CN202275867U - LED support and paster LED - Google Patents
LED support and paster LED Download PDFInfo
- Publication number
- CN202275867U CN202275867U CN2011203346003U CN201120334600U CN202275867U CN 202275867 U CN202275867 U CN 202275867U CN 2011203346003 U CN2011203346003 U CN 2011203346003U CN 201120334600 U CN201120334600 U CN 201120334600U CN 202275867 U CN202275867 U CN 202275867U
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- China
- Prior art keywords
- led
- cavity
- containing cavity
- sucker
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an LED support and a paster LED. The paster LED comprises an LED support. The LED support comprises a support body. An accommodating chamber is disposed on the support body. A cavity is arranged on the opening of the accommodating chamber on the support body (1). A luminescence chip is arranged on the bottom of the accommodating chamber. Packaging glue is placed in the accommodating chamber. No packaging glue is filled in the cavity. According to the LED support and the paster LED, when a sucker is adopted for adsorption, the sucker is not contacted with the packaging glue in the accommodating chamber, and the packaging glue can not be adhered to the sucker, so that the nozzle of the sucker is not blocked and the internal structure of the packaging glue is not destroyed.
Description
Technical field
The utility model relates to led support, particularly TOP led support and paster LED.
Background technology
Led support is the bottom susceptor of LED lamp pearl before encapsulation, when encapsulation, chip is fixed on the led support, and the welding positive and negative electrode is used encapsulated moulding of packaging plastic again.At present, a led support is arranged, as shown in Figure 1, comprise stake body; On stake body, have a containing cavity, when encapsulation, earlier led chip is welded on the bottom surface of containing cavity, then; Packaging plastic is encapsulated in the containing cavity, and this technology is to single led encapsulation, if produce in batch, then generally on streamline, makes moulding; When moving packaged LED, adopt sucker absorption usually, as shown in Figure 2, existing sucker is directly to be adsorbed on the packaging plastic; Like this, can produce following defective: (1) packaging plastic is attached to easily on the sucker and suction nozzle is blocked, thus carrying out smoothly of producing of influence; (2) if the pressure on the sucker is excessive, the absorption affinity of sucker is again to act on the packaging plastic, therefore, destroys the internal organizational structure of packaging plastic easily, thereby influences the light effect that goes out of LED.
Summary of the invention
The purpose of the utility model provides a kind of led support; This led support structure, when adopting sucker absorption led support, sucker can not contact with the interior packaging plastic of containing cavity; Packaging plastic can be attached on the sucker and suction nozzle is blocked, and can not destroy the internal organizational structure of packaging plastic yet.
Another purpose of the utility model provides a kind of paster LED; This paster LED, when adopting sucker absorption, sucker can not contact with the interior packaging plastic of containing cavity; Packaging plastic can be attached on the sucker and suction nozzle is blocked, and can not destroy the internal organizational structure of packaging plastic yet.
For achieving the above object, a kind of led support comprises stake body, and stake body is provided with containing cavity; The opening part that on stake body, is positioned at containing cavity is provided with cavity.
As improvement, the sectional area of cavity is formed with a step surface greater than the sectional area of containing cavity opening part between cavity and the containing cavity.
For reaching above-mentioned another purpose, a kind of paster LED comprises led support, and led support comprises stake body, and stake body is provided with containing cavity; The opening part that on stake body, is positioned at containing cavity is provided with cavity; The bottom surface of containing cavity is provided with luminescence chip, is filled with packaging plastic in the containing cavity.
When the led support that utilizes the utility model is made LED, earlier chip is installed on the bottom surface of containing cavity, then; Packaging plastic is placed in the containing cavity; Do not encapsulate packaging plastic in the cavity, when adopting sucker absorption led support, because the existence of cavity; Do not contact when therefore, sucker is adsorbed on the surface of stake body with packaging plastic.
The beneficial effect of the utility model is: owing on stake body, be provided with cavity, like this, sucker can not contact with the packaging plastic in the containing cavity; Therefore; Packaging plastic can be attached on the sucker and suction nozzle is blocked, and can not influence the production of streamline, does not need often to clear up sucker yet; In addition, even the suction of sucker is bigger, can not destroy the packaging plastic in the containing cavity yet.
Description of drawings
Fig. 1 is a led support structure chart of the prior art.
Fig. 2 is led support of the prior art state diagram in use.
Fig. 3 is the led support structure chart in the utility model.
Fig. 4 is the paster LED structure chart in the utility model.
Fig. 5 is the led support state diagram in use in the utility model.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further elaborated.
As shown in Figure 3, a kind of led support comprises stake body 1, and stake body 1 is provided with containing cavity 2; The opening part that on stake body, is positioned at containing cavity is provided with the cavity 3 of sectional area greater than the sectional area of containing cavity opening part, is formed with a step surface 4 between cavity 3 and the containing cavity 2.
As shown in Figure 4, a kind of paster LED comprises above-mentioned led support, and luminescence chip 5 is installed on the bottom surface of containing cavity 2, and packaging plastic 6 places in the containing cavity 2, does not fill packaging plastic in the cavity 3.
As shown in Figure 5, when the led support that utilizes the utility model is made LED, earlier chip 5 is installed on the bottom surface of containing cavity 2; Then, packaging plastic 6 is placed in the containing cavity 2, do not fill packaging plastic in the cavity 3; When adopting sucker 7 absorption led supports, because cavity 3 existing sucker 7 to be adsorbed on the surface of stake body and not contacting with packaging plastic, therefore; Packaging plastic can be attached on the sucker 7 and suction nozzle is blocked, and can not influence the production of streamline, does not need often to clear up sucker yet; In addition,, can not destroy the packaging plastic in the containing cavity yet, can not change the light effect that of reservation even the suction of sucker 7 is bigger.
Claims (4)
1. a led support comprises stake body (1), and stake body is provided with containing cavity (2); It is characterized in that: the opening part that on stake body (1), is positioned at containing cavity (2) is provided with cavity (3).
2. led support according to claim 1 is characterized in that: the sectional area of cavity (3) is formed with a step surface (4) greater than the sectional area of containing cavity (2) opening part between cavity (3) and the containing cavity (2).
3. a paster LED comprises led support, and led support comprises stake body (1), and stake body is provided with containing cavity (2); It is characterized in that: the opening part that on stake body (1), is positioned at containing cavity (2) is provided with cavity (3); The bottom surface of containing cavity (2) is provided with luminescence chip (5), is filled with packaging plastic (6) in the containing cavity (2).
4. paster LED according to claim 3 is characterized in that: the sectional area of cavity (3) is formed with a step surface (4) greater than the sectional area of containing cavity (2) opening part between cavity (3) and the containing cavity (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203346003U CN202275867U (en) | 2011-09-07 | 2011-09-07 | LED support and paster LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203346003U CN202275867U (en) | 2011-09-07 | 2011-09-07 | LED support and paster LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202275867U true CN202275867U (en) | 2012-06-13 |
Family
ID=46196206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203346003U Expired - Fee Related CN202275867U (en) | 2011-09-07 | 2011-09-07 | LED support and paster LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202275867U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104518070A (en) * | 2014-11-17 | 2015-04-15 | 浙江英特来光电科技有限公司 | High-grayscale and high-contrast SMD (surface-mounted) LED (light emitting diode) and adhesive dispensing technology thereof |
-
2011
- 2011-09-07 CN CN2011203346003U patent/CN202275867U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104518070A (en) * | 2014-11-17 | 2015-04-15 | 浙江英特来光电科技有限公司 | High-grayscale and high-contrast SMD (surface-mounted) LED (light emitting diode) and adhesive dispensing technology thereof |
| CN104518070B (en) * | 2014-11-17 | 2018-09-07 | 浙江英特来光电科技有限公司 | A kind of high gray scale high contrast SMD LED and its gluing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou Patentee before: Guangzhou Hongli Tronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120613 Termination date: 20190907 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |