invention, the light that flip-chip is sent can be directly emitted downwards,
The light part sent upwards can be emitted directly through packing colloid, and the upward another part light projection sent is in cavity
By can also pass through fluorescence packing colloid, overall light efficiency height after reflection on inwall.
Beneficial effect possessed by additional technical feature of the present invention will be said in this specification specific embodiment part
It is bright.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the Flip-Chip Using of prior art；
Fig. 2 is another structural representation of the Flip-Chip Using of prior art；
Fig. 3 is the structural representation of the LED encapsulation structure in the one of embodiment of the present invention；
Fig. 4 is the schematic diagram of the right-angled trapezium plasticity catoptric arrangement part network structure of the LED encapsulation method of the present invention；
Fig. 5 is the schematic diagram of attached heat resistant plastics' counterdie of the LED encapsulation method of the present invention；
Fig. 6 is the schematic diagram of the die bond of the LED encapsulation method of the present invention；
Fig. 7 is the schematic diagram of the injecting glue of the LED encapsulation method of the present invention；
Fig. 8 is the schematic diagram of the cutting of the LED encapsulation method of the present invention.
In Fig. 3-Fig. 8,10-LED flip-chips；The electrode surface of 11-LED flip-chips；12- electrodes；20- catoptric arrangements
Part；21- cavitys；21a- open tops；21b- bottom openings；The upper surface of 22- catoptric arrangement parts；Under 23- catoptric arrangement parts
End face；24- flanges；The inwall of 25- cavitys；The lateral surface of 26- catoptric arrangement parts；30- packing colloids；40- catoptric arrangement part plates
Material；50- counterdies；60- lines of cut.
Embodiment
Below with reference to the accompanying drawings and the present invention is described in detail in conjunction with the embodiments.It should be noted that do not conflicting
In the case of, the feature in following embodiment and embodiment can be mutually combined.
Fig. 3 is the structural representation of the LED encapsulation structure in the one of embodiment of the present invention.As illustrated, LED is encapsulated
Structure includes：Catoptric arrangement part 20, LED flip chip 10 and packing colloid 30, wherein, the catoptric arrangement part 20 is injection
Part, catoptric arrangement part 20 have cavity 21, be respectively arranged with the upper surface 22 of the catoptric arrangement part 20 and lower surface 23 with
The open top 21a and bottom opening 21b that the cavity 21 connects.Preferably, the longitudinal section of the inwall 25 of the cavity 21 is in
Herringbone, the light reflection effect of inwall 25 of the cavity 21 are good.Preferably, it is provided with the inwall 25 of the bottom of cavity 21
Inwardly projecting flange 24, the flange 24 are used to position LED flip chip 10.Preferably, the catoptric arrangement part 20 is outer
Side 26 is vertical with the upper surface 22 and the lower surface 23, to facilitate processing.
The LED flip chip 10 is located in the cavity 21, and the electrode surface 11 of the LED flip chip 10 is towards institute
State bottom opening 21b, the either flush of the electrode surface 11 of the LED flip chip 10 and the flange 24, the LED upside-down mountings core
The electrode 12 of piece 10 stretches out from the bottom opening 21b, and the end face of the electrode 12 is concordant with the lower surface 23, in order to
Direct welding circuit uses.
The packing colloid 30 is filled in the cavity 21 (not shown in Fig. 3) to encapsulate the LED flip chip 10.
For LED encapsulation structure in the embodiment of the present invention as a result of said structure, the light that flip-chip 10 is sent is downward
Can directly it be emitted from bottom opening 21b, the light part sent upwards can be emitted directly through packing colloid, upward hair
Another part light projection gone out on the inwall of cavity by reflection after can also pass through fluorescence packing colloid, overall light efficiency is high.
Present invention also offers a kind of method for packing of above-mentioned LED encapsulation structure, as shown in Fig. 4-Fig. 8, method for packing bag
Include following steps：
Step a, it is molded to form catoptric arrangement part sheet material 40 using plastic material, has on the catoptric arrangement part sheet material 40
Some cavitys 21 (as shown in Figure 4) in matrix arrangement.Plastic material preferably is selected from being modified poly- terephthalate p-phenylenediamine PPA
Plastics, poly terephthalic acid 1,4-CHDM ester PCT resins, epoxy film EMC resins.Wherein isosceles trapezoid plasticity reflects
Two hypotenuses of structural member 23 form one and fall eight word cavitys.
Step b, counterdie 50 is pasted on the lower surface of the catoptric arrangement part sheet material 40, opens the bottom of the cavity 21
Mouth 21b closings (as shown in Figure 5).Counterdie 50 is preferably heat resistant plastics' film.
Step c, flip-chip 10 is put into the cavity 21 and carries out die bond, the electrode 12 of the flip-chip 10 abuts
On the counterdie 50 (as shown in Figure 6).
Step d, encapsulating material is injected in the cavity 21, forms the packing colloid 30.Encapsulating material height with it is anti-
The upper surface for penetrating structural member sheet material 40 is concordant (as shown in Figure 7).
Step e, packing colloid 30 described in baking-curing.Preferably, 30~60min, temperature are solidified at 150 ± 5 DEG C of temperature
Spending the setting of section can accordingly be adjusted according to encapsulating material difference.
Step f, after solidifying, catoptric arrangement part sheet material 40 is cut along line of cut 50 under baking temperature, cut
To at the plasticity net bottom film thickness 1/2~3/4, the catoptric arrangement part 20 is formed.High-temperature machining, made in the absence of cutting stress
Into scrapping, high yield rate, manufacturing cost is low.
Step g, counterdie 40 is removed, sorting obtains required LED encapsulation structure.
It was found from technical scheme above, pass through the obtained LED encapsulation structure of LED encapsulation method of the present invention, upside-down mounting core
The light that piece is sent can be emitted downwards between, and the light part sent upwards can be emitted directly through fluorescence packing colloid, and
The upward another part light projection sent both sides right-angled trapezium plasticity catoptric arrangement part light by reflection after can also pass through
Fluorescence packing colloid, overall light efficiency is high, and cutting stress is also not present and causes to scrap, high yield rate, and manufacturing cost is low.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.
Claims (9)
1. a kind of method for packing of LED encapsulation structure, it is characterised in that the LED encapsulation structure includes：
Catoptric arrangement part (20), the catoptric arrangement part (20) has cavity (21), in the upper end of the catoptric arrangement part (20)
Face (22) and lower surface (23) are respectively arranged with the open top (21a) connected with the cavity (21) and bottom opening (21b)；
LED flip chip (10), the LED flip chip (10) is located in the cavity (21), and the LED flip chip
(10) electrode surface (11) is towards the bottom opening (21b)；And
Packing colloid (30), the packing colloid (30) are filled in the cavity (21) to encapsulate the LED flip chip
(10)
The method for packing comprises the following steps：
A, it is molded to form catoptric arrangement part sheet material (40) using plastic material, has on the catoptric arrangement part sheet material (40) some
The cavity (21) arranged in matrix；
B, counterdie (50) is pasted on the lower surface of the catoptric arrangement part sheet material (40), makes the bottom opening of the cavity (21)
(21b) is closed；
C, the flip-chip (10) is put into the cavity (21) and carries out die bond, the electrode (12) of the flip-chip (10)
Abut against on the counterdie (50)；
D, encapsulating material is injected in the cavity (21), forms the packing colloid (30)；
E, packing colloid described in baking-curing (30)；
F, cutting catoptric arrangement part sheet material (40) formation catoptric arrangement part (20), the high-temperature machining under baking temperature,
And it is cut at the 1/2~3/4 of the counterdie (50) thickness；And
G, the counterdie (50) is removed.
2. LED encapsulation method according to claim 1, it is characterised in that in step a, the plastic material is modified poly-
Terephthalate p-phenylenediamine plastics, poly terephthalic acid 1,4 cyclohexane dimethanol ester resin or epoxy film resin.
3. LED encapsulation method according to claim 1, it is characterised in that the catoptric arrangement part (20) is moulding.
4. LED encapsulation method according to claim 1, it is characterised in that the vertical of the inwall (25) of the cavity (21) cuts
Face is in herringbone.
5. LED encapsulation method according to claim 4, it is characterised in that on the inwall (25) of cavity (21) bottom
It is provided with inwardly projecting flange (24), the electrode surface (11) of the LED flip chip (10) and the top surface of the flange (24)
Concordantly.
6. LED encapsulation method according to claim 1, it is characterised in that the lateral surface of the catoptric arrangement part (20)
(26) it is vertical with the upper surface (22) and the lower surface (23).
7. LED encapsulation method according to claim 1, it is characterised in that the electrode (12) of the LED flip chip (10)
Stretched out from the bottom opening (21b), and the end face of the electrode (12) is concordant with the lower surface (23).
8. LED encapsulation method according to claim 1, it is characterised in that be mixed with fluorescence in the packing colloid (30)
Powder.
9. LED encapsulation method according to claim 1, it is characterised in that the top surface of the packing colloid (30) with it is described
The upper surface (22) of catoptric arrangement part (20) is concordant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410528562.3A CN105576107B (en) | 2014-10-09 | 2014-10-09 | LED encapsulation structure and its method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410528562.3A CN105576107B (en) | 2014-10-09 | 2014-10-09 | LED encapsulation structure and its method for packing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105576107A CN105576107A (en) | 2016-05-11 |
| CN105576107B true CN105576107B (en) | 2018-02-13 |
Family
ID=55886026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410528562.3A Active CN105576107B (en) | 2014-10-09 | 2014-10-09 | LED encapsulation structure and its method for packing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105576107B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108666307B (en) * | 2017-03-28 | 2020-07-28 | 江苏博睿光电有限公司 | CSP light source and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102884645A (en) * | 2010-01-29 | 2013-01-16 | 西铁城电子株式会社 | Method for producing light-emitting device and light emitting device |
| CN103515513A (en) * | 2012-06-19 | 2014-01-15 | 晶元光电股份有限公司 | Method for manufacturing light-emitting device |
| CN103531692A (en) * | 2012-06-29 | 2014-01-22 | 日东电工株式会社 | Phosphor layer-covered LED, producing method thereof, and LED device |
| CN204204913U (en) * | 2014-10-09 | 2015-03-11 | 广东德豪润达电气股份有限公司 | LED encapsulation structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040173808A1 (en) * | 2003-03-07 | 2004-09-09 | Bor-Jen Wu | Flip-chip like light emitting device package |
| US7791096B2 (en) * | 2007-06-08 | 2010-09-07 | Koninklijke Philips Electronics N.V. | Mount for a semiconductor light emitting device |
-
2014
- 2014-10-09 CN CN201410528562.3A patent/CN105576107B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102884645A (en) * | 2010-01-29 | 2013-01-16 | 西铁城电子株式会社 | Method for producing light-emitting device and light emitting device |
| CN103515513A (en) * | 2012-06-19 | 2014-01-15 | 晶元光电股份有限公司 | Method for manufacturing light-emitting device |
| CN103531692A (en) * | 2012-06-29 | 2014-01-22 | 日东电工株式会社 | Phosphor layer-covered LED, producing method thereof, and LED device |
| CN204204913U (en) * | 2014-10-09 | 2015-03-11 | 广东德豪润达电气股份有限公司 | LED encapsulation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105576107A (en) | 2016-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100481546C (en) | Power LED with glue-filling formed bottom and manufacturing method thereof | |
| CN101582475B (en) | Method for coating phosphor powder layer on LED chip and manufacture of LED device | |
| CN201820758U (en) | LED integrated structure with cooling device | |
| CN107248546B (en) | The consistent integration packaging display module of surfacing and its manufacturing method | |
| CN106876534A (en) | A kind of method for packing of flip-chip level LED light source | |
| CN102270712B (en) | LED (Light-Emitting Diode) vacuum encapsulating device and method | |
| TW201403873A (en) | Method for manufacturing LED package | |
| CN201741711U (en) | Plastic piece injection-mold die of positioning lens or forming lens with formed LED integrated structure | |
| CN107275459A (en) | Potted element and its manufacture method | |
| CN105576107B (en) | LED encapsulation structure and its method for packing | |
| CN102456780A (en) | Packaging method of light emitting diode (LED) | |
| CN204204913U (en) | LED encapsulation structure | |
| CN105633248A (en) | LED lamp and preparation method thereof | |
| CN106058027A (en) | LED light source with lens and manufacturing method of LED light source | |
| CN102054919A (en) | High-brightness yellow-green lamp and manufacturing method thereof | |
| CN108400217A (en) | A kind of high efficiency LED chip flip-chip packaged method | |
| CN102610602A (en) | High-resolution LED (light emitting diode) light source made of single-package-based material and manufacturing process of high-resolution LED light source | |
| CN102593320B (en) | Light emitting diode (LED) light source and packaging method thereof | |
| CN103258941B (en) | LED matrix, the fluorescent powder film of coated LED chip and the method for coating of fluorescent powder film | |
| CN203932107U (en) | A kind of LED encapsulation sealing heating arrangement | |
| CN104600183B (en) | The preparation method of LED white light-emitting diodes | |
| CN202487642U (en) | Packaging fixture assembly of SMD (surface mount device) light emitting diodes | |
| CN101752465B (en) | Packaging method of high-power light-emitting diode | |
| CN103050613B (en) | Encapsulation structure of LED and manufacture method thereof | |
| CN204424308U (en) | A kind of LED support and LED lamp bead |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190911 Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Guangdong Elec-Tech Lighting Electrical Co. Ltd. Address before: Xiangzhou District of Guangdong city in Zhuhai province 519000 tangjiewan Jinfeng Road, No. 1 Patentee before: Guangdong Electech International Inc. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Zhuhai Leishi Lighting Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |