CN203910789U - Novel large-power LED integrated light source with integrated optical lens - Google Patents
Novel large-power LED integrated light source with integrated optical lens Download PDFInfo
- Publication number
- CN203910789U CN203910789U CN201420120534.3U CN201420120534U CN203910789U CN 203910789 U CN203910789 U CN 203910789U CN 201420120534 U CN201420120534 U CN 201420120534U CN 203910789 U CN203910789 U CN 203910789U
- Authority
- CN
- China
- Prior art keywords
- optical lens
- silica gel
- integrated
- light source
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model discloses a novel large-power LED integrated light source with an integrated optical lens, which comprises a bracket, a plurality of LED chips arranged on the bracket, metal wires used for connecting all the LED chips with one another and also connecting the LED chips with the bracket, silica gel arranged on the LED chips, and a solid optical lens arranged on the silica gel and integrated with the silica gel. In this way, the novel large-power LED integrated light source is simpler and more convenient to use for consumers. Meanwhile, since the solid optical lens is integrated with the silica gel on the LED chips. That is to say, the LED chips and the optical lens are integrated as a whole, and no air layer exists between the LED chips and the optical lens. Therefore, the loss of the luminous efficiency caused by the total reflection effect can be reduced, so that the luminous efficiency of the entire LED lamp is greatly improved. In addition, the light distribution of a lamp fixture is enabled, so that the novel large-power LED integrated light source can be directly put in the air. The heat on the surfaces of the LED chips is directly and quickly diffused into the surrounding air through the integrated optical lens, so that the novel large-power LED integrated light source is good in heat dissipation performance.
Description
Technical field
The utility model relates to a kind of LED light source, relates in particular to a kind of high power LED integrated light source.
Background technology
At present, in LED encapsulation field, 1-5W light source mainly adopts the packaged type with bell-type lens, and other high power LED integrated light source of 10-100W level is due to factors such as light-emitting area are large, heating power is large, substantially all adopt lensless planar package mode, be only provided with a support 11, a plurality of LED chip 12, gold thread 13 and silica gel 14, as shown in Figure 1, when consumer uses, also to the PC class of bell-type be installed on integrated optical source again or the optical lens of glass material carries out luminous intensity distribution, so, consumer's use also becomes complicated inconvenient.And between optical lens meeting of installing like this and integrated optical source, have air layer, due to the silica gel 14 on LED chip and the total reflection effect between air layer, thereby the light that integrated optical source surface is penetrated is understood, some reflected light source is inner causes light efficiency loss; In addition, because the heating power of integrated optical source is large and heat is very concentrated, the major part that integrated optical source is distributed on its light source surface of use procedure converges in the optical lens inside of PC class or glass material, cannot be dispersed in time in air, cause integrated optical source silica gel 14 surface temperatures very high, in long-term use procedure, easily occur that thereby the surperficial flavescence blackout of integrated optical source silica gel 14 causes serious light decay, causes gold thread 13 to break the bad phenomenon such as light source fails thereby even there will be silica gel 14 glue to split.
Utility model content
The purpose of this utility model is to provide a kind of novel high power LED integrated light source with integrated optical lens.
For achieving the above object, the technical scheme that the utility model adopts is:
The novel high power LED integrated light source with integrated optical lens, comprises a support, establishes
Be placed in a plurality of LED chips on support, connect each LED chip and connect LED chip and support gold thread, be arranged at the silica gel on described LED chip, also comprise be arranged at above described silica gel and with the integrated solid optical lens of described silica gel.
Described solid optical lens is the solid optical lens of silica gel.
Described solid optical lens adopts silica gel to make by mould model technology.
Described solid optics lens package is drawn together PC or glass bell-type optical lens and the filling of being fixed on support
Silica gel or silicone oil between silica gel on described bell-type optical lens and LED chip.
Silica gel upper surface on described LED chip is provided with silica gel tackifier.
Described support central authorities are provided with a groove, and described LED chip is arranged in described groove, described in the silica gel that is arranged on LED chip fill up described groove.
The described silica gel being arranged on LED chip is fluorescent glue.
The beneficial effects of the utility model are: directly in encapsulation, form solid optical lens, make consumption
Person can directly use and not need to carry out luminous intensity distribution design again, uses more simple and convenient; Silica gel on solid optical lens and LED chip is integrated, that is to say that LED chip and solid optical lens are integrated, thereby there is not air layer between the two, therefore reduced the light efficiency loss that total reflection effect causes, thereby can increase substantially the luminous efficiency of whole lamp; In addition, the high power LED integrated light source of the utility model band integrated optical lens has completed the luminous intensity distribution of light fixture, therefore can directly be placed in air, the heat on LED chip surface can directly be diffused into rapidly in ambient air by integrated solid optical lens, and heat dispersion is good.
Accompanying drawing explanation
Fig. 1 is the high-power integrated optical source schematic diagram of known lensless planar package form;
Fig. 2 is high power LED integrated light source the first embodiment schematic diagram with integrated optical lens of the present utility model;
Fig. 3 is high power LED integrated light source the second embodiment schematic diagram with integrated optical lens of the present utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The first embodiment
As shown in Figure 2, in the present embodiment, the utility model with the high power LED integrated light source of integrated optical lens comprise a support 21, be arranged at a plurality of LED chips 22 on support 21, connect each LED chip 22 and connect LED chip 22 and support 21 gold thread 23, be arranged at the silica gel 24 on described LED chip 22, also comprise be arranged at described silica gel 24 tops and with the integrated solid optical lens 25 of described silica gel 24.
In the present embodiment, preferably, described solid optical lens 25 is the solid optical lens 25 of silica gel, is the solid optical lens 25 of silica gel forming by mould model technology, specifically, described solid optical lens 25 adopts the silica gel of Good Heat-resistance to make by mould model technology.
In the present embodiment, preferably, the silica gel 24 on described LED chip is fluorescent glue.
Encapsulate time of the present utility model, first assemble support 21, LED chip 22, gold thread 23, then on LED chip 22, apply silica gel 24, then baking, make silica gel 24 primary solidification on LED chip 22, make silica gel 24 upper surface one decks be thick, so, the solid optical lens 25 of mould model is placed on the surperficial one deck of silica gel 24 on LED chip 22 again, now, the silica gel of mould model optical lens 25 does not solidify completely yet, this time, toast again, thereby the silica gel 24 on LED chip 22 is merged with the silica gel of mould model optical lens 25, by the time after solidifying completely, silica gel 24 on LED chip 22 forms as one with the silica gel of mould model optical lens 25, that is to say, silica gel 24 on LED chip 22 forms as one with optical lens 25, because silica gel 24 is to be coated on LED chip 22, thereby silica gel 24 is also integrated with LED chip 22, so, LED chip 22 forms as one with optical lens 25.
In the present embodiment, preferably, silica gel 24 upper surfaces on described LED chip 22 are provided with silica gel tackifier (not shown), thereby can be so that be coated in silica gel 24 on LED chip 22 and make more close and firm of bonding force between the silica gel of optical lens 25.After the silica gel 24 of described silica gel tackifier on primary solidification LED chip 22, be sprayed on silica gel 24 surfaces on LED chip 22.
In the present embodiment, described support 21 central authorities are provided with a groove 211, and described LED chip 22 is arranged in described groove 211, described in the silica gel 24 that is coated on LED chip 22 fill up described groove 211.
In other embodiments, mould model optical lens 25 is not limited to silica gel, and also available other can be made with the well known materials that silica gel merges.
In other embodiments, also can not adopt mould model fabrication techniques optical lens, also can adopt PC or glass bell-type optical lens (not shown), and PC or glass bell-type optical lens with corresponding positioner (not shown) is set on support 21, screens assembles after PC or glass bell-type optical lens and support 21, toward filling gel or silicone oil (not shown) between the silica gel 24 on lens and LED chip 22, and then baking, silica gel or the silica gel on silicone oil and LED chip 22 24 of filling are merged, thereby make lens, silica gel 24 on filling gel or silicone oil and LED chip 22 is integrated, so, PC or glass bell-type optical lens are together with the silica gel or silicone oil of filling wherein, also formed solid optical lens.That is to say, in the above-described embodiments, described solid optics lens package is drawn together PC or the glass bell-type optical lens being fixed on support 21 and is filled in silica gel or the silicone oil between the silica gel 24 on described bell-type optical lens and LED chip 22.
In sum, directly in encapsulation, form solid optical lens 25, make the consumer can be direct
Use and do not need to carry out again luminous intensity distribution design, using more simple and convenient; And solid optical lens 25 is integrated with the silica gel 24 on LED chip 22, that is to say that LED chip 22 and optical lens 25 are integrated, thereby there is not air layer between the two, therefore reduced the light efficiency loss that total reflection effect causes, thereby can increase substantially the luminous efficiency of whole lamp; In addition, the high power LED integrated light source of the utility model band integrated optical lens has completed the luminous intensity distribution of light fixture, therefore can directly be placed in air, the heat on LED chip 22 surfaces can directly be diffused into rapidly in ambient air by integrated solid optical lens 25, heat dispersion is good, thereby can avoid traditional various quality hidden danger that cause because surface radiating is bad without the Planar integration light source of lens packages.
The second embodiment
As shown in Figure 3, in the present embodiment, only the shape of optical lens 26 is different from the optical lens 25 in the first embodiment, that is to say, the concrete shape of optical lens is not limit, difform optical lens has different distribution curve fluxs, by mould model technology, can realize the various optical lens shape with specific distribution curve flux.
Claims (7)
1. the novel high power LED integrated light source with integrated optical lens, it is characterized in that: comprise a support, be arranged at a plurality of LED chips on support, connect each LED chip and connect LED chip and support gold thread, be arranged at the silica gel on described LED chip, also comprise be arranged at above described silica gel and with the integrated solid optical lens of described silica gel.
2. the novel high power LED integrated light source with integrated optical lens according to claim 1, is characterized in that: described solid optical lens is the solid optical lens of silica gel.
3. the novel high power LED integrated light source with integrated optical lens according to claim 2, is characterized in that: described solid optical lens adopts silica gel to make by mould model technology.
4. the novel high power LED integrated light source with integrated optical lens according to claim 1, is characterized in that: described solid optics lens package is drawn together PC or the glass bell-type optical lens being fixed on support and is filled in silica gel or the silicone oil between the silica gel on described bell-type optical lens and LED chip.
5. according to the novel high power LED integrated light source with integrated optical lens described in claim 1 or 2 or 3 or 4, it is characterized in that: the silica gel upper surface on described LED chip is provided with silica gel tackifier.
6. the novel high power LED integrated light source with integrated optical lens according to claim 5, it is characterized in that: described support central authorities are provided with a groove, described LED chip is arranged in described groove, described in the silica gel that is arranged on LED chip fill up described groove.
7. the novel high power LED integrated light source with integrated optical lens according to claim 6, is characterized in that: described in the silica gel that is arranged on LED chip be fluorescent glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420120534.3U CN203910789U (en) | 2014-03-18 | 2014-03-18 | Novel large-power LED integrated light source with integrated optical lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420120534.3U CN203910789U (en) | 2014-03-18 | 2014-03-18 | Novel large-power LED integrated light source with integrated optical lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203910789U true CN203910789U (en) | 2014-10-29 |
Family
ID=51785043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420120534.3U Expired - Fee Related CN203910789U (en) | 2014-03-18 | 2014-03-18 | Novel large-power LED integrated light source with integrated optical lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203910789U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411587A (en) * | 2018-12-10 | 2019-03-01 | 邱凡 | A kind of purple LED production method and its purple LED containing silica-gel lens |
| CN112909147A (en) * | 2019-11-19 | 2021-06-04 | 深圳Tcl新技术有限公司 | Quantum dot LED and preparation method thereof |
-
2014
- 2014-03-18 CN CN201420120534.3U patent/CN203910789U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411587A (en) * | 2018-12-10 | 2019-03-01 | 邱凡 | A kind of purple LED production method and its purple LED containing silica-gel lens |
| CN112909147A (en) * | 2019-11-19 | 2021-06-04 | 深圳Tcl新技术有限公司 | Quantum dot LED and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20180318 |
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| CF01 | Termination of patent right due to non-payment of annual fee |