CN204696126U - Based on the COB structure white light LED light source of ceramic phosphor encapsulation - Google Patents
Based on the COB structure white light LED light source of ceramic phosphor encapsulation Download PDFInfo
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- CN204696126U CN204696126U CN201520440779.9U CN201520440779U CN204696126U CN 204696126 U CN204696126 U CN 204696126U CN 201520440779 U CN201520440779 U CN 201520440779U CN 204696126 U CN204696126 U CN 204696126U
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- light led
- blue
- led chip
- ceramic phosphor
- light source
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Abstract
A kind of COB structure white light LED light source based on ceramic phosphor encapsulation, comprise ceramic substrate, blue-light LED chip, transparent silica gel, PPA plastics box dam, substrate is connected by gold thread with blue-light LED chip electrode, blue-light LED chip and gold thread transparent silica gel are encapsulated in the PPA plastics box dam on ceramic substrate, lid layer ceramic phosphor in transparent silica gel.COB structure white light LED light source based on ceramic phosphor encapsulation of the present utility model, blue-light LED chip does not directly contact with ceramic phosphor, the heat produced when blue-light LED chip can be avoided to work causes fluorescent material to produce decay, improves the luminous flux sustainment rate of COB structure large power white light LED light source; Meanwhile, because the coefficient of heat conduction of ceramic phosphor is higher, reduce the heat accumulation of blue-light LED chip, greatly improve the reliability of COB structure large power white light LED light source, useful life extends greatly.
Description
Technical field
The utility model relates to a kind of COB structure white light LED light source based on ceramic phosphor encapsulation.
Technical background
Current COB construction packages large power white light LED generally adopts ceramic substrate as package carrier, by conducting adhesive glue, many blue-light LED chips are fixed on ceramic substrate by matrix arrangement mode, ultrasonic ball bonding technique is adopted to utilize gold thread to be connected with electrode of substrate with chip, chip by chip again, fluorescent material and silica gel is selected to be mixed with phosphor gel, adopt phosphor gel to be encapsulated blue-light LED chip by encapsulating mode, blue-light LED chip fluorescence excitation arogel is prepared into COB construction packages large power white light LED.COB construction packages large power white light LED prepared by aforesaid way, its blue-light LED chip directly contacts with fluorescent material, during the work of COB construction packages large power white light LED, the heat that blue-light LED chip produces can make fluorescent material produce heat fade, reduce the launching efficiency of fluorescent material, thus cause the luminous efficiency of COB construction packages large power white light LED to decay, reduce the luminous flux sustainment rate (light life-span) of COB construction packages large power white light LED.Simultaneously, the partial heat produced during blue-light LED chip work is upwards conducted by fluorescent glue, then take out in free convection mode by contacting with air, main component because of fluorescent glue is silica gel, its pyroconductivity is lower, the heat that blue-light LED chip is produced cannot take out fast, reduces the useful life of blue-light LED chip, thus reduces the life-span of COB construction packages large power white light LED.
Summary of the invention
The purpose of this utility model is just to provide that a kind of luminous flux sustainment rate is high, the COB structure white light LED light source based on ceramic phosphor encapsulation of perfect heat-dissipating, long service life.
COB structure white light LED light source based on ceramic phosphor encapsulation of the present utility model, comprise ceramic substrate, blue-light LED chip, transparent silica gel, PPA plastics box dam, it is characterized in that, substrate is connected by gold thread with blue-light LED chip electrode, gold thread is connected with positive and negative electrode by Copper Foil, blue-light LED chip and gold thread transparent silica gel are encapsulated in the PPA plastics box dam on ceramic substrate, lid layer ceramic phosphor in transparent silica gel.
COB structure white light LED light source based on ceramic phosphor encapsulation of the present utility model, blue-light LED chip does not directly contact with ceramic phosphor, the heat produced when blue-light LED chip can be avoided to work causes fluorescent material to produce decay, guarantee that the launching efficiency of fluorescent material does not reduce, improve the luminous flux sustainment rate of COB structure large power white light LED light source; Simultaneously, because the coefficient of heat conduction of ceramic phosphor is higher, ceramic phosphor when blue-light LED chip can be worked the heat be delivered in transparent silica gel take out fast, reduce the heat accumulation of blue-light LED chip, greatly improve the reliability of COB structure large power white light LED light source, useful life extends greatly.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
A kind of COB structure white light LED light source based on ceramic phosphor encapsulation, comprise ceramic substrate 1, blue-light LED chip 4, transparent silica gel 3, PPA plastics box dam 6, it is characterized in that, ceramic substrate 1 is connected by gold thread with blue-light LED chip 4 electrode, gold thread is connected with positive pole 2, negative pole 7 by Copper Foil 8, blue-light LED chip 4 and gold thread transparent silica gel 3 are encapsulated in the PPA plastics box dam 6 on ceramic substrate 1, lid layer ceramic phosphor 5 in transparent silica gel 3.
Claims (1)
1. the COB structure white light LED light source based on ceramic phosphor encapsulation, comprise ceramic substrate (1), blue-light LED chip (4), transparent silica gel (3), PPA plastics box dam (6), it is characterized in that: ceramic substrate (1) is connected by gold thread with blue-light LED chip (4) electrode, gold thread is connected with positive pole (2), negative pole (7) by Copper Foil (8), blue-light LED chip (4) and gold thread transparent silica gel (3) are encapsulated in the PPA plastics box dam (6) on ceramic substrate (1), the upper lid layer ceramic phosphor (5) of transparent silica gel (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520440779.9U CN204696126U (en) | 2015-06-25 | 2015-06-25 | Based on the COB structure white light LED light source of ceramic phosphor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520440779.9U CN204696126U (en) | 2015-06-25 | 2015-06-25 | Based on the COB structure white light LED light source of ceramic phosphor encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204696126U true CN204696126U (en) | 2015-10-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520440779.9U Expired - Fee Related CN204696126U (en) | 2015-06-25 | 2015-06-25 | Based on the COB structure white light LED light source of ceramic phosphor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204696126U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609496A (en) * | 2016-03-23 | 2016-05-25 | 天津大学 | High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof |
| US10615316B2 (en) | 2016-05-09 | 2020-04-07 | Current Lighting Solutions, Llc | Manganese-doped phosphor materials for high power density applications |
| CN114464608A (en) * | 2022-02-16 | 2022-05-10 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
-
2015
- 2015-06-25 CN CN201520440779.9U patent/CN204696126U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609496A (en) * | 2016-03-23 | 2016-05-25 | 天津大学 | High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof |
| US10615316B2 (en) | 2016-05-09 | 2020-04-07 | Current Lighting Solutions, Llc | Manganese-doped phosphor materials for high power density applications |
| CN114464608A (en) * | 2022-02-16 | 2022-05-10 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
| CN114464608B (en) * | 2022-02-16 | 2022-11-15 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151007 Termination date: 20210625 |