CN206274525U

CN206274525U - A kind of LED encapsulation

Info

Publication number: CN206274525U
Application number: CN201621481082.7U
Authority: CN
Inventors: 肖瑞斌
Original assignee: Dongguan City Deda Photoelectric Technology Co Ltd
Current assignee: Dongguan City Deda Photoelectric Technology Co Ltd
Priority date: 2016-12-30
Filing date: 2016-12-30
Publication date: 2017-06-23
Anticipated expiration: 2026-12-30

Abstract

The utility model is related to a kind of LED to encapsulate, including base plate, heat sink, substrate, bearing, reflector layer, mucilage binding layer, chip, concace mirror lens, layer of silica gel and heat-conducting layer；Conventional LED encapsulation lacks the heat abstractor of chip so that the heat that chip is produced cannot be derived fast and effectively, and so as to be had undesirable effect to chip, service life is short；And, the light that conventional LED encapsulation is produced is in disorder, and battle-sight range is short, it is impossible to play illuminating effect to greatest extent.Beneath chips of the present utility model are fitted and are connected on heat sink, enable that the heat that chip is produced timely and effectively exports to outside, so as to solve the problems, such as chip cooling, the utility model is also Promethean to have installed concace mirror lens additional, can by light arrange and reflect in order, and layer of silica gel of arranging in pairs or groups refraction action, so as to improve the linearity of light, irradiation distance is farther, improves illumination efficiency.

Description

A kind of LED encapsulation

Technical field

The utility model is related to and LED structure technology, more particularly to a kind of LED encapsulation.

Background technology

At present in lighting field, after LED productions are encapsulated through SMD, when product is used because LED lighting angles are smaller, light Line is disorderly and unsystematic, does not often reach enough illumination space or irradiation distances, and illumination efficiency is low.Simultaneously during product use Chip can cause that chip burns out due to lacking heat abstractor, cause LED service lifes to shorten.

In the prior art, such as Patent No. 201120189697.3, the applying date is 2011.05.27《LED is encapsulated》, the reality Encapsulated with new LED and LED billboards and display are provided

Good contrast in device between different pixels, while not reducing luminous flux or the brightness of the perception of display.But It is that the utility model radiating effect is not good enough, light is in disorder, and irradiation distance is short, and illumination efficiency is low, is further improved.

Utility model content

In view of the above-mentioned state of the art, technical problem to be solved in the utility model is to provide a kind of radiating effect The LED encapsulation that really good, light linearity is good, irradiation distance is farther, illumination efficiency is high.

The utility model solve the technical scheme that is used of above-mentioned technical problem for：A kind of LED encapsulation, including base plate, dissipate Hot plate, substrate, bearing, reflector layer, mucilage binding layer, chip, concace mirror lens, layer of silica gel and heat-conducting layer, it is characterised in that the base plate Be fixedly arranged above heat sink, the upper planar central of the heat sink forms support block, on four edges of the support block Side forms vertical flange, and the chip is placed on the top of support block and is located between four vertical flange；The chip and Heat-conducting layer is provided between support block；Substrate is further fixed in the upper plane of the heat sink and positioned at the outside of support block, institute That states substrate is fixedly arranged above bearing；Filled with mucilage binding layer between vertical flange on the reflector layer and support block；The branch The upper horizontal edge of seat forms back-up ring, and the back-up ring has been internally embedded concace mirror lens, the concace mirror lens and bearing it is upper Side forms layer of silica gel；The focal length of the concace mirror lens is engaged with the focal length that layer of silica gel possesses.

Preferably, the base plate is ceramic wafer.

Preferably, the heat sink is aluminium sheet.

Preferably, the substrate is epoxy resin board.

Preferably, the center of the bearing offers taper die cavity, is fixed with the inner side of the taper die cavity anti- Photosphere, the reflector layer can be by the overcentre of light collection to chip.

Preferably, the mucilage binding layer is formed using transparent glass fiber powder solidification crystallization.

Preferably, the structure of the layer of silica gel is arch, and being added in the layer of silica gel has fluorescent material.

Compared with prior art, the utility model has the advantage of：Conventional LED encapsulation lacks the heat abstractor of chip, So that the heat that chip is produced cannot be derived fast and effectively, so as to be had undesirable effect to chip, service life is short；And, The light that conventional LED encapsulation is produced is in disorder, and battle-sight range is short, it is impossible to play illuminating effect to greatest extent.It is of the present utility model Beneath chips are fitted and are connected on heat sink so that the heat that chip is produced can timely and effectively export to outside, so as to solve Determine the problem of chip cooling, the utility model is also Promethean to have installed concace mirror lens additional, can arrange light and reflect in order, And the refraction action of layer of silica gel of arranging in pairs or groups, so as to improve the linearity of light, irradiation distance is farther, improves illumination efficiency.

Brief description of the drawings

Fig. 1 is section of structure of the present utility model.

Specific embodiment

As shown in figure 1, a kind of LED encapsulation, including base plate 1, heat sink 2, substrate 3, bearing 4, reflector layer 5, mucilage binding layer 6, Chip 7, concace mirror lens 8, layer of silica gel 9 and heat-conducting layer 10；Base plate 1 is ceramic wafer, and base plate 1 is fixedly arranged above heat sink 2, is dissipated Hot plate 2 is aluminium sheet, can quickly derive heat, chip operation is more stablized, and is increased the service life, and lightweight；Heat sink 2 Upper planar central forms support block 21, and four edges top of support block 21 forms vertical flange 22, and chip 7 is placed on branch The top of bracer 21 simultaneously be located at four vertical flange 22 between so that chip 7 encapsulate when position be more fixed, location efficiency and High precision；Heat-conducting layer 10 is additionally provided between chip 7 and support block 21, the heat that heat-conducting layer 10 can produce chip 7 is more preferable It is delivered on heat sink 2；Substrate 3 is further fixed in the upper plane of heat sink 2 and positioned at the outside of support block 21, substrate 3 is ring Oxygen resin plate；Substrate 3 is fixedly arranged above bearing 4, and the center of bearing 4 offers taper die cavity 41, the inside of taper die cavity 41 Reflector layer 5 is fixed with side, reflector layer 5 can be by the overcentre of light collection to chip 7；Reflector layer 5 and support block 21 On vertical flange 22 between formed using transparent glass fiber powder solidification crystallization filled with mucilage binding layer 6, mucilage binding layer 6；Bearing 4 Upper horizontal edge also form back-up ring 42, back-up ring 42 has been internally embedded concace mirror lens 8, the light that concace mirror lens 8 can be converged Line suitably dissipates and is allowed to average emitted to outside, and the top of concace mirror lens 8 and bearing 4 forms layer of silica gel 9, layer of silica gel 9 Structure is arch, and being added in layer of silica gel 9 has fluorescent material, and layer of silica gel 9 can be by light collection and parallel launch to distant place；Concace mirror lens The focal length that 8 focal length possesses with layer of silica gel 9 is engaged；Light produce when, chip 7 produce light by reflector layer 5 convergence, Again by the refraction of concace mirror lens 8 and layer of silica gel 9 so that the linearity of light more preferably, irradiation it is farther.

Conventional LED encapsulation lacks the heat abstractor of chip so that the heat that chip is produced cannot be derived fast and effectively, So as to be had undesirable effect to chip, service life is short；And, the light that conventional LED encapsulation is produced is in disorder, and battle-sight range is short, Illuminating effect cannot to greatest extent be played.Beneath chips of the present utility model are fitted and are connected on heat sink 2 so that chip The heat of generation can timely and effectively export to outside, so as to solve the problems, such as chip cooling, the utility model also originality Installed concace mirror lens 8 additional, can by light arrange and reflect in order, and layer of silica gel 9 of arranging in pairs or groups refraction action, so as to improve light The linearity of line, irradiation distance is farther, improves illumination efficiency.

Finally it should be noted that：Above example is only used to illustrate the technical solution of the utility model, rather than its limitations； Although being described in detail to the utility model with reference to the foregoing embodiments, it will be understood by those of skill in the art that its according to The technical scheme described in foregoing embodiments can so be modified, or which part technical characteristic is replaced on an equal basis Change；And these modifications or replacement, the essence of appropriate technical solution is departed from each embodiment technical scheme of the utility model Spirit and scope.

Claims

1. a kind of LED encapsulation, including base plate, heat sink, substrate, bearing, reflector layer, mucilage binding layer, chip, concace mirror lens, silica gel Layer and heat-conducting layer, it is characterised in that the base plate is fixedly arranged above heat sink, the upper planar central shaping of the heat sink The four edges top for having support block, the support block forms vertical flange, and the chip is placed on the top of support block simultaneously Between four vertical flange；Heat-conducting layer is provided between the chip and support block；In the upper plane of the heat sink also It is fixed with substrate and positioned at the outside of support block, the substrate is fixedly arranged above bearing；On the reflector layer and support block Filled with mucilage binding layer between vertical flange；The upper horizontal edge of the bearing forms back-up ring, and the back-up ring has been internally embedded Concace mirror lens, layer of silica gel is formed above the concace mirror lens and bearing；The focal length of the concace mirror lens possesses with layer of silica gel Focal length be engaged.

2. a kind of LED encapsulation according to claim 1, it is characterised in that the base plate is ceramic wafer.

3. a kind of LED encapsulation according to claim 1, it is characterised in that the heat sink is aluminium sheet.

4. a kind of LED encapsulation according to claim 1, it is characterised in that the substrate is epoxy resin board.

5. a kind of LED encapsulation according to claim 1, it is characterised in that the center of the bearing offers taper die cavity, Reflector layer is fixed with the inner side of the taper die cavity, the reflector layer can be by the center of light collection to chip Side.

6. a kind of LED encapsulation according to claim 1, it is characterised in that the mucilage binding layer uses transparent glass fibre Powder solidification crystallization is formed.

7. a kind of LED encapsulation according to claim 1, it is characterised in that the structure of the layer of silica gel is arch, the silicon Being added in glue-line has fluorescent material.